CN111554596A

CN111554596A - Substrate processing system

Info

Publication number: CN111554596A
Application number: CN202010423471.9A
Authority: CN
Inventors: 张志皇
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2017-04-13
Filing date: 2018-04-13
Publication date: 2020-08-18
Also published as: CN111564389A; KR20180115839A; CN111554597B; CN108735625A; CN111554597A; KR101970780B1; CN117038520A; CN111564389B; CN108735625B

Abstract

The present invention relates to a substrate processing system. A substrate processing system according to an embodiment of the present invention may include: a first chamber for simultaneously carrying in and out at least two substrates; a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced-apart manner; a plurality of second chambers processing the at least two substrates aligned in the first chamber; and a substrate transfer unit transferring the at least two aligned substrates from the first chamber to the second chamber or from the second chamber to the first chamber.

Description

Substrate processing system

The present application is a divisional application of patent applications entitled "substrate processing system and substrate transfer method" with an application date of 2018, 4/13/2018 and an application number of 201810328229.6.

Technical Field

The present invention relates to a substrate processing system.

Background

The manufacturing process of the display device includes a plurality of unit processes different from each other, wherein each unit process is generally performed in a space different from each other. Therefore, in the case of manufacturing a display device using a substrate, the substrate is moved to each of the spaces isolated from each other to perform the unit process.

One large substrate may be put into each process Chamber (Processing Chamber) in which each unit process is performed as described above, and a deposition process or the like may be performed on the large substrate.

Recently, as the size of display devices to be manufactured is diversified, the size of a substrate to be put into a deposition process is also diversified. For example, a substrate half the size of a large substrate may be used instead of a conventional large substrate.

However, when such a half-sized substrate is loaded into the process chamber, a space of the process chamber is unnecessarily left, or a design change such as manufacturing a new process chamber for the half-sized substrate is required.

Disclosure of Invention

The present invention provides a plurality of substrate processing systems capable of processing a plurality of substrates in one process chamber by using a conventional process chamber for a large substrate.

The present invention also provides a substrate transfer method for transferring at least two substrates from a cassette for transferring and storing the substrates into a chamber.

A substrate processing system according to an embodiment of the present invention may include: a first chamber for simultaneously carrying in and out at least two substrates; a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced-apart manner; a plurality of second chambers processing the at least two substrates aligned in the first chamber; and a substrate transfer unit transferring the at least two aligned substrates from the first chamber to the second chamber or from the second chamber to the first chamber.

The at least two substrates include a first substrate and a second substrate, and the first substrate may include: a first side surface parallel to the first direction and located on an upper side of the first substrate; a second side surface parallel to the first side surface and located at a lower side of the first substrate; and third and fourth sides parallel to a second direction crossing the first direction, the second substrate may include: a fifth side surface parallel to the first direction and located on an upper side of the second substrate; a sixth side surface parallel to the fifth side surface and located at a lower side of the second substrate; a seventh side parallel to the second direction and facing the third side of the first substrate, and an eighth side parallel to the seventh side.

The substrate alignment unit may include: a substrate support table supporting a first substrate and a second substrate among the at least two substrates arranged to be spaced apart from each other in the first direction; a plurality of corner supporting parts supporting corners of the first and second substrates at both end sides in the first direction; and a plurality of interval adjusting parts which can move along the second direction and are inserted into the space between the first substrate and the second substrate, so as to push the first substrate and the second substrate to the side of the plurality of corner supporting parts contacting with the first substrate and the second substrate, respectively.

The plurality of interval adjusting parts may include: a first interval adjusting part which can be inserted into the space between the first substrate and the second substrate from top to bottom along the second direction; and a second interval adjusting part which can be inserted into the space from the bottom to the top along the second direction.

The first interval adjusting part may include: a first body; first substrate side support tables which are arranged on the first body to be spaced apart from each other in the first direction and are capable of contacting the first side of the first substrate and the fifth side of the second substrate, respectively; and a first interval expansion part rotatably coupled to the first body and capable of simultaneously pushing the third side surface of the first substrate and the seventh side surface of the second substrate.

The second interval adjusting part may include: a second body; a second substrate side support table disposed on the second body to be spaced apart from each other in the first direction and capable of contacting the second side of the first substrate and the sixth side of the second substrate, respectively; and a second interval expansion part rotatably coupled to the second body and capable of simultaneously pushing the third side surface of the first substrate and the seventh side surface of the second substrate.

The first and second interval-expanded portions may include a pair of rod-shaped members spaced apart at a predetermined interval.

The pair of rod-shaped members may comprise rubber, silicone or polyurethane.

Each of the corner supporting parts may have a shape corresponding to the corners of the first and second substrates.

The substrate carrying unit may include: a first support bar supporting the at least two substrates; and a first driving part which is combined with the first supporting rod and moves the first supporting rod.

The substrate processing system may further include: a cassette for storing the at least two substrates transferred to the first chamber; and a transfer part which transfers the at least two substrates from the cassette to the first chamber.

The carrying section may include: a plurality of second support bars supporting the at least two substrates arranged in parallel with each other and extending in one direction; and a second driving part combined with the plurality of second support rods and moving the plurality of second support rods.

Each of the second support bars may have a seating groove in which the at least two base plates are seated.

The plurality of corner supporting parts may be in contact with or separated from the corners of the first and second substrates.

The first chamber may be arranged along a virtual line of a ring shape with the plurality of second chambers.

According to an embodiment of the present invention, a substrate transfer method for simultaneously transferring two substrates from a cassette including a plurality of receiving slots to a first chamber may include: confirming whether the two substrates are arranged in one of the plurality of accommodating grooves; placing the two substrates on a support bar of a carrying part under the condition that the two substrates are arranged in the one accommodating groove, and carrying the two substrates to the first chamber; and placing the two substrates on the support bar after the one accommodating groove is provided with the other substrate under the condition that the one accommodating groove is provided with the one substrate, and further carrying the two substrates to the first chamber.

The step of disposing the other substrate in the one accommodating groove may include the steps of: it is confirmed whether the one substrate is located inside or outside the one receiving groove.

The step of disposing the other substrate in the one accommodating groove may include the steps of: the other substrate is disposed outside the housing groove with the one substrate positioned inside the one housing groove.

The step of disposing the other substrate in the one accommodating groove may include the steps of: in a case where the one substrate is located outside the one receiving groove, the one substrate disposed outside is moved to an inside of the one receiving groove, and the other substrate is disposed outside the receiving groove.

In the case where the one receiving groove is disposed with the one substrate, the one substrate may be a substrate for deposition, and the additional another substrate may be a dummy substrate.

The substrate processing system described above can simultaneously process a plurality of substrates in a conventional process chamber for large substrates.

At least two substrates are simultaneously transferred from the cassette to the chamber by the substrate transfer method.

Drawings

Fig. 1 is a diagram schematically illustrating a substrate processing system according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of the cassette and the conveying unit in fig. 1.

Fig. 3 is a diagram illustrating a state in which two substrates are placed on the conveying unit of fig. 1.

Fig. 4 to 8 are views illustrating a process of transferring two substrates from the cassette to the first chamber by the transfer unit.

Fig. 9 to 15 are views illustrating a process of transferring two substrates from the cassette to the second chamber.

Fig. 16 to 19 are diagrams illustrating a process in which two substrates are aligned by the substrate alignment unit.

Fig. 20 is a perspective view schematically illustrating the interval adjustment part of fig. 16.

Fig. 21 is a view schematically illustrating the corner support part of fig. 16.

Fig. 22 is a diagram illustrating a process in which the substrate support table on which the two aligned substrates are placed is conveyed.

Fig. 23 and 24 are views showing a substrate support table on which two aligned substrates are placed, and a stopper portion is provided.

Description of the symbols

100: the box 300: conveying part

500: the processing space 510: the first chamber

520. 530, 540, 560, 570: second chamber

511: substrate supporting table

710. 720, 730, 740: multiple corner supports

750: first interval adjustment section 751: first main body

753: first spacer 755: first substrate side supporting table

760: second interval adjusting part

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order that those having ordinary skill in the art to which the present invention pertains can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described in the present specification. In order to clearly explain the present invention, portions that are not related to the explanation are omitted in the drawings, and the same reference numerals are given to the same or similar components throughout the specification.

Further, the size and thickness of each component in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to the contents shown in the drawings.

The thicknesses are shown exaggerated to more clearly illustrate the various layers and regions in the drawings. In the drawings, the thickness of a part of layers and regions is exaggerated for convenience of description. When a layer, a film, a region, a plate, or the like is referred to as being partially "over" or "on" other portions, it includes not only a case where "directly" over "the other portions but also a case where another portion is interposed therebetween.

In addition, throughout the specification, when a part "includes" a certain component, other components are not excluded and other components may be included unless otherwise stated. In the entire specification, "at … …" means located above or below the target portion, and does not mean that the target portion is necessarily located above with respect to the direction of gravity.

Hereinafter, a substrate processing system according to an embodiment of the present invention will be described with reference to fig. 1 to 3.

Fig. 1 is a diagram schematically illustrating a substrate processing system according to an embodiment of the present invention, fig. 2 is a schematic perspective view of a cassette and a conveying part of fig. 1, and fig. 3 is a diagram illustrating a state in which two substrates are placed on the conveying part of fig. 1.

Referring to fig. 1 to 3, the substrate processing system of the present embodiment may include a cassette 100, a transfer part 300, a first chamber 510, a

second chamber

520, 530, 540, 560, 570,

substrate alignment units

710, 720, 730, 740, 750, 760 (see fig. 16), and a substrate transfer unit 580. In the present embodiment, two substrates S1, S2 may be simultaneously transferred from the cassette 100 to the first chamber 510 as a Load lock chamber (Load lock chamber), and after the two substrates S1, S2 are aligned in the first chamber 510, the two substrates S1, S2 are simultaneously transferred to the

second chambers

520, 530, 540, 560, 570 as process chambers.

Referring to fig. 2 and 3, the cassette 100 stores a plurality of substrates, and the cassette 100 has a plurality of storage grooves for storing the substrates S1 and S2, and the plurality of storage grooves may be arranged in a row in the vertical direction. In this embodiment, two substrates S1 and S2 are placed in each receiving groove. The two substrates S1 and S2 placed in the respective receiving grooves may be simultaneously transferred to the first chamber 510 by the transfer unit 300.

At this time, the transfer unit 300 is configured to simultaneously transfer two substrates S1 and S2 from the cassette 100 to the first chamber 510, and may include a plurality of second support bars 310 and a second driving unit 350. The plurality of second support bars 310 simultaneously support the two base plates S1, S2, and the plurality of second support bars 310 may be bar (bar) -shaped members extending in one direction. The plurality of second support bars 310 may be arranged to be spaced apart from each other at a predetermined interval.

A plurality of seating grooves are formed in the plurality of second support bars 310, respectively, to allow the two substrates to be inactivated during movement. Since the two substrates are disposed in the plurality of seating grooves, the two substrates are not moved.

In this embodiment, the

protrusions

330, 331, 333, 335 coupled to the second support bars 310 may have a stepped shape seating groove. At this time, the plurality of

protrusions

330, 331, 333, 335 may be formed integrally with the plurality of second support bars 310.

In addition, the second driving part 350 may move the second support bar 310, on which the two substrates are placed, from the cassette 100 to the first chamber 510. The second driving part 350 may move the second support bar 310 in the up-and-down direction in order to move the second support bar 310 to a desired receiving groove of the cartridge 100. The second driving unit 350 may rotate the second support bar 310 or move the second support bar 310 in a horizontal direction.

Referring again to fig. 1, the two substrates S1 and S2 conveyed by the conveying part 300 may be moved to the processing space 500 in which the first and

second chambers

520, 530, 540, 560, and 570 are disposed. The processing space 500 may be a virtual space for performing various processes such as deposition and etching on the substrates S1 and S2 transferred from the outside.

The first chamber 510 of the processing space 500 may be a chamber into which the substrates S1 and S2 loaded into the processing space 500 from the outside are loaded. At this time, the first chamber 510 may be a load lock chamber. The substrates S1 and S2 transferred from the outside may be transferred to the other

second chambers

520, 530, 540, 560, and 570 as process chambers through the first chamber 510. The first chamber 510 may carry out the substrates S1 and S2, on which the processes are completed in the

second chambers

520, 530, 540, 560, and 570, to the outside. In the present embodiment, the first chamber 510 may be configured to load the substrates S1 and S2 only from the outside and load the substrates S1 and S2 from another chamber to the outside.

The

second chambers

520, 530, 540, 560, and 570 are process chambers for depositing deposition substances on the substrates S1 and S2 transferred from the first chamber 510, and etching the deposition substances in a predetermined pattern to form a predetermined pattern.

At this time, the substrate transfer unit 580 may perform a process of transferring the substrates S1, S2 from the first chamber 510 to the

second chambers

520, 530, 540, 560, 570. The substrate transfer unit 580 may include a first support rod 582 and a first driving part 581. The first support bar 582 is a bar (bar) -shaped member extending in a direction, and may simultaneously support two substrates S1, S2 aligned in the first chamber 510. The first driving part 581 may carry the first support rod 582 on which the two substrates are placed from the first chamber 510 to the

second chamber

520, 530, 540, 560, 570 disposed at a specific position. The first driving part 581 is movable in the vertical and horizontal directions and is also rotatable.

Hereinafter, a process of simultaneously transferring the two substrates S1, S2 from the cassette 100 to the first chamber 510 will be described with reference to fig. 4 to 8.

The second support bar 310 (see fig. 3) of the transfer unit 300 may simultaneously support the two substrates S1 and S2 in the storage groove of the cassette 100 (see fig. 1), and transfer the two substrates S1 and S2 to the first chamber 510. However, in the case where two substrates S1 and S2 are not placed in the storage groove of the cassette 100 (see fig. 1), that is, in the case where only one substrate is placed in the storage groove, one substrate is additionally input into the storage groove, and then the second support bar 310 (see fig. 3) simultaneously carries the two substrates.

Substrates to be carried into the first chamber 510 (see fig. 1) are placed in the respective storage grooves of the cassette 100 (see fig. 1), and in some cases, only one substrate is placed in one storage groove instead of two substrates.

At this time, if the second support bar 310 (see fig. 3) moves only one substrate disposed in the receiving groove to the first chamber 510 (see fig. 1), only one substrate is moved to the

second chambers

520, 530, 540, 560, and 570 (see fig. 1). Only one substrate should be placed in the

second chamber

520, 530, 540, 560, 570 (refer to fig. 1) where two substrates should be placed and a deposition process, etc. should be performed. Finally, the

second chambers

520, 530, 540, 560, 570 (refer to fig. 1) may perform a deposition process, etc. in a state where one substrate position is left.

As described above, if the vacant positions are generated in the

second chambers

520, 530, 540, 560, 570 (refer to fig. 1), the flow (flow) of the deposition material may be affected, thereby also affecting the deposition of the substrate placed in the

second chambers

520, 530, 540, 560, 570 (refer to fig. 1).

In the present embodiment, in order to prevent one substrate from being carried into the

second chambers

520, 530, 540, 560, 570 (see fig. 1), that is, in order to drop two substrates S1, S2 into the

second chambers

520, 530, 540, 560, 570 (see fig. 1), two substrates are placed in the respective storage grooves of the cassette 100 (see fig. 1) before the substrates are carried into the first chamber 510 (see fig. 1).

For this reason, in the present embodiment, it is first confirmed whether or not two substrates are arranged in the housing groove of the cartridge 100 (see fig. 1).

As shown in fig. 4, when one substrate S is placed in the receiving groove of the cassette 100 (see fig. 1), another substrate is additionally disposed, and then the two substrates are transferred to the first chamber 510 (see fig. 1).

Before another substrate is additionally arranged, it is confirmed whether the substrate S placed in the storage groove of the cassette 100 (see fig. 1) is located inside I or outside II of the storage groove. Here, the position close to the entrance of the substrate into the storage groove corresponds to the outer side II, and the position far from the entrance of the storage groove corresponds to the inner side I.

Referring to fig. 4 and 5, when the substrate S is disposed inside I of the receiving groove, another substrate D is additionally disposed outside II of the receiving groove. In this case, the substrate D added to the outer side II may be the same substrate for deposition as the substrate disposed on the inner side I, or may be a dummy (dummy) substrate.

Unlike fig. 4, when the substrate is placed on the outer side II of the storage groove, the additional substrate D is not directly disposed on the inner side I of the storage groove. As shown in fig. 7, if the additional substrate D is directly disposed on the inner side I of the receiving groove, the second support bar 310 (see fig. 3) of the transfer unit 300 may damage the substrate S placed on the outer side II during the process of placing the substrate D.

In order to prevent this, after the substrate S placed on the outer side II of the storage tank is moved to the inner side I of the storage tank, an additional substrate D is additionally disposed on the outer side II of the storage tank. Through the above-mentioned process, the substrate S, D will be placed on the inner side I and the outer side II of the receiving slot. Thereafter, the two substrates disposed in the receiving grooves are transferred to the first chamber 510 (see fig. 1).

If the substrates S1 and S2 are placed on the inner side I and the outer side II of the storage grooves respectively in the process of confirming whether or not two substrates are placed in the storage grooves of the cassette 100 (see fig. 1), the second support bar 310 (see fig. 3) of the transfer unit 300 simultaneously carries the two substrates to the first chamber 510 (see fig. 1) without undergoing a process of adding substrates as shown in fig. 8.

Referring to fig. 9 to 12, when all of the two substrates S1 and S2 are placed in the receiving slots, the two substrates S1 and S2 are transferred to the first chamber 510 by the transfer unit 300. In fig. 9 to 12, a case where the substrates S1, S2 are all substrates for deposition is illustrated. However, the present invention is not limited to this, and one of the two substrates may be a dummy substrate.

Next, as shown in fig. 12, if two substrates S1, S2 are placed in the first chamber 510, the

substrate alignment units

710, 720, 730, 740, 750, 760 (refer to fig. 16) may align the two substrates S1, S2 within the first chamber 510. The

substrate alignment units

710, 720, 730, 740, 750, 760 (refer to fig. 16) are disposed in the first chamber 510 to align the two substrates S1, S2 to be spaced apart by a predetermined interval. A process of aligning the two substrates S1, S2 by the

substrate alignment units

710, 720, 730, 740, 750, 760 (refer to fig. 16) will be described below with reference to fig. 16 to 21.

If the alignment of the two substrates S1, S2 is completed in the first chamber 510, the two substrates S1, S2 may be simultaneously transferred to the

second chambers

520, 530, 540, 560, 570 as shown in fig. 13 to 15. Here, the

second chambers

520, 530, 540, 560, 570 are process chambers that perform the deposition or etching processes, etc. as described above. In this embodiment, the deposition process may be performed by putting two substrates S1 and S2 into the

second chambers

520, 530, 540, 560, and 570, in which the deposition process has been conventionally performed on one large substrate. The substrates S1, S2 used in the present embodiment may be half the size of the existing large-sized substrate. That is, according to the present embodiment, the

second chambers

520, 530, 540, 560, 570 once used for one large substrate may be used for a deposition process for a plurality of substrates smaller than the size of the large substrate.

In addition, a plurality of

second chambers

520, 530, 540, 560, 570 may be disposed within the processing space 500. The processes different from each other may be performed in the

second chambers

520, 530, 540, 560, 570 disposed in the processing space 500, respectively. At this time, the plurality of

second chambers

520, 530, 540, 560, 570 and the first chamber 510 may be arranged along a virtual line of a ring shape within the processing space 500.

At this time, the substrate transfer unit 580 disposed in the processing space 500 may transfer the two substrates S1, S2 to the

second chambers

520, 530, 540, 560, 570. The substrate transfer unit 580 may include a plurality of first support rods 582 and a first driving unit 581. The plurality of first support bars 582 may simultaneously support two base plates S1, S2, the plurality of first support bars 582 being bar (bar) -shaped members extending in a direction. The plurality of first support rods 582 may be arranged to be spaced apart from each other at a predetermined interval. At this time, when the plurality of first support rods 582 transfer the two substrates S1, S2 to the

second chambers

520, 530, 540, 560, 570, the plurality of first support rods 582 may lift the substrate support table 511 (see fig. 16) on which the aligned two substrates S1, S2 are placed to transfer the substrates S1, S2, or the plurality of first support rods 582 may directly lift the two substrates S1, S2 to transfer the substrates S1, S2.

The first driver 581 can move the first support rod 582, on which the two substrates are placed, from the first chamber 510 to the

second chambers

520, 530, 540, 560, and 570. The first driving unit 581 may move the first support rod 582 in the vertical or horizontal direction, and may rotate the first support rod 582, as in the second driving unit 350 of the conveying unit 300.

Hereinafter, referring to fig. 16 to 21, a process of aligning the two substrates S1, S2 by the

substrate alignment units

710, 720, 730, 740, 750, 760 in the first chamber 510 will be described in detail.

Fig. 16 to 19 are views illustrating a process in which two substrates are aligned by the substrate alignment unit, fig. 20 is a perspective view schematically illustrating the interval adjustment part of fig. 16, and fig. 21 is a view schematically illustrating the corner support part of fig. 16.

Referring to fig. 16, the substrate alignment unit may include a substrate support table 511, a plurality of corner supports 710, 720, 730, 740, a first interval adjustment part 750, and a second interval adjustment part 760.

The substrate support table 511 can support two substrates S1 and S2 transferred from the cassette 100. The substrate support table 511 may have a plate shape having a quadrangular plane.

In the present embodiment, the two substrates S1, S2 are disposed on the substrate support table 511 in a spaced-apart manner, and the two substrates S1, S2 are disposed on the substrate support table 511 in a spaced-apart manner. In the following description, for convenience of explanation, the substrate disposed on the left side in the first direction (X-axis direction) when viewed in plan view in fig. 16 is referred to as a first substrate S1, and the substrate disposed on the right side in the first direction (X-axis direction) is referred to as a second substrate S2.

In addition, a plurality of

corner supporting parts

710, 720, 730, 740 may be disposed at the corners of the first and second substrates S1 and S2. More specifically, as shown in fig. 16, corner supports 710 and 720 may be disposed at left-side corners of the first substrate S1, and corner supports 730 and 740 may be disposed at right-side corners of the second substrate S2.

At this time, when the first and

second space adjusters

750 and 760 push the first substrate S1 to the left, the

corner supporting parts

710 and 720 can prevent the first substrate S1 from moving to the left and fix the left corner of the first substrate S1 at a predetermined position. When the first and

second spacing adjusters

750 and 760 push the second substrate S2 to the right, the corner supports 730 and 740 prevent the second substrate S2 from moving to the right and fix the right corner of the second substrate S2 at a predetermined position.

Referring to fig. 17, the plurality of corner supports 710, 720, 730, 740 may be moved to predetermined positions. Here, the predetermined position may indicate a position where the corners of the first and second substrates S1 and S2 should be located when the interval adjustment of the first and second substrates S1 and S2 is completed. In fig. 17, the plurality of

corner supporting parts

710, 720, 730, and 740 are shown to be in contact with the corners of the first and second substrates S1 and S2, but may not be in contact with each other.

As shown in fig. 17, if the plurality of corner supports 710, 720, 730, 740 are placed at predetermined positions, the plurality of corner supports 710, 720, 730, 740 are fixed until the interval adjustment of the first substrate S1 and the second substrate S2 is completed.

Referring to fig. 18 and 19, if the plurality of corner supports 710, 720, 730, and 740 are disposed at predetermined positions, the first and second

spacing adjustment parts

750 and 760 may be inserted into a space between the first and second substrates S1 and S2 facing each other. At this time, the first and

second space adjusters

750 and 760 may push the first and second substrates S1 and S2 toward the corner side of the first substrate S1 and the corner side of the second substrate S2, respectively. More specifically, the first and second interval-adjusting

parts

750 and 760 may push the first substrate S1 to the left and the second substrate S2 to the right. Furthermore, the left side corner of the first substrate S1 is closely attached to the

corner supporting parts

710 and 720, and the right side corner of the second substrate S2 is closely attached to the

corner supporting parts

730 and 740.

In the present embodiment, the first interval adjusting part 750 may be inserted into the space between the first and second substrates S1 and S2 from top to bottom in the second direction (Y direction). Also, the second interval adjusting part 760 may be inserted into a space between the first and second substrates S1 and S2 from bottom to top in the second direction (Y direction).

In addition, the first interval adjusting part 750 may include a first body 751, a first substrate side supporting stage 755, and a first interval expanding part 753. Also, the second gap adjusting part 760 may include a second body 761, a second substrate side supporting table 765, and a second gap expanding part 763.

The first substrate side support 755 is coupled to the first body 751 and may contact the first side P1 of the first substrate S1 and the fifth side P5 of the second substrate. Also, the second substrate side supporting table 765 is coupled to the second body 761 and may be in contact with the second side P2 of the first substrate S1 and the sixth side P6 of the second substrate. When the first and

second gap adjusters

750 and 760 are activated, the first and second substrate side supports 755 and 765 prevent the first and second substrates S1 and S2 from moving upward or downward in the second direction (Y direction). For convenience of description in this specification, the first substrate S1 includes, when viewed in plan in fig. 18, a first side P1 located on an upper side, a second side P2 located on a lower side, a third side P3 located on a right side, and a fourth side P4 located on a left side. The second substrate S2 includes a fifth side surface P5 located at the upper side, a sixth side surface P6 located at the lower side, a seventh side surface P7 located at the left side, and an eighth side surface P8 located at the right side.

At this time, the first space expanding part 753 is rotatably coupled to the first body 751 so that the third side P3 of the first substrate and the seventh side P7 of the second substrate S2 can be simultaneously pushed. Also, as such, the second space expanding part 763 is rotatably coupled to the second body 761, so that the third side P3 of the first substrate and the seventh side P7 of the second substrate S2 can be simultaneously pushed. That is, the first space extender 753 and the second space extender 763 may push the third side surface P3 of the first substrate to the left and the seventh side surface P7 of the second substrate S2 to the right.

In the present embodiment, the first interval-expanded portion 753 and the second interval-expanded portion 763 may include a pair of rod-shaped members spaced apart at a predetermined interval. When the first space expanding portion 753 is first inserted into a space between the third side surface P3 of the first substrate and the seventh side surface P7 of the second substrate S2, the pair of rod-shaped members are arranged in a row in parallel with the second direction (Y direction). Next, as shown in fig. 19, the first space expanding portion 753 and the second space expanding portion 763 are rotated, and the pair of rod-shaped members are aligned in parallel with the first direction (X direction). Further, the first space expanding portion 753 and the second space expanding portion 763 may push the third side P3 of the first substrate and the seventh side P7 of the second substrate S2 at the same time.

Referring to FIG. 20, the first substrate side support table 755 may comprise a pair of rod-type members. However, the first substrate side supporting table 755 is not limited thereto, and may be formed in a single extended plate shape.

In addition, a pair of rod-shaped members of the first space expansion portion 753 may be disposed on the first rotation plate 753 c. The pair of lever-type members may be arranged in parallel with the first direction (X direction) or in parallel with the second direction (Y direction) according to the rotation of the first rotation plate 753 c. At this time, the first rotation plate 753c may be controlled by a motor. The motor applied to this embodiment may be a servo motor. However, the first rotating plate 753c is not limited thereto, and a link member may be coupled between the first rotating plate 753c and the motor.

The pair of rod-shaped members of the first space expanding portion 753 may include rubber, silicone rubber, or urethane. However, the material of the pair of lever members is not limited to this, and may be formed of a soft (soft) material so as to avoid damage to the first substrate S1 and the second substrate S2 that are in contact with the pair of lever members. The second space-extending portion 763 has the same structure as the first space-extending portion 753, and therefore, a detailed description thereof will be omitted.

Referring to fig. 21, the corner support 730 may have a shape corresponding to the corner of the second substrate S2 in contact. In the present embodiment, the corner supporting part 730 may have a shape bent by 90 degrees corresponding to the corner of the contacted second substrate S2. In addition, the corner supporting portion 730 may be coupled to the plurality of

link members

820 and 830 and the driving portion 810. As shown in fig. 16, after the first and second substrates S1 and S2 are placed on the substrate support table 511 of the first chamber 510, the corner support 730 moves to a predetermined position. As described above, the plurality of

link members

820 and 830 and the driving part 810 may move the corner support 730 to a predetermined position.

In addition, when the alignment of the first and second substrates S1 and S2 is completed in the first chamber 510 by the

substrate alignment units

710, 720, 730, 740, 750, and 760 (see fig. 16), the substrates may be transferred to the

second chambers

520, 530, 540, 560, and 570 in an aligned state by the substrate transfer unit 580, as shown in fig. 22.

Referring to fig. 23 and 24, in the present embodiment, before the aligned first and second substrates S1 and S2 are transferred to the

second chambers

520, 530, 540, 560, 570,

stoppers

610, 611, 613 may be disposed around the first and second substrates S1 and S2. The

barriers

610, 611, 613 may be arranged along the peripheries of the first and second substrates S1, S2 when viewed in plan view in fig. 23. When the deposition process using the plasma is performed in the

second chambers

520, 530, 540, 560, 570 (refer to fig. 13) on the first and second substrates S1 and S2, the sides of the first and second substrates S1 and S2 may be affected by the plasma. Due to such plasma, the first substrate S1 and the second substrate S2 may be damaged. That is, in the present embodiment, the

barriers

610, 611, 613 are disposed around the first and second substrates S1, S2, so that damage to the side surfaces of the first and second substrates S1, S2 caused by plasma can be minimized.

As described above, the present invention is explained by the limited embodiments and the accompanying drawings, but the present invention is not limited thereto, and a person having ordinary knowledge in the art to which the present invention belongs can make various modifications and variations within the technical idea of the present invention and the equivalent scope of the claims.

Claims

1. A substrate processing system, comprising:

a first chamber for simultaneously carrying in and out at least two substrates;

a substrate alignment unit disposed in the first chamber to align the at least two substrates in a predetermined spaced-apart manner;

a plurality of second chambers processing the at least two substrates aligned in the first chamber; and

a substrate carrying unit that carries the at least two substrates aligned from the first chamber to the second chamber,

wherein the substrate alignment unit includes:

a substrate support table supporting a first substrate and a second substrate among the at least two substrates arranged to be spaced apart from each other in a first direction;

a first corner support supporting a corner of the first substrate;

a second corner supporting part supporting a corner of the second substrate; and

a space adjusting part movable in a second direction and inserted into a space between the first substrate and the second substrate to adjust a space between the first substrate and the second substrate,

wherein the interval adjusting part includes: a space expanding portion rotatably coupled so as to be able to push both one side surface of the first substrate and one side surface of the second substrate,

the first direction is a direction parallel to one of a plurality of side surfaces of the first substrate or the second substrate,

the second direction is a direction crossing the first direction on a horizontal plane and being parallel to another side surface not parallel to the one side surface.

2. The substrate processing system of claim 1,

the first corner support and the first corner support have shapes corresponding to the corners of the first substrate and the second substrate, respectively.

3. The substrate processing system of claim 1,

the substrate carrying unit includes:

a first support bar supporting the at least two substrates; and

and a first driving part which is combined with the first supporting rod and moves the first supporting rod.

4. The substrate processing system of claim 1, further comprising:

a cassette for storing the at least two substrates transferred to the first chamber; and

and a transfer part which transfers the at least two substrates from the cassette to the first chamber.

5. The substrate processing system of claim 4,

the conveying part comprises:

a plurality of second support bars supporting the at least two substrates arranged in parallel with each other and extending in one direction; and

and a second driving part combined with the plurality of second support rods and moving the second support rods.

6. The substrate processing system of claim 5,

the number of the second supporting rods is more than two.

7. The substrate processing system of claim 5,

the length of the plurality of second support rods is greater than the total length of the at least two substrates.

8. The substrate processing system of claim 1,

the first chamber and the plurality of second chambers are arranged along a virtual line of a ring shape.

9. The substrate processing system of claim 1,

the interval adjustment part further includes: a substrate side support table adjacent to the space expanding portion and contactable with a side of the first substrate or a side of the second substrate, respectively.

10. The substrate processing system of claim 9,

the interval adjustment part further includes: and a main body on which the space expanding portion and the substrate side surface supporting base are formed.

11. The substrate processing system of claim 10,

the interval expansion part protrudes from the main body, thereby having a structure capable of pushing all of one side surface of the first substrate and one side surface of the second substrate.

12. The substrate processing system of claim 1,

the first or second corner support part is connected to and operates with a link member and a driving part connected to the link member.

13. The substrate processing system of claim 1, further comprising:

a substrate support table on which the first substrate and the second substrate are placed,

wherein the substrate supporting table includes: and the barrier part is positioned at the periphery of the first substrate and the second substrate.

14. The substrate processing system of claim 1,

the interval adjustment part further includes:

a pair of substrate side support tables adjacent to the space expanding portion and capable of contacting with a side surface of the first substrate and a side surface of the second substrate, respectively; and

a T-shaped main body having the space expanding portion and the pair of substrate side supporting tables and having a linear portion and a convex portion,

wherein the interval expansion part is located at the protruding part, and the pair of substrate side surface supporting tables are located at the linear part.

15. A substrate processing system, comprising:

a first chamber for simultaneously carrying in and out at least two substrates;

wherein the substrate alignment unit includes:

a substrate support table supporting a first substrate and a second substrate among the at least two substrates arranged to be spaced apart from each other;

a first corner support supporting a corner of the first substrate;

a space adjusting part inserted into a space between the first substrate and the second substrate to adjust a space between the first substrate and the second substrate,

wherein the interval adjusting part includes: and a space expanding part rotatably coupled so as to push all of one side surface of the first substrate and one side surface of the second substrate.

16. The substrate processing system of claim 15,

17. The substrate processing system of claim 15,

the substrate carrying unit includes:

a first support bar supporting the at least two substrates; and

18. The substrate processing system of claim 15, further comprising:

19. The substrate processing system of claim 18,

the conveying part comprises:

20. The substrate processing system of claim 19,

the number of the second supporting rods is more than two.

21. The substrate processing system of claim 19,

22. The substrate processing system of claim 15,

23. The substrate processing system of claim 15,

24. The substrate processing system of claim 23,

25. The substrate processing system of claim 24,

26. The substrate processing system of claim 15,

27. The substrate processing system of claim 15, further comprising:

28. The substrate processing system of claim 15,

the interval adjustment part further includes: