CN112447570A - Alignment module and substrate processing system including the same - Google Patents

Alignment module and substrate processing system including the same Download PDF

Info

Publication number
CN112447570A
CN112447570A CN202010885072.4A CN202010885072A CN112447570A CN 112447570 A CN112447570 A CN 112447570A CN 202010885072 A CN202010885072 A CN 202010885072A CN 112447570 A CN112447570 A CN 112447570A
Authority
CN
China
Prior art keywords
substrate
alignment
divided
substrates
aligning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010885072.4A
Other languages
Chinese (zh)
Inventor
刘成真
金娧永
金颍俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wonik IPS Co Ltd
Original Assignee
Wonik IPS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wonik IPS Co Ltd filed Critical Wonik IPS Co Ltd
Publication of CN112447570A publication Critical patent/CN112447570A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Abstract

The present invention relates to substrate processing, and more particularly, to an alignment module for aligning a substrate to be processed and a substrate processing system including the same. The invention discloses an alignment module (100) for selectively aligning a single substrate (11) of a rectangular quadrilateral shape introduced from the outside or 2 divided substrates (12) for dividing the single substrate (11) into 2 pieces, comprising: an alignment chamber (110) forming a sealed interior space; a substrate support part (120) disposed in the alignment chamber (110) to support the single substrate (11) or the 2 divided substrates (12); and an alignment unit that aligns the single substrate (11) when the single substrate (11) is introduced into the alignment chamber (110), and aligns the 2 divided substrates (12) when the 2 divided substrates (12) are introduced into the alignment chamber (110).

Description

Alignment module and substrate processing system including the same
Technical Field
The present invention relates to substrate processing, and more particularly, to an alignment module for aligning a substrate to be processed and a substrate processing system including the same.
Background
The substrate processing system is configured with cluster type and inline type according to the combination of the load lock module and the process module.
Cluster type refers to a substrate processing system architecture as follows: a load lock module, which introduces a substrate from the outside with one transfer module for transferring the substrate as a center, and a plurality of process modules, which are coupled to the transfer module to receive the substrate processing substrate from the transfer module, are provided.
Here, the load lock module may have various structures such as a pressure conversion function as a module for performing a function required before substrate processing such as alignment, preheating, etc., before introducing a substrate introduced from the outside into the transfer module or the process module, and may transfer the substrate from the outside under atmospheric pressure to the transfer module or the process module under vacuum pressure, etc., as required.
On the other hand, there are sixth generation, seventh generation, eighth generation, etc. of the substrate processing system including the load lock module, and the size is increased according to the size of the substrate based on the processed substrate, and the size, alignment function, recipe, etc. are generally optimized according to the increased specification of the substrate.
Such a substrate processing system is required to process not only a single substrate having standards of each generation but also a divided substrate obtained by dividing a single substrate.
However, in the case of the conventional substrate processing system, since the substrate processing cannot be performed on the divided substrates obtained by dividing the single substrate by the substrate processing system capable of processing the single substrate, in order to perform the substrate processing on the divided substrates obtained by dividing the single substrate, it is necessary to newly configure the substrate processing system optimized for performing the substrate processing on the divided substrates, and accordingly, there is a problem that the investment cost for equipment increases.
Disclosure of Invention
(problem to be solved)
An object of the present invention is to solve the above-described problems and to provide a substrate processing system capable of switching a process between a substrate processing process for a single substrate and a substrate processing process for a divided substrate divided into 2 pieces for a single substrate.
Another object of the present invention is to provide an alignment module and a substrate processing system including the same, which can perform alignment for both a single substrate to be processed and a divided substrate in which the single substrate is divided into 2 pieces.
(means for solving the problems)
The present invention has been made to achieve the above-described object of the present invention, and discloses an alignment module 100 as an alignment module 100 for selectively aligning a single substrate 11 having a rectangular quadrilateral shape introduced from the outside or 2 divided substrates 12 obtained by dividing the single substrate 11 into 2 pieces, the alignment module 100 including: an alignment chamber 110 forming a sealed inner space; a substrate support part 120 disposed in the alignment chamber 110 to support the single substrate 11 or the 2 divided substrates 12; and an aligning unit for aligning the single substrate 11 when the single substrate 11 is introduced into the alignment chamber 110, and aligning the 2 divided substrates 12 when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The alignment part may include: a single-substrate-dedicated aligning section 410 for aligning the single substrate 11; a divided substrate dedicated alignment unit 420 for aligning the 2 divided substrates 12; the general alignment unit 430 aligns the single substrate 11 together with the single substrate dedicated alignment unit 410 when the single substrate 11 is introduced into the alignment chamber 110, and aligns the 2 divided substrates 12 together with the divided substrate dedicated alignment unit 420 when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The common aligning part 430 is movable between a single substrate aligning position for aligning the single substrate 11 and a divided substrate aligning position for aligning the 2 divided substrates 12.
The alignment portion 410 for single substrate may be provided to correspond to one vertex (hereinafter, first vertex P1) of four vertices of the single substrate 11 in a state where the single substrate 11 is supported by the substrate support portion 120.
The common alignment portion 430 may be located at a vertex (hereinafter, a second vertex P2) diagonally opposite to the first vertex in the single substrate 11 when aligning the single substrate 11.
The alignment unit 410 may include a pressing member 412 dedicated to a single substrate, and the pressing member 412 dedicated to a single substrate may press the single substrate in a horizontal direction by closely contacting the first vertex P1 to two adjacent sides of the single substrate 11.
The divided substrate-dedicated aligning part 420 may include: a divided substrate center aligning part 510 that is disposed in a diagonal direction with respect to one divided substrate 12 (hereinafter, a first divided substrate 12a) among the 2 divided substrates 12 in a state where the 2 divided substrates 12 are disposed in the horizontal direction in the alignment chamber 110, enters between the 2 divided substrates 12 from a pair of adjacent vertexes (hereinafter, a pair of third vertexes P3) of the 2 divided substrates 12 with the common aligning part 430, and pressurizes both sides of the 2 divided substrates 12 in the horizontal direction, respectively; the divided substrate side surface aligning portion 520 horizontally presses both side edges of the second divided substrate 12b from a vertex (hereinafter, fourth vertex P4) that diagonally faces the third vertex in the remaining one divided substrate 12 (hereinafter, second divided substrate 12b) of the 2 divided substrates 12.
The divided substrate side aligning part 520 may include a divided substrate dedicated pressing member 522, and the divided substrate dedicated pressing member 522 may press the divided substrate in a horizontal direction while the fourth apex P4 is in close contact with both side edges of the second divided substrate 12 b.
The common alignment part 430 may be located at a vertex (hereinafter, a fifth vertex P5) diagonally opposite to the third vertex P3 in the first divided substrate 12a when aligning the 2 divided substrates 12.
The universal alignment feature 430 may include: a common pressing member 432 that presses the second vertex P2 against both side edges of the single substrate 11 at the single-substrate alignment position, and presses the fifth vertex P5 against both side edges of the first divided substrate 12a in the horizontal direction at the divided-substrate alignment position; a position adjusting portion for changing the position of the common pressing member 432 between the single-substrate alignment position and the divided-substrate alignment position.
The alignment unit 420 dedicated for divided substrates is located at a standby position not interfering with the single substrate 11 when aligning the single substrate 11; the alignment unit 410 dedicated to a single substrate may be located at a standby position where it does not interfere with the 2 divided substrates 12 when aligning the 2 divided substrates 12.
The alignment part may include: a single substrate aligning unit for aligning the horizontal positions of the single substrates 11 at positions facing each other in a main diagonal direction D1 when the single substrates 11 are introduced into the alignment chamber 110; the divided substrate aligning part aligns the horizontal positions of the 2 divided substrates 12 at positions where the sub-diagonal directions D2 and D3 of the divided substrates 12 face each other when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The divided substrate alignment part may include a first divided substrate alignment part and a second divided substrate alignment part that align horizontal positions of the respective divided substrates 12.
The first divided substrate alignment part may include: a first center aligning part 210 linearly moving between a pair of inner sides of the 2 quadrangular divided substrates 12 facing each other to support the inner side of the support substrate of one of the 2 divided substrates 12; a first side alignment part 220 disposed near a vertex facing the first center alignment part 210 in a first sub-diagonal direction D2, and pressurizing the support substrate in a horizontal direction by at least one of rotation and linear movement, wherein the first sub-diagonal direction D2 is a sub-diagonal direction of the support substrate supported by the first center alignment part 210;
the second divided substrate alignment part may include: a second center aligning part 240 which is provided at a position opposite to the first center aligning part 210 with reference to an inner side edge of the support substrate of the remaining one of the 2 divided substrates 12, and linearly moves between a pair of inner side edges of the 2 rectangular divided substrates 12 facing each other to support the inner side edge of the support substrate; a second side alignment part 230 disposed near a vertex facing the second center alignment part 240 in a second sub-diagonal direction D3, for pressing the support substrate in a horizontal direction by at least one of rotation and linear movement, wherein the second sub-diagonal direction D3 is the sub-diagonal direction of the support substrate supported by the second center alignment part 240.
At least one of the first and second centering portions 210 and 240 may include: the plurality of centering members 222 are configured such that, with respect to a horizontal virtual reference line L perpendicular to the arrangement direction of the 2 divided substrates 12, the outermost portion S approaches the horizontal virtual reference line L while moving from the horizontal virtual reference line L in the direction of the divided substrates 12, and further linearly moves between a pair of inner sides of the 2 rectangular divided substrates 12 facing each other to support the inner side of one of the 2 rectangular divided substrates 12.
At least one of the first and second centering portions 210 and 240 may include: a center alignment member 212 supporting an inner side edge of the support substrate; an alignment member moving part 214 linearly moves the center alignment member 212 between the pair of inner side edges.
The center aligning member 212 is rotatably coupled to the rotating member 213 in a state of being eccentric from a rotating shaft of the rotating member 213, wherein the rotating member 213 is rotatably provided in the body part 215 around a rotating shaft perpendicular to the 2 rectangular substrates 1; when the center aligning member 212 is located between the pair of inner sides, the rotating member 213 may be rotated by a rotating tool in order to shorten a relative distance of the center aligning member 212 with respect to the inner sides of the support substrate.
Positions corresponding to the apexes of the single substrate 11 are defined as K1, K2, K3, K4 in the counterclockwise direction; positions corresponding to the apexes of one of the 2 divided substrates 12 are defined as K1, K5, K7, K4 in the counterclockwise direction; when positions corresponding to the vertices of the remaining one of the 2 divided substrates 12 are defined as K6, K2, K3, and K8 in the counterclockwise direction, the principal diagonal direction D1 is defined by a diagonal direction connecting the vertices of the single substrates 11 provided corresponding to K1 and K3; the first sub diagonal direction D2 is defined by a diagonal direction connecting vertices of the divided substrates 12 provided corresponding to K4 and K5; the second sub diagonal direction D3 may be defined by a diagonal direction connecting vertices of the divided substrates 12 disposed corresponding to K8 and K2.
At least one of the first and second centering portions 210 and 240 may include a contour support member 219 supporting an outer side adjacent to an inner side of the support substrate with respect to an apex.
Positions corresponding to apexes of the single substrate 11 are defined as K1, K2, K3, K4 in a counterclockwise direction; positions corresponding to the apexes of one of the 2 divided substrates 12 are defined as K1, K5, K7, K4 in the counterclockwise direction; when positions corresponding to the vertices of the remaining one of the 2 divided substrates 12 are defined as K6, K2, K3, and K8 in the counterclockwise direction, the main diagonal direction D1 is defined by a diagonal direction connecting the vertices of the single substrates 11 provided corresponding to K4 and K5; the first sub diagonal direction D2 is defined by a diagonal direction connecting vertices of the divided substrates 12 provided corresponding to K4 and K5; the second sub diagonal direction D3 may be defined by a diagonal direction connecting vertices of the divided substrates 12 disposed corresponding to K8 and K2.
At least one of the first and second centering portions 210 and 240 may include a contour support member 219 supporting an outer side adjacent to an inner side of the support substrate with respect to an apex.
At least one of the first side aligning part 220 and the second side aligning part 230 may constitute the single-substrate aligning part.
An alignment position of the apex of each of the divided substrates 12 provided corresponding to the K2 and K4 when the divided substrates 12 are aligned is referred to as a divided substrate alignment position; when an alignment position of a vertex of a single substrate 11 provided corresponding to the K2 and the K4 when aligning the single substrate 11 is referred to as a single substrate alignment position, the divided substrate alignment position and the single substrate alignment position corresponding to at least one of the K2 and the K4 are located at different alignment positions from each other; at least one of the first side aligning part 220 and the second side aligning part 230 is movably disposed between the divided substrate aligning position and the single substrate aligning position, which are different from each other.
In another aspect, the present invention discloses a substrate processing system comprising: an alignment module 100 for introducing a single substrate 11 or dividing the single substrate 11 into 2 divided substrates 12; a transfer module 20 coupled to the alignment module and configured to guide the single substrate 11 or the divided substrate 12 out of the alignment module 100 by a transfer robot 21; one or more process modules 50 coupled to the transfer module 20, and configured to receive the single substrate 11 or the divided substrates 12 by the transfer robot 21 and perform substrate processing;
in another aspect, the present invention discloses a substrate processing system as a substrate processing system including an alignment module 100, a transfer module 200, and a plurality of process modules 300, wherein the alignment module 100 aligns a processing object introduced from the outside, the transfer module 200 is provided with a transfer robot 21, the transfer robot 21 is coupled to one side of the alignment module 100 and guides out the processing object from the alignment module 100, the plurality of process modules 300 are coupled to the transfer module 200 and receive the processing object from the transfer robot 21 to perform substrate processing, and the processing object is a single substrate 11 having a rectangular quadrilateral shape or 2 divided substrates 12 dividing the single substrate 11 into 2 pieces; the substrate processing system performs alignment and substrate processing on the single substrate 11 when the single substrate 11 is introduced from the outside; alignment and substrate processing are performed on the 2 divided substrates 12 when the 2 divided substrates 12 are introduced.
At least one of the plurality of process modules 300 may be a single substrate processing module for performing substrate processing with respect to the single substrate 11; at least one of the plurality of process modules 300 may be a divided substrate processing module for performing substrate processing with respect to the 2 divided substrates 12.
The process module 300 may selectively perform substrate processing for the single substrate 11 and substrate processing for the 2 divided substrates 12 according to the processing object received from the transfer module 200.
(Effect of the invention)
The substrate processing system of the present invention can switch the process between the substrate processing process for a single substrate and the substrate processing process for 2 divided substrates divided into 2 for a single substrate, and thus has an advantage that the substrate processing can be performed regardless of whether the substrate processing object is a single substrate or a divided substrate.
Accordingly, the substrate processing system of the present invention has the following advantages: even if the substrate processing object is changed from a single substrate to a divided substrate or vice versa, the existing substrate processing system can be directly and flexibly utilized without redesigning the substrate processing system, so that the cost required for equipment investment can be saved, and the substrate processing can be performed regardless of the kind of the substrate processing object, so that the substrate processing speed can be increased, and the system footprint can be improved.
In more detail, the alignment module of the substrate processing system of the present invention has the following advantages: alignment can be performed regardless of whether a substrate processing object is a single substrate or a divided substrate in which a single substrate is divided into 2 pieces, thereby increasing a substrate processing speed and improving a footprint compared to an existing alignment module that performs only alignment for a single substrate or performs only alignment for a divided substrate.
As an example, the alignment module of the present invention may be configured to adjust a position of a part of the structure with respect to an alignment portion for aligning a substrate processing object, and is flexible and versatile for aligning a single substrate and aligning divided substrates, and further has one alignment module that can perform alignment for both a single substrate and 2 divided substrates; therefore, the method has the following advantages: the structure of the alignment part is simplified, and a single alignment module can be directly and flexibly used without increasing equipment no matter whether the substrate processing object is a single substrate or a divided substrate.
As another example, the alignment module and the substrate processing system including the same according to the present invention have a single substrate alignment part for aligning a single substrate and a divided substrate alignment part for aligning a divided substrate into 2 pieces from the single substrate, and thus may perform alignment with respect to both the single substrate and the divided substrate, so that there is no need to replace the alignment module or the like according to a change in the size of the substrate, and further, there is no need to replace the remaining existing modules such as a process module or the like, but may process the substrate through simple deformation, and thus, there is an advantage in that the substrate manufacturing cost may be significantly reduced.
Drawings
Fig. 1a to 1c are conceptual views illustrating an embodiment of a substrate processing system of the present invention.
FIG. 2a is a plan view showing the alignment module of the substrate processing system of the present invention aligning a single substrate; fig. 2b is a plan view illustrating alignment of 2 divided substrates by the alignment module of the substrate processing system of the present invention.
Fig. 3 is a side sectional view of the alignment module of fig. 2 b.
Fig. 4a and 4b are views illustrating an operation of a part of the structure of the alignment module of the substrate processing system according to the present invention.
Fig. 5 is a diagram illustrating a position adjustment operation of a part of the structure of the alignment module of the substrate processing system according to the present invention.
FIG. 6a is a plan view illustrating a process of aligning a single substrate by an alignment module of a substrate processing system according to another embodiment of the present invention; fig. 6b is a plan view illustrating a process of aligning 2 divided substrates by the alignment module of the substrate processing system of the present invention.
Fig. 7 is a plan view showing a process of aligning a single substrate as a modification of the alignment modules of fig. 6a and 6 b.
Fig. 8a and 8b are partial plan views showing the structure and operation of at least one of the first and second centering portions of the alignment module of fig. 6a and 6b as a first embodiment.
Fig. 9 is a cross-sectional view taken along the line I-I in fig. 8 b.
Fig. 10 is a bottom view showing the bottom surface side of the main body in fig. 8 b.
Fig. 11a and 11b are partial plan views showing a structure and an operation, which are a second embodiment of at least one of the first and second centering portions of the alignment module of fig. 6a and 6 b.
Fig. 12 is a cross-sectional view taken along line I-I in fig. 11 b.
Fig. 13 is a partial plan view showing a modification of the embodiment of fig. 11a and 11 b.
Fig. 14a and 14b are partial plan views showing the structure and operation of an alignment module of fig. 6a and 6b, which is an example of a side alignment part.
(description of reference numerals)
11: single substrate 12: dividing substrate
100: the alignment module 200: transport module
300: process module
Detailed Description
Hereinafter, a substrate processing system according to the present invention will be described with reference to the drawings.
The substrate processing system of the present invention, as a cluster type substrate processing system, may include: an alignment module 100 aligning a processing object introduced from the outside; a transfer module 200 provided with a transfer robot 21 coupled to one side of the alignment module 100 and configured to lead out a processing object from the alignment module 100; the plurality of process modules 300 are coupled to the transfer module 200, receive the processing target from the transfer robot 21, and perform substrate processing.
The alignment module 100 may be any one of load lock modules as long as it is configured to be loaded with a processing object from the outside and then unloaded after alignment.
Then, the alignment module 100 of the present invention is applicable to substrate processing systems for substrate processing such as etching, deposition, etc., in both cluster type and in-line type.
As an example, as shown in fig. 1a to 1c, as an example of a substrate processing system in which the alignment module 100 of the present invention is provided as a load lock module, it includes: an alignment module 100 into which the substrates 11 and 12 are introduced from the outside by a transfer robot; a transfer module 200 coupled to the alignment module 100 and configured to guide the substrates 11 and 12 out of the alignment module 100 by a transfer robot 21; the one or more process modules 300 are coupled to the transfer module 200, and receive the substrates 11 and 12 by the transfer robot 21 to perform substrate processing.
In this case, gate valves 31, 32, 41 can be provided in the individual modules for the purpose of isolation from one another.
The transfer module 200 may have various structures such as a structure including a transfer chamber in which the transfer robot 21 is disposed together with the transfer robot 21, as a structure for disposing the transfer robot 21 coupled to the alignment module 100 and leading out the processing object from the alignment module 100.
The process module 300 may have various structures according to the kind of substrate processing, as a module that is coupled to the transfer module 200 and receives a processing object from the transfer robot 21 to perform substrate processing such as etching and deposition.
The processing object that has completed the substrate processing in the process module 300 is naturally discharged to the outside again by the transfer robot 21 of the transfer module 200.
On the other hand, the processing target may be a substrate (for example, a glass substrate) to be processed, and may be a single substrate 11 having a rectangular quadrilateral shape or 2 divided substrates 12 obtained by dividing the single substrate 11 into 2 pieces.
The single substrate 11 may be a rectangular quadrilateral substrate having a size of a specification of each generation.
The 2 divided substrates 12 are substrates obtained by dividing the single substrate 11 into 2 pieces along the center line L of the single substrate 11, and may be 2 pieces of substrates having a symmetrical rectangular shape with respect to the center line L. Then, in the case of dividing the substrate into 2 divided substrates 12, all of the 2 substrates can be transported at once.
In this case, the substrate processing system according to the present invention can perform alignment and substrate processing on a single substrate 11 when the single substrate 11 is introduced from the outside, and can perform alignment and substrate processing on 2 divided substrates 12 when 2 divided substrates 12 are introduced from the outside.
That is, the substrate processing system of the present invention can be configured to perform both the substrate processing for a single substrate 11 and the substrate processing for 2 divided substrates 12, and thus can perform the substrate processing process in alignment regardless of whether the processing target introduced from the outside is the single substrate 11 or the 2 divided substrates 12.
As an example, as shown in fig. 1a, the substrate processing system of the present invention comprises: when the single substrate 11 is introduced from the outside, the single substrate 11 is aligned by the alignment module 100, and then the single substrate 11 is transferred to each process module 300 by the transfer module 200, so that the substrate processing can be performed on the single substrate 11.
As another example, as shown in fig. 1b, the substrate processing system of the present invention comprises: when 2 divided substrates 12 are introduced from the outside, the 2 divided substrates 12 are aligned by the alignment module 100, and then the 2 divided substrates 12 are transferred to the respective process modules 300 by the transfer module 200, and substrate processing can be performed on the 2 divided substrates 12.
On the other hand, the mounting position of the divided substrate 12 in the alignment chamber 110 of the alignment module 100 may be variously set as the relative position of the single substrate 11.
As an example, the mounting position of the divided substrates 12 in the alignment chamber 110 of the alignment module 100 may be set such that the center line of the divided substrate 12 in the X-axis direction (i.e., the transport direction) coincides with the center line of the single substrate 11 in the X-axis direction in a rectangular shape formed by 2 divided substrates 12.
As another example, the mounting position of the divided substrates 12 in the alignment chamber 110 of the alignment module 100 may be set such that the front side in the transport direction of 2 divided substrates 12 coincides with the front side in the X-axis direction of a single substrate 11.
As another example, the mounting position of the divided substrates 12 in the alignment chamber 110 of the alignment module 100 may be set such that the rear side of the 2 divided substrates 12 in the transport direction coincides with the rear side of the single substrate 11 in the X-axis direction.
In the case of fig. 1a to 1b, the alignment module 100 may selectively perform all of the alignment for a single substrate 11 and the alignment for 2 divided substrates 12 according to the kind of a processing object introduced from the outside; the process module 300 may selectively perform all of the substrate processing for the single substrate 11 and the substrate processing for the 2 divided substrates 12 according to the processing objects received from the transfer module 200.
As another example, as shown in fig. 1c, the substrate processing system of the present invention comprises: at least one of the plurality of process modules 300 may be a single substrate processing module for performing substrate processing with respect to the single substrate 11; at least one of the plurality of process modules 300 may be a dividing machine board processing module for performing substrate processing with respect to the 2 divided substrates 12.
In the case of fig. 1a to 1b, the alignment module 100 may also selectively perform the alignment for a single substrate 11 and the alignment for 2 divided substrates 12 in their entirety.
Accordingly, the substrate processing system of the present invention has the following advantages: substrate processing can be performed regardless of whether the substrate introduced from the outside is a single substrate 11 or 2 divided substrates 12 obtained by dividing the single substrate 11 into 2 pieces.
In more detail, in order for the substrate processing system to perform substrate processing on both a single substrate 11 and 2 divided substrates 12, the alignment module 100 may include: an alignment chamber 110 forming a sealed inner space; a substrate support part 120 disposed in the alignment chamber 110 to support the single substrate 11 or the 2 divided substrates 12; the alignment unit aligns the single substrate 11 when the single substrate 11 is introduced into the alignment chamber 110, and aligns 2 divided substrates 12 when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The alignment chamber 110 may include a chamber body 112 and an upper cover plate 114 as a structure forming a sealed inner space, the chamber body 112 having a rectangular parallelepiped shape and an upper side opened, the upper cover plate 114 being detachably coupled with the chamber body 112.
The chamber body 112 is formed with one or more shutters 102 to introduce and discharge the processing objects, and a pair of shutters 102 may be formed in directions facing each other as shown in fig. 2a to 2 b.
On the other hand, the alignment chamber 110 may incorporate a pressure conversion device such as a vacuum pump according to the installation environment to realize pressure conversion, and thus may transfer the processing object from the outside under the atmospheric pressure to the transfer module 200 under the vacuum pressure.
In addition, the alignment chamber 110 may be provided with, for example, a heater, etc. according to the kind of substrate processing, for preheating, etc.
The substrate support 120 is a structure disposed in the alignment chamber 110 to support a single substrate 11 or the 2 divided substrates 12, and may have various structures.
That is, the substrate support part 120 supports a single substrate 11 when introducing the single substrate 11 into the alignment chamber 110, and supports 2 divided substrates 12 when introducing 2 divided substrates 12 into the alignment chamber 110.
As an example, the substrate support part 120 may be formed of lift pins formed to protrude from the bottom surface of the alignment chamber 110 to the upper side.
In addition, the substrate support part 120 may be composed of the substrate support unit 3 disclosed in fig. 3c, etc. of korean laid-open patent publication No. 10-2014-0119283.
On the other hand, the substrate support 120 is provided to be movable up and down.
In addition, when the substrate support portion 120 supports 2 divided substrates 12, an embodiment in which 2 divided substrates 12 are supported such that the 2 divided substrates 12 have a height difference in the vertical direction may be realized.
At this time, as shown in fig. 2a to 2b, 2 divided substrates 12 can be arranged in the alignment chamber 110 in a horizontal direction perpendicular to the center line L of the single substrate 11 arranged in the alignment chamber 110.
The 2 divided substrates 12 are arranged in the alignment chamber 110 so as to be spaced apart from each other by a predetermined pitch with respect to the center line L of each substrate 11.
Preferably, the 2 divided substrates 12 may be arranged to be symmetrical with respect to the center line L of the single substrate 11 aligned in the alignment chamber 110.
The mounting positions of the single substrate 11 and the 2 divided substrates 12 in the alignment chamber 110 may be arranged at various positions according to the structure of an alignment portion described later and the like.
Although not shown, the 2 divided substrates 12 may be symmetrical with respect to the center line L of the single substrate 11 aligned in the alignment chamber 110, or may be asymmetrical, and may be disposed in a state of being shifted to one side in the horizontal direction as an example of asymmetry.
The alignment part may have various structures as a structure provided at a horizontal position of the alignment chamber 110 to align the single substrate 11 or the 2 divided substrates 12 supported by the substrate support part 120.
That is, the aligning part may be configured to align a single substrate 11 when introducing the single substrate 11 into the alignment chamber 110, and to align 2 divided substrates 12 when introducing 2 divided substrates 12 into the alignment chamber 110.
In one embodiment, as shown in fig. 2a to 2b and fig. 4a to 5, the alignment portion may include: a single-substrate-dedicated aligning section 410 for aligning the single substrate 11; a divided substrate dedicated alignment unit 420 for aligning 2 divided substrates 12; the general alignment unit 430 aligns the single substrate 11 together with the alignment unit 410 for single substrate when the single substrate 11 is introduced into the alignment chamber 110, and aligns the 2 divided substrates 12 together with the alignment unit 420 for divided substrates when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The alignment unit 410 for single substrate may have various configurations as a configuration for aligning the single substrate 11 together with a general alignment unit 430 described later when the single substrate 11 is introduced into the alignment chamber 110.
As an example, as shown in fig. 4a to 4b, the single-substrate dedicated alignment part 410 may be provided corresponding to one vertex (hereinafter, the first vertex P1) of four vertices of the single substrate 11 in a state where the single substrate 11 is supported by the substrate support part 120.
In this case, the alignment unit 410 for single-substrate exclusive use may include a pressing member 412 for single-substrate exclusive use, and the pressing member 412 for single-substrate exclusive use may press the adjacent two side edges of the single-substrate 11 in the horizontal direction while the first vertex P1 is in close contact therewith.
The pressing member 412 for single-substrate exclusive use may be formed in an L-shape so that the first apex P1 of the single-substrate 11 supported by the alignment chamber 110 is closely attached to both sides adjacent to the first apex P1.
In this case, the pressing member 412 dedicated to the single substrate may be provided with a pair of contact rollers 413 which are in contact with both side edges of the single substrate 11.
On the other hand, the pressing member 412 dedicated to the single substrate may be configured to press both side edges of the single substrate 11 by at least one of horizontal linear movement and horizontal rotational movement.
In this case, the alignment unit 410 dedicated to a single substrate may be configured as follows: the standby position is set so as not to interfere with the 2 divided substrates 12 when the 2 divided substrates 12 are aligned, and the pressing position is set so as to press both side edges of the single substrate 11 at the first vertex P1 of the single substrate 11 when the single substrate 11 is aligned.
In one embodiment, as shown in fig. 4a and 4b, the alignment unit 410 for single-substrate may be provided with a hinge shaft member 416a at a distal end 416 of the pressing member 412 for single-substrate, and the hinge shaft member 416a may rotate the pressing member 412 for single-substrate about a vertical (Z-direction) axis.
In this case, the single substrate-dedicated pressing portion 410 may include: a pressing member 412 dedicated to a single substrate; a rod portion 414 coupled to the pressing member 412 dedicated to a single substrate; and a rod portion driving portion (not shown) that drives the rod portion 414 to move in the horizontal direction to form a pressing force against the single-substrate 11 by the single-substrate dedicated pressing member 412.
Various structures, such as an actuator, may be adapted for the rod portion driving portion (not shown) as long as the movement of the rod portion 414 can be driven.
When the lever 414 is moved in a direction toward the single substrate 11 (the-Y-axis direction with reference to fig. 4 a) by the lever driving part (not shown), the pressing member 412 dedicated to the single substrate is rotated about the hinge shaft member 416a to press both side edges of the single substrate 11 at a position (pressing position) corresponding to the first apex P1 of the single substrate 11. That is, a pressing force that presses the single-substrate 11 by the single-substrate dedicated pressing member 412 (more specifically, the pair of close-contact pulleys 413) can be formed by the lever driving section (not shown).
Conversely, if the lever 414 is moved in a direction (Y direction with reference to fig. 4 b) away from the single-substrate 11 by the lever driving section (not shown), the pressing member 412 dedicated to the single-substrate rotates in the reverse direction about the hinge shaft member 416a, and the pressing force against the single-substrate 11 can be released.
Further, when 2 divided substrates 12 are introduced into the alignment chamber 110, the stem driving part (not shown) may retract the pressing member 412 dedicated to the single-substrate to a standby position (a direction in which the stem 414 is away from the single substrate 11 (Y direction with reference to fig. 4 b)) at which the alignment part 410 dedicated to the single substrate and the 2 divided substrates 12 do not interfere with each other, in order to align the 2 divided substrates 12.
The divided substrate dedicated alignment part 420 is configured to align 2 divided substrates 12 together with a general alignment part 430 described later when 2 divided substrates 12 are introduced into the alignment chamber 110, and may have various configurations.
The divided substrate dedicated alignment unit 420 will be described later after describing the general alignment unit 430.
The common alignment portion 430 can be flexibly and commonly used for aligning a single substrate 11 and 2 divided substrates 12.
That is, the general alignment part 430 may have various configurations as a configuration for aligning the single substrate 1 together with the alignment part 410 for single substrate when introducing the single substrate 11 into the alignment chamber 110 and aligning the 2 divided substrates 12 together with the alignment part 420 for divided substrates when introducing the 2 divided substrates 12 into the alignment chamber 110.
For this, the common aligning part 430 may be provided to be movable between a single substrate aligning position for aligning the single substrate 11 and a divided substrate aligning position for aligning the 2 divided substrates 12. At this time, the common alignment portion 430 may be located at a vertex diagonally opposite to the first vertex (hereinafter, a second vertex P2) in the single substrate 11 when aligning the single substrate 11.
That is, the single-substrate alignment position is a position where the common alignment portion 430 is located when performing alignment with respect to the single substrate 11, and may correspond to a vertex diagonally opposed to the first vertex P1 (hereinafter, the second vertex P2) in the single substrate 11, as shown in fig. 2 a.
The universal aligning part 430 may perform alignment on the single substrate 11 at the second vertex P2 corresponding to the single substrate alignment position.
In this case, the general alignment unit 430 may have the same or similar structure as the single substrate dedicated alignment unit 410 described above, except that it is provided to be movable between the single substrate alignment position and the divided substrate alignment position.
Specifically, as shown in fig. 4a to 4b, the universal aligning unit 430 may include a universal pressing member 432, and the universal pressing member 432 presses the second vertex P2 of the single substrate 11 supported in the aligning chamber 110 against the two adjacent sides of the single substrate 11 in the horizontal direction when the single substrate 11 is aligned.
The common pressure member 432 may be formed in an L-shape such that the second vertex P2 of the single substrate 11 supported by the align chamber 110 is closely attached to both sides adjacent to the second vertex P2.
In this case, the common pressing member 432 may be provided with a pair of contact rollers 433 which are in contact with both side edges of the single substrate 11.
On the other hand, the common pressing member 432 may be configured to press both side edges of the single substrate 11 by at least one of horizontal linear movement and horizontal rotational movement.
In one embodiment, as shown in fig. 4a and 4b, the universal alignment part 430 may be provided with a hinge shaft part 436a, and the hinge shaft part 436a may allow the universal pressing part 432 to rotate around a vertical (Z) axis at a distal end part 436 of the universal pressing part 432.
At this time, the universal aligning part 430 may include: a universal pressing member 432; a stem portion 434 coupled to the common pressing member 432; and a lever driving part (not shown) driving the lever 434 to move in a horizontal direction to form a pressing force against the single substrate 11 by the common pressing member 432.
The generation and release of the pressing force of the common pressing member 432 against the single-substrate 11 by the lever driving section (not shown) is the same as the operation of the above-described alignment section 410 dedicated to single-substrates, and thus a detailed description is omitted.
Accordingly, as shown in fig. 2a, when alignment is performed with respect to the single substrates 11, the single substrate dedicated alignment section 410 presses both sides of the single substrate 11 at the first vertex P1 of the single substrate 11, and the common alignment section 430 presses both sides of the single substrate 11 at the second vertex P2 opposite to the first vertex P1 of the single substrate 11, so that the horizontal position of the single substrate 11 can be aligned using the first vertex P1 and the second vertex P2 as alignment references.
Hereinafter, a process of aligning 2 divided substrates 12 by the divided substrate dedicated aligning part 420 and the general aligning part 430 will be described in detail together with the divided substrate dedicated aligning part 420.
The divided substrate-dedicated aligning part 420 may include: a divided substrate center aligning section 510 which is provided in a diagonal direction with respect to the common aligning section 430 with reference to one divided substrate 12 (hereinafter, first divided substrate 12a) among the 2 divided substrates 12, enters between the 2 divided substrates 12 at a pair of adjacent vertexes (hereinafter, a pair of third vertexes P3) of the 2 divided substrates 12, and horizontally pressurizes both side edges of the 2 divided substrates 12, respectively; the divided substrate side aligning part 520 horizontally presses both side edges of the second divided substrate 12b at a vertex (hereinafter, fourth vertex P4) diagonally opposite to the third vertex P3 among the remaining one divided substrate 12 (hereinafter, second divided substrate 12b) among the 2 divided substrates 12.
As shown in fig. 2b, the divided substrate center aligning part 510 is provided in a diagonal direction with respect to the general aligning part 430 with reference to the first divided substrate 12a, and is configured to enter between the 2 divided substrates 12 at a pair of adjacent third vertexes P3 of the 2 divided substrates 12 to horizontally press both side edges of the 2 divided substrates 12, respectively, and may have various configurations.
That is, assuming that 2 divided substrates 12a and 12b are introduced into the alignment chamber 110 to be supported, the first divided substrate 12a and the second divided substrate 12b may be horizontally disposed in a state of being spaced apart on both sides with respect to the dividing line L for the single substrate 11, and at this time, the divided substrate center aligning portion 510 may be located at a vertex (a third vertex P3 with respect to the drawing) facing the general aligning portion 430 with respect to the first divided substrate 12 a.
Here, the pair of third vertexes P3 refers to adjacent vertexes of a pair of inner sides of the first divided substrate 12a and the second divided substrate 12b facing each other.
At this time, the divided substrate centering portion 510 enters between the 2 divided substrates 12a and 12b at the pair of third vertices P3, and can press both side edges of the 2 divided substrates 12 in the horizontal direction. That is, the divided substrate centering portion 510 may be configured to press 2 divided substrates 12a and 12b at a time at the pair of third vertices P3, respectively.
As an example, the divided substrate center aligning part 510 may include: a divided substrate center pressing member which may have a convex portion entering between the 2 divided substrates 12a, 12b and a pair of wing portions formed to extend in both side directions of the convex portion to press the 2 divided substrates 12a, 12b at a time at the pair of third vertexes P3, respectively; and a forward/backward driving part for driving the divided substrate center pressing member to move forward and backward to the 2 divided substrates 12a and 12b so as to form a pressing force by the divided substrate center pressing member.
Accordingly, both side surfaces of the protruding portion press the inner sides of the 2 divided substrates 12a, 12b facing each other, and the pair of wing portions can press the adjacent outer side walls of the first divided substrate 12a and the second divided substrate 12b, respectively.
The divided substrate center aligning part 510 may be positioned at a standby position where it does not interfere with the single substrate 11 when aligning the single substrate 11, and at a pressing position when aligning the 2 divided substrates 12 so as to press both sides of the single substrate 11 at a pair of third vertexes P3 of the 2 divided substrates 12.
That is, when aligning 2 divided substrates 12, the divided substrate center aligning section 510 may move the divided substrate center pressing member forward and backward so that the divided substrate center pressing member presses the 2 divided substrates 12 at the pressing position corresponding to the pair of third vertices P3.
In contrast, the divided substrate center aligning section 510 may move the divided substrate center pressing member backward after the alignment of the 2 divided substrates 12 is completed, and further, the divided substrate center pressing member is moved backward from the pressing positions corresponding to the pair of third vertices P3 to release the pressing force with respect to the 2 divided substrates 12; when alignment is performed with respect to the single-substrate 11, the divided substrate center pressing member may be moved backward to be located at a standby position where the single-substrate 11 and the divided substrate center pressing member do not interfere with each other.
The divided substrate side surface aligning part 520 may have various structures as a structure for horizontally pressing both side surfaces of the second divided substrate 12b at a vertex (hereinafter, fourth vertex P4) diagonally opposite to the third vertex P3 in the second divided substrate 12 b.
In this case, the divided substrate side aligning part 520 may have the same or similar configuration as the above-described alignment part 410 dedicated to a single substrate.
Specifically, as shown in fig. 4a to 4b, the divided substrate side alignment part 520 may include a divided substrate dedicated pressing member 522, and the divided substrate dedicated pressing member 522 may press the fourth vertex P4 of the second divided substrate 12b supported in the alignment chamber 110 in the horizontal direction while closely contacting the two adjacent sides of the second divided substrate 12b when aligning 2 divided substrates 12a and 12 b.
The divided substrate exclusive pressure member 522 may have an L-shape such that the fourth vertex P4 of the second divided substrate 12b supported by the alignment chamber 110 is closely attached to both sides adjacent to the fourth vertex P4.
In this case, the divided substrate-dedicated pressing member 522 may be provided with a pair of close-contact pulleys 523 that are close-contacted to both side edges of the second divided substrate 12b, respectively.
On the other hand, the divided substrate exclusive pressing member 522 may be configured to press both side edges of the second divided substrate 12b by at least one of horizontal linear movement and horizontal rotational movement.
In one embodiment, as shown in fig. 4a and 4b, the split-substrate side alignment part 520 may be provided with a hinge shaft member 526a at a distal end portion 526 of the split-substrate dedicated pressing member 522, and the hinge shaft member 526a may rotate the split-substrate dedicated pressing member 522 about a vertical direction (Z direction) axis.
At this time, the divided substrate side aligning part 520 may include: a divided substrate dedicated pressing member 522; a rod portion 524 coupled to the divided substrate dedicated pressing member 522; a lever portion driving portion (not shown) that drives the lever portion 524 to move in the horizontal direction to form a pressing force against the second divided substrate 12b by the divided substrate-dedicated pressing member 522.
The generation and release of the pressing force of the divided substrate-dedicated pressing member 522 against the second divided substrate 12b by the lever driving section (not shown) is the same as the operation of the above-described single-substrate-dedicated alignment section 410, and thus detailed description is omitted.
The divided substrate side aligning section 520 may be configured to be located at a standby position where it does not interfere with the single substrate 11 when aligning the single substrate 11, and to be located at a pressing position when aligning the 2 divided substrates 12 so as to press both sides of the single substrate 11 at the pair of third vertices P3 of the 2 divided substrates 12.
That is, when aligning 2 divided substrates 12, the divided substrate side aligning section 520 may advance and move the divided substrate dedicated pressing member 522 so that the divided substrate dedicated pressing member 522 presses the second divided substrate 12b at the pressing position corresponding to the fourth vertex P4
In contrast, the divided substrate side aligning section 520 may move the divided substrate dedicated pressing member 522 backward after the alignment of the 2 divided substrates 12 is completed, and further move the divided substrate dedicated pressing member 522 backward from the pressing position corresponding to the fourth vertex P4 to release the pressing force against the 2 divided substrates 12, and may move the divided substrate dedicated pressing member 522 backward to be located at a standby position where the single-substrate 11 and the divided substrate center pressing member 522 do not interfere with each other when the alignment is performed with respect to the single-substrate 11.
Accordingly, as shown in fig. 2b, when alignment is performed with respect to 2 divided substrates 12a, 12b, the divided substrate center aligning part 510 presses both sides of the second divided substrate 12b at the third vertex P3 of the second divided substrate 12b, and the divided substrate side aligning part 520 presses both sides of the second divided substrate 12b at the fourth vertex P4 opposite to the third vertex P3 of the second divided substrate 12b, so that the horizontal position of the second divided substrate 12b can be aligned using the third vertex P3 and the fourth vertex P4 as alignment references.
On the other hand, in the case where the 2 divided substrates 12 are disposed so as to be opened to both sides with respect to the center line L of the single substrate 11 in the alignment chamber 110, the first vertex P1 of the single substrate 11 is located further inward than the fourth vertex P4 of the second divided substrate 12b with respect to the center line L of the single substrate 11, and therefore, in this case, the single-substrate-dedicated alignment part 410 may be located further inward of the alignment chamber 110 than the divided-substrate side alignment part 520.
On the other hand, unlike the second divided substrate 12b in which the horizontal position can be aligned only by the divided substrate dedicated alignment part 420, the horizontal position alignment can be performed by the divided substrate dedicated alignment part 420 and the general alignment part 430 in the case of the first divided substrate 12 a.
That is, when aligning a single substrate 11, the general alignment section 430 aligns the single substrate 11 at a single substrate alignment position; when aligning 2 divided substrates 12, the common alignment section 430 moves to the divided substrate alignment position to align the divided substrates 12.
However, since 2 divided substrates 12 are arranged in the horizontal direction at a mutual interval, the single substrate 11 and the 2 divided substrates 12 are inevitably misaligned in a partial area on the plane within the alignment chamber 110.
Accordingly, in order to flexibly and commonly use the common alignment portion 430 for the single-substrate 11 and the divided substrates 12, it is necessary to provide the common alignment portion 430 so as to be adjustable in position between the single-substrate alignment position and the divided-substrate alignment position.
To this end, the universal alignment section 430 may include a position adjustment section for changing the position of the universal pressing member 432 in at least one direction (horizontal direction) of the X-axis and the Y-axis between the single-substrate alignment position (pressing position for the single substrate 11) and the divided-substrate alignment position (pressing position for the first divided substrate 12 a).
The position adjustment unit may be any of various position adjustment tools as long as the position of the pressure processing object (pressure position) can be changed by the general alignment unit 430.
In aligning the 2 divided substrates 12, the common alignment part 430 may be located at a vertex (hereinafter, a fifth vertex P5) diagonally opposite to the third vertex P3 in the first divided substrate 12 a.
That is, the single substrate alignment position corresponds to the second vertex P2 of the single substrate 11, and the divided substrate alignment position may correspond to a vertex diagonally opposite to the third vertex P3 in the first divided substrate 12a (hereinafter, the fifth vertex P5).
As shown in fig. 5, when it is necessary to align the single-substrate 11, the position adjustment unit may move the position of the universal alignment unit 430 to the single-substrate alignment position, so that the universal alignment unit 430 may align the single-substrate 11 at the second vertex P2 of the single-substrate 11; in the case where it is necessary to align 2 divided substrates 12, the position adjusting part may move the general alignment part 430 to the divided substrate alignment position, and may align the general alignment part 430 with the divided substrate 12 at the fifth vertex P5 of the second divided substrate 12 b.
Accordingly, the common pressing member 432 can press both sides of the single substrate 11 at the second vertex P2 in the single-substrate alignment position and can press both sides of the first divided substrate 12a at the fifth vertex P5 in the divided-substrate alignment position in the horizontal direction.
In the case of the remaining alignment sections (the alignment section for single substrate 410 and the alignment section for divided substrate 420) other than the general alignment section 430, only the pressing force against the processing target (the single substrate 11 or the divided substrate 12) can be formed/released or only the standby position (the position where no interference with the substrate occurs) can be obtained by the rod section driving section or the advancing/retreating driving section, and the alignment position (pressing position) itself cannot be changed to the first vertex P1, the third vertex P3, and the fourth vertex P4, but in the case of the general alignment section 430, the alignment position (pressing position) itself can be adjusted by the position adjusting section from the second vertex P2 to the fifth vertex P5 or from the fifth vertex P5 to the second vertex P2, which is fundamentally different from the alignment section described above.
Thus, as shown in fig. 2b, when the alignment is performed on 2 divided substrates 12a, 12b, the divided substrate center aligning part 510 presses both sides of the first divided substrate 12a at the third vertex P3 of the first divided substrate 12a, and the common aligning part 430 presses both sides of the first divided substrate 12a at the fifth vertex P5 opposite to the third vertex P3 of the first divided substrate 12a, so that the horizontal position can be aligned with respect to the first divided substrate 12a using the third vertex P3 and the fifth vertex P5 as the alignment references.
A method of aligning the single substrate 11 and the 2 divided substrates 12a and 12b in the alignment module 100 having the above-described structure will be described below.
First, when the single-substrate 11 is introduced into the alignment chamber 110, as shown in fig. 2a, the divided-substrate dedicated alignment unit 420 is retracted (pressurized off) in a direction away from the processing target and is located at a standby position where it does not interfere with the single-substrate 11; the single-substrate dedicated pressing member 412 of the single-substrate dedicated alignment section 410 presses the single substrate 11 at the first vertex P1 of the single substrate 11, the general alignment section 430 is positionally adjusted by the position adjustment section to the single substrate alignment position corresponding to the second vertex P2 of the single substrate 11, and the single substrate 11 is pressed at the second vertex P2 of the single substrate 11, thereby enabling horizontal position alignment to be performed with respect to the single substrate 11.
Then, when 2 divided substrates 12a and 12b are introduced into the alignment chamber 110, as shown in fig. 2b, the alignment unit 410 dedicated to a single substrate is retracted (pressure is released) in a direction away from the processing target and is located at a position not interfering with the 2 divided substrates 12a and 12b, and the general alignment unit 430 is positionally adjusted by the position adjustment unit to a divided substrate alignment position corresponding to the fifth vertex P5 of the first divided substrate 12 a.
Accordingly, the alignment of the horizontal position of the first divided substrate 12a at the third apex P3 and the fifth apex P5 of the first divided substrate 12a by the divided substrate center alignment part 510 and the common alignment part 430, and the alignment of the horizontal position of the second divided substrate 12b at the third apex P3 and the fourth apex P4 of the second divided substrate 12b by the divided substrate center alignment part 510 and the divided substrate side alignment part 520, may be performed.
In another embodiment, as shown in fig. 6a to 14b, the alignment part may include: a single substrate aligning section for aligning the horizontal positions of the single substrates 11 at positions facing each other in the main diagonal direction D1 when the single substrates 11 are introduced into the alignment chamber 110; the divided substrate alignment part aligns the horizontal positions of the 2 divided substrates 12 at positions facing the sub-diagonal directions D2 and D3 of the respective divided substrates 12 when the 2 divided substrates 12 are introduced into the alignment chamber 110.
The mounting positions of the single substrate 11 and the 2 divided substrates 12 in the alignment chamber 110 may be arranged at various positions according to the structures of a single substrate alignment portion and a divided substrate alignment portion, which will be described later.
The single-substrate aligning section may have various configurations according to the alignment manner and position of the single substrate 11, as a configuration for aligning the horizontal position of the single substrate 11 at a position facing the main diagonal direction D1 when the single substrate 11 is introduced into the alignment chamber 110.
At this time, as shown in fig. 6a to 7, the single-substrate alignment portions may be disposed at positions facing in the main diagonal direction D1, for example, at positions K1, K2, K3, and K4 corresponding to four vertices of a rectangular quadrangle in the shape of the single-substrate 11, at positions K1 and K3, or at positions K2 and K4.
Here, K1, K2, K3, and K4 may be defined as positions corresponding to respective vertices of the single substrate 11 in a counterclockwise direction in the rectangular quadrilateral shape. In particular, K1 is K1 as the lowest side in fig. 6a to 7, and the positions of the respective apexes are defined in the counterclockwise direction.
Specifically, the single-substrate aligning part may include: a first single substrate aligning unit 250 positioned at K1, for pressing the vertical and horizontal sides of the single substrate 11 with reference to a first vertex corresponding to K1; the second individual substrate alignment portion 260 is located at K3 facing the K1 in the first main diagonal direction D1, and presses the vertical and horizontal sides of the individual substrate 11 with the third vertex corresponding to the K3 as a reference.
The first individual substrate alignment portion 250 may have various configurations according to the pressing method of the vertical and horizontal sides of the individual substrate 11, as a configuration to press the vertical and horizontal sides of the individual substrate 11 with reference to the first vertex corresponding to the K1, which is located at the K1.
As an example, the first single substrate alignment part 250 may be configured as shown in fig. 14a and 14 b.
The second individual substrate alignment portion 260 may have various configurations according to the pressing method of the vertical and horizontal sides of the individual substrate 11 as a structure for pressing the vertical and horizontal sides of the individual substrate 11 with reference to the third vertex corresponding to K3 at K3 facing the K1 in the first main diagonal direction D1.
For example, the second single-substrate aligning portion 260 may be configured as shown in fig. 14a and 14 b.
The divided substrate alignment part may have various configurations as a configuration for aligning the horizontal positions of the 2 divided substrates 12 at positions where the sub-diagonal directions D2 and D3 of the respective divided substrates 12 face each other when the 2 divided substrates 12 are introduced into the alignment chamber 110.
As an example, as shown in fig. 6a to 7, the divided substrate alignment part may include a first divided substrate alignment part and a second divided substrate alignment part that align horizontal positions of the respective divided substrates 12.
Here, particularly, the second divided substrate alignment part may have various structures according to the substrate support structure, the alignment method, and the number and arrangement of the alignment parts with respect to the opposite sides of 2 divided substrates 12 as a structure for aligning the respective divided substrates 12 together with the first divided substrate alignment part.
Specifically, as shown in fig. 6a and 6b, the first divided substrate alignment part may include: a first centering portion 210 linearly moving between a pair of inner sides facing each other by 2 pieces of the rectangular divided substrates 12 to support the inner side of the support substrate of one of the 2 pieces of the divided substrates 12; a first side alignment part 220 disposed near a vertex facing the first center alignment part 210 in a first sub diagonal direction D2, and horizontally pressing the support substrate by at least one of rotation and linear movement, wherein the first sub diagonal direction D2 is a sub diagonal direction supporting the support substrate.
Then, the second divided substrate alignment part may include: a second center aligning part 240 which is provided at a position opposite to the first center aligning part 210 with reference to an inner side edge of the support substrate of the remaining one of the 2 divided substrates 12, and linearly moves between a pair of inner side edges of the 2 rectangular divided substrates 12 facing each other to support the inner side edges of the support substrates; a second side alignment part 230 disposed near a vertex facing the second center alignment part 240 in a second sub-diagonal direction D3, for pressing a support substrate in a horizontal direction by at least one of rotation and linear movement, wherein the second sub-diagonal direction D3 supports the sub-diagonal direction of the support substrate.
On the other hand, the first side aligning part 220 and the second side aligning part 230 are provided on the foremost side and the rearmost side with respect to the arrangement direction of the 2 divided substrates 12, and therefore, the installation environment is relatively easy.
However, the first and second centering portions 210 and 240 align the divided substrates 12 between 2 substrates, which has a problem of very limited installation environments.
Accordingly, the first and second centering portions 210 and 240 need to have a structure optimized for limited installation conditions.
Hereinafter, a first embodiment applicable to at least one of the first center alignment part 210 and the second center alignment part 240 is explained.
As a first embodiment, as shown in fig. 8a to 10, at least one of the first and second centering portions 210 and 240 may include: a center alignment member 212 supporting an inner side edge of the support substrate; an alignment member moving portion 214 linearly moves the center alignment member 212 between a pair of inner edges.
The centering member 212 serves as a structure for supporting the inner side edge of the support substrate, and the horizontal section may be formed in a circular or elliptical shape.
In particular, the center aligning member 212 may be provided to be rotatable about a rotation axis passing through the center of the horizontal section.
At this time, various materials may be used for the centering member 212 as long as it is rotatable in close contact with the edge side surface of the divided substrate 12 (i.e., the support substrate), but in order to minimize the problem of particles caused by friction with the divided substrate 12, it is preferably formed of a synthetic resin material such as engineering plastic.
As an example, the centering component 212 may include: a hub 212b of a metallic material; the cover member 212a is made of synthetic resin or the like, and is coupled to the divided substrate 12 on the outer peripheral surface of the hub 212b so as to contact the divided substrate 12. In this case, the cover member 212a is preferably formed of PEEK (polyetheretherketone) material for workability and heat resistance.
In addition, the cover member 212a is detachably coupled to the hub 212b for easy maintenance, and when the outer peripheral surface of the cover member 212a is damaged by friction with the divided substrate 12, it can be re-coupled to the hub 212b in an inverted state for use,
in this case, the contact position of the lid member 212a of the centering member 212 with the divided substrate 12 is preferably located above or below the center portion as viewed in the horizontal direction.
As shown in fig. 9, the joining position of the cover member 212a is movable up and down for joining. Accordingly, in the present invention, when the point where the lid member 212a is in close contact with the divided substrate 12 is worn due to use, the joint position of the lid member 212a is adjusted in the vertical direction so that the divided substrate 12 is in close contact with the unworn portion, and the maintenance period of the lid member 212a can be extended to the maximum.
On the other hand, the center aligning member 212 is preferably retracted from between the pair of inner edges before being carried out by the transfer robot 21 after aligning the substrates.
That is, the center aligning member 212 is linearly movable from an outer side of a pair of inner sides to a pair of inner sides by the aligning member moving part 214.
The alignment member moving part 214 is disposed at one side of the alignment chamber 110 to move the center alignment member 212 in a direction parallel to the inner sides, so that the center alignment member 212 can be positioned between the inner sides or can be retreated toward the outer side.
The movement of the centering members 212 is preferably linear in an up-down or horizontal direction, but movement to position the centering members 212 between the inner sides or back toward the outer side may be accomplished.
The alignment member moving part 214 may have various structures as a structure in which the pair of center alignment members 212 are positioned between the pair of inner sides of the 2 divided substrates 12 when the center alignment members 212 are coupled to the center alignment members 212 to align the substrates, and the center alignment members 212 are retreated outward from between the pair of inner sides of the 2 divided substrates 12 after the substrates are aligned.
Then, the alignment member moving part 214 may include a bellows which is extended and contracted in conjunction with the center alignment member 212 as being linearly moved in a horizontal direction parallel to the inner side.
In one embodiment, as shown in fig. 8a and 8b, at least one of the first and second centering portions 210 and 240 may include: a center alignment member 212 supporting an inner side edge of the support substrate; an alignment member moving part 214 linearly moving the center alignment member 212 toward between a pair of inner side edges; the body portion 215 is provided with a center aligning member 212 and linearly moved by an aligning member moving portion 214.
The main body 215 is provided with a centering member 212, and is coupled at one end to the centering member moving portion 214 such that the centering member 212 advances and retreats between the inner edges of the 2 divided substrates 12.
That is, as shown in fig. 8a, the main body 215 may be coupled to the aligning member moving part 214 at one end and the center aligning member 212 may be disposed near the other end.
In addition, the body part 215 may have one or more scale marks 215c formed on one surface thereof to confirm the alignment state of the divided substrate 12 through the view port 113 provided in the alignment chamber 110.
The center aligning member 212 may have various structures as a structure for supporting the inner side edge of the support substrate while horizontally moving the support substrate in the aligning position by pressurization.
As an example, the center alignment member 212 is preferably constructed as follows: the support substrate is positioned in a state where the relative distance to the inner side edge of the support substrate is longest before the pair of inner side edges are positioned therebetween, and then in a state where the relative distance to the inner side edge of the support substrate is shortest (for example, contact) when the pair of inner side edges are positioned therebetween.
For example, the center aligning member 212 is rotatably coupled to the rotating member 213 in a state of being eccentric from a rotating shaft of the rotating member 213, and the rotating member 213 is rotatably provided at the body 215 about a rotating shaft perpendicular to the 2-piece rectangular divided substrate 12.
Then, the rotating member 213 may be rotated by a rotating tool, thereby shortening a relative distance of the center aligning member 212 with respect to the inner side edges of the support substrate when the center aligning member 212 is located between the pair of inner side edges.
The rotating member 213 is rotatably provided in the body 215 about a rotation axis perpendicular to the 2-piece rectangular divided substrate 12, and the center aligning member 212 is rotatably provided about a rotation axis eccentric to the rotation axis of the rotating member 213.
That is, the rotating member 213 is rotatably provided in the main body 215 about a rotation axis perpendicular to the 2-piece rectangular divided substrate 12.
At this time, the rotation axis of the rotating member 213 is a shaft passing through the center of the horizontal cross section of the rotating member 213 and is eccentric to the rotation axis of the center aligning member 212.
The rotating means is a structure that rotates the rotating member 213 to shorten a relative distance with respect to the inner side edge of the support substrate when the center aligning member 212 is located between a pair of inner side edges, and may have various structures.
In an embodiment, the rotary tool may comprise: a first stopper 216c provided on the front side in the path of the linearly moving rotating member 213 by the aligning member moving portion 214; the reflector 216a is provided to protrude in a direction of a rotation axis of the rotation member 213 at a position eccentric from the rotation center of the rotation member 213, and caught by the first stopper 216c to rotate the rotation member 213 when the rotation member 213 linearly moves.
The first stopper 216c may have various structures as a structure provided on the front side in the path of linearly moving the rotation member 213 by the aligning member moving part 214 in the lower surface or the side surface of the aligning chamber 110.
The reflector 216a may be provided to protrude in the direction of the rotation axis of the rotating member 213 at a position eccentric to the rotation center of the rotating member 213.
The reflector 216a is provided at a position eccentric from the rotation center of the rotating member 213, and thus moves in the circumferential direction around the rotation center of the rotating member 213, thereby rotating the rotating member 213.
The reflector 216a is formed to protrude in the rotational axis direction of the rotational member 213, and thus is caught by the first stopper 216c when the rotational member 213 is linearly moved by the alignment member moving portion 214, thereby rotating the rotational member 213.
On the other hand, the rotary tool may further include an elastic member 216b, the elastic member 216b being coupled to the rotating member 213 at a position eccentric from the rotation center of the rotating member 213, and restoring the rotating member 213 in a direction in which the relative distance to the inner side edge of the support substrate increases by an elastic force.
The elastic member 216b is a structure that extends and contracts according to the rotation of the rotating member 213 to provide an elastic force to restore the reflector 216a, and may have various structures.
For example, the elastic member 216b may correspond to a spring provided between the bottom surface of the rotating member 213 and the bottom surface of the body 215.
At this time, the elastic member 216b is preferably provided at a point eccentric from the rotation center of the rotation member 213 to expand and contract in length with the rotation of the rotation member 213.
Further, the rotating tool may further include a second stopper 216d that catches the reflector 216a to rotate the rotating member 213 in a direction in which a relative distance to the inside of the support substrate constituted by the center aligning member 212 increases when the rotating member 213 that the center aligning member 212 retreats from between the pair of inner sides to the outside linearly moves.
The second stopper 216d is a structure provided on a path of linearly moving the rotation member 213 by the alignment member moving part 214 at a lower face or a side face of the alignment chamber 110, and may have various structures.
As shown in fig. 10, with the rotary tool having the above-described configuration, the rotary member 213 rotates in the arrow direction (counterclockwise direction) when the main body 215 enters between the inner sides, and is disposed in the direction perpendicular to the entering direction after the pair of centering members 212 disposed in the entering direction enters between the inner sides.
Accordingly, in the present invention, even when the width between the inner edges of the 2 divided substrates 12 is narrow, the center alignment member 212 can be positioned between the inner edges without generating friction between the center alignment member 212 and the divided substrates 12.
In another aspect, spacer expansion members 218 may be included that provide a greater spacing between the inner edges than the center alignment member 212, thereby facilitating positioning of the center alignment member 212 between the inner edges if the width between the inner edges is less than the diameter of the center alignment member 212.
As shown in fig. 8 a-10, the spacing expansion member 218 is preferably disposed at one end of the body portion 215 so as to be located between a pair of inner edges in preference to a pair of centering members 212.
The spacing expansion members 218 may be formed in a tapered shape extending from a contact portion contacting the inner side edges toward the distal end while shortening the horizontal width to enter between the inner side edges while minimizing friction with the divided base plates 12.
On the other hand, a profile support member 219 may be provided in the body portions 215, 225, the profile support member 219 supporting the outer side adjacent to the inner side of the support substrate with reference to the apex of the support substrate.
The outer frame support member 219 may be coupled to a wing portion 215a extending in the arrangement direction of the 2 divided substrates 12 between the other end portion of the main body portion 215 coupled to the center aligning member 212 and one end of the main body portion 215 coupled to the aligning member moving portion 214.
The outline support member 219 may support an outer side adjacent to an apex with reference to the apex adjacent to an inner side of the support substrate supported by the center alignment member 212. I.e. the vertex region.
On the other hand, the contour support member 219 may be provided at a setting position adjustable in a direction toward the inner side.
At this time, long holes 215d for position adjustment, which can adjust the screw coupling position, are formed in the wing portions 215a of the body portion 215.
The position adjustment long hole 215d is formed so that the inserted screw can linearly move with respect to the outer side of the support substrate, and the installation position can be adjusted in a direction toward the inner side; the position of the wing part 215a of the body part 215 can be fixed to the body part 215 by screwing the nut.
The outer frame support member 219 is detachably coupled to the position adjustment long hole 215 d.
As an example, the outer frame support member 219 is coupled to the position adjustment long hole 215d by screw coupling.
The outline support members 219 are formed in a circular or elliptical shape in horizontal cross section, and can support the outer sides of the 2 rectangular divided substrates 12.
The contour support member 219 may be provided to be rotatable about a rotation axis passing through the center of the horizontal section.
At this time, as for the outer-contour support member 219, various materials may be used as long as it is rotatable in close contact with the edge side surface of the divided substrate 12 (i.e., the support substrate), but in order to minimize the particle problem caused by the friction with the divided substrate 12, it is preferably formed of synthetic resin such as engineering plastic.
As an example, the profile support member 219 may include: a hub of a metallic material; the cover member 219a is made of synthetic resin or the like, and is bonded to the divided substrate 12 on the outer peripheral surface of the hub so as to be in contact with the divided substrate 12. In this case, the cover member 219a is preferably made of PEEK (polyetheretherketone) for workability, heat resistance, and the like.
In addition, the cover member 219a is detachably coupled to the outer frame support member 219 for easy maintenance, and when the outer peripheral surface of the cover member 219a is damaged by friction with the divided substrate 12, the cover member 219a can be re-coupled to the hub in an inverted state for use.
In this case, the position where the cover member 219a of the outline support member 219 contacts the divided substrate 12 is preferably located above or below the center portion when viewed in the horizontal direction.
As shown in fig. 9, the cover member 219a is coupled to move up and down to a coupling position. Accordingly, in the present invention, when the point where the cover member 219a is in close contact with the divided substrate 12 is worn out by use, the joining position of the cover member 219a is adjusted in the vertical direction so that the divided substrate 12 is in close contact with the unworn portion, and the maintenance period of the cover member 219a can be extended to the maximum.
On the other hand, the first and second centering portions 210 and 240 may be variously modified in addition to the embodiments of fig. 8a to 10.
Hereinafter, a second embodiment applicable to at least one of the first center alignment part 210 and the second center alignment part 240 is explained.
As a second embodiment, as shown in fig. 11a to 13, at least one of the first center aligning part 210 and the second center aligning part 240 may include a plurality of center aligning members 222, and the plurality of center aligning members 222 may approach the horizontal virtual reference line L while moving from the direction of the horizontal virtual reference line L toward the divided substrates 12 with the outermost part S thereof perpendicular to the arrangement direction of the 2 divided substrates 12 as a reference, and may linearly move between a pair of inner sides of the 2 rectangular divided substrates 12 facing each other to support the inner side of one of the 2 rectangular divided substrates 12.
The plurality of centering members 222 are disposed close to the horizontal virtual reference line L with the horizontal virtual reference line L perpendicular to the arrangement direction of the 2 divided substrates 12 as a reference outermost portion S, and have a cylindrical or elliptic cylindrical shape capable of supporting the inner side edge of the support substrate while moving from the horizontal virtual reference line L toward the divided substrates 12.
The plurality of centering members 222 may be provided to be rotatable about a rotation axis passing through the center of the horizontal section.
At this time, as for the centering member 222, various materials can be used as long as it is a material that is closely attached to the divided substrate 12 to be rotatable, but in order to minimize a particle problem caused by friction with the divided substrate 12, it is preferably formed of a synthetic resin material such as engineering plastic.
As an example, the centering feature 222 may include: a hub of a metallic material; the cover member is made of synthetic resin or the like, and is bonded to the divided substrate 12 on the outer peripheral surface of the hub so as to be in contact with the divided substrate 12. In this case, the cover member is preferably formed of a PEEK (polyetheretherketone) material for workability, heat resistance, and the like.
In addition, the cover member is detachably coupled to the hub for easy maintenance, and when the outer peripheral surface of the cover member is damaged by friction with the divided substrate 12, the cover member can be re-coupled to the hub in an inverted state for use.
At this time, the position where the cover member of the centering member 222 contacts the divided substrate 12 is located above or below the center portion with reference to the rotation axis direction.
As shown in fig. 12, the cover member can move up and down to a coupling position to be coupled. Accordingly, in the present invention, when the point where the lid member is in close contact with the divided substrate 12 is worn due to use, the joint position of the lid member is adjusted in the vertical direction so that the divided substrate 12 is in close contact with the unworn portion, and the maintenance period of the lid member can be extended to the maximum.
On the other hand, it is preferable that the center aligning member 222 is retreated from between the pair of inner side edges to the outside before the substrate is aligned and then carried out by the transfer robot 21.
That is, the plurality of center aligning members 222 are linearly movable between a pair of inner sides and between outer sides of a pair of inner sides by the aligning member moving part 224.
The aligning member moving part 224 is disposed at one side of the aligning chamber 110, and the center aligning member 222 is linearly moved between a pair of inner sides and between outer sides of the pair of inner sides by the aligning member moving part 224, so that the center aligning member 222 can be positioned between the inner sides or can be retracted.
The alignment member moving part 224 may have various structures as a structure that is combined with the center alignment member 222 to position the plurality of center alignment members 222 between the pair of inner sides of the 2 divided substrates 12 when aligning the substrates and to retreat the center alignment member 222 from between the pair of inner sides of the 2 divided substrates 12 after aligning the substrates.
Then, the aligning member moving part 224 may include a bellows which is extended and contracted in conjunction with the center aligning member 222 as being linearly moved in a horizontal direction parallel to the inner side.
At this time, as shown in fig. 11a and 11b, the plurality of centering members 222 may be provided on a main body portion 225 linearly moved by the centering member moving portion 224.
The main body 225 is provided with a centering member 222, and one end of the main body is coupled to the centering member moving portion 224 so that the centering member 222 can move forward and backward between the inner edges of the 2 divided substrates 12.
That is, as shown in fig. 11a, the main body portion 225 may be coupled at one end with the aligning member moving portion 224, and may be provided at the other end portion with the center aligning member 222.
The body portion 225 may have one or more scale marks 225c formed on one surface thereof to confirm the alignment state of the divided substrate 12 through the view port 113 provided in the alignment chamber 110.
The plurality of center aligning members 222 may have various structures as a structure for supporting the inner side edge of the support substrate while horizontally moving the support substrate at the aligned position by pressurization.
As an example, the center alignment member 222 is preferably constructed as follows: the support substrate is positioned between the pair of inner side edges in a state where the relative distance to the inner side edge of the support substrate is the longest, and then positioned between the pair of inner side edges in a state where the relative distance to the inner side edge of the support substrate is the shortest (e.g., contact).
Accordingly, the center aligning members 222 may approach the horizontal virtual reference line L while moving from the horizontal virtual reference line L toward the divided substrates 12, with the outermost portion S, which is a horizontal virtual reference line L perpendicular to the arrangement direction of the 2 divided substrates 12, and the center aligning members 222 may linearly move between the pair of inner side surfaces of the 2 rectangular divided substrates 12 facing each other to support the inner side of one of the 2 rectangular divided substrates 12.
In one embodiment, as shown in fig. 11a and 11b, the plurality of center alignment members 222 may be disposed to approach the horizontal virtual reference line L while moving in a direction of dividing the substrate 12 (i.e., from an outer side of the pair of inner sides to between the pair of inner sides) by a distance D from the horizontal virtual reference line L to a horizontal cross-sectional center of the center alignment member 222.
More specifically, when the first virtual layout line a1 is set between the horizontal virtual reference line L and the inner edge of the support substrate, the centering members 222 are formed in a cylindrical shape and the centers thereof can be arranged along the first virtual layout line a 1.
The first virtual layout line a1 may be set as a straight line or a curved line.
At this time, the plurality of centering members 222 constitute a cylindrical shape, and the outer diameter may be formed identically or may be formed to be gradually enlarged while being apart from the divided substrate 12.
As shown in fig. 12, in another embodiment, the plurality of center alignment members 222 may be aligned along a horizontal virtual reference line L.
At this time, in order to arrange the outermost portion S closer to the horizontal virtual reference line L while moving from the horizontal virtual reference line L in the direction of dividing the substrate 12, it is preferable that the plurality of centering members 222 gradually decrease the length (i.e., diameter) of the horizontal cross section of the centering members 222 with respect to the arrangement direction of the divided substrates 12 while moving in the direction of dividing the substrate 12.
As an example, the plurality of centering members 222 constitute a cylindrical shape, and gradually enlarge the outer diameter while being away from the divided substrate 12.
On the other hand, it is a matter of course that the embodiments shown in fig. 11a to 12 and the embodiment shown in fig. 13 can be combined to realize.
That is, the plurality of centering members 222 are aligned in a line along the horizontal virtual reference line L in a direction away from the divided substrate 12, and then may be arranged along the first virtual arrangement line a1 that forms an inclination with respect to the horizontal virtual reference line L at a point set in advance.
That is, the plurality of centering members 222 may be disposed in various ways as long as the outermost portion S, which serves as the inner side edge of the support substrate and is based on the horizontal virtual reference line L perpendicular to the arrangement direction of the divided substrates 12, approaches the horizontal virtual reference line L while moving from the horizontal virtual reference line L toward the direction of the divided substrates 12.
Accordingly, in the present invention, when the center aligning member 222 is inserted between the pair of inner sides, the inner side of the support substrate of one of the 2 substrates is pressed, and the horizontal position of the support substrate is aligned with the side aligning part (220 or 230) described later.
On the other hand, the structures of the first centering portion 210 and the second centering portion 240 may be combined with the embodiments shown in fig. 8a to 10, the embodiments shown in fig. 11a to 12, and the embodiments shown in fig. 13.
On the other hand, the center aligning part (210 or 240) may further include a space expanding member 228 in order to facilitate the center aligning member 222 to be positioned between the inner sides even when the width between the inner sides is smaller than the diameter of the center aligning member 222, and the space expanding member 228 may be formed to be spaced between the inner sides more than the pair of center aligning members 222.
As shown in fig. 11 a-12, the spacer expansion member 228 is preferably provided with a body portion 225 at one end to lie between a pair of inner edges in preference to the centering member 222.
The space expansion member 228 has a tapered shape that narrows in horizontal width while extending from a contact portion with the inner side edge toward the tip end, so as to enter between the inner side edges while minimizing friction with the divided substrates 12.
On the other hand, a profile support member 219 may be provided at the body portions 215, 225, the profile support member 219 supporting the outer side adjacent to the inner side of the support substrate with reference to the apex of the support substrate.
The profile support member 219 may be coupled to a wing part 225a, and the wing part 225a extends in the arrangement direction of 2 divided substrates 12 between the other end part of the body part 225 coupled to the center alignment member 222 and one end of the body part 225 coupled to the alignment member moving part 224.
The outline support member 219 may support an outer side adjacent to an apex with reference to the apex adjacent to an inner side of the support substrate supported by the center aligning member 222. I.e. the vertex region.
On the other hand, the outer-contour support member 219 may be provided at a setting position that is adjustable to a direction toward the inner side.
At this time, long holes (not shown) for position adjustment, which can adjust the screw coupling position, may be formed in the wing parts 225a of the body part 225, respectively.
The position adjustment long hole is formed so as to allow a screw inserted for adjusting the installation position in the direction toward the inner side to be linearly movable with respect to the outer side of the support substrate, and the position of the wing portion 225a of the main body portion 225 can be fixed to the main body portion 225 by a screw coupling nut.
In addition, the outer frame support member 219 is detachably coupled to the position adjustment long hole.
As an example, the outer frame support member 219 is coupled to the position adjustment long hole 215d by screw coupling.
The outline support members 219 are formed in a circular or elliptical shape in horizontal cross section, and can support the outer sides of the 2 rectangular divided substrates 12.
The contour support member 219 may be provided to be rotatable about a rotation axis passing through the center of the horizontal section.
At this time, various materials may be used for the outer-contour support member 219 as long as it is rotatable in close contact with the edge side surface of the divided substrate 12 (i.e., the support substrate), but it is preferably formed of a synthetic resin material such as engineering plastic in order to minimize the problem of particles caused by friction with the divided substrate 12.
As an example, the profile support member 219 may include: a hub of a metallic material; the cover member 219a is made of synthetic resin or the like, and is bonded to the divided substrate 12 on the outer peripheral surface of the hub so as to be in contact with the divided substrate 12. In this case, the cover member is preferably formed of a PEEK (polyetheretherketone) material for workability, heat resistance, and the like.
In addition, the cover member 219a is detachably coupled to the outer frame support member 219 for easy maintenance, and when the outer peripheral surface of the cover member 219a is damaged by friction with the divided substrate 12, the cover member 219a can be re-coupled to the hub in an inverted state and used.
At this time, when viewed in the horizontal direction, the position where the cover member 219a of the outline support member 219 contacts the divided substrate 12 is located above or below the center portion.
As shown in fig. 6, the cover member 219a can move up and down to a coupling position to couple. Accordingly, in the present invention, when the point where the cover member 219a is in close contact with the divided substrate 12 is worn due to use, the joining position of the cover member 219a is adjusted in the vertical direction so that the divided substrate 12 is in close contact with the unworn portion, and the period of maintaining the cover member 219a is extended to the maximum.
At least one of the first side alignment part 220 and the second side alignment part 230 has the following structure: among the vertices of the 2 rectangular-quadrilateral divided substrates 12, the vertices of the 2 rectangular-quadrilateral divided substrates 12 located diagonally opposite to the position of the center alignment member 212 can be pressed in the horizontal direction by at least one of rotation and linear movement of the 2 rectangular-quadrilateral divided substrates 12, and thus, various configurations can be provided.
As an example, as shown in fig. 14a and 14b, at least one of the first side aligning part 220 and the second side aligning part 230 may include: a support member 232 supporting the pair of close contact members 231; a hinge shaft 235 rotatably supporting the support member 232; a fixing member 236 fixed to the alignment chamber 110, thereby fixing the hinge shaft 235; a connecting shaft 233 provided between the pair of abutting members 231 and the hinge shaft 235 at the supporting member 232; a connecting rod 234 connected with the connecting shaft 233; and a driving part (not shown) connected to the link 234 to linearly move the link 234.
When at least one of the first side alignment portion 220 and the second side alignment portion 230 has the above-described configuration, among the 4 vertices (K1, K5, K7, K4, or K6, K2, K3, K8) of the rectangular quadrilateral constituted by 2 rectangular divided substrates 12 supported by the substrate support member 120, "the vertices of the 2 rectangular divided substrates 12 facing each other in the sub diagonal direction D2, D3 at the position of the center alignment member (212 or 222)" are brought into close contact with the divided substrates 12 by the rotation of the pair of contact members 231.
That is, the first side aligning part 220 and the second side aligning part 230 support the sides near the vertices facing each other, and further align the horizontal positions of the 2 rectangular-quadrilateral segmented substrates 12 (i.e., the support substrates) together with the first centering part 210 and the second centering part 240, respectively.
In particular, the present invention has advantages in that the inner and outer sides of the 2-piece quadrangular divided substrates 12 (i.e., the respective support substrates) are supported and pressed by linear movement in the configuration of the first and second centering portions 210 and 240, respectively, thereby facilitating the installation of the alignment structure and minimizing an installation space required for the installation of the alignment structure.
On the other hand, in the configuration of the first and second divided substrate alignment portions, the alignment process can be performed individually or in conjunction with each other for 2 rectangular-quadrangular divided substrates 12 by the independent structure of the first side alignment portion 220 and the first center alignment portion 210 and the independent structure of the second side alignment portion 230 and the second center alignment portion 240.
On the other hand, the main diagonal direction D1 as the alignment direction of the single substrate 11 and the second sub diagonal directions D2, D3 as the alignment direction of the divided substrates 12 may implement various embodiments.
As an example, as shown in fig. 6a and 6b, positions corresponding to apexes of the single substrate 11 are defined as K1, K2, K3, and K4 in a counterclockwise direction; positions corresponding to one vertex in the 2 divided substrates 12 are defined as K1, K5, K7, K4 in the counterclockwise direction; when positions corresponding to the remaining one vertex among the 2 divided substrates 12 are defined as K6, K2, K3, K8 in the counterclockwise direction, the main diagonal direction D1 may be defined by a diagonal direction connecting vertices of the single substrates 11 disposed corresponding to K1 and K3; the first sub diagonal direction D2 may be defined by a diagonal direction connecting vertexes of the divided substrates 12 disposed corresponding to K4 and K5; the second sub diagonal direction D3 may be defined by a diagonal direction connecting vertices of the divided substrates 12 disposed corresponding to K8 and K2.
As another example, as shown in fig. 6b to 7, positions corresponding to apexes of the single substrate 11 are defined as K1, K2, K3, K4 in a counterclockwise direction; positions corresponding to one vertex in the 2 divided substrates 12 are defined as K1, K5, K7, K4 in the counterclockwise direction; when positions corresponding to the remaining one of the vertexes of the 2 divided substrates 12 are defined as K6, K2, K3, K8 in the counterclockwise direction, the principal diagonal direction D1 may be defined by a diagonal direction connecting vertexes of the single substrates 11 disposed corresponding to K4 and K2; the first sub diagonal direction D2 may be defined by a diagonal direction connecting vertexes of the divided substrates 12 disposed corresponding to K4 and K5; the second sub diagonal direction D3 may be defined by a diagonal direction connecting vertices of the divided substrates 12 disposed corresponding to K8 and K2.
At this time, the first side aligning part 220 and the second side aligning part 230 may be configured independently of a single substrate aligning part, or may be configured as a single substrate aligning part as shown in fig. 7.
At this time, in order to smoothly perform the alignment work of the single substrate 11 and the divided substrates 12, the alignment position of the vertex of each of the divided substrates 12 provided corresponding to the K2 and K4 when the divided substrates 12 are aligned is referred to as a divided substrate alignment position; when the alignment position of the top of the single substrate 11 disposed corresponding to the K2 and K4 when aligning the single substrate 11 is referred to as a single substrate alignment position, the divided substrate alignment position and the single substrate alignment position corresponding to at least one of the K2 and the K4 are located at different alignment positions from each other, and at least one of the first side surface alignment portion 220 and the second side surface alignment portion 230 is movably disposed between the divided substrate alignment position and the single substrate alignment position.
Here, since a predetermined interval exists between 2 divided substrates 12 and the length in the X axis direction (arrangement direction of the divided substrates 12) of the overall rectangular parallelepiped formed by the 2 divided substrates 12 is longer than the length in the X axis direction of the single substrate 11, there is a difference in the X axis direction between at least one of the vertices of the divided substrates 12 corresponding to K2 and K4 and at least one of the vertices of the single substrate 11 corresponding to K2 and K3.
Accordingly, in order to smoothly perform the alignment work of the single substrate 11 and the divided substrates 12, at least one of the first side aligning part 220 and the second side aligning part 230 is preferably provided to be movable in the direction of the respective vertexes of the divided substrate 12 and the single substrate 11 to be aligned, that is, between the divided substrate alignment position and the single substrate alignment position which are different from each other in position.
The above description is only a part of the preferred embodiments that can be realized by the present invention, and it is well known that the scope of the present invention is not limited to the above-described embodiments, and the technical ideas of the present invention and the fundamental technical ideas thereof described above are all included in the scope of the present invention.

Claims (28)

1. An alignment module (100) that selectively aligns a single substrate (11) of a rectangular quadrilateral shape introduced from the outside or 2 divided substrates (12) that divide the single substrate (11) into 2, comprising:
an alignment chamber (110) forming a sealed interior space;
a substrate support part (120) disposed in the alignment chamber (110) to support the single substrate (11) or the 2 divided substrates (12);
and an alignment unit that aligns the single substrate (11) when the single substrate (11) is introduced into the alignment chamber (110), and aligns the 2 divided substrates (12) when the 2 divided substrates (12) are introduced into the alignment chamber (110).
2. The alignment module (100) of claim 1,
the alignment portion includes:
a single-substrate-dedicated aligning section (410) for aligning the single substrate (11); a divided substrate dedicated alignment unit (420) for aligning the 2 divided substrates (12); and a general alignment unit (430) that aligns the single substrate (11) with the single-substrate dedicated alignment unit (410) when the single substrate (11) is introduced into the alignment chamber (110), and aligns the 2 divided substrates (12) with the divided-substrate dedicated alignment unit (420) when the 2 divided substrates (12) are introduced into the alignment chamber (110).
3. The alignment module (100) of claim 2,
the common alignment section (430) is movable between a single substrate alignment position for aligning the single substrate (11) and a divided substrate alignment position for aligning the 2 divided substrates (12).
4. The alignment module (100) of claim 3,
the aligning part (410) special for the single substrate is,
the single substrate (11) is provided so as to correspond to one of four vertexes (hereinafter, first vertex (P1)) of the single substrate (11) in a state where the single substrate (11) is supported by the substrate support section (120).
5. The alignment module (100) of claim 4,
the common alignment unit (430) is located at a vertex (hereinafter, a second vertex (P2)) that diagonally faces the first vertex in the single substrate (11) when the single substrate (11) is aligned.
6. The alignment module (100) of claim 4,
the alignment unit (410) for single-substrate-specific alignment includes a pressing member (412) for single-substrate-specific alignment, and the pressing member (412) for single-substrate-specific alignment is configured to press the single-substrate-specific alignment in a horizontal direction by bringing the first apex (P1) into close contact with the two adjacent side edges of the single substrate (11).
7. The alignment module (100) of claim 5,
the divided substrate dedicated alignment section (420) includes:
a divided substrate center aligning section (510) which is disposed in a diagonal direction with respect to one divided substrate (12) (hereinafter, a first divided substrate (12a)) among the 2 divided substrates (12) and the common aligning section (430) in a state where the 2 divided substrates (12) are disposed in the horizontal direction in the alignment chamber (110), enters between the 2 divided substrates (12) from a pair of adjacent vertexes (hereinafter, a pair of third vertexes (P3)) of the 2 divided substrates (12), and pressurizes both side edges of the 2 divided substrates (12) in the horizontal direction, respectively;
and a divided substrate side surface alignment unit (520) that horizontally presses both side edges of the second divided substrate (12b) from a vertex (hereinafter, a fourth vertex (P4)) that diagonally faces the third vertex in the remaining one divided substrate (12) (hereinafter, a second divided substrate (12b)) of the 2 divided substrates (12).
8. The alignment module (100) of claim 7,
the divided substrate side surface alignment unit (520) includes a divided substrate dedicated pressing member (522), and the divided substrate dedicated pressing member (522) presses the second divided substrate (12b) in the horizontal direction while being in close contact with both side edges of the second divided substrate (12b) at the fourth vertex (P4).
9. The alignment module (100) of claim 7,
the common alignment part (430) is located at a vertex (hereinafter, a fifth vertex (P5)) that is diagonally opposite to the third vertex (P3) in the first divided substrate (12a) when the 2 divided substrates (12) are aligned.
10. The alignment module (100) of claim 9,
the universal alignment portion (430) includes:
a common pressing member (432) that presses the second vertex (P2) against both sides of the single substrate (11) in the single-substrate alignment position, and presses the fifth vertex (P5) against both sides of the first divided substrate (12a) in the divided-substrate alignment position in the horizontal direction; and a position adjusting unit for changing the position of the common pressing member (432) between the single-substrate alignment position and the divided-substrate alignment position.
11. The alignment module (100) of claim 2,
the alignment unit (420) for use in dividing the substrate is located at a standby position where the alignment unit does not interfere with the single substrate (11) when aligning the single substrate (11);
the alignment unit (410) for single substrate is located at a standby position where it does not interfere with the 2 divided substrates (12) when aligning the 2 divided substrates (12).
12. The alignment module (100) of claim 1,
the alignment portion includes:
a single substrate alignment unit that aligns the horizontal positions of the single substrates (11) at positions facing each other in a main diagonal direction (D1) when the single substrates (11) are introduced into the alignment chamber (110);
and a divided substrate alignment unit which aligns the horizontal positions of the 2 divided substrates (12) at positions where the sub-diagonal directions (D2, D3) of the divided substrates (12) face each other when the 2 divided substrates (12) are introduced into the alignment chamber (110).
13. The alignment module (100) of claim 12,
the split substrate alignment section includes a first split substrate alignment section and a second split substrate alignment section that align the horizontal positions of the split substrates (12).
14. The alignment module (100) of claim 13,
the first divided substrate alignment part includes:
a first center aligning part (210) linearly moving between a pair of inner sides of the 2 rectangular divided substrates (12) facing each other to support the inner side of the support substrate of one of the 2 divided substrates (12);
a first side alignment part (220) provided in the vicinity of a vertex facing the first center alignment part (210) in a first sub-diagonal direction (D2) and pressing the support substrate in a horizontal direction by at least one of rotation and linear movement, wherein the first sub-diagonal direction (D2) is a sub-diagonal direction of the support substrate supported by the first center alignment part (210);
the second divided substrate aligning part includes:
a second center aligning part (240) which is provided at a position opposite to the first center aligning part (210) with reference to an inner side edge of the supporting substrate of the remaining one of the 2 divided substrates (12), and linearly moves between a pair of inner side edges of the 2 rectangular divided substrates (12) facing each other to support the inner side edge of the supporting substrate;
a second side surface alignment part (230) provided in the vicinity of a vertex facing the second center alignment part (240) in a second sub diagonal direction (D3) and pressing the support substrate in a horizontal direction by at least one of rotation and linear movement, wherein the second sub diagonal direction (D3) is the sub diagonal direction of the support substrate supported by the second center alignment part (240).
15. The alignment module (100) of claim 14,
at least one of the first and second centering portions (210, 240) comprises:
and a plurality of centering members (222) which are positioned with respect to a horizontal virtual reference line (L) perpendicular to the arrangement direction of the 2 divided substrates (12), wherein the outermost portion (S) approaches the horizontal virtual reference line (L) while moving from the horizontal virtual reference line (L) in the direction of the divided substrates (12), and further linearly moves between a pair of inner sides of the 2 rectangular divided substrates (12) facing each other to support the inner side of a support substrate of one of the 2 rectangular divided substrates (12).
16. The alignment module (100) of claim 14,
at least one of the first and second centering portions (210, 240) comprises:
a center alignment member (212) supporting an inner side edge of the support substrate;
an alignment member moving section (214) linearly moves the center alignment member (212) between the pair of inner side edges.
17. The alignment module (100) of claim 16,
the center alignment member (212) is rotatably coupled to the rotating member (213) in a state of being eccentric from a rotating shaft of the rotating member (213), wherein the rotating member (213) is rotatably provided to the main body portion (215) with the rotating shaft perpendicular to the 2 pieces of rectangular substrate (1) as a center;
when the center aligning member (212) is located between the pair of inner sides, the rotating member (213) is rotated by a rotating tool in order to shorten a relative distance of the center aligning member (212) to the inner sides of the support substrate.
18. The alignment module (100) of any of claims 14 to 17,
defining positions corresponding to the apexes of the single substrate (11) as K1, K2, K3, K4 in a counterclockwise direction;
defining positions corresponding to the vertexes of one of the 2 divided substrates (12) as K1, K5, K7, K4 in the counterclockwise direction;
when positions corresponding to the vertexes of the remaining one of the 2 divided substrates (12) are defined as K6, K2, K3, K8 in the counterclockwise direction,
the main diagonal direction (D1) is defined by a diagonal direction connecting the apexes of the single substrates (11) arranged corresponding to K1 and K3;
the first sub diagonal direction (D2) is defined by a diagonal direction connecting vertices of the divided substrates (12) provided corresponding to K4 and K5;
the second sub diagonal direction (D3) is defined by a diagonal direction connecting the vertices of the divided substrates (12) provided corresponding to K8 and K2.
19. The alignment module (100) of claim 18,
at least one of the first and second centering portions (210, 240) comprises:
and a contour support member (219) that supports the outer side edge adjacent to the inner side edge of the support substrate with the apex as a reference.
20. The alignment module (100) of any of claims 14 to 17,
defining positions corresponding to the vertexes of the single substrate (11) as K1, K2, K3, K4 in a counterclockwise direction;
defining positions corresponding to the apex of one of the 2 divided substrates (12) as K1, K5, K7, K4 in the counterclockwise direction;
when positions corresponding to the vertexes of the remaining one of the 2 divided substrates (12) are defined as K6, K2, K3 and K8 in the counterclockwise direction,
the main diagonal direction (D1) is defined by a diagonal direction connecting the apexes of the single substrates (11) arranged corresponding to K4 and K5;
the first sub diagonal direction (D2) is defined by a diagonal direction connecting vertices of the divided substrates (12) provided corresponding to K4 and K5;
the second sub diagonal direction (D3) is defined by a diagonal direction connecting the vertices of the divided substrates (12) provided corresponding to K8 and K2.
21. The alignment module (100) of claim 20,
at least one of the first and second centering portions (210, 240) comprises:
and a contour support member (219) that supports the outer side edge adjacent to the inner side edge of the support substrate with the apex as a reference.
22. The alignment module (100) of claim 20,
at least one of the first side alignment portion (220) and the second side alignment portion (230) constitutes the single-substrate alignment portion.
23. The alignment module (100) of claim 22,
when aligning the split substrates (12), the alignment position of the vertexes of the split substrates (12) disposed corresponding to the K2 and K4 is referred to as a split substrate alignment position;
when the alignment position of the top of the single substrate (11) corresponding to the K2 and K4 is referred to as the single substrate alignment position when aligning the single substrate (11),
the divided substrate alignment position and the single substrate alignment position corresponding to at least one of the K2 and the K4 are located at different alignment positions from each other;
at least one of the first side aligning portion (220) and the second side aligning portion (230) is movably disposed between the divided substrate aligning position and the single substrate aligning position, which are different from each other.
24. A substrate processing system, comprising:
an alignment module (100) for introducing a single substrate (11) or dividing the single substrate (11) into 2 divided substrates (12) of 2 pieces from the outside;
a transfer module (20) coupled to the alignment module and configured to guide a single substrate (11) or a divided substrate (12) out of the alignment module (100) by a transfer robot (21);
one or more process modules (50) coupled to the transfer module (20) and configured to receive a single substrate (11) or to process a substrate by dividing the substrate (12) by the transfer robot (21);
wherein the alignment module (100) is the alignment module (100) of any one of claims 1 to 13.
25. A substrate processing system, comprising:
an alignment module (100) for introducing a single substrate (11) or dividing the single substrate (11) into 2 divided substrates (12) by a transfer robot from the outside;
a transfer module (20) coupled to the alignment module and configured to guide a single substrate (11) or a divided substrate (12) out of the alignment module (100) by a transfer robot (21);
one or more process modules (50) coupled to the transfer module (20) and configured to receive a single substrate (11) or to process a substrate by dividing the substrate (12) by the transfer robot (21);
wherein the alignment module (100) is the alignment module (100) of any one of claims 14 to 17.
26. A substrate processing system as a substrate processing system including an alignment module (100), a transfer module (200), and a plurality of process modules (300), wherein the alignment module (100) aligns a processing object introduced from the outside, the transfer module (200) is provided with a transfer robot (21), the transfer robot (21) is coupled to one side of the alignment module (100) and derives the processing object from the alignment module (100), the plurality of process modules (300) are coupled to the transfer module (200) and receive the processing object from the transfer robot (21) to perform substrate processing,
the processing object is a single substrate (11) in a rectangular quadrilateral shape or 2 divided substrates (12) which divide the single substrate (11) into 2 pieces;
the substrate processing system is used for aligning and processing the single substrate (11) when the single substrate (11) is led in from the outside; when the 2 divided substrates (12) are introduced, alignment and substrate processing are performed on the 2 divided substrates (12).
27. The substrate processing system of claim 26,
at least one of the plurality of process modules (300) is a single substrate processing module for performing substrate processing for the single substrate (11);
at least one of the plurality of process modules (300) is a divided substrate processing module for performing substrate processing with respect to the 2 divided substrates (12).
28. The substrate processing system of claim 26,
the process module (300) selectively performs substrate processing for the single substrate (11) and substrate processing for the 2 divided substrates (12) according to the processing object received from the transfer module (200).
CN202010885072.4A 2019-08-29 2020-08-28 Alignment module and substrate processing system including the same Pending CN112447570A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0106804 2019-08-29
KR1020190106804A KR20210026270A (en) 2019-08-29 2019-08-29 Aligning module and substrate processing system having the same

Publications (1)

Publication Number Publication Date
CN112447570A true CN112447570A (en) 2021-03-05

Family

ID=74735507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010885072.4A Pending CN112447570A (en) 2019-08-29 2020-08-28 Alignment module and substrate processing system including the same

Country Status (2)

Country Link
KR (1) KR20210026270A (en)
CN (1) CN112447570A (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562057A (en) * 1967-05-16 1971-02-09 Texas Instruments Inc Method for separating substrates
JP2000049210A (en) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd One-piece substrate transfer pallet and manufacture of electronic component
US20020021959A1 (en) * 1999-04-19 2002-02-21 Applied Materials, Inc. Method and apparatus for alignment of automated workpiece handling systems
US6517303B1 (en) * 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
KR20070015760A (en) * 2005-08-01 2007-02-06 주식회사 에이디피엔지니어링 Apparatus for manufacturing flat panel display
KR20090075922A (en) * 2008-01-07 2009-07-13 주식회사 에스에프에이 Chamfering apparatus for glass
US20110027052A1 (en) * 2009-07-30 2011-02-03 Tokyo Electron Limited Substrate position alignment mechanism, vacuum prechamber and substrate processing system having same
KR101373071B1 (en) * 2013-10-23 2014-03-11 삼성기전주식회사 Aligning device for plural work pieces
KR20150077663A (en) * 2013-12-30 2015-07-08 주식회사 에스에프에이 An apparatus and method to load substrate
CN107634014A (en) * 2016-07-18 2018-01-26 圆益Ips股份有限公司 Alignment module
KR20180115839A (en) * 2017-04-13 2018-10-24 삼성디스플레이 주식회사 Substrate processing system and control method of transferring substrate

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562057A (en) * 1967-05-16 1971-02-09 Texas Instruments Inc Method for separating substrates
US6517303B1 (en) * 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
JP2000049210A (en) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd One-piece substrate transfer pallet and manufacture of electronic component
US20020021959A1 (en) * 1999-04-19 2002-02-21 Applied Materials, Inc. Method and apparatus for alignment of automated workpiece handling systems
KR20070015760A (en) * 2005-08-01 2007-02-06 주식회사 에이디피엔지니어링 Apparatus for manufacturing flat panel display
KR20090075922A (en) * 2008-01-07 2009-07-13 주식회사 에스에프에이 Chamfering apparatus for glass
US20110027052A1 (en) * 2009-07-30 2011-02-03 Tokyo Electron Limited Substrate position alignment mechanism, vacuum prechamber and substrate processing system having same
KR101373071B1 (en) * 2013-10-23 2014-03-11 삼성기전주식회사 Aligning device for plural work pieces
KR20150077663A (en) * 2013-12-30 2015-07-08 주식회사 에스에프에이 An apparatus and method to load substrate
CN107634014A (en) * 2016-07-18 2018-01-26 圆益Ips股份有限公司 Alignment module
KR20180115839A (en) * 2017-04-13 2018-10-24 삼성디스플레이 주식회사 Substrate processing system and control method of transferring substrate
CN108735625A (en) * 2017-04-13 2018-11-02 三星显示有限公司 Base plate processing system and substrate transfer method adopted therein

Also Published As

Publication number Publication date
KR20210026270A (en) 2021-03-10

Similar Documents

Publication Publication Date Title
CN100517624C (en) Component mounting apparatus and substrate transfer method
KR102445979B1 (en) Chucking warped wafer with bellows
US9343344B2 (en) End effector device
KR102123825B1 (en) Aligning module
CN112447570A (en) Alignment module and substrate processing system including the same
CN103338875B (en) Roller hemming device
KR100978236B1 (en) Robot for transferring wafer
KR20210026269A (en) Aligning module and substrate processing system having the same
JP4425943B2 (en) Work chuck
US8941814B2 (en) Multiple-blade holding devices
CN112133655B (en) Alignment module
JP4425944B2 (en) Work chuck and control method thereof
CN214956802U (en) Pre-positioning bearing device
US20220250255A1 (en) Blade interval adjusting device
KR102031903B1 (en) Aligning module
KR20190118999A (en) Aligning module
CN113053794A (en) Pre-positioning bearing device and positioning bearing method
CN117727684B (en) Wafer vacuum carrying manipulator
KR102021547B1 (en) Aligning module
WO2005041154A1 (en) Substrate positioning device
TWI747588B (en) Substrate holding hand and substrate transfer robot
TWM576734U (en) Pressing apparatus with arrangement for supporting and positioning glass
KR102630103B1 (en) Large-area substrate handling system of a large-area substrate evaporation system
US9236285B2 (en) Movable range adjusting mechanism for workpiece conveying device
KR100890816B1 (en) Device auto pitch module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination