CN113053794A

CN113053794A - Pre-positioning bearing device and positioning bearing method

Info

Publication number: CN113053794A
Application number: CN202110335470.3A
Authority: CN
Inventors: 陈鲁; 张龙; 黄有为; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Skyverse Ltd; Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-06-29

Abstract

A pre-positioning bearing device and a positioning bearing method are provided, wherein the device comprises a bearing part, a correcting part and a positioning part; the correcting piece is detachably connected with the bearing piece and is provided with a containing position used for being matched with the bearing piece; the bearing piece is controllably moved along the first direction so as to enable the center of the bearing piece to coincide with the center of the correcting piece when the bearing piece is stored in the storage position; the positioning members are at least three and distributed around the first direction, and the positioning members can move along a second direction intersecting with the first direction in a controllable mode, so that after the positioning members abut against the edge of the correcting member, the center of a geometric area defined by the positioning members is coincident with the center of the correcting member. The correcting part is used as a reference element, the correcting and positioning of the positions of the positioning parts can be realized by adjusting the relative position relation among the positioning parts, so that the center of an area surrounded by the positioning parts can be determined, the center of the area is overlapped with the center of the bearing part, and the accurate alignment and uniform bearing force application between the bearing part and a workpiece are guaranteed.

Description

Pre-positioning bearing device and positioning bearing method

Technical Field

The invention relates to the technical field of semiconductors, in particular to a pre-positioning bearing device and a positioning bearing method.

Background

It is known that during the manufacturing, testing and the like of wafers (i.e. wafers), integrated chips, flat panel display devices and other micro or precision semiconductor devices, it is usually necessary to provide the necessary bearing and fixing for the semiconductor devices by using a bearing device (i.e. chuck), and then to realize the posture or station switching of the semiconductor devices by carrying the semiconductor devices.

When the conventional bearing device is applied, a workpiece is generally transferred to a preset position by using a gripping device such as a manipulator, and then the bearing device acts to realize bearing and fixing of the workpiece in modes such as adsorption, clamping and pressing, bearing and the like. Because the motion track of the bearing device or the position of the generated bearing action has certain deviation with the position of the workpiece, the action surface of the bearing device can not be matched with the stress surface of the workpiece, and the final bearing effect is easily influenced because the bearing device can not uniformly apply acting force to the workpiece. Taking a load-bearing workpiece (or object) as an example of a wafer, if the center of the active surface of the load-bearing device and the center of the wafer cannot be approached or overlapped to the maximum extent, the uniformity of the stress on the wafer will be seriously affected, and the local area of the wafer will be warped, drooped, even damaged, and the like, which will not only affect the quality of the finished product of the wafer, but also is not beneficial to the manufacture and inspection of the wafer.

Disclosure of Invention

The invention mainly solves the technical problem of providing a pre-positioning bearing device and a positioning bearing method applying the pre-positioning bearing device, so as to provide guarantee for bearing and fixing a workpiece through pre-positioning a bearing position.

According to a first aspect, there is provided in an embodiment a pre-positioning bearer, comprising:

the bearing piece is controllably moved along a first direction and is used for fixing and bearing a workpiece;

the correcting piece is used for matching with a workpiece, the correcting piece is detachably connected with the bearing piece, a containing position is arranged on the correcting piece, the containing position is matched with the bearing piece and is used for containing the bearing piece, and therefore the center of the bearing piece is overlapped with the center of the correcting piece; and

the positioning pieces are used for abutting against the edge of the correcting piece, at least three positioning pieces are distributed around the first direction, and the positioning pieces can move along the second direction in a controllable mode, so that the center of a geometric area defined by all the positioning pieces is coincided with the center of the correcting piece; wherein the second direction intersects the first direction.

In one embodiment, the accommodating position is a through hole structure penetrating through the correcting piece, or the accommodating position is a groove structure arranged on the correcting piece.

In one embodiment, the correcting member has a first surface and a second surface which are opposite, and the receiving position comprises a first receiving groove arranged on the first surface and a second receiving groove arranged on the second surface; the shape of the first receiving groove is different from the shape of the second receiving groove, and/or the size of the first receiving groove is different from the size of the second receiving groove.

In one embodiment, the bearing part is a circular or regular polygonal disk structure, and the shape of the accommodating position is the same as that of the bearing part.

In one embodiment, the profile shape of the correction member is a circle or a regular polygon.

In one embodiment, the positioning member includes:

the supporting piece is used for being fixed at a preset position; and

and the adjusting piece is controllably moved along the second direction, and the adjusting piece is movably connected with the supporting piece and used for abutting against the edge of the correcting piece.

In one embodiment, the positioning member further includes a driving member, and a power output end of the driving member is coupled to the adjusting member for driving the adjusting member to move in the second direction relative to the supporting member.

In one embodiment, the device further comprises a base plate member, the base plate member is provided with a through-travel hole, the through-travel hole is used for enabling the bearing member to move through the base plate member along the first direction, and the positioning member is arranged on the base plate member and located at the edge of the through-travel hole.

In one embodiment, the carrier comprises:

the bearing substrate is controllably moved along a first direction; and

the vacuum holes are uniformly distributed on the bearing surface of the bearing substrate and are used for being communicated with a vacuum source to generate adsorption force so as to adsorb and fix the workpiece on the bearing substrate.

In one embodiment, the carrier further comprises an annular flange surrounding an edge of the carrier substrate for enclosing a vacuum cavity on the carrier substrate; the vacuum holes are positioned in the vacuum groove cavity to generate a negative pressure effect in the vacuum groove cavity.

In one embodiment, the carrier further includes a plurality of supporting protrusions uniformly distributed in the vacuum cavity, the height of the annular flange is greater than or equal to the height of the supporting protrusions, and the vacuum hole is located in a gap formed by at least two adjacent supporting protrusions, so that the workpiece is abutted against the supporting protrusions when the workpiece is adsorbed.

According to a second aspect, an embodiment provides a positioning and carrying method, which uses the pre-positioning and carrying device of the first aspect to position and carry a workpiece, including the following steps:

controlling the bearing piece to move along a first direction to approach the correcting piece so that the bearing piece is accommodated in a containing position;

controlling the positioning parts to move along a second direction, so that all the positioning parts are abutted against the edge of the correcting part, and the center of a geometric area defined by all the positioning parts is superposed with the center of the correcting part;

controlling the bearing piece to move out of the containing position so as to remove the correcting piece;

placing a workpiece matched with the contour shape and the size of the correcting piece on a positioning piece so that the positioning piece abuts against the edge of the workpiece;

and controlling the bearing piece to move along the first direction so as to be close to the workpiece, thereby realizing bearing and fixing of the workpiece.

The pre-positioning bearing device according to the embodiment comprises a bearing part, a correcting part and a positioning part; the correcting piece is detachably connected with the bearing piece and is provided with a containing position used for being matched with the bearing piece; the bearing piece is controllably moved along the first direction so as to enable the center of the bearing piece to coincide with the center of the correcting piece when the bearing piece is stored in the storage position; the positioning members are at least three and distributed around the first direction, and the positioning members can move along a second direction intersecting with the first direction in a controllable mode, so that after the positioning members abut against the edge of the correcting member, the center of a geometric area defined by the positioning members is coincident with the center of the correcting member. The correcting part is used as a reference element, the correcting and positioning of the positions of the positioning parts can be realized by adjusting the relative position relation among the positioning parts, so that the center of an area surrounded by the positioning parts can be determined, the center of the area is overlapped with the center of the bearing part, and the accurate alignment and uniform bearing force application between the bearing part and a workpiece are guaranteed.

Drawings

Fig. 1 is a schematic structural assembly diagram of a pre-positioning carrier according to an embodiment.

Fig. 2 is an exploded view of a pre-positioning carrier according to an embodiment.

Fig. 3 is a schematic structural relationship diagram between the positioning element and the associated component in fig. 2.

Fig. 4 is a schematic diagram of a movement track of a positioning element in the pre-positioning carrying device according to an embodiment.

Fig. 5 is a schematic structural diagram of a calibration member in the prepositioning loading device according to an embodiment.

Fig. 6 is a schematic front-side structure diagram of a carrier in a pre-positioning carrier device according to an embodiment.

Fig. 7 is a schematic diagram illustrating a backside structure of a carrier in a pre-positioning carrier device according to an embodiment.

Fig. 8 is a flowchart of a method for positioning a bearer according to an embodiment.

In the figure: 10. a carrier; 11. a load bearing substrate; 12. an annular flange; 13. a vacuum hole; 14. supporting the salient points; 15. connecting holes; 20. a correction member; 30. a positioning member; 31. a support member; 32. an adjustment member; 32-1, an axial portion; 32-2, a radial portion; 40. a base member; 41. a base plate portion; 42. a convex ring support; a. a storage position; a1, a first accommodating groove; a2, a second receiving groove; b. and a travel through hole.

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

The term "center" as used herein refers to the center of the geometric shape of the components, either the center point or the centerline; thus, "center-coincident" may be understood as a center point or center line that coincides.

Example one

Referring to fig. 1 to 7, the pre-positioning carrying device provided in this embodiment includes a carrying member 10, a correcting member 20 and a plurality of positioning members 30, wherein the carrying device mainly uses the correcting member 20 as a reference element for adjusting the relative position relationship between the positioning members 30, so that the centers of the areas surrounded by the positioning members 30 can be finally overlapped with the center of the carrying member 10, thereby achieving the purpose of pre-correcting and positioning the positioning members 30; in the later stage, when the workpiece is supported and fixed by the bearing part 10, the characteristics that the shape and the size of the correcting part 20 are matched with those of the workpiece can be utilized, so that the center of the bearing part 10 can coincide with the center of the workpiece, the bearing part 10 can uniformly bear and apply force to the workpiece, and the uniformity of the stress of the workpiece is ensured; the term "workpiece" refers to a fixed object finally carried by the carrier, and includes but is not limited to wafers, integrated chips, flat panel display devices, and other micro, precision semiconductor devices or non-semiconductor elements; as a common application of the carrying apparatus, the present embodiment takes a workpiece as a wafer as an example, and the following description is separately provided.

Referring to fig. 1, fig. 2, fig. 6 and fig. 7, the carrier 10 mainly plays a role of fixing and supporting the wafer, and the carrier 10 can carry the wafer (e.g., drive the wafer to change its position and posture) by selecting and controlling the motion state and the travel path of the carrier, so as to realize the wafer transportation and the wafer conversion between different stations. The carrier 10 is configured to be controllably movable in a first direction, such as by a linear driving mechanism, a transmission mechanism, etc. to drive the carrier 10 to move, so that the carrier 10 has a motion condition or action performance that can approach (or separate) the calibration member 20 or the wafer; in some embodiments, the carrier 10 is further configured to be rotatable about an axis in the first direction. It should be noted that, the reference to the "first direction" can be understood as an arrangement direction between the carrier 10 and the calibration member 20 or the wafer during a specific use of the carrier device, and generally, it refers to an up-down direction or a vertical axis direction.

Referring to fig. 1, 2, 4 and 5, the calibration member 20 is mainly used for matching wafers and calibrating and positioning the positions of the positioning members 30 to ensure that the centers of the regions surrounded by the positioning members 30 can coincide with the center of the carrier 10, and further, the centers of the carrier 10 can coincide with the centers of the wafers by using the matching relationship between the wafers and the calibration member 20; generally, since the shape of the wafer is generally circular, the outline shape of the calibration member 20 should be a centrosymmetric pattern, such as a circle or a regular polygon with a center, so that a structural matching relationship can be established between the calibration member 20 and the wafer, for example, when the calibration member 30 is a regular polygon, the size of the circumscribed circle or the inscribed circle thereof has a certain linear correspondence with the size of the wafer, and for example, when the workpiece including the wafer is a regular polygon, and the calibration member 30 is a circle, the shape of the workpiece including the wafer is different, but the size aspect also has a linear correspondence; therefore, the shape of the wafer and the shape of the calibration member 20 can be selected from circular or regular polygon, and the sizes of the two can be the same or different. The calibration member 20 is configured to be detachably connected to the carrier 10, so that after the calibration member 20 completes the position calibration positioning of the positioning member 30, the calibration member 20 is separated from the carrier 10, thereby creating conditions for subsequent carrier fixing of the carrier 10 and supporting positioning of the positioning member 30 on the wafer by removing or detaching the calibration member 20.

In this embodiment, the calibration member 20 is provided with a receiving position a, the center of the receiving position a coincides with the center of the calibration member 20, the receiving position a may be a through hole structure penetrating through the calibration member 20 along the first direction, the through hole structure may be a through hole structure with an equal inner diameter to match a single-size wafer, or a through hole structure with a variable diameter to match a plurality of different-size wafers; the accommodating position a may also be a groove structure formed on the surface of the correcting member 20, or an accommodating space formed by enclosing a plurality of structural members on the correcting member 20; the key points are as follows: the shape and size of the receiving position a should be the same as or as close as possible to those of the supporting member 10, for example, the supporting member 10 is a disk structure with a central symmetrical figure such as a circle or a regular polygon, and the shape (and size) of the receiving position a should be the same as those of the supporting member 10; therefore, the structure matching relationship between the containing position a and the bearing part 10 can be conveniently established, the bearing part 10 can be finally contained in the containing position a or the structure space of the containing position a can be filled after moving along the first direction and approaching to the correcting part 20, and the coincidence of the center of the bearing part 10 and the center of the correcting part 20 is ensured by utilizing the structural characteristics that the center of the containing position a coincides with the center of the correcting part 20 and the structure matching relationship between the containing position a and the bearing part 10.

Referring to fig. 1 to 4, the positioning element 30 is mainly used for determining its position by abutting against the edge of the calibration element 20, and meanwhile, in the process of carrying and fixing the wafer by the carrying device, the positioning element 30 also plays a role of supporting and positioning the wafer, so that after the carrying element 10 moves along the first direction and approaches the wafer, the wafer can be driven to separate from the positioning element 30, thereby carrying and fixing the wafer. The positioning element 30 is configured to be controllably movable in the second direction, for example, automatically or manually by a driving mechanism, a transmission mechanism, etc., so that the positioning element 30 has a moving condition or an action performance that can approach or separate from the calibration element 20, and then a position where the positioning element 30 abuts against an edge of the calibration element 20 can be used as an initial position or a reference position after the positioning element 30 is calibrated. The number of the positioning members 30 is at least three, and at least three positioning members 30 are distributed around the first direction, so that all the positioning members 30 can be located on the same circumferential track (i.e., corresponding to a geometric area around the first direction which is formed by the positioning members 30 together) after being corrected to the initial position or the reference position, and the center of the circumferential track or the geometric area is coincident with the center of the correcting member 20; in terms of the centrosymmetric pattern adopted by the shape of the correcting element 20, when the outline shape of the correcting element 20 is a circle, the circumferential track is the outline track of the correcting element 20; when the calibration member 20 is a regular polygon, if all the positioning members 30 simultaneously abut against the side lines of the calibration member 20, the circumferential track at this time is the contour track of the inscribed circle of the calibration member 20, and if all the positioning members 30 simultaneously abut against the corner of the calibration member 20, the circumferential track at this time is the contour track of the circumscribed circle of the calibration member 20.

In one embodiment, four positioning members 30 are provided, each two positioning members are provided as a group, two positioning members 30 in each group are symmetrically distributed with respect to the first direction, and two groups of positioning members 30 are also symmetrically distributed with respect to the first direction, so that the four positioning members 30 form a layout distributed around the first direction, and in a certain state (i.e., in a state where the positioning members 30 abut against the edge of the correcting member 20), the four positioning members 30 are located on the same circumferential track. In other embodiments, the positioning members 30 may be three, four, five, six or other numbers, or, with reference to the foregoing embodiments, symmetrically or uniformly arranged in groups, or directly arranged in a surrounding and uniformly or non-uniformly distributed manner with the first direction as the center, so that a plurality of positioning members 30 can be distributed along the same circumferential track in a certain state. It should be noted that the second direction intersects the first direction, for example, when the first direction is a vertical direction or a vertical axis direction, the second direction is a horizontal direction or a multi-directional direction such as front, back, left, and right, and the like, and it can also be understood that the moving direction of each positioning element 30 is defined as the second direction, and in terms of the layout orientation of the positioning elements 30, the second direction corresponds to at least three second directions distributed around the first direction.

Based on this, the matching relationship between the storage position a and the bearing member 10 can ensure that the centers of the bearing member 10 and the calibration member 20 are overlapped, and the calibration member 20 is used as the calibration reference of the positioning members 30, so that when each positioning member 30 abuts against the edge of the calibration member 20 at the same time, the calibration positioning of the initial position or the final position of each positioning member 30 is completed, the center of the area surrounded by each positioning member 30 is overlapped with the center of the calibration member 20, and further, after each positioning member 30 is calibrated and positioned, the center of the bearing member 10 is overlapped with the center of the area corresponding to the positioning member 30, so that the pre-positioning of each positioning member 30 is realized; when the bearing device is applied at the later stage, only the correcting part 20 needs to be removed, a workpiece is directly placed on the positioning part 30, and the workpiece is supported and positioned through the positioning part 30, because the workpiece and the correcting part 20 have a structure matching relationship, the center of the workpiece naturally corresponds to the center of the bearing part 30 (if the workpiece is on the same straight line), and when the bearing part 30 is driven to move close to the workpiece and contact with the workpiece, the centers of the workpiece and the workpiece naturally coincide, so that the bearing part 30 can uniformly apply force to the workpiece, the contact area between the workpiece and the workpiece is increased to the maximum extent, series problems caused by uneven stress of the workpiece are effectively avoided, especially the problems of warping, sagging, even damage and the like of a local area of a wafer can be avoided, and favorable conditions are created for manufacturing, detecting and improving the finished product quality of the wafer.

In one embodiment, referring to fig. 2 and 5, the correcting member 20 has a disc-like structure with a central symmetrical contour, such that a first surface and a second surface opposite to each other are naturally formed on the correcting member 20; correspondingly, the containing position a adopts a groove structure, the containing position a of the groove structure is matched with the bearing piece 10, the restraint effect on the position of the correcting piece 20 can be achieved, the bearing piece 10 and the correcting piece 20 can be accurately aligned, the centers of the bearing piece 10 and the correcting piece 20 are coincident, and the bearing piece 10 and the correcting piece 20 can be prevented from shifting. In this embodiment, the receiving position a includes a first receiving groove a1 disposed on the first surface and a second receiving groove a2 disposed on the second surface, and the shapes and/or sizes of the first receiving groove a1 and the second receiving groove a2 may be the same or different; in the illustrated embodiment, the two receiving grooves have the same shape but different sizes, so that the receiving grooves can be matched with wafers or other workpieces with the same shape and different sizes; in another embodiment, the first receiving groove a1 has a different shape and size from the second receiving groove a2, so as to be able to match different workpieces and enhance the adaptability of the corrector 20. Of course, in other embodiments, the shapes and sizes of the first receiving groove a1 and the second receiving groove a2 are the same, so that not only a backup effect can be achieved, but also the receiving grooves do not need to be identified when the correction member 20 is applied.

Referring to fig. 1 to 4, an embodiment provides a pre-positioning carrier device, further including a substrate 40, the substrate 40 is mainly used as a carrier for assembling and moving the positioning element 30, the substrate 40 is provided with a through-hole b distributed through the substrate 40 along a first direction, the through-hole b is mainly used for allowing the carrier 10 to move along the first direction and pass through the substrate 40, so that the carrier 10 reaches a position where the calibration element 10 or the wafer contacts, and the positioning element 30 is disposed on the substrate 40 and located at an edge of the through-hole b, so as to move on the substrate 40 along a second direction. In specific implementation, the carrier 10 may be driven to move from the side of the base plate 40 away from the positioning member 30 toward the base plate 40 along the first direction, so that the carrier 10 reaches a structural space or region formed by a plurality of positioning members 30 after passing through the base plate 40 via the through-travel holes b (of course, the structural space or region may be circular, and may also be other geometric shapes), and then, the calibration member 20 is stacked on the carrier 10, so that the carrier 10 is accommodated in the accommodating position a, and positioning of the calibration member 20 is achieved, so that the center of the calibration member 20 coincides with the center of the carrier 10; subsequently, each positioning member 30 is driven to move on the base plate member 40 along the second direction until each positioning member 30 abuts against the edge of the correcting member 20; finally, the calibration member 20 is removed or unloaded to complete the initial or final calibration positioning of each positioning member 30, so that each positioning member 30 is located on the same circumferential track, i.e., the center of the geometric area surrounded by each positioning member 30 coincides with the center of the calibration member 20 and the center of the carrier 10.

In one embodiment, referring to fig. 1 to 4, the positioning member 30 includes a supporting member 31 and an adjusting member 32; wherein the supporting member 31 is fixed at a predetermined position, such as the base member 40 of the previous embodiment, and is located at the edge of the through-travel-hole b to provide structural support and guidance for the movement of the adjusting member 32; the adjusting member 32 belongs to a moving component of the positioning member 30, and is mainly used for determining a position to be finally corrected by abutting against the edge of the correcting member 20, and the adjusting member 32 and the supporting member 31 can be movably connected with each other with reference to the existing structures such as a slide rail module, a screw rod transmission module and the like, so that the adjusting member 32 can be driven to move in a second direction relative to the supporting member 31 so as to be close to or far from the correcting member 20; meanwhile, when the carrying device carries out carrying and fixing operations on workpieces including wafers, the adjusting member 32 can also be used for supporting the workpieces, so that the carrying member 10 can drive the workpieces to be separated from the positioning member 30 after contacting and fixing the workpieces, thereby carrying the workpieces.

In one embodiment, referring to fig. 1 to 3, the base plate 40 is mainly composed of a base plate portion 41 and a protruding ring support portion 42; wherein, the through hole b is opened on the base plate portion 41, and the protruding ring supporting portion 42 surrounds the edge of the through hole b, and the protruding ring supporting portion 42 is detachably or non-detachably mounted on the base plate portion 42, mainly for providing a structural assembling space for the positioning member 30 on the base plate portion 41, and enabling the positioning member 30 to be disposed on the base plate portion 41 at a certain height; as for the positioning member 30, the supporting members 31 may be a convex structure formed on the end surface of the side of the collar support portion 42 away from the base plate portion 41, and the supporting members 31 of the plurality of positioning members 30 are distributed around the center line of the collar support portion 42. The adjusting member 32 may be an approximately L-shaped structure as a whole, so that it has an axial portion 32-1 extending parallel to the axial direction of the collar support portion 42 and a radial portion 32-2 extending in the radial direction of the collar support portion 42, and the radial portion 32-2 is linearly slidably connected to the support member 31 in the radial direction of the collar support portion 42 (in this case, the direction corresponds to the aforementioned second direction); in the positioning and correcting process of the positioning element 30, when the carrier 10 is received in the receiving position a, the adjusting element 32 is operated to move along the second direction, so that one end of the radial portion 32-2 or the axial portion 32-1 is finally abutted against the circumferential surface of the correcting element 20, and the operation of abutting the positioning element 30 against the edge of the correcting element 20, that is, the purpose of correcting and positioning the position of each positioning element 30 is achieved. In other embodiments, the base member 40 may be omitted, and the supporting member 31 may be preset at a fixed spatial position; or the protruding ring support part 42 is omitted, and the base plate part 42 is directly provided with a structure which can be movably connected with the adjusting piece 32 and can support and guide the adjusting piece 32.

In one embodiment, the positioning member 32 further comprises a driving member (not shown), which may be formed by combining a power device such as a micro motor, an air cylinder, etc. and a component such as an encoder, a transmission mechanism, a sensing device, etc. according to actual conditions, and a power output end of the driving member is coupled to the adjusting member 32 to drive the adjusting member 32 to move in the second direction relative to the protruding ring support portion 42, the base plate portion 41, etc. so as to achieve the adjustment of the specific position of the adjusting member 32 in an automatic control manner, and finally achieve the correct positioning in cooperation with the correcting member 20.

In one embodiment, referring to fig. 5 and 6, the carrier 10 includes a carrier substrate 11, an annular flange 12, and a plurality of vacuum holes 13; the bearing substrate 11 is a basic structure of the bearing member 10, and can be coupled to a power end of a power component such as a linear driving device, so that the entire bearing member 10 can controllably move in a first direction under the driving of the power component; the annular flange 12 is arranged around the edge of the bearing base body 11 to form a vacuum groove cavity on the bearing base body 11, and the outline shape and the size of a structure consisting of the annular flange 12 and the bearing base body 11 are matched with the containing position a so as to have the condition of being contained in the containing position a, and the center of the structure is coincided with the center of the correcting piece 20; the vacuum holes 13 are uniformly distributed on the bearing substrate 11 and located in the vacuum groove cavity, and by communicating the vacuum holes 13 with a vacuum source such as a vacuum pump, a negative pressure effect can be generated in a region surrounded by the vacuum groove cavity, so that the whole bearing member 10 has the capability of generating adsorption force, and particularly, after a workpiece including a wafer is stacked on the bearing substrate 11 and the surface of the annular flange 12 is abutted against the surface of the workpiece, the vacuum groove cavity is equivalently sealed, so that a sealed cavity can be formed between the workpiece and the bearing member 10; after the positioning member 30 is calibrated and the calibration member 20 is removed, the workpiece can be adsorbed and fixed on the bearing substrate 11 (i.e. the bearing member 10) based on the vacuum adsorption principle, so as to realize adsorption type bearing and fixing of the workpiece.

In one embodiment, referring to fig. 5, the carrier 10 further includes a plurality of supporting protrusions 14 for supporting the workpiece, the supporting protrusions 14 are uniformly distributed on the surface of the carrier substrate 11 and located in the vacuum cavity, and one end of the supporting protrusion 14 contacting the workpiece may be a hemispherical structure to achieve point contact and smooth contact with the workpiece; the height of the annular flange 12 is equal to that of the supporting salient points 14 by taking the surface of the bearing substrate 11 as a reference, and the vacuum holes 13 are positioned in a gap formed by at least two adjacent supporting salient points 14; in this way, when a workpiece including a wafer is loaded, the workpiece may be placed on the carrier 10 by using a gripping device such as a robot, so that the surface of the workpiece is simultaneously abutted against the supporting protrusions 14 and the annular flange 12, and then the workpiece may be stably abutted against the supporting protrusions 14 and the annular flange 12 by using the suction force generated by the vacuum holes 13, thereby completing the suction type loading and fixing of the workpiece. The supporting salient points 14 which are uniformly distributed are used for supporting the workpiece, so that conditions can be created for improving the flatness of the bearing part 10, a full-area point contact effect can be formed between the bearing part 10 and the surface of the workpiece, and the scratch and damage to the workpiece can be reduced; meanwhile, the adsorption acting force generated by the uniformly distributed vacuum holes 13 and the matching of the supporting salient points 14 can ensure the uniformity of the stress of the workpiece, and avoid the problems of warping, drooping and the like of local areas caused by the uneven stress of the workpiece, thereby being beneficial to improving the flatness of the bearing workpiece and better adapting to the process requirements of the procedures of manufacturing, detecting and the like. It should be noted that the carrier 10 shown in fig. 2 is a simplified diagram, and the supporting bumps 14 and the vacuum holes 13 are omitted.

In another embodiment, the height of the annular flange 12 may also be greater than the height of the supporting protrusions 14, in this case, under the condition that the shape of the annular flange 12 is the same as the outline shape and the size of the workpiece including the wafer is similar, by pressing the workpiece downward toward the carrying substrate 11, the circumferential surface of the workpiece may be brought into contact with the inner circumferential wall of the annular flange 14 and abut against the supporting protrusions 14, so that a closed vacuum chamber may also be formed between the workpiece and the carrying member 10, so as to finally complete carrying and fixing of the workpiece.

In one embodiment, the vacuum holes 13 are distributed through the carrier substrate 11, and the end of the vacuum hole 13 away from the annular flange 12 is connected to a vacuum source through a pipeline to create a condition for the vacuum hole 13 to generate an adsorption force. In another embodiment, referring to fig. 6, a vacuum pipeline is disposed inside the supporting substrate 11, the vacuum hole 13 is connected to the vacuum pipeline through a side surface of the supporting substrate 11 adjacent to the annular flange 12, and a connection hole 15 is disposed on a side surface of the supporting substrate 11 away from the annular flange 14, so that the vacuum hole 13 is connected through the vacuum pipeline, and thus a vacuum source can be directly connected to the connection hole 15 through the pipeline, i.e., a complete flow channel can be established among the vacuum hole 13, the vacuum pipeline and the connection hole 15, so that the vacuum hole 13 can finally have a condition of generating an absorption force.

Example two

The embodiment provides a positioning and carrying method, which is mainly used for positioning and carrying a workpiece including a wafer by using the pre-positioning carrying device of the first embodiment, wherein the wafer is taken as an example in the embodiment for schematic illustration; referring to fig. 8 in conjunction with fig. 1 to 7, the method includes steps S1 to S5, which are described below.

In step S1, the carrier 10 is controlled to move in the first direction to approach the calibration member 20, so that the carrier 10 is accommodated in the accommodation position a.

In specific implementation, the bearing member 10 and the power output end of the linear driving device may be coupled, and the linear driving device drives the bearing member 10 to move along a first direction and to a spatial position corresponding to the plurality of positioning members 30 (i.e., a spatial region surrounded by a closed-loop track on which the plurality of positioning members 30 are distributed), and then the bearing member stays for waiting; the calibration member 20 is then stacked on the carrier 10 mechanically or manually, so that the carrier 10 is received in the receiving position a, i.e. the center of the carrier 10 coincides with the center of the calibration member 20. In other embodiments, the calibration member 20 may be placed on the carrier 10 in advance, and the carrier 10 is received in the receiving position a, so that in the subsequent step, the carrier 10 is driven to drive the calibration member 20 to move along the first direction and move to the spatial position corresponding to the plurality of positioning members 30.

And step S2, controlling the positioning members 30 to move in the second direction, so that all the positioning members 30 are abutted against the edge of the correcting member 20, and the center of the geometric area enclosed by all the positioning members 30 is coincident with the center of the correcting member 20.

Specifically, after the carrier 10 is received in the receiving position a, which is equivalent to positioning the calibration member 20 by using the carrier 10, the positioning member 30 is driven to move toward the calibration member 20 in the second direction manually or automatically by using the structural features of the positioning member 30 or configuring corresponding driving components until the positioning member 10 abuts against the edge of the calibration member 20; at this time, based on the contour shape characteristics of the calibration member 20, each positioning member 30 is located on a circumferential track distributed around the center of the calibration member 20, which is equivalent to that each positioning member 30 can enclose a geometric area, and the center of the geometric area coincides with the center of the calibration member 20, so that the center of the calibration member 20, the center of the bearing member 30, and the center of the geometric area coincide as a whole, and the primary or final calibration and positioning of the position of the positioning member 30 are completed.

In step S3, the carrier 10 is controlled to move out of the storage position a to remove the calibration member 20.

In particular, the removal of the carrier 10 from the receiving position a or the removal of the correction element 20 is a relative operational control or movement, namely: since the position of the positioning member 30 has been corrected and positioned, the correcting member 20 can be directly removed to remove the correcting member 20 from the whole device, so that the carrying member 10 is moved out of the receiving position a; or the carrier 10 is moved to move out of the receiving position a before the calibration member 20 is removed from the whole device. In summary, the carrier 10 is separated from the calibration member 20.

In step S4, a workpiece matching the contour shape and size of the calibration piece 10 is placed on the positioning piece 30, so that the positioning piece 30 abuts against the edge of the workpiece.

After removal of the correction elements 20, since the position of each positioning element 30 has been determined, the workpiece can now be placed on each positioning element 30 by means of a gripping device, such as a robot, i.e.: the method is equivalent to replacing the correction piece 20 which is removed with a workpiece, so that each positioning piece 30 can abut against the edge of the workpiece to complete the support of the workpiece, so that the workpiece is placed on the motion track of the carrier 10, and the center of the workpiece is in the same straight line with the center of the carrier 10; of course, when the shape or size of the calibration piece 20 is different from that of the workpiece, but there is a certain matching relationship between the two, for example, when the calibration piece 20 is a regular polygon and the workpiece is a circle, the shape and size of the workpiece will have a certain linear corresponding relationship with the shape and size of the inscribed circle or circumscribed circle of the calibration piece 20, and at this time, the final calibration positioning can be performed on each positioning piece 30 by performing the same parameter adjustment on the displacement amount of each positioning piece 30 moving in the second direction.

And step S5, controlling the carrier 10 to move in the first direction to approach the workpiece, so as to realize the bearing fixation of the workpiece.

After the positioning member 30 is used to complete supporting and positioning of the workpiece, the linear driving device is used to drive the carrier 10 to move along the first direction and approach the workpiece, and after the carrier 10 contacts the workpiece, the workpiece can be fixed on the carrier 10 by means of, for example, adsorption, so as to complete supporting and fixing of the workpiece; finally, the supporting member 10 can be driven to move continuously along the first direction to drive the workpiece to separate from the positioning members 30, or the supporting member 10 can be driven to drive the workpiece to rotate (e.g., rotate between the positioning members 30 around the first direction, or carry the workpiece to other spatial regions for rotation), so as to perform subsequent processing on the workpiece, such as wafer cutting, scribing, grinding, polishing, defect detection, and the like.

The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.

Claims

1. A pre-positioning carrier, comprising:

2. The pre-positioning carrier device according to claim 1, wherein the receiving locations are through-hole structures that pass through the calibration member, or the receiving locations are groove structures that are provided on the calibration member.

3. The pre-positioning carrier of claim 2, wherein the alignment member has first and second opposed surfaces, and the receiving position includes a first receiving slot provided in the first surface and a second receiving slot provided in the second surface; the shape of the first receiving groove is different from the shape of the second receiving groove, and/or the size of the first receiving groove is different from the size of the second receiving groove.

4. The apparatus of claim 1 wherein the carrier is a circular or regular polygonal disk structure and the receiving locations are the same shape as the carrier.

5. The pre-positioning carrier of claim 1, wherein the profile of the corrective member is circular or regular polygonal in shape.

6. The pre-positioning carrier device of claim 1, wherein the positioning member comprises:

the supporting piece is used for being fixed at a preset position; and

7. The pre-positioning carrier device of claim 6, wherein the positioning member further includes an actuating member, a power output of the actuating member being coupled to the adjustment member for driving the adjustment member in the second direction relative to the support member.

8. The pre-positioning carrier device of claim 1, further comprising a base member provided with a through-travel-hole for movement of the carrier member in a first direction through the base member, the positioning member being disposed on the base member at an edge of the through-travel-hole.

9. The pre-positioning carrier of claim 1, wherein the carrier comprises:

the bearing substrate is controllably moved along a first direction; and

10. The pre-positioning carrier of claim 9, wherein the carrier further comprises an annular flange disposed around an edge of the carrier substrate for enclosing a vacuum cavity on the carrier substrate; the vacuum holes are positioned in the vacuum groove cavity to generate a negative pressure effect in the vacuum groove cavity.

11. The pre-positioning carrier device of claim 10, wherein the carrier further comprises a plurality of support protrusions uniformly distributed in the vacuum cavity, the annular flange has a height greater than or equal to a height of the support protrusions, and the vacuum holes are located in a gap defined by at least two adjacent support protrusions to urge the workpiece against the support protrusions when the workpiece is being held.

12. A positioning and bearing method, characterized in that the workpiece is positioned and carried by the prepositioning carrying device according to any one of claims 1-11, comprising the following steps: