CN108735625A - Base plate processing system and substrate transfer method adopted therein - Google Patents
Base plate processing system and substrate transfer method adopted therein Download PDFInfo
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- CN108735625A CN108735625A CN201810328229.6A CN201810328229A CN108735625A CN 108735625 A CN108735625 A CN 108735625A CN 201810328229 A CN201810328229 A CN 201810328229A CN 108735625 A CN108735625 A CN 108735625A
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- substrate
- chamber
- accommodating groove
- base plate
- processing system
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- 230000008021 deposition Effects 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
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- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 13
- 230000000903 blocking effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Abstract
The present invention relates to a kind of base plate processing system and substrate transfer method adopted thereins.The base plate processing system of an embodiment according to the present invention may include：First chamber, while moving in or moving out at least two substrates；Substrate alignment unit is arranged in the first chamber, and the mode that at least two substrate separates at predetermined intervals is made to be aligned；Multiple second chambers handle at least two substrate being aligned in the first chamber；And substrate transport unit, at least two substrate of alignment is transported from the first chamber to the second chamber, or is transported from the second chamber to the first chamber.
Description
Technical field
The present invention relates to a kind of base plate processing system and the substrate transfer method adopted thereins of base plate processing system.
Background technology
The manufacturing process of display device includes multiple unit process different from each other, wherein each unit process is usually at that
It is carried out in this different space.Therefore, using substrate manufacture display device, substrate, which is moved into, to be isolated from each other
Each space and carry out unit process.
It can be put into each process chamber (Processing Chamber) for carrying out each unit process as described above
One large substrate, and deposition procedures etc. are executed to large substrate.
Recently, with the diversification of the size of the display device of manufacture, the size for putting into the substrate of deposition procedures also becomes
It obtains diversified.It is, for example, possible to use being equivalent to the substrate of one half-size scale of large substrate to substitute previous large substrate.
If however, the substrate of a this half-size scale is put into process chamber, it can unnecessarily be left process chamber
Space, or need to carry out such as manufacture for the design alteration of the new process chamber of the substrate of a half-size scale.
Invention content
The present invention provide it is a kind of utilize it is previous can be in a process chamber for the process chamber of large substrate
Handle multiple base plate processing systems of multiple substrates.
Also, the present invention provide it is a kind of by least two substrates from haulage and keeping substrate box be transported to chamber interior
Substrate transfer method adopted therein.
The base plate processing system of an embodiment according to the present invention may include：First chamber, at the same move in or move out to
Few two substrates；Substrate alignment unit is arranged in the first chamber, make at least two substrate at predetermined intervals every
The mode opened is aligned；Multiple second chambers handle at least two substrate being aligned in the first chamber；And base
Plate conveying unit transports at least two substrate of alignment to the second chamber from the first chamber, or from described
Second chamber is transported to the first chamber.
At least two substrate includes first substrate and second substrate, and the first substrate may include：First side,
It is parallel with first direction, and positioned at the upside of the first substrate；Second side, it is parallel with the first side, and it is located at institute
State the downside of first substrate；And third side and the 4th side, it is parallel to the second direction intersected with the first direction, institute
Stating second substrate may include：5th side, it is parallel with the first direction, and positioned at the upside of the second substrate；6th
Side, it is parallel with the 5th side, and positioned at the downside of the second substrate；Heptalateral face is parallel to the second direction,
And faced with the third side of the first substrate and the 8th side, it is parallel with heptalateral face.
The substrate alignment unit may include：Substrate support pedestal, support are spaced from each other arrangement along the first direction
First substrate and second substrate at least two substrate；Multiple corner support portions support the first substrate and described
Second substrate is located at along the corner of the both ends side of the first direction；And multiple interval adjustment portions, it can be along described
Two directions are moved, and the space being inserted between the first substrate and the second substrate, thus by the first substrate and institute
State the multiple corner support portion side that second substrate is pushed to contact with the first substrate and the second substrate respectively.
The multiple interval adjustment portion may include：First interval adjustment portion, can be along the second direction from top to bottom
It is inserted into the space between the first substrate and the second substrate；And the second interval adjustment portion, it can be along described the
The space is inserted into two directions from bottom to up.
Described first, which is spaced adjustment portion, may include：First main body；First substrate lateral support platform, along the first direction
Be arranged in being spaced from each other in first main body, and can respectively with the first side of the first substrate and second base
5th side of plate contacts；And the first interval enlarged portion, it is rotatably engaged in first main body, and can push away simultaneously
Move the heptalateral face of the third side and the second substrate of the first substrate.
Described second, which is spaced adjustment portion, may include：Second main body；Second substrate lateral support platform, along the first direction
Be arranged in being spaced from each other in second main body, and can respectively with the second side of the first substrate and second base
6th side of plate contacts；And the second interval enlarged portion, it is rotatably engaged in second main body, and can push away simultaneously
Move the heptalateral face of the third side and the second substrate of the first substrate.
The first interval enlarged portion and second interval enlarged portion may include a pair of of the bar separated at a predetermined interval
Type component.
The pair of rod-type component may include rubber, silica gel or polyurethane.
Each corner support portion can have corresponding with the first substrate and the corner of the second substrate
Shape.
The substrate transport unit may include：First support bar supports at least two substrate；And first driving
Portion is combined with the first support bar, and the mobile first support bar.
The base plate processing system can also include：Box, keeping are transported to described at least two of the first chamber
Substrate；And conveying unit, at least two substrate is transported to the first chamber from the box.
The conveying unit may include：Multiple second support bars support at least two substrate being arranged parallel to,
And extend along a direction；And second driving portion, it is combined with the multiple second support bar, and mobile the multiple second support
Bar.
Each second support bar can have the resettlement groove for disposing at least two substrate.
The multiple corner support portion can contact or divide with the corner of the first substrate and the second substrate
From.
The first chamber can be with the multiple second chamber along the dummy line arrangement of ring-shaped.
The substrate transfer method adopted therein of an embodiment according to the present invention, while by two substrates from the box for including multiple accommodating grooves
Son is transported to first chamber, may include steps of：Confirm whether an accommodating groove in the multiple accommodating groove is arranged
There are described two substrates；In the case where one accommodating groove is disposed with described two substrates, described two substrates are placed
In on the supporting rod of conveying unit, and then described two substrates are transported to the first chamber；And in one accommodating groove
After one accommodating groove arranges another substrate, described two substrates are placed there are one in the case of substrate for arrangement
In on the supporting rod, and then described two substrates are transported to the first chamber.
It may include steps of in the step of one accommodating groove arranges another described substrate：Confirm one
Substrate is located at the inside of one accommodating groove still positioned at the outside of one accommodating groove.
It may include steps of in the step of one accommodating groove arranges another described substrate：In one base
In the case that plate is located at the inside of one accommodating groove, by another described substrate arranged in the outside of the accommodating groove.
It may include steps of in the step of one accommodating groove arranges another described substrate：In one base
In the case that plate is located at the outside of one accommodating groove, the one substrate for being arranged in the outside is moved to described one
The inside of a accommodating groove, and by another described substrate arranged in the outside of the accommodating groove.
In the case where one accommodating groove is disposed with one substrate, one substrate can be for depositing
Substrate, another additional substrate can be virtual substrate.
By base plate processing system same as above, can simultaneously locate in the previous process chamber for large substrate
Manage multiple substrates.
Also, by substrate transfer method adopted therein, while at least two substrates are transported to chamber interior from box.
Description of the drawings
Fig. 1 is the figure for the base plate processing system for schematically illustrating an embodiment according to the present invention.
Fig. 2 is the box of Fig. 1 and the schematical stereogram of conveying unit.
Fig. 3 be illustrate Fig. 1 conveying unit place there are two substrate state figure.
Fig. 4 to Fig. 8 is to being illustrated the process that two substrates are transported from box to first chamber by conveying unit
Figure.
Fig. 9 to Figure 15 is the figure illustrated to the process for transporting two substrates to second chamber from box.
Figure 16 to Figure 19 is the figure illustrated by the process that substrate alignment unit is aligned to two substrates.
Figure 20 is the stereogram for the interval adjustment portion for being schematically illustrated Figure 16.
Figure 21 is the figure for the corner support portion for being schematically illustrated Figure 16.
Figure 22 is the figure illustrated to the allochthonous process of substrate support pedestal for being placed with the two of alignment substrates.
Figure 23 and Figure 24 is that the substrate support pedestals of two substrates for being placed with alignment is provided with the figure of blocking portion.
Symbol description
100：Box 300：Conveying unit
500：Processing space 510：First chamber
520,530,540,560,570：Second chamber
511：Substrate support pedestal
710,720,730,740：Multiple corner support portions
750：First interval adjustment portion 751：First main body
753：First interval enlarged portion 755：First substrate lateral support platform
760：Second interval adjustment portion
Specific implementation mode
Hereinafter, in order to allow in the technical field of the invention to there are the personnel of general knowledge easily to implement, refer to
The embodiment of the present invention is described in detail in attached drawing.The present invention can by it is a variety of it is different in the form of realize, and be not limited to this
The embodiment illustrated in specification.It is explicitly stated in order to be carried out to the present invention, the part unrelated with explanation is omitted in attached drawing,
And in the specification, identical reference numeral is imparted to same or similar inscape.
Also, for the convenience of explanation, arbitrarily show the size and thickness of each inscape in attached drawing, institute
It is not necessarily to be limited to attached content shown in the drawings with the present invention.
In order to more clearly indicate that each layer and the region in attached drawing, amplification illustrate thickness.And in the accompanying drawings, in order to
The facility of explanation has been illustrated turgidly a part of layer and the thickness in region.It is located at other when mentioning the part such as layer, film, region, plate
Partly " top " or when "upper", include not only " direct " situation positioned at " top " of other parts, further include sandwiched between it
There is the situation of another part.
Also, in the specification, when mentioning some some inscape of part " comprising ", no special opposite
In the case of record, however not excluded that other inscapes, and it can also includes other inscapes to mean.Also, specification is complete
Wen Zhong, " ... on " mean positioned at the upside or downside of object part, and be not meant to have to be located at gravity
Upside on the basis of direction.
Hereinafter, being illustrated to the base plate processing system of an embodiment according to the present invention referring to figs. 1 to Fig. 3.
Fig. 1 is the figure for the base plate processing system for schematically illustrating an embodiment according to the present invention, and Fig. 2 is the box of Fig. 1
Son and conveying unit schematical stereogram, Fig. 3 be illustrate Fig. 1 conveying unit place there are two substrate state figure.
Referring to figs. 1 to Fig. 3, the base plate processing system of the present embodiment may include box 100, conveying unit 300, first chamber
510, second chamber 520,530,540,560,570, substrate alignment unit 710,720,730,740,750,760 (referring to Fig.1 6)
And substrate transport unit 580.In the present embodiment, two substrates S1, S2 can be transported to from box 100 as loading simultaneously
The first chamber 510 of locking cavity (Load lock chamber), two substrates S1, S2 are after the alignment of first chamber 510, and two
A substrate S1, S2 are transported to the second chamber 520,530,540,560,570 as process chamber simultaneously.
With reference to Fig. 2 and Fig. 3, box 100 takes care of multiple substrates, has the multiple receipts for placing each substrate S1, S2 in box 100
Receive slot, multiple accommodating grooves can vertically be arranged as a row.In the present embodiment, two substrates are placed in each accommodating groove
S1,S2.Two substrates S1, S2 for being positioned over each accommodating groove by conveying unit 300 while can be transported to first chamber 510.
At this point, conveying unit 300 is simultaneously to transport two substrates S1, S2 to the composition of first chamber 510 from box 100,
May include multiple second support bars 310 and the second driving portion 350.Multiple second support bars 310 simultaneously support two substrate S1,
S2, multiple second support bars 310 can be the components of bar (bar) shape extended along a direction.Multiple second support bars 310 can
It is arranged with being spaced from each other at predetermined intervals.
Multiple resettlement grooves are respectively formed in multiple second support bars 310, keep two substrates inactive on the move.Due to
Two substrates are placed in multiple resettlement grooves, to which two substrates are inactive on the move.
In the present embodiment, be incorporated into multiple second support bars 310 multiple raised 330,331,333,335 can have
The resettlement groove of stairstepping.At this point, multiple raised 330,331,333,335 can be formed as one with multiple second support bars 310
Body.
In addition, the second driving portion 350 can will be placed, there are two the second support bars 310 of substrate to remove from box 100 to the
One chamber 510.In order to make second support bar 310 be moved to the desired accommodating groove of box 100, the second driving portion 350 can make
Second support bar 310 moves along the vertical direction.Also, the second driving portion 350 can also be such that second support bar 310 rotates, or
Second support bar 310 is set to move in the horizontal direction.
Referring again to Fig. 1, two substrates S1, the S2 transported by conveying unit 300 can be to being disposed with first chamber and
The processing space 500 of two chambers 520,530,540,560,570 moves.Processing space 500 can be the base to being brought from outside
Plate S1, S2 execute the Virtual space of the working procedures such as deposition, etching.
The first chamber 510 of processing space 500 can be moved in input by substrate S1, S2 of processing space 500 from outside
Chamber.At this point, first chamber 510 can be load locking cavity.Substrate S1, the S2 moved in from outside can pass through the first chamber
It is removed to other second chambers 520,530,540,560,570 as process chamber room 510.In addition, first chamber 510
Substrate S1, S2 that process is completed in second chamber 520,530,540,560,570 can be moved out to outside.In the present embodiment
In, it's not limited to that, and first chamber 510 can be such that substrate S1, S2 is only moved in from outside, and makes base from other other chambers
Plate S1, S2 are moved out to outside.
Second chamber 520,530,540,560,570 is used as process chamber, can execute to being brought from first chamber 510
Substrate S1, S2 deposits deposited material, and be etched in a predetermined pattern and the process etc. that forms scheduled pattern.
At this point, substrate transport unit 580 can execute by substrate S1, S2 from first chamber 510 move to second chamber 520,
530,540,560,570 process.Substrate transport unit 580 may include first support bar 582 and the first driving portion 581.The
One supporting rod 582 is the component of bar (bar) shape extended along a direction, can simultaneously support and is aligned in first chamber 510
Two substrates S1, S2.First driving portion 581 can will be placed and be removed from first chamber 510 there are two the first support bar 582 of substrate
To the second chamber 520,530,540,560,570 for being arranged in specific position.First driving portion 581 can along the vertical direction and water
Square to movement, and can also rotate.
Hereinafter, with reference to Fig. 4 to Fig. 8, to being transported two substrates S1, S2 to first chamber 510 from box 100 simultaneously
Process illustrates.
Fig. 4 to Fig. 8 is to being illustrated the process that two substrates are transported from box to first chamber by conveying unit
Figure.
The second support bar 310 (with reference to Fig. 3) of conveying unit 300 can simultaneously be propped up in the accommodating groove of box 100 (referring to Fig.1)
Two substrates S1, S2 are supportted, two substrates S1, S2 are removed to first chamber 510.However, in the storage of box 100 (referring to Fig.1)
There are two not placed in slot in the case of substrate S1, S2, that is, there are one only being placed in accommodating groove in the case of substrate, to receipts
It receives and one substrate of slot additional input, later, second support bar 310 (with reference to Fig. 3) while moving two substrates.
Each accommodating groove of box 100 (referring to Fig.1) is placed with the substrate of first chamber 510 (referring to Fig.1) to be moved to, root
According to situation, exists and only placed there are one substrate and the case where not two substrates in an accommodating groove.
At this point, if second support bar 310 (with reference to Fig. 3) only removes be arranged in accommodating groove substrate to first chamber
510 (referring to Fig.1) were then only transported to second chamber 520,530,540,560,570 (referring to Fig.1) there are one substrate.It should
Place two substrates and execute deposition procedures etc. second chamber 520,530,540,560,570 (referring to Fig.1) in be only placed
One substrate.Finally, second chamber 520,530,540,560,570 (referring to Fig.1) is possible in a vacant substrate position
Under state, deposition procedures etc. are executed.
It is same as above, it, can if generating vacant position in second chamber 520,530,540,560,570 (referring to Fig.1)
The flowing (flow) of deposited material can be impacted, to also to being placed on (the ginseng of second chamber 520,530,540,560,570
According to Fig. 1) in the deposition of substrate impact.
In the present embodiment, a substrate moves in second chamber 520,530,540,560,570 (with reference to figure in order to prevent
1), that is, in order to make two substrate S1, S2 input second chambers 520,530,540,560,570 (referring to Fig.1), to the first chamber
Before substrate is moved in room 510 (referring to Fig.1), by two substrate arrangeds to each accommodating groove of box 100 (referring to Fig.1).
For this purpose, in the present embodiment, first confiring that whether the accommodating groove in box 100 (referring to Fig.1) arranges that there are two bases
Plate.
As shown in figure 4, being placed there are one in the case of substrate S in the accommodating groove of box 100 (referring to Fig.1), arrangement is added
Another substrate later transports two substrates to first chamber 510 (referring to Fig.1).
Before additional another substrate of arrangement, substrate S for the accommodating groove for being positioned over box 100 (referring to Fig.1) is confirmed
Still it is located at outside II in the inside I of accommodating groove.Here, for inside I and outside II, substrate is put by proximad accommodating groove
Entrance position be equivalent to outside II, far from accommodating groove entrance position be equivalent to inside I.
With reference to Fig. 4 and Fig. 5, in the case where substrate S is arranged in the inside I of accommodating groove, added to the outside II of accommodating groove
Arrange another substrate D.At this point, the substrate D of II can be identical with the inside substrate of I is arranged in for sinking on the outside of being appended to
Long-pending substrate can also be virtual (dummy) substrate.
It is different from Fig. 4, in the case where substrate is positioned over the outside II of accommodating groove, not directly to the inside I cloth of accommodating groove
Set additional substrate D.If as shown in fig. 7, directly placing substrate D to the additional substrate D of the inside I of accommodating groove arrangements
In the process, the second support bar 310 (with reference to Fig. 3) of conveying unit 300 may be such that the substrate S for being put into outside II occurs damaged.
To prevent the above situation, the substrate S for the outside II for being positioned over accommodating groove is removed to the inside I of accommodating groove,
The outside II of accommodating groove adds the additional substrate D of arrangement.By process same as above, substrate S, D will all be placed on receipts
Receive the inside I and outside II of slot.Later, two substrates for being arranged in accommodating groove are transported to first chamber 510 (referring to Fig.1).
If confirming whether the accommodating groove in box 100 (referring to Fig.1) is arranged there are two during substrate, receiving
The inside I and outside II of slot of receiving is placed with substrate S1, substrate S2 respectively, then as shown in figure 8, not suffering from the process of additional substrate,
The second support bar 310 (with reference to Fig. 3) of conveying unit 300 removes two substrates to first chamber 510 (referring to Fig.1) simultaneously.
With reference to Fig. 9 to Figure 12, if two substrates S1, S2 are all positioned over accommodating groove, two substrates S1, S2 pass through conveyance
Portion 300 is transported to first chamber 510.In Fig. 9 to Figure 12, it is illustrated that all substrates for deposition of substrate S1, S2
Situation.However, it's not limited to that, a substrate in two substrates can also be virtual substrate.
Next, as shown in figure 12, if two substrates S1, S2 are placed on first chamber 510, substrate alignment unit
710,720,730,740,750,760 (referring to Fig.1 6) can make two substrate S1, S2 alignment in first chamber 510.Substrate
Alignment unit 710,720,730,740,750,760 (referring to Fig.1 6) is arranged in first chamber 510, so that two substrate S1,
S2 is aligned in a manner of scheduled spaced apart.For substrate alignment unit 710,720,730,740,750,760 (with reference to figure
16) be aligned two substrates S1, S2 process, will referring to Fig.1 6 to Figure 21 and be described below.
If two substrates S1, S2 complete to be aligned in first chamber 510, as shown in FIG. 13 to 15, two substrates S1, S2
It can be transported to second chamber 520,530,540,560,570 simultaneously.Here, second chamber 520,530,540,560,570 is
Execute the process chamber of deposition same as above or etching work procedure etc..It in the present embodiment, can be in the past to one large-scale base
Plate executes two substrates S1, S2 of input in the second chamber 520,530,540,560,570 of deposition procedures and executes deposition procedures.
Substrate S1, the S2 applied in the present embodiment can be the half of existing large substrate size.That is, according to the present embodiment,
Once size less than large substrate can be used in by being used in the second chamber 520,530,540,560,570 of a large substrate
Multiple substrates deposition procedures.
In addition, multiple second chambers 520,530,540,560,570 can be arranged in processing space 500.It is being arranged in
Second chamber 520,530,540,560,570 in processing space 500 can carry out mutually different process respectively.At this point, more
A second chamber 520,530,540,560,570 and first chamber 510 can be in processing spaces 500 along the virtual of ring-shaped
Line arranges.
At this point, the substrate transport unit 580 being arranged in processing space 500 can transport two substrates S1, S2 to
Two chambers 520,530,540,560,570.Substrate transport unit 580 may include that multiple first support bars 582 and first drive
Portion 581.Multiple first support bars 582 can simultaneously support two substrates S1, S2, and multiple first support bars 582 are along a direction
The component of bar (bar) shape of extension.Multiple first support bars 582 can be spaced from each other and arrange at predetermined intervals.At this point,
When multiple first support bars 582 transport two substrates S1, S2 to second chamber 520,530,540,560,570, multiple first
The substrate support pedestal 511 (referring to Fig.1 6) for two substrates S1, S2 for being placed with alignment can be lifted and transport base by supporting rod 582
Plate S1, S2, or directly two substrates S1, S2 can be lifted by multiple first support bars 582 and transport substrate S1, S2.
In addition, the first driving portion 581 can will be placed, there are two the first support bars 582 of substrate to be removed from first chamber 510
To second chamber 520,530,540,560,570.Identically as the second driving portion 350 of conveying unit 300, the first driving portion 581
It can make first support bar 582 along the vertical direction or horizontal direction movement, and first support bar 582 can also be made to rotate.
Hereinafter, referring to Fig.1 6 to Figure 21, in first chamber 510 substrate alignment unit 710,720,730,740,750,
The process of 760 alignment two substrates S1, S2 is specifically described.
Figure 16 to Figure 19 is the figure illustrated by the process that substrate alignment unit is aligned to two substrates, figure
20 be the stereogram for the interval adjustment portion for being schematically illustrated Figure 16, and Figure 21 is the corner support portion for being schematically illustrated Figure 16
Figure.
Referring to Fig.1 6, substrate alignment unit may include substrate support pedestal 511, multiple corner support portions 710,720,730,
740, the first interval adjustment portion 750 and second is spaced adjustment portion 760.
Substrate support pedestal 511 can support two substrates S1, the S2 moved from box 100.Substrate support pedestal 511 can be with
It is the plate-like shape of the plane with quadrangle.
In the present embodiment, two substrates S1, S2 are arranged in substrate support pedestal 511 with being spaced from each other, and maintain accommodating groove
Interval between interior two substrates S1, S2 and be arranged in substrate support pedestal 511.In the following description, for the convenience of explanation,
By from plan view Figure 16 when be arranged in first direction (X-direction) the substrate in left side be known as first substrate S1, will arrange
Substrate in the right side of first direction (X-direction) is known as second substrate S2.
In addition, the corner of first substrate S1 and second substrate S2 can be disposed with multiple corners support portion 710,720,
730,740.More specifically, as shown in figure 16, can the left side corner of first substrate S1 be disposed with corner support portion 710,
720, it is disposed with corner support portion 730,740 in the right side corner of second substrate S2.
At this point, when the first interval interval of adjustment portion 750 and second adjustment portion 760 pushes first substrate S1 to the left, corner
Support portion 710,720 can prevent first substrate S1 movable to the left, and it is pre- so that the left side corner of first substrate S1 is fixed on
Fixed position.When the first interval interval of adjustment portion 750 and second adjustment portion 760 pushes second substrate S2 to the right, corner support
Portion 730,740 can prevent second substrate S2 movable to the right, and it is scheduled so that the right side corner of second substrate S2 is fixed on
Position.
Referring to Fig.1 7, multiple corner support portions 710,720,730,740 can be moved to scheduled position.Here, predetermined
Position can indicate when the interval for completing first substrate S1 and second substrate S2 is adjusted, first substrate S1 and second substrate S2
Corner should the location of.In addition, in fig. 17, although illustrate multiple corner support portions 710,720,730,740 with
The situation that the corner of first substrate S1 and second substrate S2 contact with each other, but can also be not in contact with each other.
As shown in figure 17, if multiple corner support portions 710,720,730,740 are placed on scheduled position, until complete
Until being adjusted at the interval of first substrate S1 and second substrate S2, multiple corner support portions 710,720,730,740 are fixed.
8 and Figure 19 referring to Fig.1, if multiple corner support portions 710,720,730,740 are positioned over scheduled position, first
Interval adjustment portion 750 and second is spaced adjustment portion 760 and can be inserted between opposed facing first substrate S1 and second substrate S2
Space.At this point, the first interval interval of adjustment portion 750 and second adjustment portion 760 can be by first substrate S1 and second substrate S2
Push the corner side of first substrate S1 and the corner side of second substrate S2 to respectively.More specifically, first interval adjustment portion 750 and
First substrate S1 can be pushed to left side by the second interval adjustment portion 760, push second substrate S2 to right sides.In turn, first substrate
Corner support portion 710,720 is tightly attached in the left side corner of S1, the right side corner of second substrate S2 be tightly attached to corner support portion 730,
740。
In the present embodiment, the first interval adjustment portion 750 (Y-direction) can be inserted into the first base from top to bottom in a second direction
Space between plate S1 and second substrate S2.Also, second interval adjustment portion 760 can in a second direction (Y-direction) from down toward
The upper space being inserted between first substrate S1 and second substrate S2.
In addition, the first interval adjustment portion 750 may include the first main body 751, first substrate lateral support platform 755 and first
It is spaced enlarged portion 753.Also, the second interval adjustment portion 760 may include the second main body 761, second substrate lateral support platform 765
And second interval enlarged portion 763.
First substrate lateral support platform 755 is incorporated into the first main body 751, and can be with the first side P1 of first substrate S1
It is contacted with the 5th side P5 of second substrate.Also, second substrate lateral support platform 765 is incorporated into the second main body 761, and can be with
It is contacted with the second side P2 of first substrate S1 with the 6th side P6 of second substrate.Between first interval adjustment portion 750 and second
When adjustment portion 760 starts, first substrate lateral support platform 755 and second substrate lateral support platform 765 can prevent the first base
(Y-direction) is movable to upside or downside in a second direction by plate S1 and second substrate S2.In this specification for the convenience of explanation, with
From plan view Figure 18 when first substrate S1 include positioned at the first side P1 of upside, positioned at the second side P2 of downside, position
Third side P3 in right side and the 4th side P4 positioned at left side.Also, include positioned at the 5th of upside with second substrate S2
Side P5, positioned at the 6th side P6, the heptalateral face P7 positioned at left side of downside and the situation of the 8th side P8 positioned at right side
It illustrates.
At this point, the first interval enlarged portion 753 is rotatably engaged in the first main body 751, so as to push first simultaneously
The heptalateral face P7 of the third side P3 and second substrate S2 of substrate.Also, it is identical with this, the second interval enlarged portion 763 can revolve
Turn ground be incorporated into the second main body 761, so as at the same push first substrate third side P3 and second substrate S2 the 7th
Side P7.That is, the first interval enlarged portion 753 and second is spaced enlarged portion 763 and can push the third side P3 of first substrate to
To right sides are pushed the heptalateral face P7 of second substrate S2 in left side.
In the present embodiment, it may include at predetermined intervals that the first interval enlarged portion 753 and second, which is spaced enlarged portion 763,
A pair of of the rod-type component separated.It is initially inserted into the third side P3 and second substrate of first substrate in the first interval enlarged portion 753
When space between the heptalateral face P7 of S2, a pair of of rod-type component is arranged in parallel with second direction (Y-direction) as a row.It connects
It, as shown in figure 19, the first interval enlarged portion 753 and second is spaced enlarged portion 763 and rotates, to a pair of of rod-type component and first
Direction (X-direction) is arranged in parallel.In turn, the first interval enlarged portion 753 and second is spaced enlarged portion 763 can push the simultaneously
The heptalateral face P7 of the third side P3 and second substrate S2 of one substrate.
With reference to Figure 20, first substrate lateral support platform 755 may include a pair of of rod-type component.However, first substrate side
It's not limited to that for supporting table 755, the sheet shape of an extension can also be utilized to be formed.
In addition, a pair of of rod-type component of the first interval enlarged portion 753 can be arranged on the first swivel plate 753c.According to
The rotation of one swivel plate 753c, a pair of of rod-type component can be parallelly arranged with first direction (X-direction), or and second direction
(Y-direction) is parallelly arranged.At this point, the first swivel plate 753c can pass through motor control.The motor that the present embodiment is applied can
To be servo motor.However, it's not limited to that by the first swivel plate 753c, can also be tied between the first swivel plate 753c and motor
Conjunction has connecting rod (link) component.
A pair of of rod-type component of first interval enlarged portion 753 may include rubber, silica gel or polyurethane.However, a pair of of bar
It's not limited to that for the material of type component, the material of soft (soft) can also be utilized to be formed, to avoid with a pair of of rod-type component
The first substrate S1 and second substrate S2 of contact are damaged.In addition, the second interval enlarged portion 763 includes and the first interval enlarged portion
753 identical compositions, therefore, omission illustrate this.
With reference to Figure 21, corner support portion 730 can have shape corresponding with the corner of second substrate S2 of contact.At this
In embodiment, corner support portion 730 can have the corner corresponding to the second substrate S2 of contact and be in the shape of 90 degree of bendings.
In addition, corner support portion 730 can be incorporated into multiple linkage components 820,830 and driving portion 810.As shown in figure 16, the first chamber
After placing first substrate S1 and second substrate S2 in the substrate support pedestal 511 of room 510, corner support portion 730 moves, Jin Eryi
It moves to scheduled position.As described above, multiple linkage components 820,830 and driving portion 810 can make corner support portion 730 to pre-
Fixed position movement.
If in addition, first substrate S1 and second substrate S2 in the first chamber 510 by substrate alignment unit 710,720,
730, alignment is completed in 740,750,760 (referring to Fig.1 6), then as shown in figure 22, can be by substrate transport unit 580 to be aligned
State to second chamber 520,530,540,560,570 transport.
With reference to Figure 23 and Figure 24, in the present embodiment, the first substrate S1 and second substrate S2 of alignment are transported to second
Before chamber 520,530,540,560,570, blocking portion can be disposed with around first substrate S1 and second substrate S2
610,611,613.From plan view Figure 23 when, blocking portion 610,611,613 can be along first substrate S1 and second substrate S2
Around arrange.In first substrate S1 and second substrate S2 in second chamber 520,530,540,560,570 (referring to Fig.1 3)
When executing the deposition procedures using plasma, the side of first substrate S1 and second substrate S2 may be by the shadows of plasma
It rings.Due to such plasma, first substrate S1 and second substrate S2 may be damaged.That is, in the present embodiment,
Blocking portion 610,611,613 is arranged around one substrate S1 and second substrate S2, is caused by plasma so as to minimize
First substrate S1 and second substrate S2 side damage.
As described above, by the embodiment and attached drawing of restriction, the present invention is described, and but the invention is not restricted to this,
And the people with general knowledge can be in technological thought and claims of the invention in the technical field of the invention
It is subject to a variety of modifications and deformation in equivalency range.
Claims (20)
1. a kind of base plate processing system, wherein including：
First chamber, while moving in or moving out at least two substrates；
Substrate alignment unit is arranged in the first chamber, the side for making at least two substrate separate at predetermined intervals
Formula is aligned；
Multiple second chambers handle at least two substrate being aligned in the first chamber；And
Substrate transport unit transports at least two substrate of alignment to the second chamber from the first chamber, or
It is transported from the second chamber to the first chamber.
2. base plate processing system as described in claim 1, wherein
At least two substrate includes first substrate and second substrate,
The first substrate includes：
First side, it is parallel with first direction, and positioned at the upside of the first substrate；
Second side, it is parallel with the first side, and positioned at the downside of the first substrate；And
Third side and the 4th side, are parallel to the second direction intersected with the first direction,
The second substrate includes：
5th side, it is parallel with the first direction, and positioned at the upside of the second substrate；
6th side, it is parallel with the 5th side, and positioned at the downside of the second substrate；
Heptalateral face is parallel to the second direction, and is faced with the third side of the first substrate, and
8th side, it is parallel with heptalateral face.
3. base plate processing system as claimed in claim 2, wherein
The substrate alignment unit includes：
Substrate support pedestal, support along the first direction be spaced from each other first substrate at least two substrate of arrangement and
Second substrate；
Multiple corner support portions support being located at along the both ends of the first direction for the first substrate and the second substrate
The corner of side；And
Multiple interval adjustment portions can be moved along the second direction, and be inserted into the first substrate and the second substrate it
Between space, so that the first substrate and the second substrate be pushed to and the first substrate and the second substrate respectively
The multiple corner support portion side of contact.
4. base plate processing system as claimed in claim 3, wherein
The multiple interval adjustment portion includes：
First interval adjustment portion, can be from top to bottom inserted into along the second direction first substrate and the second substrate it
Between the space；And
Second interval adjustment portion, can be inserted into the space from bottom to up along the second direction.
5. base plate processing system as claimed in claim 4, wherein
First interval adjustment portion respectively includes：
First main body；
First substrate lateral support platform is arranged in along the first direction in first main body, and can divide with being spaced from each other
It is not contacted with the 5th side of the first side of the first substrate and the second substrate；And
First interval enlarged portion, is rotatably engaged in first main body, and can push the first substrate simultaneously
The heptalateral face of the third side and the second substrate.
6. base plate processing system as claimed in claim 5, wherein
Described second, which is spaced adjustment portion, includes：
Second main body；
Second substrate lateral support platform is arranged in along the first direction in second main body, and can divide with being spaced from each other
It is not contacted with the 6th side of the second side of the first substrate and the second substrate；And
Second interval enlarged portion, is rotatably engaged in second main body, and can push the first substrate simultaneously
The heptalateral face of the third side and the second substrate.
7. base plate processing system as claimed in claim 6, wherein
The first interval enlarged portion and second interval enlarged portion include a pair of of the rod-type component separated at a predetermined interval.
8. base plate processing system as claimed in claim 7, wherein
The pair of rod-type component includes rubber, silica gel or polyurethane.
9. base plate processing system as claimed in claim 3, wherein
Each in the multiple corner support portion has the corner pair with the first substrate and the second substrate
The shape answered.
10. base plate processing system as claimed in claim 3, wherein
The substrate transport unit includes：
First support bar supports at least two substrate；And
First driving portion is combined with the first support bar, and the mobile first support bar.
11. base plate processing system as claimed in claim 3, wherein further include：
Box, keeping are transported at least two substrate of the first chamber；And
At least two substrate is transported to the first chamber by conveying unit from the box.
12. base plate processing system as claimed in claim 11, wherein
The conveying unit includes：
Multiple second support bars support at least two substrate being arranged parallel to, and extend along a direction；And
Second driving portion is combined with the multiple second support bar, and mobile the multiple second support bar.
13. base plate processing system as claimed in claim 12, wherein
Each in the multiple second support bar has the resettlement groove for disposing at least two substrate.
14. base plate processing system as claimed in claim 3, wherein
The multiple corner support portion is contacted or is detached with the corner of the first substrate and the second substrate.
15. base plate processing system as described in claim 1, wherein
Dummy line of the first chamber with the multiple second chamber along ring-shaped arranges.
16. a kind of substrate transfer method adopted therein, while two substrates are transported to first chamber from the box including multiple accommodating grooves,
In, include the following steps：
Confirm whether an accommodating groove in the multiple accommodating groove is disposed with described two substrates；
In the case where one accommodating groove is disposed with described two substrates, described two substrates are positioned over to the branch of conveying unit
On strut, and then described two substrates are transported to the first chamber；And
One accommodating groove arrangement there are one substrate in the case of, one accommodating groove arrange another substrate it
Afterwards, described two substrates are positioned on the supporting rod, and then described two substrates is transported to the first chamber.
17. substrate transfer method adopted therein as claimed in claim 16, wherein
Include the following steps in the step of one accommodating groove arranges another described substrate：
Confirm that one substrate is located at the inside of one accommodating groove still positioned at the outside of one accommodating groove.
18. substrate transfer method adopted therein as claimed in claim 17, wherein
Include the following steps in the step of one accommodating groove arranges another described substrate：
In the case where one substrate is located at the inside of one accommodating groove, by another described substrate arranged in described
The outside of accommodating groove.
19. substrate transfer method adopted therein as claimed in claim 17, wherein
Include the following steps in the step of one accommodating groove arranges another described substrate：
In the case where one substrate is located at the outside of one accommodating groove, the one of the outside will be arranged in
Substrate is moved to the inside of one accommodating groove, and by another described substrate arranged to the outside of the accommodating groove.
20. substrate transfer method adopted therein as claimed in claim 16, wherein
In the case where one accommodating groove is disposed with one substrate,
One substrate is the substrate for deposition, another additional substrate is virtual substrate.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010423057.8A CN111564389B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
| CN202010425102.3A CN111554597B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system and substrate conveying method |
| CN202010423471.9A CN111554596A (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
| CN202311022598.XA CN117038520A (en) | 2017-04-13 | 2018-04-13 | Substrate conveying method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0047979 | 2017-04-13 | ||
| KR1020170047979A KR101970780B1 (en) | 2017-04-13 | 2017-04-13 | Substrate processing system and control method of transferring substrate |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010423471.9A Division CN111554596A (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
| CN202010423057.8A Division CN111564389B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
| CN202311022598.XA Division CN117038520A (en) | 2017-04-13 | 2018-04-13 | Substrate conveying method |
| CN202010425102.3A Division CN111554597B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system and substrate conveying method |
Publications (2)
| Publication Number | Publication Date |
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| CN108735625A true CN108735625A (en) | 2018-11-02 |
| CN108735625B CN108735625B (en) | 2020-06-12 |
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| CN201810328229.6A Active CN108735625B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system and substrate transfer method |
| CN202010423057.8A Active CN111564389B (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
| CN202311022598.XA Pending CN117038520A (en) | 2017-04-13 | 2018-04-13 | Substrate conveying method |
| CN202010423471.9A Pending CN111554596A (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
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| CN202311022598.XA Pending CN117038520A (en) | 2017-04-13 | 2018-04-13 | Substrate conveying method |
| CN202010423471.9A Pending CN111554596A (en) | 2017-04-13 | 2018-04-13 | Substrate processing system |
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| CN111755371A (en) * | 2019-03-27 | 2020-10-09 | 东京毅力科创株式会社 | Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method |
| CN112447570A (en) * | 2019-08-29 | 2021-03-05 | 圆益Ips股份有限公司 | Alignment module and substrate processing system including the same |
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| JP2021182612A (en) * | 2020-05-20 | 2021-11-25 | 東京エレクトロン株式会社 | Concatenation processing container, substrate processing system, and substrate processing method |
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| CN112447570A (en) * | 2019-08-29 | 2021-03-05 | 圆益Ips股份有限公司 | Alignment module and substrate processing system including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111564389A (en) | 2020-08-21 |
| KR20180115839A (en) | 2018-10-24 |
| CN111554597B (en) | 2023-08-29 |
| CN111554597A (en) | 2020-08-18 |
| KR101970780B1 (en) | 2019-04-22 |
| CN117038520A (en) | 2023-11-10 |
| CN111564389B (en) | 2023-08-29 |
| CN108735625B (en) | 2020-06-12 |
| CN111554596A (en) | 2020-08-18 |
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