CN111370557A - 一种多层共挤制备光学基片的方法以及一种光学基片 - Google Patents
一种多层共挤制备光学基片的方法以及一种光学基片 Download PDFInfo
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- CN111370557A CN111370557A CN202010190871.XA CN202010190871A CN111370557A CN 111370557 A CN111370557 A CN 111370557A CN 202010190871 A CN202010190871 A CN 202010190871A CN 111370557 A CN111370557 A CN 111370557A
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- 239000010410 layer Substances 0.000 claims abstract description 79
- 239000011241 protective layer Substances 0.000 claims abstract description 39
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 37
- 238000001125 extrusion Methods 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims description 30
- 239000002096 quantum dot Substances 0.000 claims description 29
- 239000013081 microcrystal Substances 0.000 claims description 15
- -1 polyethylene, ethylene Polymers 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 10
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- 239000012792 core layer Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
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- 239000002356 single layer Substances 0.000 claims description 5
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- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
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- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 3
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- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
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CN202010190871.XA CN111370557B (zh) | 2020-03-18 | 2020-03-18 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
PCT/CN2021/078080 WO2021185050A1 (zh) | 2020-03-18 | 2021-02-26 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
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CN202010190871.XA CN111370557B (zh) | 2020-03-18 | 2020-03-18 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
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CN111370557A true CN111370557A (zh) | 2020-07-03 |
CN111370557B CN111370557B (zh) | 2021-02-23 |
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CN (1) | CN111370557B (zh) |
WO (1) | WO2021185050A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021185050A1 (zh) * | 2020-03-18 | 2021-09-23 | 马鞍山微晶光电材料有限公司 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
Citations (11)
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CN1331269A (zh) * | 2000-06-24 | 2002-01-16 | 大连路明科技集团有限公司 | 发光板及其制造方法 |
CN1524190A (zh) * | 2001-06-11 | 2004-08-25 | 3M | 偏振分束器 |
WO2015168174A1 (en) * | 2014-04-28 | 2015-11-05 | Madico, Inc. | Protective sheet for a photovoltaic module |
US20160096307A1 (en) * | 2014-10-06 | 2016-04-07 | Reifenhaeuser Gmbh & Co. Kg Maschinenfabrik | Coextrusion apparatus, single-layer extrusion apparatus and retrofit kit as well as a method for measuring a layer thickness, for producing a plastic film, and for retrofitting an extrusion apparatus |
CN106154364A (zh) * | 2015-04-07 | 2016-11-23 | 宁波长阳科技股份有限公司 | 一种背光模组用量子点广色域聚酯膜、增亮膜及扩散膜 |
CN106461817A (zh) * | 2014-06-18 | 2017-02-22 | 3M创新有限公司 | 光学膜 |
TW201922500A (zh) * | 2017-10-16 | 2019-06-16 | 日商Ns材料股份有限公司 | 含量子點之樹脂片或膜、及其製造方法、及波長轉換構件 |
CN110311055A (zh) * | 2019-07-26 | 2019-10-08 | 马鞍山微晶光电材料有限公司 | 一种复合发光基片及其制备方法和应用 |
CN110621502A (zh) * | 2017-05-08 | 2019-12-27 | 美国杜邦泰津胶片合伙人有限公司 | 适用于在多层卡中使用的多层膜组件 |
CN209963091U (zh) * | 2019-07-26 | 2020-01-17 | 马鞍山微晶光电材料有限公司 | 一种复合发光基片 |
CN110699083A (zh) * | 2018-12-14 | 2020-01-17 | 马鞍山微晶光电材料有限公司 | 一种水相量子点微晶的制备方法 |
Family Cites Families (8)
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KR101253586B1 (ko) * | 2010-08-25 | 2013-04-11 | 삼성전자주식회사 | 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 |
WO2013005791A1 (ja) * | 2011-07-05 | 2013-01-10 | デクセリアルズ株式会社 | 蛍光体シート形成用樹脂組成物 |
CN107431111A (zh) * | 2014-12-26 | 2017-12-01 | Ns材料株式会社 | 波长转换构件及其制造方法 |
WO2017010076A1 (ja) * | 2015-07-10 | 2017-01-19 | デクセリアルズ株式会社 | 蛍光体シート、該蛍光体シートを備える白色光源装置、並びに、該白色光源装置を備える表示装置 |
JP2017136737A (ja) * | 2016-02-03 | 2017-08-10 | 凸版印刷株式会社 | 蛍光体用保護フィルム、及びそれを用いた波長変換シート |
CN106229401A (zh) * | 2016-08-24 | 2016-12-14 | 电子科技大学 | 荧光led封装阵列 |
CN109796975A (zh) * | 2019-03-25 | 2019-05-24 | 深圳扑浪创新科技有限公司 | 一种二氧化硅和氧化铝两层包覆量子点及其制备方法及量子点薄膜的制备方法 |
CN111370557B (zh) * | 2020-03-18 | 2021-02-23 | 马鞍山微晶光电材料有限公司 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
-
2020
- 2020-03-18 CN CN202010190871.XA patent/CN111370557B/zh active Active
-
2021
- 2021-02-26 WO PCT/CN2021/078080 patent/WO2021185050A1/zh active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1331269A (zh) * | 2000-06-24 | 2002-01-16 | 大连路明科技集团有限公司 | 发光板及其制造方法 |
CN1524190A (zh) * | 2001-06-11 | 2004-08-25 | 3M | 偏振分束器 |
WO2015168174A1 (en) * | 2014-04-28 | 2015-11-05 | Madico, Inc. | Protective sheet for a photovoltaic module |
CN106461817A (zh) * | 2014-06-18 | 2017-02-22 | 3M创新有限公司 | 光学膜 |
US20160096307A1 (en) * | 2014-10-06 | 2016-04-07 | Reifenhaeuser Gmbh & Co. Kg Maschinenfabrik | Coextrusion apparatus, single-layer extrusion apparatus and retrofit kit as well as a method for measuring a layer thickness, for producing a plastic film, and for retrofitting an extrusion apparatus |
CN106154364A (zh) * | 2015-04-07 | 2016-11-23 | 宁波长阳科技股份有限公司 | 一种背光模组用量子点广色域聚酯膜、增亮膜及扩散膜 |
CN110621502A (zh) * | 2017-05-08 | 2019-12-27 | 美国杜邦泰津胶片合伙人有限公司 | 适用于在多层卡中使用的多层膜组件 |
TW201922500A (zh) * | 2017-10-16 | 2019-06-16 | 日商Ns材料股份有限公司 | 含量子點之樹脂片或膜、及其製造方法、及波長轉換構件 |
CN110699083A (zh) * | 2018-12-14 | 2020-01-17 | 马鞍山微晶光电材料有限公司 | 一种水相量子点微晶的制备方法 |
CN110311055A (zh) * | 2019-07-26 | 2019-10-08 | 马鞍山微晶光电材料有限公司 | 一种复合发光基片及其制备方法和应用 |
CN209963091U (zh) * | 2019-07-26 | 2020-01-17 | 马鞍山微晶光电材料有限公司 | 一种复合发光基片 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021185050A1 (zh) * | 2020-03-18 | 2021-09-23 | 马鞍山微晶光电材料有限公司 | 一种多层共挤制备光学基片的方法以及一种光学基片 |
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WO2021185050A1 (zh) | 2021-09-23 |
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