CN111564389B

CN111564389B - Substrate processing system

Info

Publication number: CN111564389B
Application number: CN202010423057.8A
Authority: CN
Inventors: 张志皇
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2017-04-13
Filing date: 2018-04-13
Publication date: 2023-08-29
Anticipated expiration: 2038-04-13
Also published as: CN111554597B; CN108735625A; CN108735625B; KR101970780B1; CN111564389A; CN111554597A; CN117038520A; KR20180115839A; CN111554596A

Abstract

The present application relates to a substrate processing system. A substrate processing system according to an embodiment of the present application may include: a first chamber for simultaneously carrying in or out at least two substrates; a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced apart manner; a plurality of second chambers for processing the at least two substrates aligned in the first chamber; and a substrate transfer unit that transfers the at least two substrates aligned from the first chamber to the second chamber or from the second chamber to the first chamber.

Description

Substrate processing system

The present application is a divisional application of patent application entitled "substrate processing System and substrate transfer method" having application date of 2018, 4, 13, and application number of 201810328229.6.

Technical Field

The present application relates to a substrate processing system.

Background

The manufacturing process of the display device includes a plurality of unit processes different from each other, wherein each unit process is generally performed in a different space from each other. Therefore, in the case of manufacturing a display device using a substrate, the substrate is moved to each space isolated from each other to perform a unit process.

One large substrate may be put into each process chamber (Processing Chamber) in which each unit process is performed as described above, and a deposition process or the like may be performed on the large substrate.

Recently, as the size of the manufactured display device is diversified, the size of the substrate put into the deposition process is also diversified. For example, a substrate corresponding to half the size of a large substrate may be used instead of the conventional large substrate.

However, when such a half-sized substrate is put into the process chamber, a space for the process chamber is unnecessarily left, or design changes such as manufacturing a new process chamber for the half-sized substrate are required.

Disclosure of Invention

The present application provides a plurality of substrate processing systems capable of processing a plurality of substrates in one process chamber by using a conventional process chamber for a large-sized substrate.

The present application also provides a substrate transfer method for transferring at least two substrates from a cassette for transferring and storing substrates into a chamber.

A substrate processing system according to an embodiment of the present application may include: a first chamber for simultaneously carrying in or out at least two substrates; a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced apart manner; a plurality of second chambers for processing the at least two substrates aligned in the first chamber; and a substrate transfer unit that transfers the at least two substrates aligned from the first chamber to the second chamber or from the second chamber to the first chamber.

The at least two substrates include a first substrate and a second substrate, and the first substrate may include: a first side surface parallel to the first direction and positioned on the upper side of the first substrate; a second side surface parallel to the first side surface and positioned at the lower side of the first substrate; and third and fourth sides parallel to a second direction crossing the first direction, the second substrate may include: a fifth side surface parallel to the first direction and located on the upper side of the second substrate; a sixth side surface parallel to the fifth side surface and positioned at the lower side of the second substrate; a seventh side surface parallel to the second direction and facing the third side surface of the first substrate, and an eighth side surface parallel to the seventh side surface.

The substrate alignment unit may include: a substrate support table supporting a first substrate and a second substrate of the at least two substrates arranged to be spaced apart from each other in the first direction; a plurality of corner support portions that support corners of the first substrate and the second substrate on both end sides in the first direction; and a plurality of interval adjusting parts capable of moving along the second direction and inserted into a space between the first substrate and the second substrate, thereby pushing the first substrate and the second substrate to the sides of the plurality of corner supporting parts contacting the first substrate and the second substrate, respectively.

The plurality of interval adjustment parts may include: a first interval adjusting part capable of being inserted into the space between the first substrate and the second substrate from top to bottom in the second direction; and a second interval adjusting part capable of being inserted into the space from bottom to top in the second direction.

The first interval adjusting part may include: a first body; a first substrate side surface support table disposed on the first body so as to be spaced apart from each other in the first direction and capable of being in contact with a first side surface of the first substrate and a fifth side surface of the second substrate, respectively; and a first interval expansion part rotatably coupled to the first body and capable of simultaneously pushing the third side of the first substrate and the seventh side of the second substrate.

The second interval adjusting part may include: a second body; a second substrate side support stand disposed on the second body to be spaced apart from each other in the first direction and capable of being in contact with a second side of the first substrate and a sixth side of the second substrate, respectively; and a second interval expansion part rotatably coupled to the second body and capable of simultaneously pushing the third side of the first substrate and the seventh side of the second substrate.

The first interval expansion part and the second interval expansion part may include a pair of rod-shaped members spaced apart at a predetermined interval.

The pair of rod members may comprise rubber, silicone or polyurethane.

Each of the corner support parts may have a shape corresponding to the corners of the first and second substrates.

The substrate transfer unit may include: a first support bar supporting the at least two substrates; and a first driving part coupled to the first support bar and moving the first support bar.

The substrate processing system may further include: a cassette storing the at least two substrates transferred to the first chamber; and a transfer unit that transfers the at least two substrates from the cassette to the first chamber.

The conveying section may include: a plurality of second support bars supporting the at least two substrates arranged parallel to each other and extending in a direction; and a second driving part coupled to the plurality of second support bars and moving the plurality of second support bars.

Each of the second support bars may have a seating groove to seat the at least two substrates.

The plurality of corner supports may be in contact with or separated from the corners of the first and second substrates.

The first chamber may be aligned with the plurality of second chambers along a virtual line of the ring shape.

According to the substrate transfer method of an embodiment of the present application, transferring two substrates simultaneously from a cassette including a plurality of receiving slots to a first chamber may include the steps of: confirming whether the two substrates are arranged in one of the plurality of receiving grooves; placing the two substrates on a support bar of a conveying part in a state that the two substrates are arranged in the one storage groove, and then conveying the two substrates to the first chamber; and in a case where one substrate is arranged in the one accommodation groove, after the other substrate is arranged in the one accommodation groove, placing the two substrates on the support bar, and then carrying the two substrates to the first chamber.

The step of disposing the other substrate in the one receiving groove may include the steps of: and confirming whether the one substrate is located inside the one receiving groove or outside the one receiving groove.

The step of disposing the other substrate in the one receiving groove may include the steps of: in a case where the one substrate is located inside the one receiving groove, the other substrate is disposed outside the receiving groove.

The step of disposing the other substrate in the one receiving groove may include the steps of: in a case where the one substrate is located outside the one receiving groove, the one substrate disposed at the outside is moved to the inside of the one receiving groove, and the other substrate is disposed at the outside of the receiving groove.

In the case where the one receiving groove is arranged with the one substrate, the one substrate may be a substrate for deposition, and the additional other substrate may be a dummy substrate.

With the substrate processing system described above, a plurality of substrates can be simultaneously processed in a process chamber for a conventional large-sized substrate.

At least two substrates are simultaneously transferred from the cassette into the chamber by the substrate transfer method.

Drawings

Fig. 1 is a diagram schematically illustrating a substrate processing system according to an embodiment of the present application.

Fig. 2 is a schematic perspective view of the cassette and the conveying section of fig. 1.

Fig. 3 is a diagram illustrating a state in which two substrates are placed on the conveying unit of fig. 1.

Fig. 4 to 8 are views for explaining a process of transferring two substrates from a cassette to a first chamber by a transfer unit.

Fig. 9 to 15 are diagrams for explaining a process of transferring two substrates from a cassette to a second chamber.

Fig. 16 to 19 are diagrams illustrating a process in which two substrates are aligned by a substrate alignment unit.

Fig. 20 is a perspective view schematically illustrating the interval adjusting part of fig. 16.

Fig. 21 is a view schematically illustrating a corner support portion of fig. 16.

Fig. 22 is a diagram for explaining a process in which a substrate support table on which two substrates aligned are placed is moved.

Fig. 23 and 24 are views showing a substrate support table on which two substrates aligned are placed, provided with a stopper.

Symbol description

100: box 300: conveying part

500: processing space 510: first chamber

520. 530, 540, 560, 570: a second chamber

511: substrate support table

710. 720, 730, 740: multiple corner supports

750: first interval adjustment portion 751: a first main body

753: first spacing expansion portion 755: first substrate side support table

760: second interval adjusting part

Detailed Description

Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those having ordinary skill in the art to which the present application pertains can easily implement the present application. The present application may be embodied in many different forms and is not limited to the embodiments described in this specification. For the purpose of clearly explaining the present application, parts irrelevant to the explanation are omitted in the drawings, and the same or similar constituent elements are given the same reference numerals throughout the specification.

The size and thickness of each constituent element in the drawings are arbitrarily shown for convenience of explanation, and therefore the present application is not necessarily limited to what is shown in the drawings.

Thicknesses are shown enlarged to more clearly represent the various layers and regions in the drawings. And in the drawings, the thickness of a portion of layers and regions are exaggeratedly illustrated for ease of illustration. When a layer, film, region, sheet, or the like is referred to as being "over" or "on" other portions, it is intended to include not only the case where it is "directly over" the other portions, but also the case where another portion is interposed therebetween.

In the present specification, when a certain component is referred to as "including" a certain component, unless otherwise stated, the other component is not excluded, but it is meant that the other component may be included. Throughout the specification, "on … …" means on the upper side or the lower side of the target portion, and does not mean necessarily on the upper side with reference to the gravitational direction.

Hereinafter, a substrate processing system according to an embodiment of the present application will be described with reference to fig. 1 to 3.

Fig. 1 is a diagram schematically illustrating a substrate processing system according to an embodiment of the present application, fig. 2 is a schematic perspective view of the cassette and the transfer section of fig. 1, and fig. 3 is a diagram illustrating a state in which two substrates are placed in the transfer section of fig. 1.

Referring to fig. 1 to 3, the substrate processing system of the present embodiment may include a cassette 100, a transfer part 300, a first chamber 510, a second chamber 520, 530, 540, 560, 570, a substrate alignment unit 710, 720, 730, 740, 750, 760 (refer to fig. 16), and a substrate transfer unit 580. In the present embodiment, the two substrates S1, S2 may be simultaneously transferred from the cassette 100 to the first chamber 510 as the load lock chamber (Load lock chamber), and after the two substrates S1, S2 are aligned in the first chamber 510, the two substrates S1, S2 are simultaneously transferred to the second chambers 520, 530, 540, 560, 570 as the process chambers.

Referring to fig. 2 and 3, the cassette 100 stores a plurality of substrates, and the cassette 100 includes a plurality of storage grooves in which the substrates S1 and S2 are placed, and the plurality of storage grooves may be aligned in a vertical direction. In the present embodiment, two substrates S1 and S2 are placed in each storage groove. The two substrates S1 and S2 placed in the respective storage tanks can be simultaneously transferred to the first chamber 510 by the transfer unit 300.

At this time, the transfer unit 300 is configured to simultaneously transfer the two substrates S1 and S2 from the cassette 100 to the first chamber 510, and may include a plurality of second support bars 310 and a second driving unit 350. The plurality of second support bars 310 simultaneously support the two substrates S1, S2, and the plurality of second support bars 310 may be bar-shaped members extending in one direction. The plurality of second support bars 310 may be arranged to be spaced apart from each other at predetermined intervals.

A plurality of seating grooves are formed at the plurality of second support bars 310, respectively, to make the two substrates inactive during movement. Since the two substrates are disposed in the plurality of disposition grooves, the two substrates are not movable in movement.

In the present embodiment, the plurality of protrusions 330, 331, 333, 335 coupled to the plurality of second support bars 310 may have a stepped seating groove. At this time, the plurality of protrusions 330, 331, 333, 335 may be formed integrally with the plurality of second support bars 310.

In addition, the second driving part 350 may move the second support bar 310, on which two substrates are placed, from the cassette 100 to the first chamber 510. The second driving part 350 may move the second support bar 310 in the up-down direction in order to move the second support bar 310 to a desired receiving groove of the cassette 100. The second driving unit 350 may rotate the second support bar 310 or move the second support bar 310 in the horizontal direction.

Referring again to fig. 1, the two substrates S1, S2 transferred by the transfer unit 300 can be moved to the processing space 500 where the first and second chambers 520, 530, 540, 560, 570 are disposed. The processing space 500 may be a virtual space for performing various processes such as deposition and etching on the substrates S1 and S2 carried from the outside.

The first chamber 510 of the processing space 500 may be a chamber into which the substrates S1 and S2 carried into the processing space 500 from the outside are put. At this time, the first chamber 510 may be a load lock chamber. The substrates S1 and S2 carried in from the outside may be carried into the other second chambers 520, 530, 540, 560, 570 as process chambers through the first chamber 510. The first chamber 510 may carry out the substrates S1 and S2, which have been processed in the second chambers 520, 530, 540, 560, and 570, to the outside. In the present embodiment, the first chamber 510 is not limited to this, and the substrates S1 and S2 may be carried in from the outside only, and the substrates S1 and S2 may be carried out from the other chambers.

The second chambers 520, 530, 540, 560, 570 may be used as process chambers, and a process of depositing a deposition material on the substrates S1, S2 carried from the first chamber 510, and etching the deposition material in a predetermined pattern to form a predetermined pattern may be performed.

At this time, the substrate transfer unit 580 may perform a process of transferring the substrates S1, S2 from the first chamber 510 to the second chambers 520, 530, 540, 560, 570. The substrate transfer unit 580 may include a first support bar 582 and a first driving part 581. The first support rod 582 is a rod (bar) shaped member extending in a direction, and may simultaneously support the two substrates S1, S2 aligned in the first chamber 510. The first driving part 581 may move the first support bar 582, on which two substrates are placed, from the first chamber 510 to the second chambers 520, 530, 540, 560, 570 arranged at specific positions. The first driving unit 581 is movable in the up-down direction and the horizontal direction, and is also rotatable.

Hereinafter, a process of simultaneously transferring two substrates S1, S2 from the cassette 100 to the first chamber 510 will be described with reference to fig. 4 to 8.

The second support bar 310 (see fig. 3) of the conveying unit 300 can simultaneously support the two substrates S1 and S2 in the storage groove of the cassette 100 (see fig. 1) and convey the two substrates S1 and S2 to the first chamber 510. However, when the two substrates S1 and S2 are not placed in the storage groove of the cassette 100 (see fig. 1), that is, when only one substrate is placed in the storage groove, one substrate is additionally placed in the storage groove, and then the second support bar 310 (see fig. 3) simultaneously moves the two substrates.

Substrates to be carried into the first chamber 510 (see fig. 1) are placed in each storage groove of the cassette 100 (see fig. 1), and in some cases, only one substrate is placed in one storage groove instead of two substrates.

At this time, if the second support bar 310 (see fig. 3) moves only one substrate disposed in the receiving groove to the first chamber 510 (see fig. 1), only one substrate is moved to the second chambers 520, 530, 540, 560, 570 (see fig. 1). Only one substrate should be placed in the second chamber 520, 530, 540, 560, 570 (refer to fig. 1) in which two substrates should be placed to perform a deposition process or the like. Finally, the second chambers 520, 530, 540, 560, 570 (see fig. 1) may perform a deposition process or the like in a state where one substrate position is left.

As described above, if a free position is generated in the second chamber 520, 530, 540, 560, 570 (see fig. 1), the flow (flow) of the deposition material may be affected, and thus the deposition of the substrate placed in the second chamber 520, 530, 540, 560, 570 (see fig. 1) may be affected.

In the present embodiment, in order to prevent one substrate from being carried into the second chambers 520, 530, 540, 560, 570 (see fig. 1), that is, in order to put the two substrates S1, S2 into the second chambers 520, 530, 540, 560, 570 (see fig. 1), the two substrates are placed in the respective storage grooves of the cassette 100 (see fig. 1) before the substrates are carried into the first chamber 510 (see fig. 1).

For this reason, in the present embodiment, it is first confirmed whether or not two substrates are arranged in the storage groove of the cassette 100 (refer to fig. 1).

As shown in fig. 4, when one substrate S is placed in the storage groove of the cassette 100 (see fig. 1), the other substrate S is additionally placed, and then, both substrates are transferred to the first chamber 510 (see fig. 1).

Before another substrate is additionally placed, it is confirmed whether the substrate S placed in the storage groove of the cassette 100 (see fig. 1) is located at the inner side I or the outer side II of the storage groove. Here, the positions of the inner side I and the outer side II close to the entrance where the substrate is put into the storage groove correspond to the outer side II, and the positions of the substrate far from the entrance of the storage groove correspond to the inner side I.

Referring to fig. 4 and 5, when the substrate S is disposed on the inner side I of the storage groove, another substrate D is additionally disposed on the outer side II of the storage groove. In this case, the substrate D added to the outer side II may be the same substrate for deposition as the substrate disposed on the inner side I, or may be a dummy (dummy) substrate.

Unlike fig. 4, when the substrate is placed on the outer side II of the storage groove, the additional substrate D is not directly placed on the inner side I of the storage groove. As shown in fig. 7, if the additional substrate D is directly placed on the inner side I of the storage groove, the second support bar 310 (see fig. 3) of the conveying unit 300 may break the substrate S placed on the outer side II during the placement of the substrate D.

In order to prevent this, the substrate S placed on the outer side II of the storage groove is moved to the inner side I of the storage groove, and then an additional substrate D is additionally placed on the outer side II of the storage groove. Through the same process as described above, the substrate S, D is placed on both the inner side I and the outer side II of the receiving groove. After that, the two substrates placed in the storage groove are transferred to the first chamber 510 (see fig. 1).

If the substrates S1 and S2 are placed on the inner side I and the outer side II of the storage slot in the case 100 (see fig. 1), respectively, during the process of confirming whether or not the two substrates are placed in the storage slot, as shown in fig. 8, the second support bar 310 (see fig. 3) of the transport unit 300 simultaneously transports the two substrates to the first chamber 510 (see fig. 1) without going through the process of adding the substrates.

Referring to fig. 9 to 12, when all of the two substrates S1 and S2 are placed in the storage groove, the two substrates S1 and S2 are transferred to the first chamber 510 by the transfer unit 300. In fig. 9 to 12, the case where the substrates S1, S2 are all substrates for deposition is illustrated. However, the present application is not limited thereto, and one of the two substrates may be a dummy substrate.

Next, as shown in fig. 12, if two substrates S1, S2 are placed in the first chamber 510, the substrate alignment units 710, 720, 730, 740, 750, 760 (refer to fig. 16) may align the two substrates S1, S2 in the first chamber 510. The substrate alignment units 710, 720, 730, 740, 750, 760 (refer to fig. 16) are disposed within the first chamber 510 such that the two substrates S1, S2 are aligned in a predetermined spaced apart manner. As for the process of aligning the two substrates S1, S2 by the substrate alignment units 710, 720, 730, 740, 750, 760 (refer to fig. 16), description will be made hereinafter with reference to fig. 16 to 21.

If the alignment of the two substrates S1, S2 is completed in the first chamber 510, the two substrates S1, S2 may be simultaneously transferred to the second chambers 520, 530, 540, 560, 570 as shown in fig. 13 to 15. Here, the second chambers 520, 530, 540, 560, 570 are process chambers that perform deposition or etching processes and the like as described above. In the present embodiment, the deposition process may be performed by putting two substrates S1 and S2 into the second chambers 520, 530, 540, 560, 570 where the deposition process is performed on one large substrate in the past. The substrates S1, S2 applied in the present embodiment may be half the size of the existing large substrate. That is, according to the present embodiment, the second chambers 520, 530, 540, 560, 570 that were used for one large substrate may be used for a deposition process of a plurality of substrates smaller than the size of the large substrate.

In addition, a plurality of second chambers 520, 530, 540, 560, 570 may be disposed within the processing space 500. The second chambers 520, 530, 540, 560, 570 disposed in the processing space 500 may be subjected to different processes from each other, respectively. At this time, the plurality of second chambers 520, 530, 540, 560, 570 and the first chamber 510 may be arranged along a virtual line of the ring shape within the processing space 500.

At this time, the substrate transfer unit 580 disposed in the processing space 500 may transfer the two substrates S1, S2 to the second chambers 520, 530, 540, 560, 570. The substrate transfer unit 580 may include a plurality of first support bars 582 and a first driving part 581. The plurality of first support rods 582 may simultaneously support the two substrates S1, S2, and the plurality of first support rods 582 are rod (bar) shaped members extending in one direction. The plurality of first support rods 582 may be arranged to be spaced apart from each other at a predetermined interval. At this time, when the plurality of first support rods 582 transfer the two substrates S1, S2 to the second chambers 520, 530, 540, 560, 570, the plurality of first support rods 582 may lift the substrate support table 511 (see fig. 16) on which the aligned two substrates S1, S2 are placed to transfer the substrates S1, S2, or the plurality of first support rods 582 may directly lift the two substrates S1, S2 to transfer the substrates S1, S2.

The first driving unit 581 may move the first support rod 582 with the two substrates placed therein from the first chamber 510 to the second chambers 520, 530, 540, 560, 570. The first driving unit 581 may move the first support rod 582 in the up-down direction or the horizontal direction, and may rotate the first support rod 582, similarly to the second driving unit 350 of the conveying unit 300.

Hereinafter, a process of aligning the two substrates S1, S2 by the substrate alignment units 710, 720, 730, 740, 750, 760 in the first chamber 510 will be specifically described with reference to fig. 16 to 21.

Fig. 16 to 19 are views for explaining a process of aligning two substrates by the substrate alignment unit, fig. 20 is a perspective view schematically illustrating the interval adjusting part of fig. 16, and fig. 21 is a view schematically illustrating the corner supporting part of fig. 16.

Referring to fig. 16, the substrate alignment unit may include a substrate support table 511, a plurality of corner support portions 710, 720, 730, 740, a first interval adjustment portion 750, and a second interval adjustment portion 760.

The substrate support 511 may support two substrates S1, S2 transferred from the cassette 100. The substrate support 511 may have a plate shape having a quadrangular plane.

In the present embodiment, the two substrates S1, S2 are arranged on the substrate support table 511 with a space therebetween, and the two substrates S1, S2 are arranged on the substrate support table 511 with a space therebetween maintained in the storage groove. In the following description, for convenience of description, a substrate disposed on the left side in the first direction (X-axis direction) when viewing fig. 16 from the plane is referred to as a first substrate S1, and a substrate disposed on the right side in the first direction (X-axis direction) is referred to as a second substrate S2.

In addition, a plurality of corner supporting parts 710, 720, 730, 740 may be disposed at corners of the first and second substrates S1 and S2. More specifically, as shown in fig. 16, corner supports 710, 720 may be disposed at the left side corner of the first substrate S1, and corner supports 730, 740 may be disposed at the right side corner of the second substrate S2.

At this time, when the first substrate S1 is pushed to the left by the first interval adjusting part 750 and the second interval adjusting part 760, the corner supporting parts 710 and 720 can prevent the first substrate S1 from moving to the left and fix the left corner of the first substrate S1 at a predetermined position. When the first and second interval adjusting parts 750 and 760 push the second substrate S2 to the right, the corner supporting parts 730 and 740 can prevent the second substrate S2 from moving to the right and fix the right corner of the second substrate S2 at a predetermined position.

Referring to fig. 17, the plurality of corner supports 710, 720, 730, 740 may be moved to predetermined positions. Here, the predetermined position may indicate a position where corners of the first substrate S1 and the second substrate S2 should be located when the interval adjustment of the first substrate S1 and the second substrate S2 is completed. In fig. 17, the corners of the first and second substrates S1 and S2 are brought into contact with each other by the plurality of corner support portions 710, 720, 730, 740, but may not be brought into contact with each other.

As shown in fig. 17, when the plurality of corner support portions 710, 720, 730, 740 are placed at predetermined positions, the plurality of corner support portions 710, 720, 730, 740 are fixed until the adjustment of the spacing between the first substrate S1 and the second substrate S2 is completed.

Referring to fig. 18 and 19, if the plurality of corner supporting parts 710, 720, 730, 740 are placed at predetermined positions, the first and second interval adjusting parts 750, 760 may be inserted into a space between the first and second substrates S1, S2 facing each other. At this time, the first and second interval adjusting parts 750 and 760 may push the first and second substrates S1 and S2 toward the corner sides of the first and second substrates S1 and S2, respectively. More specifically, the first and second interval adjusting parts 750 and 760 may push the first substrate S1 to the left and the second substrate S2 to the right. Further, the left side corner of the first substrate S1 is abutted against the corner support portions 710, 720, and the right side corner of the second substrate S2 is abutted against the corner support portions 730, 740.

In the present embodiment, the first interval adjusting part 750 may be inserted into a space between the first substrate S1 and the second substrate S2 from top to bottom in the second direction (Y direction). Also, the second interval adjusting part 760 may be inserted into a space between the first and second substrates S1 and S2 from bottom to top in the second direction (Y direction).

The first interval adjusting portion 750 may include a first body 751, a first substrate side support stand 755, and a first interval expanding portion 753. The second interval adjusting portion 760 may include a second body 761, a second substrate side support table 765, and a second interval expanding portion 763.

The first substrate side support 755 is coupled to the first body 751 and may be in contact with the first side P1 of the first substrate S1 and the fifth side P5 of the second substrate. The second substrate side support 765 is coupled to the second body 761 and can be in contact with the second side P2 of the first substrate S1 and the sixth side P6 of the second substrate. When the first and second interval adjusting parts 750 and 760 are activated, the first and second substrate side support tables 755 and 765 can prevent the first and second substrates S1 and S2 from moving upward or downward in the second direction (Y direction). For convenience of explanation in the present specification, the first substrate S1 includes a first side P1 located at an upper side, a second side P2 located at a lower side, a third side P3 located at a right side, and a fourth side P4 located at a left side when viewing fig. 18 from a plane. The second substrate S2 is described as including the fifth side surface P5 on the upper side, the sixth side surface P6 on the lower side, the seventh side surface P7 on the left side, and the eighth side surface P8 on the right side.

At this time, the first interval expansion portion 753 is rotatably coupled to the first body 751, so that the third side P3 of the first substrate and the seventh side P7 of the second substrate S2 can be simultaneously pushed. In the same manner, the second interval expansion portion 763 is rotatably coupled to the second body 761, so that the third side surface P3 of the first substrate and the seventh side surface P7 of the second substrate S2 can be simultaneously pushed. That is, the first and second space expanding portions 753 and 763 may push the third side surface P3 of the first substrate to the left and the seventh side surface P7 of the second substrate S2 to the right.

In the present embodiment, the first and second spacing expansion parts 753 and 763 may include a pair of rod-shaped members spaced apart at a predetermined interval. When the first space expanding portion 753 is initially inserted into the space between the third side surface P3 of the first substrate and the seventh side surface P7 of the second substrate S2, a pair of rod-shaped members are aligned in parallel with the second direction (Y direction). Next, as shown in fig. 19, the first space expansion portion 753 and the second space expansion portion 763 are rotated, and the pair of rod-shaped members are aligned parallel to the first direction (X direction). Further, the first and second space expanding portions 753 and 763 can simultaneously push the third side surface P3 of the first substrate and the seventh side surface P7 of the second substrate S2.

Referring to fig. 20, the first substrate side support block 755 may include a pair of bar-type members. However, the first substrate side support 755 is not limited thereto, and may be formed using one extended plate shape.

In addition, a pair of rod-shaped members of the first interval expansion portion 753 may be disposed on the first rotating plate 753 c. According to the rotation of the first rotating plate 753c, a pair of lever-type members may be arranged in parallel with the first direction (X direction) or in parallel with the second direction (Y direction). At this time, the first rotating plate 753c may be controlled by a motor. The motor to which the present embodiment is applied may be a servo motor. However, the first rotary plate 753c is not limited thereto, and a link member may be coupled between the first rotary plate 753c and the motor.

The pair of rod-shaped members of the first spacing expansion part 753 may include rubber, silica gel, or polyurethane. However, the material of the pair of rod members is not limited thereto, and may be formed of a soft (soft) material so as to avoid breakage of the first and second substrates S1 and S2 in contact with the pair of rod members. The second space expansion portion 763 has the same configuration as the first space expansion portion 753, and therefore, a detailed description thereof will be omitted.

Referring to fig. 21, the corner support 730 may have a shape corresponding to a corner of the contacted second substrate S2. In the present embodiment, the corner support 730 may have a shape bent at 90 degrees corresponding to the corner of the contacted second substrate S2. In addition, the corner support portion 730 may be coupled to the plurality of link members 820, 830 and the driving portion 810. As shown in fig. 16, after the first substrate S1 and the second substrate S2 are placed on the substrate support table 511 of the first chamber 510, the corner support 730 moves to a predetermined position. As described above, the plurality of link members 820 and 830 and the driving part 810 can move the corner support part 730 to a predetermined position.

When the first substrate S1 and the second substrate S2 are aligned in the first chamber 510 by the substrate alignment units 710, 720, 730, 740, 750, 760 (see fig. 16), the substrates can be transferred to the second chambers 520, 530, 540, 560, 570 in an aligned state by the substrate transfer unit 580 as shown in fig. 22.

Referring to fig. 23 and 24, in the present embodiment, before the aligned first and second substrates S1 and S2 are transferred to the second chambers 520, 530, 540, 560, 570, barrier portions 610, 611, 613 may be disposed around the first and second substrates S1 and S2. The blocking portions 610, 611, 613 may be disposed along the circumference of the first and second substrates S1, S2 when viewing fig. 23 from a plane. When the first and second substrates S1 and S2 perform a deposition process using plasma in the second chambers 520, 530, 540, 560, 570 (see fig. 13), the sides of the first and second substrates S1 and S2 may be affected by the plasma. Due to such plasma, the first substrate S1 and the second substrate S2 may be damaged. That is, in the present embodiment, the barrier portions 610, 611, 613 are disposed around the first and second substrates S1, S2, so that damage to the side surfaces of the first and second substrates S1, S2 caused by plasma can be minimized.

As described above, the present application has been described by way of the defined embodiments and the accompanying drawings, but the present application is not limited thereto, and a person having ordinary skill in the art to which the present application pertains may make various modifications and variations within the technical spirit of the present application and the scope of equivalents of the claims.

Claims

1. A substrate processing system, comprising:

a first chamber for simultaneously carrying in or out at least two substrates;

a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced apart manner;

a plurality of second chambers for processing the at least two substrates aligned in the first chamber; and

a substrate transfer unit that transfers the at least two substrates aligned from the first chamber to the second chamber,

wherein the substrate alignment unit includes:

a substrate support table supporting a first substrate and a second substrate of the at least two substrates arranged to be spaced apart from each other in a first direction;

a first corner support portion supporting a corner of the first substrate;

a second corner support part supporting a corner of the second substrate; and

a space expansion part capable of moving along a second direction and inserted into a space between the first substrate and the second substrate, capable of pushing one side surface of the first substrate and one side surface of the second substrate simultaneously by rotating,

the first direction is a direction parallel to one of the plurality of sides of the first substrate or the second substrate,

the second direction is a direction intersecting the first direction in a horizontal plane and parallel to the other side not parallel to the one side.

2. The substrate processing system of claim 1, wherein,

the first corner support portion and the second corner support portion have shapes corresponding to the corners of the first substrate and the second substrate, respectively.

3. The substrate processing system of claim 1, wherein,

the substrate transfer unit includes:

a first support bar supporting the at least two substrates; and

the first driving part is combined with the first supporting rod and moves the first supporting rod.

4. The substrate processing system of claim 1, further comprising:

a cassette storing the at least two substrates transferred to the first chamber; and

and a transfer unit that transfers the at least two substrates from the cassette to the first chamber.

5. The substrate processing system of claim 4, wherein,

the conveying section includes:

a plurality of second support bars supporting the at least two substrates arranged parallel to each other and extending in a direction; and

and the second driving part is combined with the plurality of second supporting rods and moves the second supporting rods.

6. The substrate processing system of claim 5, wherein,

the number of the second support rods is more than two.

7. The substrate processing system of claim 5, wherein,

the plurality of second support rods have a length greater than a total length of the at least two substrates.

8. The substrate processing system of claim 1, wherein,

the first chamber and the plurality of second chambers are arranged along a virtual line of the ring shape.

9. The substrate processing system of claim 1, wherein the substrate alignment unit further comprises: a substrate side support stand adjacent to the space expanding portion and capable of being in contact with a side surface of the first substrate or a side surface of the second substrate, respectively.

10. The substrate processing system of claim 9, wherein,

the substrate alignment unit further includes: and a main body formed with the space expanding portion and the substrate side support table.

11. The substrate processing system of claim 10, wherein,

the interval expansion part protrudes from the main body so as to have a structure capable of pushing one side of the first substrate and one side of the second substrate simultaneously.

12. The substrate processing system of claim 1, wherein,

the first corner support portion or the second corner support portion is connected to a link member and operated by a driving portion connected to the link member.

13. The substrate processing system of claim 1, further comprising:

a substrate support table for placing the first substrate and the second substrate,

wherein the substrate support table comprises: and the blocking part is positioned around the first substrate and the second substrate.

14. The substrate processing system of claim 1, further comprising:

a pair of substrate side support tables adjacent to the space expansion section and capable of contacting the side surfaces of the first substrate and the second substrate, respectively; and

a T-shaped main body formed with the spacing expansion part and the pair of substrate side support tables and having a linear part and a protruding part,

wherein the spacing expansion portion is located at the protruding portion, and the pair of substrate side support tables is located at the linear portion.

15. A substrate processing system for simultaneously carrying in and out a first substrate and a second substrate, comprising:

a substrate alignment unit for aligning the first substrate and the second substrate at a predetermined interval,

wherein the substrate alignment unit includes:

a first corner support portion supporting a corner of the first substrate;

a second corner support part supporting a corner of the second substrate; and

a space adjusting part inserted into a space between the first substrate and the second substrate to adjust a space between the first substrate and the second substrate,

the interval adjusting part includes: and a space expansion part capable of pushing one side surface of the first substrate and one side surface of the second substrate simultaneously.

16. The substrate processing system of claim 15, wherein,

17. The substrate processing system of claim 15, further comprising:

and a conveying part for conveying at least two substrates.

18. The substrate processing system of claim 17, wherein,

the conveying section includes:

a plurality of support bars supporting the at least two substrates arranged parallel to each other and extending in a direction; and

and a driving part coupled to the plurality of support bars and moving the plurality of support bars.

19. The substrate processing system of claim 18, wherein,

the number of the support rods is more than two.

20. The substrate processing system of claim 18, wherein,

the plurality of support rods have a length greater than a total length of the at least two substrates.

21. The substrate processing system of claim 15, wherein,

the interval adjusting part further includes: a substrate side support stand adjacent to the space expanding portion and capable of being in contact with a side surface of the first substrate or a side surface of the second substrate, respectively.

22. The substrate processing system of claim 21, wherein,

the interval adjusting part further includes: and a main body formed with the space expanding portion and the substrate side support table.

23. The substrate processing system of claim 22, wherein,

24. The substrate processing system of claim 15, wherein,

25. The substrate processing system of claim 15, further comprising:

26. The substrate processing system of any of claims 21 to 25, wherein,

the interval adjusting part is rotatably formed.

27. The substrate processing system of claim 15, wherein,

the interval adjusting part further includes: