CN111467246A - 牙科用陶材膏 - Google Patents
牙科用陶材膏 Download PDFInfo
- Publication number
- CN111467246A CN111467246A CN202010071206.9A CN202010071206A CN111467246A CN 111467246 A CN111467246 A CN 111467246A CN 202010071206 A CN202010071206 A CN 202010071206A CN 111467246 A CN111467246 A CN 111467246A
- Authority
- CN
- China
- Prior art keywords
- dental
- paste
- particle diameter
- ceramic paste
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000919 ceramic Substances 0.000 title claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 50
- 239000000843 powder Substances 0.000 claims abstract description 42
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000003960 organic solvent Substances 0.000 claims abstract description 25
- 239000011351 dental ceramic Substances 0.000 claims abstract description 19
- 238000009835 boiling Methods 0.000 claims abstract description 12
- 239000011164 primary particle Substances 0.000 claims abstract description 12
- 229910021487 silica fume Inorganic materials 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 26
- 238000004040 coloring Methods 0.000 claims description 9
- 238000010304 firing Methods 0.000 abstract description 37
- 238000003763 carbonization Methods 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 229920000642 polymer Polymers 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 57
- 238000000034 method Methods 0.000 description 36
- 239000000377 silicon dioxide Substances 0.000 description 29
- 230000000052 comparative effect Effects 0.000 description 18
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 15
- 229910010293 ceramic material Inorganic materials 0.000 description 15
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000000790 scattering method Methods 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- -1 and the like Chemical compound 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 229910052906 cristobalite Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229910052682 stishovite Inorganic materials 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 229910052905 tridymite Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 4
- 238000002296 dynamic light scattering Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 235000019437 butane-1,3-diol Nutrition 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- SXQXMCWCWVCFPC-UHFFFAOYSA-N aluminum;potassium;dioxido(oxo)silane Chemical compound [Al+3].[K+].[O-][Si]([O-])=O.[O-][Si]([O-])=O SXQXMCWCWVCFPC-UHFFFAOYSA-N 0.000 description 2
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000001246 colloidal dispersion Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000010485 coping Effects 0.000 description 2
- 239000005548 dental material Substances 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000006112 glass ceramic composition Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- UPWOEMHINGJHOB-UHFFFAOYSA-N oxo(oxocobaltiooxy)cobalt Chemical compound O=[Co]O[Co]=O UPWOEMHINGJHOB-UHFFFAOYSA-N 0.000 description 2
- 229960005323 phenoxyethanol Drugs 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- 229940083957 1,2-butanediol Drugs 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 229960002903 benzyl benzoate Drugs 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- IYYIVELXUANFED-UHFFFAOYSA-N bromo(trimethyl)silane Chemical compound C[Si](C)(C)Br IYYIVELXUANFED-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- DIJRHOZMLZRNLM-UHFFFAOYSA-N dimethoxy-methyl-(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](C)(OC)CCC(F)(F)F DIJRHOZMLZRNLM-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- RSEIMSPAXMNYFJ-UHFFFAOYSA-N europium(III) oxide Inorganic materials O=[Eu]O[Eu]=O RSEIMSPAXMNYFJ-UHFFFAOYSA-N 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229940077441 fluorapatite Drugs 0.000 description 1
- 229910052587 fluorapatite Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003103 lithium disilicate glass Substances 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
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Abstract
本发明提供一种牙科用陶材膏,所述牙科用陶材膏能够长期保持膏状态,具有优异的涂布性,在烧成时几乎不发生因有机成分或高分子成分的影响而引起的碳化和气泡。本发明的牙科用陶材膏用于制作牙科补缀装置,其特征在于,所述牙科用陶材膏包含:50.0wt%~80.0wt%的最大粒径为100μm以下且平均粒径为1μm~20μm的玻璃粉末(a);0.5wt%~10.0wt%的平均一次粒径为1nm~50nm的疏水化微粒二氧化硅(b);以及10.0wt%~49.5wt%的沸点(bp)为100℃~300℃的有机溶剂(c)。
Description
技术领域
本发明涉及一种牙科用陶材膏,所述牙科用陶材膏使用于人工牙齿等牙科补缀装置,将在由牙科技师的手工作业的陶材构筑时适合使用的牙科用陶材或牙科陶瓷用着色材料制成膏状。
背景技术
牙科用陶材(porcelain)是将长石等作为原料的玻璃陶瓷材料,主要用于缺损牙齿的牙冠补缀修复。当根据使用方法来进行分类时,有在金属制框架上烧接的金属结合用陶材、在氧化锆制框架上烧接的氧化锆用陶材以及单独由牙科用陶材制作的补缀装置。
另外,牙科陶瓷用着色材料与牙科用陶材相同地,以玻璃材料或玻璃陶瓷材料为基底,配合有多种着色材料成分(颜料)。用于牙科用陶材和牙科用陶瓷材料(氧化铝、氧化锆等)的色调调整的成分。
专利文献1中,作为不透明陶材公开了一种适合用于牙科用顶盖 (coping)的膏,所述膏由不透明陶材和氨基甲酸酯聚合物的水溶性胶状分散液构成。其特征在于,通过利用氨基甲酸酯聚合物的水溶性胶状分散液进行膏化来在构筑主体陶材层之前不需要烧成。
但是,氨基甲酸酯聚合物在陶材烧成条件下不能完全烧掉而发生碳化和气泡。另外,在本技术中难以均匀涂布。
专利文献2中,公开了一种不透明陶瓷膏,通过将包含约10%~20%的约小于2μm粒子的陶瓷粉末与沸点小于300℃的有机溶剂混合来进行调整。
但是,此不透明陶瓷膏,难以在保持优异的涂布性的同时抑制因经年劣化而带来的粉末与液体成分的分离。
专利文献3中,公开了一种在使用时难以干燥、固化的牙科用膏状陶材。其特征在于,将溶解有高分子材料的粘度为50,000cps~1,500,000cps的有机溶剂7重量份~45重量份与剩余部分的陶材粉末混合至100重量份,并呈膏状。
但是,如果使用溶解有高分子材料的高粘度有机溶剂,则在陶材烧成时不能完全烧掉而发生碳化和气泡。另外,在本技术中,难以均匀涂布。
专利文献4中,公开了一种能够抑制烧成前后的色差的膏状牙科用陶材,其特征在于,包含烧成时脱色的着色剂、有机溶剂以及表面处理的陶材粉末。
但是,在本技术中,在烧成时不能完全烧掉而发生碳化和气泡。另外,难以均匀涂布。
任何现有技术,也不能实现在长期保持涂布性优异的膏状态的同时抑制因烧成时的有机成分和高分子成分的燃烧剩余而引起的碳化和气泡。
现有技术文献
专利文献
专利文献1:日本特开昭59-196807号公报
专利文献2:日本特开平01-125312号公报
专利文献3:日本特开2001-079019号公报
专利文献4:日本特开2017-193492号公报
发明内容
发明所要解决的问题
提供一种牙科用陶材膏,所述牙科用陶材膏能够长期保持膏状态,具有优异的涂布性,在烧成时几乎不发生因有机成分或高分子成分的影响而引起的碳化和气泡。
解决问题的技术方案
本发明的牙科用陶材膏用于制作牙科补缀装置,其特征在于,所述牙科用陶材膏包含:50.0wt%~80.0wt%的最大粒径为100μm以下且平均粒径为 1μm~20μm的玻璃粉末(a);0.5wt%~10.0wt%的平均一次粒径为1nm~ 50nm的疏水化微粒二氧化硅(b);以及10.0wt%~49.5wt%的沸点(bp) 为100℃~300℃的有机溶剂(c)。
本发明中,最大粒径是指在全部粒子中最大粒子的直径。玻璃粉末的最大粒径,能够通过使用激光衍射散射法、动态光散射法、离心沉降法、电敏感区法等的测定来求出。
本发明中,平均粒径是全部粒径的平均值。玻璃粉末的平均粒径,能够通过使用激光衍射散射法、动态光散射法、离心沉降法、电敏感区法等的测定来求出。
本发明中,平均一次粒径是指在不凝集的状态下的全部粒径的平均值。微粒二氧化硅的平均一次粒径,能够通过使用气体吸附法、压汞法、气体渗透法、泡点法等的测定而获得的比表面积来算出。
本发明中,优选进一步包含着色材料(d)和/或荧光材料(e)。
发明效果
本发明的牙科用陶材膏,能够均匀涂布而不被技师的熟练度左右,能够长期保持恒定的膏性状,能够防止碳化,能够抑制气泡的产生。
具体实施方式
牙科用陶材膏中,能够通过在核上构筑牙科用陶材膏并烧成来获得目的牙科补缀装置的形状。
通常650℃~850℃的温度域,是为了烧成牙科用陶材膏的烧成温度。通常通过在本烧成温度停留1分钟~10分钟来烧成。
在850℃以上进行烧成的情况下,不能保持牙科补缀装置的形状,从而有时产生变形和泡。
在650℃以下进行烧成的情况下,以烧成不足够的方式碳化,从而有时不能获得目的色调。另外,需要10分钟以上的长期停留,有时难以在实际使用中使用。
一次以上烧成是指至少需要一次烧成,在成为目的牙科补缀装置的形状之前在所述烧成温度烧成,构筑牙科用陶材膏并烧成,能够在所述烧成温度烧成多次。
玻璃粉末(a)是成为烧成而获得的牙科补缀装置的基材的玻璃成分,通过烧成来熔融而与核材料融合并结合。本发明中,优选不包含除了玻璃粉末(a)以外的玻璃粉末。
玻璃粉末的平均粒径为1μm~20μm。优选为2μm~10μm。最优选为3μm~9μm。如果平均粒径小,则有时在膏化时玻璃粒子彼此凝集,使涂布性变化。如果平均粒径大,则在膏化时玻璃粉末容易沉降。
玻璃粉末的最大粒径为100μm以下。优选为90μm以下。最优选为80 μm以下。如果包含大于100μm的粒子,则操作性差,并且在膏化时玻璃粉末容易沉降。
玻璃粉末(a)的软化点(Ts)优选为500℃~650℃。通过使用软化点 (Ts)为500℃~650℃的玻璃粉末,能够进行在650℃~850℃的烧成,能够适用于由二硅酸锂系玻璃陶瓷制作的核材料中,该二硅酸锂系玻璃陶瓷当在高于850℃的温度烧成时有可能变形。
关于玻璃粉末的配合量,能够以获得所期望的膏的性状的方式适当配合,以50.0wt%~80.0wt%的范围配合,优选以65.0wt%~75.0wt%的范围配合。如果玻璃粉末的配合量过少,则不能实现作为本发明特征的均匀涂布性,具有也难以保持膏性状的趋势。另外,如果玻璃粉末的配合量过多,则具有难以膏化的趋势。
本发明所使用的玻璃粉末(a),只要能够用作牙科用陶材就没有特别的限定,也可以包含结晶。只要软化点小于650℃且能够在650℃~850℃的温度烧成就优选。关于玻璃粉末,例如,可以举出以SiO2为主成分(含量最多的成分)的玻璃或晶化玻璃。这样的玻璃,除了SiO2以外,还可以包含 Al2O3、B2O3、ZnO、K2O、Na2O、Li2O、ZrO2、CaO、MgO等。具体而言,可以举出非晶型铝硅酸钾玻璃、非晶型硼硅酸钾玻璃、结晶型铝硅酸钾玻璃、结晶型氟磷灰石玻璃、结晶型硅酸锂玻璃等。
可以利用如下所示的硅烷偶联材料来处理一部分或全部的玻璃粉末 (a)。
疏水性微粒二氧化硅(b)的平均一次粒径为1nm~50nm,优选为5nm~ 45nm,更优选为7nm~40nm。如果疏水性微粒二氧化硅的平均一次粒径大于50nm,则会产生难以保持膏性状和提高涂布性的问题。关于平均一次粒径小于1nm的疏水性微粒二氧化硅,由于微粒二氧化硅自身制作困难且不普遍,因此不能使用。疏水化微粒二氧化硅,通过表面处理来疏水化。
疏水化微粒二氧化硅能够根据所期望的膏性状来适当配合,配合量为 0.5wt%~10wt%的范围,优选为2.0wt%~5.0wt%的范围。如果疏水化微粒二氧化硅的配合量过少,则有时难以保持膏性状和提高涂布性。另外,如果疏水化微粒二氧化硅的配合量过多,则有时在烧成后产生源自疏水化微粒二氧化硅的白浊。
疏水化微粒二氧化硅(b),通过由表面处理材料的表面处理来疏水化。作为表面处理材料,可以举出硅烷偶联材料等。作为硅烷偶联材料,没有特别的限定,可以举出甲基三甲氧基硅烷、二甲基二甲氧基硅烷、苯基三甲氧基硅烷、二苯基二甲氧基硅烷、甲基三乙氧基硅烷、二甲基二乙氧基硅烷、苯基三乙氧基硅烷、二苯基二乙氧基硅烷、异丁基三甲氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三(2-甲氧基乙氧基)硅烷、3,3,3- 三氟丙基三甲氧基硅烷、甲基-3,3,3-三氟丙基二甲氧基硅烷、2-(3,4-环氧环己基)乙基三甲氧基硅烷、六甲基二硅氮烷、3-缩水甘油醚氧丙基三甲氧基硅烷、3-缩水甘油醚氧丙基甲基二乙氧基硅烷、3-缩水甘油醚氧丙基三乙氧基硅烷、3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、聚二甲基硅氧烷、3-甲基丙烯酰氧基丙基甲基二乙氧基硅烷、N-2(氨基乙基)3-氨基丙基甲基二甲氧基硅烷、N-2(氨基乙基)3-氨基丙基三甲氧基硅烷、N-2(氨基乙基)3-氨基丙基三乙氧基硅烷、3-氨基丙基三甲氧基硅烷、3-氨基丙基三乙氧基硅烷、N-苯基 -3-氨基丙基三甲氧基硅烷、3-巯基丙基三甲氧基硅烷、三甲基硅烷醇、甲基三氯硅烷、甲基二氯硅烷、二甲基二氯硅烷、三甲基氯硅烷、苯基三氯硅烷、二苯基二氯硅烷、乙烯基三氯硅烷、三甲基溴硅烷、二乙基硅烷、乙烯基三乙酰氧基硅烷、ω-(甲基)丙烯酰氧基烷基三甲氧基硅烷((甲基)丙烯酰氧基与硅原子之间的碳原子数:3~12,例如3-甲基丙烯酰氧基丙基三甲氧基硅烷等)、ω-(甲基)丙烯酰氧基烷基三乙氧基硅烷((甲基)丙烯酰氧基与硅原子之间的碳原子数:3~12,例如3-甲基丙烯酰氧基丙基三乙氧基硅烷等) 等。
作为表面处理方法,可以举出使所述硅烷偶联材料与疏水化微粒二氧化硅接触的方法等。具体而言,可以举出将疏水化微粒二氧化硅投入已加热的反应器中并以每1kg的二氧化硅中硅烷偶联材料为0.01kg~0.5kg的比率通过氮等非活性气体来向反应器中并流送气的方法等。
本发明中,只要是不影响本发明的效果的程度,就可以包含除了疏水化微粒二氧化硅以外的二氧化硅,例如可以包含亲水性二氧化硅。具体而言,本发明中,除了疏水化微粒二氧化硅以外的二氧化硅的比例,优选为二氧化硅总量的50wt%以上且100wt%以下,更优选为60wt%以上且100wt%以下,进一步优选为70wt%以上且100wt%以下,更进一步优选为80wt%以上且100wt%以下,最优选为90wt%以上且100wt%以下。此外,本发明中,优选不包含除了疏水化微粒二氧化硅以外的二氧化硅。
本发明的必须成分的有机溶剂(c)使用沸点为100℃~300℃的溶剂。如果有机溶剂的沸点过低,则在涂布时挥发而操作性会变差。如果有机溶剂的沸点过高,则在烧成时燃烧剩余而成为碳化和气泡的原因。
本发明中,能够通过将有机溶剂的配合量包含10.0wt%~49.5wt%的范围来膏化,能够作为牙科用陶材膏进行操作。配合量更优选为25.0wt%~ 35.0wt%的范围。如果有机溶剂的配合量过少,则难以膏化。如果有机溶剂的配合量过多,则因经年劣化而容易产生与玻璃粉末的分离,成为在烧成后发生源自有机成分的碳化和气泡的原因。
作为本发明所使用的具体的有机溶剂(c),例如,可以举出邻苯二甲酸二甲酯、邻苯二甲酸二乙酯等酯系溶剂;1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、甘油、二乙二醇、三乙二醇、聚乙二醇(分子量200~400)、丙二醇、二丙二醇等多元醇系溶剂;乙二醇单甲醚、乙二醇单乙醚、丙二醇单甲醚、丙二醇单乙醚、乙二醇单丁醚、二乙二醇单甲醚、二乙二醇单乙醚、丙二醇单丙醚、三丙二醇单甲醚、二乙二醇单丁醚、三乙二醇单甲醚等多元醇单醚系溶剂;2-苯氧基乙醇、苄基醇等芳香族醇溶剂等。这些有机溶剂中,优选为多元醇系溶剂、多元醇单醚系溶剂、芳香族醇溶剂,更优选为1,3-丁二醇(沸点:约204℃)、丙二醇(沸点:约189℃)、2-苯氧基乙醇(沸点:约240℃)。这些有机溶剂(c),可以单独使用一种或适当组合两种以上使用。在组合使用两种以上的有机溶剂的情况下,其沸点使用将使用的各有机溶剂的沸点乘以添加比例的总数值。
本发明的牙科用陶材膏,可以包含着色材料(d)和/或荧光材料(e)。
着色材料(d)为无机材料,可以使用通常用于牙科材料的物质。具体而言,可以举出通过混合并烧成多种SiO2、Al2O3、CaO、TiO2、SnO、Cr2O3、 MnO、Sb2O3、V2O5、ZnO、Fe2O3、W2O3、Co2O3、ZrO2等金属氧化物来制作的着色材料。其配合量优选为0.05wt%~40wt%的范围,更优选为 0.10wt%~35wt%的范围,最优选为0.30wt%~30%的范围。
荧光材料(e)为无机材料,可以使用通常用于牙科材料的物质。具体而言,可以举出通过混合并烧成多种SiO2、Al2O3、CaO、MgO、SrO、BaO、Eu2O3、Y2O3、CeO2、P2O5、SnO、Cr2O3、MnO、V2O5、ZnO、ZrO2等金属氧化物来制作的着色材料。其配合量优选为0.1wt%~5.0wt%的范围,更优选为0.3wt%~4.5wt%的范围,最优选为0.5wt%~4.0wt%的范围。其特征在于,着色材料(d)和/或荧光材料(e)为无机材料。
本发明的牙科用陶材膏的制作,可以通过本技术领域的技术人员所拥有的通常的膏组合物的制造方法来实施而不受限制。作为通常的制造方法,是以获得目的膏组合物的方式配合玻璃粉末、疏水化微粒二氧化硅、有机溶剂、着色材料和荧光材料并利用搅拌脱泡装置混合而获得膏的方法。
[实施例]
以下,参照实施例和比较例进一步对本发明进行具体说明,但本发明完全不限定于这些实施例和比较例。
以下示出实施例和比较例中的玻璃粉末的粒径和软化点、疏水化微粒二氧化硅的一次粒径、膏组合物的流动值、涂布性、确认气泡和碳化、确认膏分离的评价方法。
(玻璃粉末的平均粒径的测定方法)
玻璃粉末的平均粒径,可以通过使用激光衍射散射法、动态光散射法、离心沉降法、电敏感区法等的测定来求出。实施例和比较例的玻璃粉末的粒径由激光衍射散射法进行测定。具体而言,通过激光衍射式粒度分布测定装置Microtrack MT-3000II(マイクロトラックMT-3000II)(MicrotracBEL(マイクロトラックベル)制)进行测定。
(玻璃粉末的最大粒径的测定方法)
玻璃粉末的最大粒径,可以通过使用激光衍射散射法、动态光散射法、离心沉降法、电敏感区法等的测定来求出。实施例和比较例的玻璃粉末的粒径由激光衍射散射法进行测定。具体而言,通过激光衍射式粒度分布测定装置Microtrack MT-3000II(マイクロトラックMT-3000II)(MicrotracBEL(マイクロトラックベル)制)进行测定。
(疏水化微粒二氧化硅的一次粒径的测定方法)
疏水化微粒二氧化硅的一次粒径,可以从使用气体吸附法、压汞法、气体渗透法、泡点法等的测定而获得的比表面积来算出。实施例和比较例的疏水化微粒二氧化硅的一次粒径,由气体吸附法进行测定。具体而言,通过自动比表面积、细孔分布测定装置TriStarII 3020(トライスターII 3020)(岛津制作所制)来进行测定。
(软化点的测定方法)
玻璃粉末的软化点(Ts),可以由热膨胀法进行测定。实施例和比较例的玻璃粉末的软化点,具体而言,通过热膨胀计TM8140C(日本理学株式会社(リガク)制)来进行测定。在测定中,利用蒸馏水捏合玻璃粉末,将捏合物填充于硅制的棒状(6×6×25mm)模具,反复压缩和吸水,制作成型体。从硅模具中取出所制作的成型体,使用牙科技工用陶瓷烧成炉Esthemat Slim(エステマットスリム)(日本松风公司制),进行真空烧成一次、大气烧成一次、共计两次。将获得的二次烧成物的两端研磨并露出平行面,将调整为5×5×20mm的尺寸的试样作为试验体进行测定。
(膏的制作)
将表1和表2所记载的玻璃粉末、疏水化微粒二氧化硅、有机溶剂以成为膏组成的方式利用搅拌脱泡装置混合而制造实施例1~12和比较例1~11 的膏(记作wt%)。
(流动值的评价)
将实施例和比较例的各膏在23℃的恒温室放置1小时。放置之后,在玻璃板上以0.3±0.03g的范围量取膏,从上方盖上另一玻璃板并放置20g的砝码。从放置砝码开始30秒之后取下砝码,测定扩展成圆状的膏的直径的最长直径和最短直径,将这些平均长度记作流动值。
小于3mm:能够构筑,可能难以涂布。
3mm~20mm:能够涂布且也能够构筑。
大于20mm:能够涂布,但不能进行0.1mm厚度以上的构筑。
直到20mm的流动值的能够在临床上使用。
(试验体的制作)
在氧化锆制的板(10.0×10.0×2.0mm)的10.0×10.0mm的面上,利用毛笔以0.1mm的厚度整面涂布实施例和比较例的各膏,使用牙科技工用陶瓷烧成炉Esthemat Slim(エステマットスリム)(日本松风公司制),在表1 所记载的温度和时间进行真空烧成,将烧成物作为试验体。
(涂布性的评价)
如上所述地,在制作试验体时,评价涂布性。以下示出评价基准。
○:能够制作出均匀的玻璃层。
×:不均匀且部分露出氧化锆面。
(气泡、碳化的确认)
将实施例和比较例的各膏,在氧化锆制的板(10.0×10.0×2.0mm)涂布 1.0mm的厚度,使用牙科技工用陶瓷烧成炉Esthemat Slim(エステマットスリム)(日本松风公司制),进行真空烧成,将烧成物作为试验体。通过肉眼评价所制作的试验体。
○:是具有透明性的玻璃层状态。
×:产生因产生气泡而引起的白浊、因碳化而引起的变黑。
(膏分离的确认)
将3g实施例和比较例的各膏,量取到5mL的玻璃瓶中并盖上盖子,投入到设定为50℃的恒温器,静置7天之后,将装在从恒温器取出的玻璃瓶的膏作为试验体。此试验体通过肉眼来评价保存稳定性。
○:从混合后的状态几乎没有变化。
×:有机溶剂浮出表面或者玻璃粉末沉降在底部等液体与粉末分离。
<实施例1~22、比较例1~16>
实施例、比较例所使用的各组成:
玻璃粉末由SiO2、Al2O3、K2O和其他成分构成,使用软化点(Ts)为 575℃的钾铝硅酸盐玻璃,利用通常的粉碎机进行粉碎,制作平均粒径为0.5 μm、1μm、5μm、20μm、26μm的玻璃粉末并使用。
关于疏水化微粒二氧化硅和亲水性微粒二氧化硅,使用RX50、R974、 R812、#50、#200、#300(日本Aerosil社(日本アエロジル社)制)、YA050C、 YA100C(株式会社Admatechs社(株式会社アドマッテクス社)制)。
关于有机溶剂,使用乙醇(bp=89℃)、丙二醇(bp=188.2℃)、1,3-丁二醇(bp=204℃)、苯甲酸苄酯(bp=324℃)。
[表1]
[表2]
[表3]
在全部的实施例中,显示出优异的涂布性,另外在烧成之后也透明,显示出优异的保存稳定性。
另一方面,在比较例1~6、9~10、13~14、16中,烧成后的表面为不均匀的面,因此不能获得优异的涂布性。在比较例7、11中,能够确认到在烧成后因碳化而引起的变黑或因气泡而引起的白浊,因此不能获得烧成后的透明性。另外,在比较例2~6、10、13、15~16中,通过保存稳定性试验来在膏中产生分离,因此不能获得优异的保存稳定性。关于比较例8、12,不能制作均匀的膏。
由以上结果可知,本发明的牙科用陶材膏显示出优异的涂布性,在烧成后也透明,满足因经年劣化而引起的膏的保存稳定性的良好的结果。认为这是因为,含有通过表面处理来疏水化的疏水化微粒二氧化硅且将控制粒径的玻璃粉末与适当的有机溶剂组合而膏化。
因此,本发明的牙科用陶材膏显著改善以往的膏组合物的涂布性、透明性、能够长期保持膏性状的保存稳定性。
本说明书中,在发明的构成要素为单数或复数的任意一种来进行说明的情况下,或者在未限定为单数或复数来进行说明的情况下,除了从上下文能理解的情况以外,该构成要素既可以为单数或复数的任一种。
虽然参照详细的实施方式说明本发明,但只要是本技术领域的技术人员,就应该理解为基于本说明书中公开事项能够进行各种变更或修正。因此,本发明的实施方式的范围意图包含任意变更或修正。
工业实用性
由本发明提供的牙科用陶材膏能够长期保持膏状态,具有优异的涂布性,在烧成时几乎不发生因有机成分或高分子成分的影响而引起的碳化和气泡,在牙科领域的修复治疗中,能够应用于多种牙冠修复物。
Claims (2)
1.一种牙科用陶材膏,所述牙科用陶材膏用于制作牙科补缀装置,其特征在于,所述牙科用陶材膏包含:
50.0wt%~80.0wt%的最大粒径为100μm以下且平均粒径为1μm~20μm的玻璃粉末(a);
0.5wt%~10.0wt%的平均一次粒径为1nm~50nm的疏水化微粒二氧化硅(b);以及
10.0wt%~49.5wt%的沸点bp为100℃~300℃的有机溶剂(c)。
2.根据权利要求1所述的牙科用陶材膏,其特征在于,
所述牙科用陶材膏进一步包含着色材料(d)和/或荧光材料(e)。
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