WO2021185050A1 - 一种多层共挤制备光学基片的方法以及一种光学基片 - Google Patents

一种多层共挤制备光学基片的方法以及一种光学基片 Download PDF

Info

Publication number
WO2021185050A1
WO2021185050A1 PCT/CN2021/078080 CN2021078080W WO2021185050A1 WO 2021185050 A1 WO2021185050 A1 WO 2021185050A1 CN 2021078080 W CN2021078080 W CN 2021078080W WO 2021185050 A1 WO2021185050 A1 WO 2021185050A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
light
layers
optical substrate
emitting
Prior art date
Application number
PCT/CN2021/078080
Other languages
English (en)
French (fr)
Inventor
王建伟
齐航
Original Assignee
马鞍山微晶光电材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 马鞍山微晶光电材料有限公司 filed Critical 马鞍山微晶光电材料有限公司
Publication of WO2021185050A1 publication Critical patent/WO2021185050A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the invention belongs to the technical field of optical materials, and in particular relates to a method for preparing an optical substrate by multi-layer co-extrusion and an optical substrate.
  • Optical signal processing and transmission technology has applications in various fields. The most widely used is in LED display screens. With the development of electronic technology, LED display screens have been fully popularized, and the most important basic component is the optical substrate.
  • quantum dot film is the most mature and widely used optical substrate, and most of the quantum dot TVs and display devices on the market use quantum dot film.
  • the quantum dot film adopts a "sandwich" structure, and the upper and lower surfaces of the quantum dot layer are covered with water and oxygen barrier films. Due to the extremely high activity of quantum dot materials, it is easy to react with water vapor and oxygen in the air and cause significant performance degradation.
  • the traditional quantum dot film sandwiches the quantum dots after being glued. Although the upper and lower water and oxygen barrier layers are covered, the quantum dot interlayer is easy to be exposed.
  • the quantum dot film used in this field requires edge sealing to prevent oxidation. The edge sealing process is very complicated and difficult to operate. The preparation of quantum dot film The cost is also higher.
  • quantum dot diffusion plates include a plate body and a water and oxygen barrier layer coated on the outer surface of the plate.
  • the quantum dots and the light diffuser are uniformly dispersed in the plate body.
  • the preparation method of this kind of optical substrate is complicated, the steps are many, it cannot be formed at one time, and it is difficult to mass produce.
  • the object of the present invention is to provide a method for preparing an optical substrate by multi-layer co-extrusion and an optical substrate.
  • the invention utilizes multi-layer co-extrusion to prepare the optical substrate, can realize one-time molding, has simple process, mass production, low production cost, and the obtained optical substrate has a compact structure and excellent performance.
  • a method for preparing an optical substrate by multi-layer co-extrusion includes the following steps:
  • the optical substrate has a sandwich structure, the core layer of the sandwich structure is a light-emitting layer, and both sides of the core layer are protective layers;
  • the protective layer material is a thermoplastic resin; the light-emitting layer material is obtained by mixing a thermoplastic resin and a light-emitting material, and the light-emitting material is bonded to the surface of the thermoplastic resin.
  • the number of the light-emitting layer is greater than or equal to 1 layer.
  • the number of the light-emitting layer is 1 to 5 layers.
  • the number of layers of the protective layer on one side of the core layer is 2 to 5 layers.
  • the single-layer thickness of the light-emitting layer is 0.05-0.5 mm; the single-layer thickness of the protective layer is 0.01-0.15 mm.
  • the preparation method of the light-emitting layer material includes the following steps: coating an adhesive on the surface of the thermoplastic resin, then wrapping the light-emitting material, and curing the light-emitting layer material to obtain the light-emitting layer material.
  • the luminescent material includes water phase quantum dot microcrystals, water phase quantum dot modified microcrystals, perovskite luminescent materials, silicate phosphors, aluminate phosphors, aluminosilicate phosphors, nitrogen One or more of chemical phosphor, tungstate phosphor, molybdate phosphor, sulfide phosphor, fluoride phosphor, phosphate phosphor and rare earth oxide phosphor.
  • the particle size of the luminescent material is 300 meshes or more.
  • the thermoplastic resin includes one or more of polyethylene, ethylene and vinyl alcohol copolymer, polyamide, polypropylene, polyvinyl chloride, polyoxymethylene and polycarbonate.
  • the thermoplastic resin is a mixture of polyethylene and a copolymer of ethylene and vinyl alcohol, and the mass ratio of the polyethylene to the copolymer of ethylene and vinyl alcohol is 2:1.
  • the temperature of the multi-layer co-extrusion molding is 145-200°C, and the extrusion speed is 0.1-2 m/min.
  • the present invention also provides an optical substrate prepared by the method described in the above solution.
  • the total number of light-emitting layers and protective layers in the optical substrate is 7 layers, wherein the middle layer is the light-emitting layer, and both sides of the light-emitting layer are 3 protective layers.
  • the thickness of the light-emitting layer is 0.2 mm, and the thickness of the single layer of the protective layer is 0.07 mm.
  • the total number of light-emitting layers and protective layers in the optical substrate is 9 layers, of which the middle 3 layers are light-emitting layers, and each side of the light-emitting layer is 3 protective layers.
  • the total thickness of the three light-emitting layers is 0.3 mm, and the thickness of the single protective layer is 0.1 mm.
  • the total number of light-emitting layers and protective layers in the optical substrate is 11 layers, wherein the middle 3 layers are light-emitting layers, and each side of the light-emitting layer is 4 protective layers.
  • the total thickness of the three light-emitting layers is 0.4 mm, and the thickness of the single protective layer is 0.1 mm.
  • the present invention also provides the application of the optical substrate of the above solution in an LED display screen, and the optical substrate emits light under the excitation of LED blue light or ultraviolet light.
  • the present invention provides a method for preparing an optical substrate by multi-layer co-extrusion, which includes the following steps: multi-layer co-extrusion molding of a light-emitting layer material and a protective layer material to obtain an optical substrate.
  • the present invention uses multi-layer co-extrusion technology to prepare optical substrates, which can realize one-time molding, has simple process steps, can be mass-produced, and has low production cost; further, the present invention can adjust the color according to the required light-emitting properties, which can be convenient There is no need to add other steps when multiple light-emitting layers are arranged; the optical substrate prepared by the present invention has a compact structure and good light-emitting performance, and the present invention uses thermoplastic resin as the material of the light-emitting layer and protective layer, and the obtained optical substrate has stable performance.
  • the present invention provides a method for preparing an optical substrate by multi-layer co-extrusion, which includes the following steps:
  • the light-emitting layer material and the protective layer material are subjected to multi-layer co-extrusion molding to obtain an optical substrate;
  • the optical substrate has a sandwich structure, the core layer of the sandwich structure is a light-emitting layer, and both sides of the core layer are protective layers.
  • the number of light-emitting layers in the optical substrate is ⁇ 1 layer, more preferably 1 to 5 layers, further preferably 1, 2 or 3 layers, and the thickness of the single-layer light-emitting layer is preferably 0.05 to 0.5 mm, more preferably 0.1 to 0.3 mm;
  • the number of protective layers on one side of the core layer is preferably 2 to 5 layers, more preferably 3 to 4 layers, and the number of protective layers on both sides of the core layer Preferably, the same.
  • the total number of light-emitting layers and protective layers of the optical substrate is 7 layers in total, one light-emitting layer in the middle constitutes the core layer, and each side of the light-emitting layer has 3 protective layers.
  • the middle 3 light-emitting layers constitute the core layer, and each side of the core layer is 3 protective layers.
  • the middle 3 light-emitting layers constitute the core layer, and each side of the core layer is 4 protective layers.
  • the thickness of the single layer of the protective layer is preferably 0.01 to 0.15 mm, more preferably 0.05 to 0.1 mm; in the present invention, multiple protective layers are provided on both sides of the light-emitting layer to prevent water, vapor, and moisture. Anti-scratch effect and maintain its light transmittance, which is conducive to cutting, packaging, transportation, storage and installation.
  • the protective layer material is a thermoplastic resin;
  • the thermoplastic resin includes polyethylene (PE), ethylene and vinyl alcohol copolymer (EOVH), polyamide (PA), polypropylene (PP), polyvinyl chloride One or more of (PVC), polyoxymethylene (POM) and polycarbonate (PC); in the present invention, when the protective layer includes multiple layers, the type of thermoplastic resin selected for each protective layer can be the same or Different, no special requirements.
  • the light-emitting layer material is obtained by mixing a thermoplastic resin and a light-emitting material, and the light-emitting material is bonded to the surface of the thermoplastic resin; the optional types of the thermoplastic resin are the same as the above-mentioned solutions, and will not be repeated here;
  • the thermoplastic resin used in the luminescent material is preferably obtained by mixing polyethylene with a copolymer of ethylene and vinyl alcohol at a mass ratio of 2:1;
  • the luminescent material preferably includes water phase quantum dot microcrystals, Aqueous quantum dot modified microcrystals, perovskite phosphors, silicate phosphors, aluminate phosphors, aluminosilicate phosphors, nitride phosphors, tungstate phosphors, molybdate phosphors
  • sulfide phosphor fluoride phosphor, phosphate phosphor and rare
  • traditional optical substrates generally use oil phase quantum dots as luminescent materials.
  • the oil phase quantum dots have severe thermal attenuation when the temperature exceeds 120°C. Multi-layer co-extrusion requires a higher temperature.
  • the traditional oil phase quantum dots The dots cannot meet the requirements, and the above-mentioned types of luminescent materials selected in the present invention have good high temperature resistance, especially the water-phase quantum dot crystallites can withstand temperature up to 200°C, thereby ensuring that subsequent co-extrusion molding can be achieved.
  • the particle size of the luminescent material is preferably 300 mesh or more, more preferably 300-2000 mesh.
  • the luminescent material it is preferable to select the luminescent material and the number of layers of the luminescent layer according to the required luminescent properties.
  • the luminescent materials of different wavelengths can be combined in different luminescent layers, or multiple luminescent layers can be combined in the same luminescent layer.
  • the luminescent material can be selected according to actual needs.
  • the preparation method of the light-emitting layer material preferably includes the following steps: coating an adhesive on the surface of the thermoplastic resin, then wrapping the light-emitting material, and curing the light-emitting layer material to obtain the light-emitting layer material.
  • the present invention does not have a fixed requirement on the quality ratio of the luminescent material and the thermoplastic resin, and the content of the luminescent material is designed according to the product use; the present invention has no special requirements on the adhesive, and only a thermoplastic adhesive well known to those skilled in the art can be used; The present invention does not make special requirements for the amount of the adhesive. In the specific embodiment of the present invention, a small amount of adhesive is used to bond the luminescent material.
  • the curing temperature is preferably 70-90°C, more preferably 75-85°C; after curing, the luminescent material can be firmly wrapped on the surface of the thermoplastic resin to complete the bonding of the thermoplastic resin and the luminescent material.
  • the temperature of the multi-layer co-extrusion molding is preferably 145 to 200°C, and the extrusion speed is preferably 0.1 to 2 m/min, more preferably 0.5 to 1.5 m/min.
  • the present invention preferably uses multiple single-screw extruders for co-extrusion molding, and the number of single-screw extruders used can be determined according to the total number of layers of the optical substrate, for example: when the total number of layers of the optical substrate In the case of 7 layers, 7 single-screw extruders are used to simultaneously extrude the materials of each layer through the die, and the optical substrate can be obtained after die-cutting after being pulled out by the rolling wheel to cool and shape.
  • the screw diameter of the single-screw extruder is preferably 75mm, and the screw speed of the single-screw extruder is preferably determined according to the extrusion speed.
  • the screw speed Stepless speed regulation can be carried out as required.
  • the solution of the present invention utilizes a mixture of luminescent materials and thermoplastic resins, and then prepares optical substrates through multi-layer co-extrusion.
  • the thermoplastic resin has stable performance, unique water and gas barrier properties and chemical stability, and can firmly fix the luminescent materials.
  • the luminescent material has a good protective effect and prevents it from being oxidized; and the method of the present invention does not require the edge sealing process in the traditional quantum dot film, the steps are simple, and the cost is lower.
  • the present invention also provides an optical substrate prepared by the method described in the above solution.
  • the optical substrate provided by the present invention has a compact structure and good light-emitting performance, and the present invention uses thermoplastic resin as the basic material of the light-emitting layer and protective layer.
  • the obtained optical substrate has stable performance and the light-emitting material is not easily oxidized;
  • the substrate can also adjust the color and number of the light-emitting layer according to the required light-emitting properties to meet different light-emitting requirements.
  • the optical substrate can emit light under the excitation of LED blue light or ultraviolet light.
  • the optical substrate prepared in this embodiment includes three protective layers above and below the light-emitting layer.
  • the protective layer materials are as follows: the inner layer is EVOH (ethylene and vinyl alcohol copolymer), and the second layer is PA (polyamide). ), the outer layer is PP (polypropylene); the material of the protective layer on the other side is the same.
  • the light-emitting layer material is obtained by bonding the thermoplastic resin (polyethylene, ethylene and vinyl alcohol copolymer at a mass ratio of 2:1) and the water-phase quantum dot microcrystals of the light-emitting material.
  • the quality of the water-phase quantum dot microcrystals in the light-emitting layer material The percentage content is 13%; the preparation method of the luminescent layer material is: coating a thermosetting adhesive on the thermoplastic resin particles, then wrapping the luminescent material, and drying and curing at 70°C.
  • the optical substrate includes a total of 7 layers.
  • the middle layer is the light-emitting layer.
  • the heating temperature is 145°C.
  • a single screw extruder with a screw diameter of 75 mm is used.
  • the screw speed is 27 revolutions per minute; the upper and lower layers are protected by 3 layers.
  • heating temperature is 165°C, using 6 single-screw extruders with a screw diameter of 75 mm, and the screw speed is 27 rpm; simultaneously extruded through 7 extruders, passed through a co-extrusion die, and then rolled After being pulled out, cooled and shaped, and the mold is slit to obtain an optical substrate, the thickness of the light-emitting layer is 0.2mm, the protective layer on both sides is 3 layers, each layer is 0.07mm thick, and the total thickness of the optical substrate is 0.62mm.
  • the optical substrate prepared in this embodiment includes three protective layers above and below the light-emitting layer.
  • the materials of the protective layer are as follows: the inner layer is EVOH (ethylene and vinyl alcohol copolymer), and the second layer is PA (poly Amide), the outer layer is (PC) polycarbonate; the material of the protective layer on the other side is the same.
  • the optical substrate prepared in this embodiment includes three light-emitting layers.
  • the material of the light-emitting layer is obtained by bonding a thermoplastic resin (polyethylene, ethylene and vinyl alcohol copolymer at a mass ratio of 2:1) and a light-emitting material, water-phase quantum dot microcrystals.
  • the mass percentage of water-phase quantum dot crystallites in the light-emitting layer material is 8%, and the 3 layers of light-emitting layers use the same light-emitting materials (the advantage of the 3 layers is that the light-emitting materials are more uniformly dispersed, and thicker products can be obtained, with oxidation resistance. Better);
  • the preparation method of the light-emitting layer material is: coating a little thermosetting adhesive on the thermoplastic resin particles, then wrap the light-emitting material, and dry and cure at 90°C.
  • the optical substrate consists of 9 layers in total.
  • the middle 3 layers are light-emitting layers.
  • the heating temperature is 145°C.
  • Three single-screw extruders with a screw diameter of 75 mm are used. The screw speed is adjusted to 27 rpm; the upper and lower are 3 Layer protective layer, heating temperature is 165°C, using 6 single-screw extruders with a screw diameter of 75 mm, and the screw speed is up to 27 revolutions per minute; simultaneously extruded through 9 extruders, and passed through a co-extrusion die. Then it is rolled out, cooled and shaped, and the die is slit to obtain an optical substrate.
  • the total thickness of the three light-emitting layers is 0.3mm
  • the two protective layers are 3 layers each, each with a thickness of 0.1mm
  • the total thickness of the optical substrate is 0.9 mm.
  • the optical substrate prepared in this embodiment includes 4 protective layers above and below the light-emitting layer.
  • the inner layer of the protective layer material is EVOH (ethylene and vinyl alcohol copolymer), and the two layers are PA (polyamide).
  • the three layers are polyethylene and the outer layer is polypropylene; the material of the protective layer on the other side is the same.
  • the optical substrate prepared in this embodiment includes three light-emitting layers.
  • the material of the light-emitting layer is obtained by bonding a thermoplastic resin (polyethylene, ethylene and vinyl alcohol copolymer at a mass ratio of 2:1) and a water-phase quantum dot microcrystal of a light-emitting material.
  • the mass percentage of water-phase quantum dot microcrystals in the luminescent material is 6%, and the luminescent materials used in the three luminescent layers are the same. Good);
  • the preparation method of the luminescent layer material is: coating a little thermosetting adhesive on the thermoplastic resin particles, then wrap the luminescent material, and dry and cure at 90°C.
  • the optical substrate includes a total of 11 layers, the middle 3 layers are light-emitting layers, the heating temperature is 145°C, and 3 single-screw extruders with a screw diameter of 75 mm are used. The screw speed is adjusted to 27 rpm; the upper and lower layers are 4 respectively.
  • Layer protective layer, heating temperature is 165°C, using 8 single-screw extruders with a screw diameter of 75 mm, and the screw speed is up to 27 revolutions per minute; simultaneously extruded through 9 extruders, and passed through a co-extrusion die. Then it is rolled out, cooled and shaped, and the die is slit to obtain an optical substrate.
  • the total thickness of the three light-emitting layers is 0.4mm, and the two protective layers are 4 layers each, each with a thickness of 0.1mm, and the total thickness of the optical substrate is 1.2 mm.
  • the optical substrate provided by the present invention has good light-emitting performance.
  • Stability test The stability test of the optical substrate prepared in Example 2 shows that the substrate is placed at a temperature of 65°C and a humidity of 90% for 1000 hours, and the brightness attenuation is less than 8.5%; (the national standard requires that the brightness attenuation is less than 15%); Start-up aging test: the brightness attenuation is less than 5% in 1000 hours.
  • the optical substrates prepared in Example 1 and Example 3 were tested for luminescence performance and stability. The results showed that the optical substrates obtained in Example 1 and Example 3 had excellent luminescence performance and stability.
  • the method provided by the present invention utilizes multi-layer co-extrusion technology to prepare an optical substrate, which can realize one-time molding, simple process steps, mass production, low production cost, and good light-emitting performance of the obtained optical substrate , The performance is stable.

Abstract

本发明涉及光学材料技术领域，提供了一种多层共挤制备光学基片的方法以及一种光学基片。本发明提供的方法包括以下步骤：将发光层材料和保护层材料进行多层共挤成型，得到光学基片。本发明利用多层共挤技术制备光学基片，可以实现一次成型，工艺步骤简单，可大批量生产，且生产成本低；进一步的，本发明可以根据所需发光性质进行色彩调整，可以方便的设置多层发光层，无需增加其他步骤；本发明制备得到的光学基片结构紧凑，发光性能好，且本发明以热塑性树脂为发光层和保护层的基础材料，所得光学基片性能稳定。

Description

一种多层共挤制备光学基片的方法以及一种光学基片
本申请要求于2020年3月18日提交中国专利局、申请号为202010190871.X、发明名称为“一种多层共挤制备光学基片的方法以及一种光学基片”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明属于光学材料技术领域，尤其涉及一种多层共挤制备光学基片的方法以及一种光学基片。
背景技术
光信号处理与传输技术在各个领域中均有应用，应用最广泛的是在LED显示屏中，随着电子技术的发展，LED显示屏已经全面普及，其中最重要的基础部件为光学基片。
目前，量子点膜是最成熟、应用广泛的光学基片，市面上大部分的量子点电视和显示设备均采用量子点膜。量子点膜采用“三明治”结构，在量子点层的上下两个表面覆盖有水氧阻隔膜。由于量子点材料具有极高的活性，易与空气中的水汽和氧气发生反应而造成性能显著衰退，传统的量子点膜将量子点配胶后夹在中间。虽然上下覆盖水氧阻隔层，但量子点夹层还是容易裸露出来，目前本领域中使用的量子点膜都需要封边才可阻止氧化，而封边工艺非常复杂，难以操作，量子点膜的制备成本也较高。
此外，本领域常见的光学基片还有量子点扩散板，量子点扩散板包括板体和涂覆在板体外表面的水氧阻隔层，量子点和光扩散剂均匀分散在板体内。这种光学基片制备方法复杂，步骤较多，不能一次成型，难以大批量生产。
发明内容
有鉴于此，本发明的目的在于提供一种多层共挤制备光学基片的方法以及一种光学基片。本发明利用多层共挤制备光学基片，可以实现一次成型，工艺简单可大批量生产，生产成本低，且所得光学基片结构紧凑、性能优异。
为了实现上述发明目的，本发明提供以下技术方案：
一种多层共挤制备光学基片的方法，包括以下步骤：
将发光层材料和保护层材料进行多层共挤成型，得到光学基片；所述光学基片具有夹芯结构，所述夹芯结构的芯层为发光层，芯层两侧为保护层；
所述保护层材料为热塑性树脂；所述发光层材料由热塑性树脂和发光材料混合得到，所述发光材料粘结在热塑性树脂表面。
优选的，所述发光层的层数≥1层。
优选的，所述发光层的层数为1～5层。
优选的，所述芯层单侧的保护层的层数为2～5层。
优选的，所述发光层的单层厚度为0.05～0.5mm；所述保护层的单层厚度为0.01～0.15mm。
优选的，所述发光层材料的制备方法包括以下步骤：在热塑性树脂表面涂覆胶粘剂，然后裹上发光材料，固化后得到所述发光层材料。
优选的，所述发光材料包括水相量子点微晶、水相量子点改性微晶、钙钛矿发光材料、硅酸盐荧光粉、铝酸盐荧光粉、硅铝酸盐荧光粉、氮化物荧光粉、钨酸盐荧光粉、钼酸盐荧光粉、硫化物荧光粉、氟化物荧光粉、磷酸盐荧光粉和稀土氧化物荧光粉中的一种或几种。
优选的，所述发光材料的粒径目数为300目以上。
优选的，所述热塑性树脂包括聚乙烯、乙烯和乙烯醇共聚物、聚酰胺、聚丙烯、聚氯乙烯、聚甲醛和聚碳酸酯中的一种或几种。
优选的，所述热塑性树脂为聚乙烯与乙烯和乙烯醇共聚物的混合物，所述聚乙烯与乙烯和乙烯醇共聚物的质量比为2:1。
优选的，所述多层共挤成型的温度为145～200℃，挤出速度为0.1～2m/min。
本发明还提供了上述方案所述方法制备得到的光学基片。
优选的，所述光学基片中发光层和保护层的总层数为7层，其中，中间1层为发光层，发光层两侧各为3层保护层。
优选的，所述发光层的厚度为0.2mm，单层所述保护层的厚度为0.07mm。
优选的，所述光学基片中发光层和保护层的总层数为9层，其中，中 间3层为发光层，发光层两侧各为3层保护层。
优选的，3层所述发光层的总厚度为0.3mm，单层所述保护层的厚度为0.1mm。
优选的，所述光学基片中发光层和保护层的总层数为11层，其中，中间3层为发光层，发光层两侧各为4层保护层。
优选的，3层所述发光层的总厚度为0.4mm，单层所述保护层的厚度为0.1mm。
本发明还提供了上述方案所述光学基片在LED显示屏中的应用，所述光学基片在LED蓝光或紫外光激发下发光。
本发明提供了一种多层共挤制备光学基片的方法，包括以下步骤：将发光层材料和保护层材料进行多层共挤成型，得到光学基片。本发明利用多层共挤技术制备光学基片，可以实现一次成型，工艺步骤简单，可大批量生产，且生产成本低；进一步的，本发明可以根据所需发光性质进行色彩调整，可以方便的设置多层发光层，无需增加其他步骤；本发明制备得到的光学基片结构紧凑，发光性能好，且本发明以热塑性树脂为发光层和保护层的材料，所得光学基片性能稳定。
具体实施方式
本发明提供了一种多层共挤制备光学基片的方法，包括以下步骤：
将发光层材料和保护层材料进行多层共挤成型，得到光学基片；所述光学基片具有夹芯结构，所述夹芯结构的芯层为发光层，芯层两侧为保护层。
在本发明中，所述光学基片中发光层的层数≥1层，更优选为1～5层，进一步优选为1层、2层或3层，单层发光层的厚度优选为0.05～0.5mm，更优选为0.1～0.3mm；所述芯层单侧的保护层的层数优选为2～5层，更优选为3～4层，所述芯层两侧的保护层的层数优选相同，例如，当所述光学基片的发光层和保护层总层数共为7层时，中间1层发光层构成芯层，发光层两侧各为3层保护层，当所述光学基片的发光层和保护层总层数共为9层时，中间3层发光层构成芯层，芯层两侧各为3层保护层，当所述光学基片的发光层和保护层总层数共为11层时，中间3层发光层构成芯层，芯层两侧各为4层保护层。在本发明中，单层所述保护层的厚度优选 为0.01～0.15mm，更优选为0.05～0.1mm；本发明在发光层两侧设置多层保护层，能够起到阻水、阻汽、抗刮擦的作用并保持其透光性，有利于分切、包装、运输、储存和安装使用。
在本发明中，所述保护层材料为热塑性树脂；所述热塑性树脂包括聚乙烯(PE)、乙烯和乙烯醇共聚物(EOVH)、聚酰胺(PA)、聚丙烯(PP)、聚氯乙烯(PVC)、聚甲醛(POM)和聚碳酸酯(PC)中的一种或几种；在本发明中，当保护层包括多层时，各个保护层选择的热塑性树脂种类可以相同，也可以不同，不做特殊要求。
在本发明中，所述发光层材料由热塑性树脂和发光材料混合得到，所述发光材料粘结在热塑性树脂表面；所述热塑性树脂的可选种类和上述方案一致，在此不再赘述；在本发明的具体实施例中，所述发光材料中使用的热塑性树脂优选由聚乙烯与乙烯和乙烯醇共聚物以质量比2：1混合得到；所述发光材料优选包括水相量子点微晶、水相量子点改性微晶、钙钛矿发光材料、硅酸盐荧光粉、铝酸盐荧光粉、硅铝酸盐荧光粉、氮化物荧光粉、钨酸盐荧光粉、钼酸盐荧光粉、硫化物荧光粉、氟化物荧光粉、磷酸盐荧光粉和稀土氧化物荧光粉中的一种或几种；本发明对所述水相量子点改性微晶没有特殊要求，使用本领域技术人员熟知的水相量子点改性微晶即可。在本领域中，传统的光学基片一般以油相量子点为发光材料，油相量子点在温度超过120℃时热衰减严重，多层共挤成型需要较高的温度，传统的油相量子点无法达到要求，而本发明选择的上述种类的发光材料均具有较好的耐高温性能，尤其是水相量子点微晶耐温可达200℃，从而确保后续的共挤成型能够实现。
在本发明中，所述发光材料的粒径目数优选为300目以上，更优选为300～2000目。
在本发明的具体实施例中，优选根据所需发光性质选择发光材料和设置发光层的层数，可以在不同的发光层中复合不同波长的发光材料，也可以在同一发光层中复合多种发光材料，具体根据实际需要进行选择即可。
在本发明中，所述发光层材料的制备方法优选包括以下步骤：在热塑性树脂表面涂覆胶粘剂，然后裹上发光材料，固化后得到所述发光层材料。本发明对所述发光材料和热塑性树脂的质量比不做固定要求，视产品用途 设计发光材料含量即可；本发明对所述胶粘剂没有特殊要求，使用本领域技术人员熟知的热塑性胶粘剂即可；本发明对所述胶粘剂的用量不做特殊要求，在本发明的具体实施例中，使用少量胶粘剂，能够将发光材料粘结即可。在本发明中，所述固化的温度优选为70～90℃，更优选为75～85℃；固化后，发光材料即可牢固在包裹在热塑性树脂表面，完成热塑性树脂和发光材料的粘结。
在本发明中，所述多层共挤成型的温度优选为145～200℃，挤出速度优选为0.1～2m/min，更优选为0.5～1.5m/min。本发明优选使用多台单螺杆挤出机进行共挤成型，所用单螺杆挤出机的数量根据光学基片的总层数进行确定即可，具体如：当所述光学基片的总层数为7层时，使用7台单螺杆挤出机将各层材料通过模具同时挤出，在经滚压轮滚压拉出冷却定型，模切后即可得到光学基片。在本发明中，所述单螺杆挤出机的螺杆直径优选为75mm，所述单螺杆挤出机的螺杆转速优选根据挤出速度进行确定，在本发明的具体实施例中，所述螺杆转速按需进行无级调速即可。
本发明的方案利用发光材料和热塑性树脂的混合，然后再通过多层共挤制备光学基片，热塑性树脂性能稳定，具有独特阻水阻气性能和化学稳定性，能牢牢固定住发光材料，对发光材料起到很好的保护作用，避免其被氧化；并且本发明的方法无需传统的量子点膜中的封边工艺，步骤简单，成本更低。
本发明还提供了上述方案所述方法制备得到的光学基片。本发明提供的光学基片结构紧凑，发光性能好，且本发明以热塑性树脂为发光层和保护层的基础材料，所得光学基片性能稳定，发光材料不易被氧化；此外，本发明提供的光学基片还可以根据所需发光性质调整发光层色彩和层数，可以满足不同的发光需求。在本发明中，所述光学基片可在LED蓝光或紫外光激发下发光。
下面将结合本发明中的实施例，对本发明中的技术方案进行清楚、完整地描述。
实施例1
本实施例制备的光学基片在发光层上下各包括三层保护层，以单侧为例，保护层材料如下：里层为EVOH(乙烯和乙烯醇共聚物)，二层为PA (聚酰胺)，外层为PP(聚丙烯)；另一侧的保护层材料相同。
发光层材料由热塑性树脂(聚乙烯与乙烯和乙烯醇共聚物以2：1的质量比混合)和发光材料水相量子点微晶粘结得到，发光层材料中水相量子点微晶的质量百分含量为13％；发光层材料制备方法为：在热塑性树脂颗粒上涂覆热固胶粘剂，然后裹上发光材料，70℃烘干固化。
光学基片共包括7层，中间1层为发光层，加热温度为145℃，采用1台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为27转/分钟；上下各为3层保护层，加热温度为165℃，采用6台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为27转/分钟；经过7台挤出机同时挤出，经过共挤口模，然后滚压拉出冷却定型，模具分切后得到光学基片，其中发光层厚度为0.2mm，两面保护层各为3层，每层厚度为0.07mm，光学基片共厚为0.62mm。
实施例2
本实施例制备的光学基片在发光层上下各包括三层保护层，以单侧为例，保护层材料材料如下：里层为EVOH(乙烯和乙烯醇共聚物)，二层为PA(聚酰胺)，外层为(PC)聚碳酸酯；另一侧的保护层材料相同。
本实施例制备的光学基片包括三层发光层，发光层材料由热塑性树脂(聚乙烯与乙烯和乙烯醇共聚物以质量比2：1混合)和发光材料水相量子点微晶粘结得到，发光层材料中水相量子点微晶的质量百分含量为8％，3层发光层使用的发光材料相同(3层的好处在于发光材料分散更均匀，可以得到较厚产品，抗氧化性能更佳)；发光层材料的制备方法为：在热塑性树脂颗粒上涂覆少许热固胶粘剂，然后裹上发光材料，90℃烘干固化。
光学基片共包括9层，中间3层为发光层，加热温度为145℃，采用3台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为调至27转/分钟；上下各为3层保护层，加热温度为165℃，采用6台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为至27转/分钟；经过9台挤出机同时挤出，经过共挤口模，然后滚压拉出冷却定型，模具分切后得到光学基片，其中三层发光层总厚度为0.3mm，两面保护层各为3层，每层厚度为0.1mm，光学基片共厚为0.9mm。
实施例3
本实施例制备的光学基片在发光层上下各包括4层保护层，以单侧为例，保护层材料里层为EVOH(乙烯和乙烯醇共聚物)，二层为PA(聚酰胺)，三层为聚乙烯，外层为聚丙烯；另一侧的保护层材料相同。
本实施例制备的光学基片包括三层发光层，发光层材料由热塑性树脂(聚乙烯与乙烯和乙烯醇共聚物按照质量比2：1混合)和发光材料水相量子点微晶粘结得到，发光材料中水相量子点微晶的质量百分含量为6％，3层发光层用的发光材料相同(3层的好处在于发光材料分散更均匀，可以得到较厚产品，抗氧化性能更佳)；发光层材料的制备方法为：在热塑性树脂颗粒上涂覆少许热固胶粘剂，然后裹上发光材料，90℃烘干固化。
光学基片共包括11层，中间3层为发光层，加热温度为145℃，采用3台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为调至27转/分钟；上下各为4层保护层，加热温度为165℃，采用8台螺杆直径为75毫米的单螺杆挤出机，螺杆转速为至27转/分钟；经过9台挤出机同时挤出，经过共挤口模，然后滚压拉出冷却定型，模具分切后得到光学基片，其中三层发光层总厚度为0.4mm，两面保护层各为4层，每层厚度为0.1mm，光学基片共厚为1.2mm。
对实施例2所得光学基片进行发光性能测试，并对所得CIE1931色度图进行解析，解析数据列于表1中：
表1发光性能测试结果
Figure PCTCN2021078080-appb-000001
根据表1中的结果可以看出，本发明提供的光学基片具有良好的发光性能。
稳定性测试：对实施例2制备的光学基片进行稳定性测试，结果显示， 基片在温度65℃，湿度90％环境下放置1000小时亮度衰减小于8.5％；(国家标准中要求亮度衰减小于15％)；开机老化实验：1000小时亮度衰减小于5％。
按照上述测试方法对实施例1和实施例3制备的光学基片进行发光性能和稳定性测试，结果显示实施例1和实施例3所得光学基片均有优异的发光性能和稳定性。
由以上实施例可以看出，本发明提供的方法利用多层共挤技术制备光学基片，可以实现一次成型，工艺步骤简单，可大批量生产，生产成本低，并且所得光学基片发光性能好，性能稳定。
以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰，这些改进和修饰也落入本发明权利要求的保护范围内。对这些实施例的多种修改对本领域的专业技术人员来说是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (19)

  1. 一种多层共挤制备光学基片的方法，其特征在于，包括以下步骤：
    将发光层材料和保护层材料进行多层共挤成型，得到光学基片；所述光学基片具有夹芯结构，所述夹芯结构的芯层为发光层，芯层两侧为保护层；
    所述保护层材料为热塑性树脂；
    所述发光层材料由热塑性树脂和发光材料混合得到，所述发光材料粘结在热塑性树脂表面。
  2. 根据权利要求1所述的方法，其特征在于，所述发光层的层数≥1层。
  3. 根据权利要求2所述的方法，其特征在于，所述发光层的层数为1～5层。
  4. 根据权利要求1所述的方法，其特征在于，所述芯层单侧的保护层的层数为2～5层。
  5. 根据权利要求1～4任意一项所述的方法，其特征在于，所述发光层的单层厚度为0.05～0.5mm；所述保护层的单层厚度为0.01～0.15mm。
  6. 根据权利要求1所述的方法，其特征在于，所述发光层材料的制备方法包括以下步骤：在热塑性树脂表面涂覆胶粘剂，然后裹上发光材料，固化后得到所述发光层材料。
  7. 根据权利要求1或6所述的方法，其特征在于，所述发光材料包括水相量子点微晶、水相量子点改性微晶、钙钛矿发光材料、硅酸盐荧光粉、铝酸盐荧光粉、硅铝酸盐荧光粉、氮化物荧光粉、钨酸盐荧光粉、钼酸盐荧光粉、硫化物荧光粉、氟化物荧光粉、磷酸盐荧光粉和稀土氧化物荧光粉中的一种或几种。
  8. 根据权利要求7所述的方法，其特征在于，所述发光材料的粒径目数为300目以上。
  9. 根据权利要求1或6所述的方法，其特征在于，所述热塑性树脂包括聚乙烯、乙烯和乙烯醇共聚物、聚酰胺、聚丙烯、聚氯乙烯、聚甲醛和聚碳酸酯中的一种或几种。
  10. 根据权利要求9所述的方法，其特征在于，所述热塑性树脂为聚乙烯与乙烯和乙烯醇共聚物的混合物，所述聚乙烯与乙烯和乙烯醇共聚物的质量比为2:1。
  11. 根据权利要求1所述的方法，其特征在于，所述多层共挤成型的温度为145～200℃，挤出速度为0.1～2m/min。
  12. 权利要求1～11任意一项所述方法制备得到的光学基片。
  13. 根据权利要求12所述的光学基片，其特征在于，所述光学基片中发光层和保护层的总层数为7层，其中，中间1层为发光层，发光层两侧各为3层保护层。
  14. 根据权利要求13所述的光学基片，其特征在于，所述发光层的厚度为0.2mm，单层所述保护层的厚度为0.07mm。
  15. 根据权利要求12所述的光学基片，其特征在于，所述光学基片中发光层和保护层的总层数为9层，其中，中间3层为发光层，发光层两侧各为3层保护层。
  16. 根据权利要求15所述的光学基片，其特征在于，3层所述发光层的总厚度为0.3mm，单层所述保护层的厚度为0.1mm。
  17. 根据权利要求12所述的光学基片，其特征在于，所述光学基片中发光层和保护层的总层数为11层，其中，中间3层为发光层，发光层两侧各为4层保护层。
  18. 根据权利要求17所述的光学基片，其特征在于，3层所述发光层的总厚度为0.4mm，单层所述保护层的厚度为0.1mm。
  19. 权利要求12～18任意一项所述光学基片在LED显示屏中的应用，其特征在于，所述光学基片在LED蓝光或紫外光激发下发光。
PCT/CN2021/078080 2020-03-18 2021-02-26 一种多层共挤制备光学基片的方法以及一种光学基片 WO2021185050A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010190871.XA CN111370557B (zh) 2020-03-18 2020-03-18 一种多层共挤制备光学基片的方法以及一种光学基片
CN202010190871.X 2020-03-18

Publications (1)

Publication Number Publication Date
WO2021185050A1 true WO2021185050A1 (zh) 2021-09-23

Family

ID=71211846

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/078080 WO2021185050A1 (zh) 2020-03-18 2021-02-26 一种多层共挤制备光学基片的方法以及一种光学基片

Country Status (2)

Country Link
CN (1) CN111370557B (zh)
WO (1) WO2021185050A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370557B (zh) * 2020-03-18 2021-02-23 马鞍山微晶光电材料有限公司 一种多层共挤制备光学基片的方法以及一种光学基片

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120052608A1 (en) * 2010-08-25 2012-03-01 Yoo Cheol-Jun Phosphor film, method of forming the same, and method of coating phosphor layer on led chips
CN103649215A (zh) * 2011-07-05 2014-03-19 迪睿合电子材料有限公司 荧光体片形成用树脂组合物
CN106229401A (zh) * 2016-08-24 2016-12-14 电子科技大学 荧光led封装阵列
JP2017136737A (ja) * 2016-02-03 2017-08-10 凸版印刷株式会社 蛍光体用保護フィルム、及びそれを用いた波長変換シート
CN107431111A (zh) * 2014-12-26 2017-12-01 Ns材料株式会社 波长转换构件及其制造方法
CN107735699A (zh) * 2015-07-10 2018-02-23 迪睿合株式会社 荧光体片、具备该荧光体片的白色光源装置、以及具备该白色光源装置的显示装置
CN109796975A (zh) * 2019-03-25 2019-05-24 深圳扑浪创新科技有限公司 一种二氧化硅和氧化铝两层包覆量子点及其制备方法及量子点薄膜的制备方法
CN111370557A (zh) * 2020-03-18 2020-07-03 马鞍山微晶光电材料有限公司 一种多层共挤制备光学基片的方法以及一种光学基片

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1162507C (zh) * 2000-06-24 2004-08-18 大连路明科技集团有限公司 发光板及其制造方法
US6609795B2 (en) * 2001-06-11 2003-08-26 3M Innovative Properties Company Polarizing beam splitter
WO2015168174A1 (en) * 2014-04-28 2015-11-05 Madico, Inc. Protective sheet for a photovoltaic module
US9919339B2 (en) * 2014-06-18 2018-03-20 3M Innovation Properties Company Optical film
DE102014014511B4 (de) * 2014-10-06 2023-10-19 Reifenhäuser GmbH & Co. KG Maschinenfabrik Coextrusionsvorrichtung, Einschichtextrusionsvorrichtung und Nachrüstkit sowie Verfahren zum Messen einer Schichtdicke, zum Herstellen einer Kunststofffolie und zum Nachrüsten einer Extrusionsvorrichtung
CN106154364B (zh) * 2015-04-07 2019-04-05 宁波长阳科技股份有限公司 一种背光模组用量子点广色域聚酯膜、增亮膜及扩散膜
GB201707361D0 (en) * 2017-05-08 2017-06-21 Dupont Teijin Films U S Ltd Partnership Multi-layer film assembly
JP7387949B2 (ja) * 2017-10-16 2023-11-29 Ｔｏｐｐａｎホールディングス株式会社 量子ドット含有樹脂シート又はフィルム、及びその製造方法、並びに、波長変換部材
CN110724393A (zh) * 2018-12-14 2020-01-24 马鞍山微晶光电材料有限公司 一种量子点微晶母料
CN209963091U (zh) * 2019-07-26 2020-01-17 马鞍山微晶光电材料有限公司 一种复合发光基片
CN110311055A (zh) * 2019-07-26 2019-10-08 马鞍山微晶光电材料有限公司 一种复合发光基片及其制备方法和应用

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120052608A1 (en) * 2010-08-25 2012-03-01 Yoo Cheol-Jun Phosphor film, method of forming the same, and method of coating phosphor layer on led chips
CN103649215A (zh) * 2011-07-05 2014-03-19 迪睿合电子材料有限公司 荧光体片形成用树脂组合物
CN107431111A (zh) * 2014-12-26 2017-12-01 Ns材料株式会社 波长转换构件及其制造方法
CN107735699A (zh) * 2015-07-10 2018-02-23 迪睿合株式会社 荧光体片、具备该荧光体片的白色光源装置、以及具备该白色光源装置的显示装置
JP2017136737A (ja) * 2016-02-03 2017-08-10 凸版印刷株式会社 蛍光体用保護フィルム、及びそれを用いた波長変換シート
CN106229401A (zh) * 2016-08-24 2016-12-14 电子科技大学 荧光led封装阵列
CN109796975A (zh) * 2019-03-25 2019-05-24 深圳扑浪创新科技有限公司 一种二氧化硅和氧化铝两层包覆量子点及其制备方法及量子点薄膜的制备方法
CN111370557A (zh) * 2020-03-18 2020-07-03 马鞍山微晶光电材料有限公司 一种多层共挤制备光学基片的方法以及一种光学基片

Also Published As

Publication number Publication date
CN111370557A (zh) 2020-07-03
CN111370557B (zh) 2021-02-23

Similar Documents

Publication Publication Date Title
US8723411B2 (en) Photoluminescent sheet
KR102558338B1 (ko) 파장 변환 시트 및 백라이트 유닛
JP7387949B2 (ja) 量子ドット含有樹脂シート又はフィルム、及びその製造方法、並びに、波長変換部材
US20180230374A1 (en) Wavelength conversion member, phosphor sheet, white light source device, and display device
CN1836898A (zh) 一种温室用光反射多功能复合薄膜及其制备方法
WO2013005791A1 (ja) 蛍光体シート形成用樹脂組成物
CN106133562A (zh) 波长转换片、背光单元以及荧光体用保护薄膜
JP6600013B2 (ja) 波長変換フィルム
CN106154364B (zh) 一种背光模组用量子点广色域聚酯膜、增亮膜及扩散膜
WO2021185050A1 (zh) 一种多层共挤制备光学基片的方法以及一种光学基片
CN114019595A (zh) 一种量子点的扩散板
JP2003249349A (ja) エレクトロルミネセンス素子及びその製造方法
TWI661024B (zh) 密封膠帶、螢光體片、照明裝置、液晶顯示裝置、螢光體片的製造方法以及密封方法
CN209963091U (zh) 一种复合发光基片
JP2017116728A (ja) 波長変換部材
JP2016198902A (ja) 白色発光性蓄光シート
CN216670312U (zh) 一种高稳定性量子点扩散板
JP6776422B2 (ja) 波長変換部材、蛍光体シート、白色光源装置、及び表示装置
JPS6361203A (ja) 偏光板及びその製造方法
CN220913371U (zh) 一种多层共挤量子点扩散板及其熔体挤出结构
CN114755861B (zh) 一种高效率量子点光学基片及其制备方法
CN117382277A (zh) 一种高水氧阻隔量子点扩散复合材料及其制备方法与应用
KR20240024378A (ko) 양자점 광학시트 제조방법
CN112711154A (zh) 量子点膜及其制作方法
CN114854179A (zh) 一种量子点扩散板组合物、光扩散板及其制备方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21772177

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21772177

Country of ref document: EP

Kind code of ref document: A1