17314twf.doc/r 九、發明說明： 【發明所屬之技術領域】 一本發明是有關於一種顯示面板，且特別是有關於一種 顯示面板的組立方法。 【先前技術】 單晶矽反射液晶面板（Liquid Crystal on Silicon panel， LCOS panel )是一種架構於矽晶圓背板㈨如加 backpanel)上的液晶面板。因為這種利用矽晶圓作為背板的 LCOS面板是以金氧半電晶體(M〇s transist〇r)取代傳統液 晶顯示器的薄膜電晶體’且其畫素電極(pixel ele_de)是 以金屬材質為主，所以LCOS面板是屬於一種反射型的液 晶面板。同時，因為LCOS面板之金屬晝素電極是完全覆 蓋於一畫素區域上，特別是將金氧半電晶體覆蓋住，所以 LCOS面板顯示影像的能力較傳統液晶顯示器優異。此 外，由於LCOS面板架構於石夕背板上、體積小且具有不錯 的解析度，所以將LCOS面板應用於一般液晶投影機中甚 為常見，且LCOS面板十分符合液晶投影機在體積上曰益 縮減的需求。 圖1繪示習知LCOS面板組立時的剖面示意圖。請參 照圖1，在製作LCOS面板時，係先將矽晶圓背板與玻璃 基板組立，之後再進行切裂製程，以形成多個LC0S面板。 由於每一 LCOS面板的結構相同，在此為了說明方便，係 以單一 LCOS面板組立時的剖面示意圖為例進行說明。 承上述，LCOS面板的下基板11〇為矽基板，上基板 17314twf.doc/r 120為玻璃基板’而在進行基板組立時，會先於下基板ι1〇 上塗佈框膠(sealant)130。此框膠130的材質例如為紫外光 固化膠。之後，在大氣環境下藉由機台30進行上基板12〇 與下基板110的對位及壓合。接著’藉由紫外光照射框膠 130 ’以使框膠130固化。 一般而言，顯示面板的上基板與下基板之間的液晶胞 間隙(cell gap)係藉由間隙物來維持，所以間隙物在顯示面 板内的密度與分佈與液晶胞間隙的均勻性息息相關。然 而，在LCOS面板中’由於間隙物僅分佈於框膠13〇内， 在機台30進行上基板120與下基板11〇的壓合時，上基板 120及下基板11〇接觸框膠13〇的部分與其他未接觸框膠 130的部分所受的應力不同，導致上基板12〇與下基板ι1〇 在壓合時容易產生彎曲的情形。如此會造成上基板12〇與 下基板110之間的液晶胞間隙不均勻，以致於Lc〇s面板17314 twf.doc/r IX. Description of the Invention: [Technical Field] The present invention relates to a display panel, and more particularly to a method of assembling a display panel. [Prior Art] A liquid crystal on silicon panel (LCOS panel) is a liquid crystal panel which is mounted on a back wafer (9) such as a backpanel. Because the LCOS panel using the germanium wafer as the backplane is a thin film transistor of the conventional liquid crystal display replaced by a metal oxide semi-transistor (M〇s transist〇r) and its pixel electrode (pixel ele_de) is made of metal. Mainly, the LCOS panel belongs to a reflective LCD panel. At the same time, because the metal halogen electrode of the LCOS panel is completely covered on a pixel area, especially the gold oxide semi-transistor, the ability of the LCOS panel to display images is superior to that of the conventional liquid crystal display. In addition, because the LCOS panel is built on the stone back plate, small in size and has good resolution, it is very common to apply the LCOS panel to general LCD projectors, and the LCOS panel is very suitable for the volume of the LCD projector. Reduced demand. FIG. 1 is a schematic cross-sectional view showing a conventional LCOS panel. Referring to Fig. 1, when the LCOS panel is fabricated, the silicon wafer backplane is assembled with the glass substrate, and then the chipping process is performed to form a plurality of LC0S panels. Since the structure of each LCOS panel is the same, for convenience of explanation, a cross-sectional schematic view of a single LCOS panel is taken as an example for illustration. In the above, the lower substrate 11 of the LCOS panel is a germanium substrate, and the upper substrate 17314twf.doc/r 120 is a glass substrate'. When the substrate is assembled, a sealant 130 is applied to the lower substrate ι1. The material of the sealant 130 is, for example, an ultraviolet curable adhesive. Thereafter, the upper substrate 12A and the lower substrate 110 are aligned and pressed by the machine 30 in an atmospheric environment. The sealant 130 is then irradiated with ultraviolet light to cure the sealant 130. In general, the cell gap between the upper substrate and the lower substrate of the display panel is maintained by the spacers, so the density and distribution of the spacers in the display panel are closely related to the uniformity of the liquid crystal cell gap. However, in the LCOS panel, the upper substrate 120 and the lower substrate 11 are in contact with the sealant 13 when the upper substrate 120 and the lower substrate 11 are pressed together when the spacer 30 is only distributed in the sealant 13〇. The portion is different from the stress of the portion of the other non-contact seal 130, which causes the upper substrate 12 and the lower substrate ι1 to be easily bent when pressed. This causes the liquid crystal cell gap between the upper substrate 12 and the lower substrate 110 to be uneven, so that the Lc〇s panel
在顯示時產生牛頓環(Newton ring)，因而嚴重影響Lc〇S 面板的顯示品質。 此外，在LCOS面板中，間隙物的高度約為2〜3微 米，然而在大氣環境下容易產生直徑大於3微米的微粒子 (particle) ’其會造成上基板120與下基板u〇組立不良， 使得上述之牛頓環現象更為嚴重。 圖2 A與圖2 B繪示習知兩種塗佈於矽晶圓背板上之保 濩膠的結構示意圖。請先參照圖2A ,在進行矽晶圓背板 50與玻璃基板的切裂時係使用濕式製程，而為了防止液體 污染係晶圓背板50 ’在矽晶圓背板50與玻璃基板組立前， 17314twf.doc/r 3?:夕^曰圓月板Μ上塗佈-保護框8〇。然而，由於保 二日士 ^ ’切晶圓f板5G與玻璃基板 板50與玻璃基板之間的空氣無法 排出:導致壓合時無法達到所需的液晶胞間隙。 '參’’?、圖2Β>為了改善上述空氣無法排出的問題， 了=保，框8。β又。十夕個開σ 82 ’並在石夕晶圓背板5。與玻 璃基板壓合後，再_這些.82。然而，此種作法需要 夕道封閉開口的製程’使得生產時間增加，進 產成本。 【發明内容】 本發明的目的就是在提供一種顯示面板的組立方 法，以改善顯示面板因組立不良所產生的牛頓環現象。 基於上述與其他目的，本發明提出一種顯示面板的組 立方法，其主要包括下列步驟：首先，將一第一基板與一 第二基板置於一腔室中，其中第一基板上已配置有一框 膠，且腔室内的壓力為一第一壓力。接著，將腔室内的壓 力調整至一第二壓力，且第二壓力係小於第一壓力。之後， 將第一與第二基板進行對位，並使第二基板置於框膠上， 以於第一與第二基板之間形成一封閉空間，且此封閉空間 内的壓力為第二壓力。然後，使腔室内的壓力從第二壓力 升至一第三壓力’以藉由腔室内的第三壓力與封閉空間内 的第二壓力之壓力差壓合第一與第二基板。繼之，固化框 膠。 上述之顯示面板的組立方法中，在將腔室内的壓力調 17314twf.doc/r 整至第二壓力之前例如更包括將腔室内的壓力調整至一第 四壓力，其中第四壓力係小於第二壓力。此外，在將腔室 内的壓力調整至第四壓力後例如更包括等待腔室内的壓力 穩定。 上述之顯示面板的組立方法中，第四壓力例如係小於 30Pa。 、 上述之顯示面板的組立方法中，在將腔室内的壓力調 整至第二壓力後例如更包括等待腔室内的壓力穩定。 上述之顯示面板的組立方法中，第一壓力例如 氣壓力。 上述之顯示面板的組立方法中，第二壓力 20kPa至50kPa之間。 丨 上述之顯示面板的組立方法中，第二壓力例如 1/4大氣壓力至1/3大氣壓力之間。 、 第二廢力例如係大於 上述之顯示面板的組立方法中 第一壓力。 第二壓力例如係小於 ，第二壓力例如係等於 上述之顯示面板的組立方法中，框膠的材 外光固化膠’而固化框膠的方法係以紫外光照射二4 上述之顯不面板的組立方法中，框膠的材質 固化膠，而固化框膠的方法為加熱框膠。、疋熱 上述之顯不面板的組立方法中 第一壓力》 上述之顯示面板的組立方法中 第一壓力。 17314twf.d〇c/r 上述之顯示面板的組立方法中’第一基板例如是石夕基 板’而第二基板例如是玻璃基板。 上述之顯示面板的組立方法中，第一基板例如是玻璃 基板’而第二基板例如是矽基板。 本發明係藉由控制封閉空間内的壓力與第三壓力的 壓力差來壓合第-基板與第二基板，以改善第__基板盘第 二基板於組立時發生彎曲的情形。如此’可有效改盖顯 面板於顯示時產生牛頓環現象。 “為讓本發明之上述和其他㈣、特徵和優點能更明顯 易懂’下文特舉較佳實施例，並配合所附圖式，作詳 明如下。 、β 【實施方式】 以下内容中將以LCOS面板為例來說明本發明之顯示 面板的組対法，但本發批顯示峰軌对法並非揭 限於LCOS面板。此外，謂作LC()S面板時，係先將石夕 晶圓背板與玻璃基板組立，之後再進㈣裂製程，以形成 多個LCOS面板。由於每一乙⑽面板的結構相同，為了 說明方便，以下内容將以單—LC()S面㈣組立為例 說明。 第一實施例 圖3係繪不本發明第一實施例之顯示面板的組立方法 之步驟流程圖，而圖4A至圖4C係緣示顯示面板組立時的 剖面不意圖。請參照圖3 ’本實關之顯示面板的組立方 法主要包括下列步驟： 1333569 17314twf.doc/r 首先’如步驟S110及圖4A所示，將一第一基板210 與一第二基板220置於一腔室240中，其中第一基板210 上已配置有一框膠230，且腔室240内的壓力為一第一壓 力Pi。此第一壓力Pi例如是一大氣壓力。此外，第一基 板210例如為矽基板，而第二基板22〇例如為玻璃基板， 且玻璃基板上例如配置有一透明電極層。此透明電極層的 材質可為銦錫氧化物(Indium Tin Oxide, IT0)、銦鋅氧化物 (Indium Zinc Oxide，IZO)或其他透明導電材質。需注意的 是’在本實施例中第一基板210與第二基板220亦可分別 為玻璃基板與碎基板。 接著，如步驟S120所示，將腔室240内的壓力調整 至一第一壓力P2 ’且P2<P1。在本實施例中，第二壓力 例如係介於20kPa至50kPa之間，更佳的是係介於1/4大 氣壓力至1/3大氣壓力之間。此外，在將腔室240内的壓 力調整至第二壓力P2後’可先等待腔室240内的壓力穩 定之後再進行下一個步驟。 之後’如步驟S130及圖4B所示，將第一基板210與 第二基板220進行對位，並使第二基板22〇置於框膠23〇 上’以於第一基板21〇與第二基板220之間形成一封閉空 間250。此時，封閉空間250内的壓力與腔室240内的壓 力皆為第二壓力P2。在本實施例中例如是以機台進行第一 基板210與第二基板22〇的對位，並以機台將第二基板22〇 置於框膠230上，但機台並不進行壓合第一基板210與第 一基板220的動作。 1333569 17314twf.doc/r 然後，如步驟S140及圖4C所示，使腔室24〇内的屋 力從第二壓力P2升至-第三勤P3。此時，由於封閉空 間25^内的壓力與腔室24〇内的壓力不同，且腔室24〇内 的第三壓力P3大於封閉空間250内的第二壓力p2，故可 藉由第三壓力P3與第二壓力P2之壓力差匕壓合第一基板 210與第二基板220。 繼之，如步驟S150所示，對框膠23〇進行固化。其 中固化框膠230的方法視框膠230的材質而定。具體而 言，當框膠230的材質為紫外光固化膠時，則固化框膠23〇 的方法係以紫外光照射框膠23〇，以使框膠23〇固化。另 方面，當框膠230的材質為熱固化膠時，則固化框膠23〇 的方法為加熱框膠230，以使框膠230固化。 由於本貫施例係藉由腔室240内的第三壓力P3與封 閉空間250内的第二壓力P2之壓力差匕來壓合第一基板 21〇與第二基板220’故第一基板210與第二基板220的組 立疋否良好與壓力差Pd息息相關。換言之，若壓力差pd 控制得宜，則可改善第一基板210與第二基板220壓合時 =彎曲的情形，進而改善LCOS面板在顯示時會產生牛頓 環的現象’以提升LCOS面板的顯示品質。 β 本發明第一實施例中，第三壓力ρ3例如係等於第一 壓力Ρ1，亦即第三壓力Ρ3例如為一大氣壓力，而第二壓 ，例如係介於20kPa至50kPa之間，更佳的是介於1/4大 ，壓力至1/3大氣壓力之間，如此可減輕第一基板21〇與 第〜基板220在壓合時產生的彎曲程度，以改善lc〇S面 11 17314twf.d〇c/r 進而提升LCOS面板的 板在顯示時會產生牛頓環的現象 顯不品質。 視'卜’本發明之顯示面板的組立方法中，可 力=的m 〇S面板的尺寸)來調整第三壓力P3與第二壓 致笛一 /差Pd。f中，調整壓力差匕的方法除了可調 二一 4'力P2外，還可調整第三壓力P3。也就是說，第 =力P3除了等於第一壓力ρι外還可小於或大於第一 壓力P1。 此外’就整個石夕晶圓背板與玻璃基板的組立而言，藉 由本發明之顯福板軸立枝，可改善时晶圓背板上 的封閉式保護框80(如圖2A所示)使得空氣無法排出，以 致於無法將矽晶圓背板與玻璃基板壓合至適當液晶胞間隙 的問題。 第二實施例 圖5係繪示本發明苐二貫施例之顯示面板的組立方法 之步驟流程圖。請參照圖5，本實施例之顯示面板的組立 方法與第一實施例所述相似’不同處在於本實施例之顯示 面板的組立方法中，在進行完步驟S110之後，會先進行 步驟S115 ’之後再進行步驟S120。其中，步驟S115是將 腔室240内的壓力調整至一第四壓力P4，此第四壓力P4 係小於第二壓力P2。具體而言’在本實施例中例如是將腔 室240内抽成真空，使得腔室240内的微粒子減到最少， 如此可使LCOS面板的顯示品質較不容易受到微粒子影 響。此外，第四壓力P4例如是真空狀態下的壓力，其值 12 1333569 17314twf.doc/r 係小於30Pa。另外，在將腔室24〇内的壓力調整至第四壓 力P4後，可先等待腔室240内的壓力穩定之後再進行下 一個步驟。 本發明第二實施例中，在進行步驟SU5之後接著進 行步驟S120而非直接進行步驟sl3〇即在避免因第四壓力 P4與第二壓力P3的壓力差pd’過大，導致第一基板21〇與 第二基板220產生嚴重的彎曲，而影響LCOS面板的顯矛 品質。 丁'上所述，本發明之顯示面板的組立方法至少且有下 列優點： 八 1. 藉由控制封閉空間内的壓力與第三壓力的壓力差來 壓合第-基板與第二基板，可改善第—基板與第二基板於 組^發生_•曲的情形。如此，可有效改善顯示面板於顯 示·產生牛頓環現象，進而提高顯示面板的顯示品質。 2. 將腔至内抽成真空，可使腔室内的微粒子減到 ^低^將錄子對黯面板賴H所造成的影響降至 六氣可改善_背板上的封閉式保護框使得 至適當液晶胞間隙的問題。 缝口 if定ΐΐ日ί發明6以較佳實施例揭露如上，然其並非用以 範園當視後附之申;專：所：為因;本發明之保護 13 17314twf.doc/r 【圖式簡單說明】 圖1繪示習知LCOS面板組立時的剖面示意圖。 圖2A與圖2B繪示習知兩種塗佈於矽晶圓背板上之保 護膠的結構示意圖。 ' 圖3係繪示本發明第一實施例之顯示面板的組立方法 之步驟流程圖。 圖4A至圖4C係繪示顯示面板組立時的剖面示意圖。 圖5係繪示本發明第二實施例之顯示面板的組立方法 之步驟流程圖。 【主要元件符號說明】 30 :機台 50 .碎晶圓背板 80 :保護框 82 :保護框開口 110 :下基板 120 :上基板 130、230 :框膠 210 :第一基板 220 :第二基板 240 :腔室 250 :封閉空間 P2 :第二壓力 P3 :第三壓力 S110 H基板與第二基板置於腔室中，其中第一 1333569 17314twf.doc/r 基板上已配置有一框膠，且腔室内的壓力為一第一壓力PI S115 :將腔室内的壓力調整至第四壓力P4，其中P4 <P1 S120 :將腔室内的壓力調整至第二壓力P2，且P2< P1 S130 :將第一與第二基板進行對位，並使第二基板置 於框膠上，以於第一與第二基板之間形成一封閉空間 S140 :使腔室内的壓力從第二壓力P2升至第三壓力 P3，以藉由腔室内的第三壓力P3與封閉空間内的第二壓 力P2之壓力差壓合第一基板與第二基板 S150 :固化框膠A Newton ring is produced during display, thus seriously affecting the display quality of the Lc〇S panel. In addition, in the LCOS panel, the height of the spacer is about 2 to 3 micrometers. However, in the atmospheric environment, particles having a diameter larger than 3 micrometers are easily generated, which may cause the upper substrate 120 and the lower substrate to be poorly assembled. The above-mentioned Newton's ring phenomenon is more serious. 2A and 2B are schematic views showing the structure of two kinds of protective rubber coated on a back sheet of a silicon wafer. Referring first to FIG. 2A, a wet process is used to perform the chipping of the silicon wafer backsheet 50 and the glass substrate, and the wafer backplane 50' is formed on the wafer backplane 50 and the glass substrate in order to prevent liquid contamination. Before, 17314twf.doc/r 3?: 夕^曰The moon board is coated with a protective frame 8〇. However, since the air between the 2nd ‧ s wafer wafer 5G and the glass substrate 50 and the glass substrate cannot be discharged: the desired liquid crystal cell gap cannot be achieved at the time of pressing. '参''?, Fig. 2Β> In order to improve the problem that the above air cannot be discharged, = Bao, Box 8. Beta again. The Tenth Festival opened σ 82 ' and was on the Shi Xi wafer backplane 5. After pressing with the glass substrate, _ these .82. However, this practice requires a process of closing the opening to make the production time increase and the production cost. SUMMARY OF THE INVENTION An object of the present invention is to provide a group cubic method for a display panel to improve the Newton's ring phenomenon caused by poor assembly of the display panel. Based on the above and other objects, the present invention provides a method for assembling a display panel, which mainly includes the following steps: First, a first substrate and a second substrate are placed in a chamber, wherein a frame is disposed on the first substrate. Glue, and the pressure in the chamber is a first pressure. Next, the pressure in the chamber is adjusted to a second pressure, and the second pressure system is less than the first pressure. Thereafter, the first and second substrates are aligned, and the second substrate is placed on the sealant to form a closed space between the first and second substrates, and the pressure in the closed space is the second pressure. . Then, the pressure in the chamber is raised from the second pressure to a third pressure' to press the first and second substrates by the pressure difference between the third pressure in the chamber and the second pressure in the enclosed space. Following this, the frame is cured. In the above method for assembling the display panel, before the pressure of the chamber is adjusted to 17314 twf.doc/r to the second pressure, for example, the pressure in the chamber is further adjusted to a fourth pressure, wherein the fourth pressure system is smaller than the second pressure. pressure. Further, after adjusting the pressure in the chamber to the fourth pressure, for example, it is further included that the pressure in the chamber is stabilized. In the above method of assembling the display panel, the fourth pressure is, for example, less than 30 Pa. In the above method of assembling the display panel, after the pressure in the chamber is adjusted to the second pressure, for example, it is further included that the pressure in the chamber is stabilized. In the above method of assembling the display panel, the first pressure is, for example, gas pressure. In the above method of assembling the display panel, the second pressure is between 20 kPa and 50 kPa.丨 In the above method of assembling the display panel, the second pressure is, for example, between 1/4 atmosphere pressure and 1/3 atmosphere pressure. The second waste force is, for example, greater than the first pressure in the assembly method of the display panel described above. The second pressure is, for example, less than, and the second pressure is, for example, equal to the above-described method of assembling the display panel, and the method of curing the sealant by ultraviolet light is irradiated by ultraviolet light. In the assembly method, the material of the sealant is cured, and the method of curing the sealant is to heat the sealant. In the above-mentioned method of assembling the display panel, the first pressure is the first pressure in the method of assembling the display panel described above. 17314twf.d〇c/r In the above method of assembling the display panel, the 'first substrate is, for example, a stone substrate> and the second substrate is, for example, a glass substrate. In the above method of assembling a display panel, the first substrate is, for example, a glass substrate ’, and the second substrate is, for example, a ruthenium substrate. According to the present invention, the first substrate and the second substrate are pressed by controlling the pressure difference between the pressure in the closed space and the third pressure to improve the bending of the second substrate of the first substrate. This can effectively change the display panel to produce a Newton's ring phenomenon when displayed. The above and other (four) features, advantages and advantages of the present invention will become more apparent and understood. The following detailed description of the preferred embodiments, together with the accompanying drawings, will be described below as follows: [beta] [Embodiment] The LCOS panel is taken as an example to illustrate the stacking method of the display panel of the present invention, but the present invention shows that the peak-track pairing method is not limited to the LCOS panel. In addition, when it is referred to as the LC()S panel, the stone wafer back is first The board and the glass substrate are assembled, and then the (four) cracking process is performed to form a plurality of LCOS panels. Since each B (10) panel has the same structure, for convenience of explanation, the following content will be exemplified by a single-LC() S-face (four) assembly. Fig. 3 is a flow chart showing the steps of the method of assembling the display panel according to the first embodiment of the present invention, and Figs. 4A to 4C are diagrams showing the cross-section of the display panel when it is assembled. Please refer to Fig. 3' The method for assembling the display panel of the present invention mainly includes the following steps: 1333569 17314twf.doc/r First, as shown in step S110 and FIG. 4A, a first substrate 210 and a second substrate 220 are placed in a chamber 240. , wherein the first substrate 210 has been A frame 230 is disposed, and the pressure in the chamber 240 is a first pressure Pi. The first pressure Pi is, for example, an atmospheric pressure. Further, the first substrate 210 is, for example, a crucible substrate, and the second substrate 22 is, for example, A transparent substrate is disposed on the glass substrate, and the transparent electrode layer is made of Indium Tin Oxide (IT0), Indium Zinc Oxide (IZO), or other transparent conductive material. It should be noted that in the present embodiment, the first substrate 210 and the second substrate 220 may be a glass substrate and a broken substrate, respectively. Next, as shown in step S120, the pressure in the chamber 240 is adjusted to a first The pressure P2' and P2<P1. In the present embodiment, the second pressure is, for example, between 20 kPa and 50 kPa, more preferably between 1/4 atmosphere pressure and 1/3 atmosphere pressure. After the pressure in the chamber 240 is adjusted to the second pressure P2, the next step can be performed after waiting for the pressure in the chamber 240 to stabilize. Thereafter, as shown in steps S130 and 4B, the first substrate 210 is The second substrate 220 is aligned and the second The plate 22 is placed on the frame rubber 23' to form a closed space 250 between the first substrate 21A and the second substrate 220. At this time, the pressure in the closed space 250 and the pressure in the chamber 240 are both The second pressure P2. In this embodiment, for example, the first substrate 210 and the second substrate 22 are aligned by the machine, and the second substrate 22 is placed on the sealant 230 by the machine, but the machine is The action of pressing the first substrate 210 and the first substrate 220 is not performed. 1333569 17314twf.doc/r Then, as shown in step S140 and FIG. 4C, the house force in the chamber 24 is raised from the second pressure P2 to - Third Qin P3. At this time, since the pressure in the closed space 25 is different from the pressure in the chamber 24, and the third pressure P3 in the chamber 24 is larger than the second pressure p2 in the closed space 250, the third pressure can be utilized. The pressure difference between P3 and the second pressure P2 is pressed against the first substrate 210 and the second substrate 220. Then, as shown in step S150, the sealant 23 is cured. The method of curing the sealant 230 depends on the material of the sealant 230. Specifically, when the material of the sealant 230 is a UV curable adhesive, the method of curing the sealant 23 照射 irradiates the sealant with ultraviolet light to cure the sealant 23〇. On the other hand, when the material of the sealant 230 is a thermosetting adhesive, the method of curing the sealant 23 is to heat the sealant 230 to cure the sealant 230. Since the present embodiment presses the first substrate 21 and the second substrate 220 by the pressure difference 第三 between the third pressure P3 in the chamber 240 and the second pressure P2 in the closed space 250, the first substrate 210 Whether the assembly with the second substrate 220 is good or not is closely related to the pressure difference Pd. In other words, if the pressure difference pd is properly controlled, the bending of the first substrate 210 and the second substrate 220 can be improved, and the phenomenon that the LCOS panel will generate a Newton ring during display can be improved to improve the display quality of the LCOS panel. . In the first embodiment of the present invention, the third pressure ρ3 is, for example, equal to the first pressure Ρ1, that is, the third pressure Ρ3 is, for example, an atmospheric pressure, and the second pressure is, for example, between 20 kPa and 50 kPa, more preferably It is between 1/4 large and the pressure is between 1/3 atmospheric pressure, so that the degree of bending of the first substrate 21 第 and the first substrate 220 during pressing can be reduced to improve the lc〇S surface 11 17314 twf. D〇c/r further enhances the appearance of the Newton ring when the LCOS panel is displayed. In the method of assembling the display panel of the present invention, the third pressure P3 and the second pressure difference/difference Pd are adjusted by the size of the m 〇 S panel. In f, the method of adjusting the pressure difference 除了 can adjust the third pressure P3 in addition to the adjustable 2' 4' force P2. That is, the first force P3 may be smaller or larger than the first pressure P1 in addition to the first pressure ρι. In addition, in terms of the assembly of the entire Shixi wafer backsheet and the glass substrate, the closed protection frame 80 on the wafer backsheet can be improved by the display shaft of the present invention (as shown in FIG. 2A). The problem that the air cannot be discharged is such that the silicon wafer back sheet and the glass substrate cannot be pressed to the appropriate liquid crystal cell gap. SECOND EMBODIMENT Fig. 5 is a flow chart showing the steps of a method of assembling a display panel according to a second embodiment of the present invention. Referring to FIG. 5, the method for assembling the display panel of the present embodiment is similar to that of the first embodiment. The difference is that in the method for assembling the display panel of the embodiment, after step S110 is performed, step S115 is performed first. Then, step S120 is performed. Wherein, in step S115, the pressure in the chamber 240 is adjusted to a fourth pressure P4, which is lower than the second pressure P2. Specifically, in the present embodiment, for example, the inside of the chamber 240 is evacuated so that the particles in the chamber 240 are minimized, so that the display quality of the LCOS panel is less susceptible to the influence of the particles. Further, the fourth pressure P4 is, for example, a pressure in a vacuum state, and its value 12 1333569 17314twf.doc/r is less than 30 Pa. Further, after the pressure in the chamber 24 is adjusted to the fourth pressure P4, the next step can be performed after waiting for the pressure in the chamber 240 to stabilize. In the second embodiment of the present invention, after step SU5 is performed, step S120 is performed instead of directly performing step sl3, that is, the pressure difference pd' due to the fourth pressure P4 and the second pressure P3 is prevented from being excessively large, resulting in the first substrate 21〇. The second substrate 220 is severely bent, which affects the quality of the LCOS panel. As described above, the method of assembling the display panel of the present invention has at least the following advantages: VIII. Pressing the first substrate and the second substrate by controlling the pressure difference between the pressure in the closed space and the third pressure. The situation in which the first substrate and the second substrate are caused to occur in the group is improved. In this way, the display panel can be effectively improved in display and generation of Newton's ring phenomenon, thereby improving the display quality of the display panel. 2. Draw the cavity into the vacuum to reduce the particle size in the chamber to a low level. The effect of the recording on the panel on the H can be improved. The closed protective frame on the back panel is The problem of proper liquid crystal cell gap. The invention is disclosed in the preferred embodiment as above, but it is not used in the application of Fan Yuan; the special:: the cause; the protection of the invention 13 17314twf.doc / r Brief Description of the Drawings Fig. 1 is a schematic cross-sectional view showing a conventional LCOS panel. 2A and 2B are schematic views showing the structure of two protective adhesives applied to a back sheet of a silicon wafer. Fig. 3 is a flow chart showing the steps of the method of assembling the display panel according to the first embodiment of the present invention. 4A to 4C are schematic cross-sectional views showing the display panel assembled. Fig. 5 is a flow chart showing the steps of a method of assembling a display panel according to a second embodiment of the present invention. [Main component symbol description] 30: Machine 50. Shredded wafer back plate 80: protective frame 82: protective frame opening 110: lower substrate 120: upper substrate 130, 230: sealant 210: first substrate 220: second substrate 240: chamber 250: closed space P2: second pressure P3: third pressure S110 H substrate and second substrate are placed in the chamber, wherein the first 1333569 17314twf.doc / r substrate has been configured with a sealant, and cavity The pressure in the chamber is a first pressure PI S115 : the pressure in the chamber is adjusted to a fourth pressure P4, wherein P4 < P1 S120 : the pressure in the chamber is adjusted to the second pressure P2, and P2 < P1 S130 : Aligning with the second substrate, and placing the second substrate on the sealant to form a closed space S140 between the first and second substrates: increasing the pressure in the chamber from the second pressure P2 to the third a pressure P3 for pressing the first substrate and the second substrate S150 by a pressure difference between the third pressure P3 in the chamber and the second pressure P2 in the closed space: curing the sealant
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