CN111341878A - 一种晶硅太阳能电池片的制备方法 - Google Patents
一种晶硅太阳能电池片的制备方法 Download PDFInfo
- Publication number
- CN111341878A CN111341878A CN201811555750.XA CN201811555750A CN111341878A CN 111341878 A CN111341878 A CN 111341878A CN 201811555750 A CN201811555750 A CN 201811555750A CN 111341878 A CN111341878 A CN 111341878A
- Authority
- CN
- China
- Prior art keywords
- controlled
- solar cell
- crystalline silicon
- silicon solar
- following
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 230000003647 oxidation Effects 0.000 claims abstract description 19
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- 230000005684 electric field Effects 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 5
- 239000007888 film coating Substances 0.000 claims abstract description 3
- 238000009501 film coating Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000002310 reflectometry Methods 0.000 claims description 4
- 239000013585 weight reducing agent Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005215 recombination Methods 0.000 description 7
- 230000006798 recombination Effects 0.000 description 7
- 238000002161 passivation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明公开了一种晶硅太阳能电池片的制备方法,具体技术方案步骤依次为:原始硅片预清洗、制绒及酸清洗;高温磷扩散;湿法刻蚀;热氧化处理;背面镀膜处理;正面PECVD镀膜处理;激光开槽;背电极、背电场和正电极丝网印刷及烧结,完成电池片制备。本发明的有益效果是有效地提升了晶硅太阳能电池片的开路电压、短路电流,光电转换效率提高1%以上。
Description
技术领域
本发明涉及晶硅太阳能电池片制造领域,具体地涉及一种晶硅太阳能电池片的制备方法。
背景技术
目前,高效多晶硅太阳能电池是光伏行业领域的研究热点之一。目前太阳能电池片制作常规工艺流程为:常规片、预清洗、制绒、磷扩散、湿法刻蚀、背面PECVD镀膜、背电极、背电场和正电极丝网印刷及烧结。硅表面复合速率较高,严重制约多晶硅太阳能电池的光电转换效率。通过晶硅表面的钝化技术可以降低晶硅表面的复合速率,从而提高晶硅太阳能电池的光电转换效率。传统的表面钝化技术使用PECVD法在硅表面沉积一层氮化硅薄膜,但热氧化法生长的二氧化硅薄膜与衬底硅的晶格系数更加匹配,钝化效果更加好。经过大量有关晶硅太阳能电池表面钝化技术的研究结果表明,半导体表面存在大量悬挂键、断键等不饱和键,容易在禁带形成复合中心能级,加大载流子在表面复合消失速率,严重影响少子寿命,从而降低电池的光电转换效率。而表面钝化能很好地去除这些复合中心,降低硅的表面态密度,从而降低载流子的表面复合速率。
发明内容
本发明的目的是提供一种晶硅太阳能电池片的制备方法,达到更好地控制SiO2层的厚度,使硅片表面起到多层减反射膜的效果,增强电池片对光的吸收,提高短路电流;降低光生载流子复合,提高少子寿命,进而提高开路电压的目的;使电池片短路电流提升300~600mA、开路电压提升10~20mV、光电转换效率提升1%以上。
为了解决上述技术问题,本发明提供一种晶硅太阳能电池片的制备方法。本发明的具体技术方案步骤为:
(1)原始硅片预清洗、制绒及酸清洗;
(2)高温磷扩散;
(3)湿法刻蚀;
(4)热氧化处理;
(5)背面镀膜处理;
(6)正面PECVD镀膜处理;
(7)激光开槽;
(8)背电极、背电场和正电极丝网印刷及烧结,完成电池片制备。
进一步地,
步骤(1)中,所述硅片制绒减重小于等于0.05g,反射率控制在13%~18%;
步骤(2)中,所述磷扩散后方阻控制在70~120 ohm/squ;
步骤(3)中,所述湿法刻蚀后减重控制在0.1~0.2g,方阻提升在8~15欧姆;
步骤(4)中,所述热氧化处理具体为:初始温度为700~750℃,经过500~700s恒温恒压至680~720℃,恒温恒压(800-1200mbar)氧化800~1500s,氧气流量为300~400sccm,氮气流量为8000~12000sccm。然后经过400~600s的冷却,降温至550~650℃,氮气流量为8000~12000sccm;热氧化后方阻较热氧化前方阻提升5~12欧姆,硅片亲水性强,距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>15cm;
步骤(5)中,所述背面镀膜处理工艺具体为:通入流量为4~6slm 的N2O,70~90% 的三甲胺液体,经过100~200s,通入流量为4~6slm的N2O,流量为100~200sccm的 SiN4,流量为0.2~1slm的 NH3, 经过200~300s处理,通入流量为600~900sccm的SiN4,流量为3~5slm的NH3,经过200~300s,再通入流量为600~900sccm的SiN4,流量为6~8slm的NH3,经过500~600s;膜厚控制在90~200nm,折射率控制在2.0~2.15之间;
步骤(6)中,所述正面PECVD镀膜膜厚控制在75~95nm之间,折射率控制在2.0~2.15之间;
步骤(7)中,所述激光开槽,槽深控制在100~200nm之间,槽宽控制在20~60um之间。
本发明的有益效果是有效地提升了晶硅太阳能电池片的开路电压、短路电流,光电转换效率提高1%以上。
附图说明
图1本发明提供的一种晶硅太阳能电池片的制备方法的工艺流程。
具体实施方式
下面结合实施例对本发明的技术方案作进一步地详细说明。
实施例1
一种晶硅太阳能电池片的制备方法,包括以下步骤:
(1)原始硅片经过预清洗、制绒及酸清洗,硅片制绒后减重控制在0.03g,反射率控制在15%。
(2)高温磷扩散:方阻控制在90±5ohm/squ之间。
(3)湿法刻蚀:减重为0.15g,方阻提升8.5±1.5欧姆。
(4)热氧化处理:初始温度720℃,经过600s恒温恒压至700℃,恒温恒压(1000mbar)氧化时间为1000s,氧气流量为320sccm,氮气流量为10000sccm。然后经过450s的冷却,降温至630℃,氮气流量为10000sccm。氧化后方阻较氧化前提升6.5±1.5欧姆,水滴扩散直径为16cm。
(5)背面镀膜:通入流量为5slm的N2O,80% 三甲胺液体,经过150s,通入流量为5slm的 N2O,流量为150sccm的SiN4,NH3流量为0.5slm, 经过250s,通入流量为750sccm的SiN4,流量为4slm的NH3,经过250s,再通入流量为750sccm的SiN4,流量为7slm的NH3,经过550s;膜厚控制在105±5nm,折射率控制在2.06±0.02。
(6)正面PECVD镀膜:膜厚控制在82±4nm,折射率控制在2.06±0.02。
(7)激光开槽:槽深控制在150±10nm,槽宽控制在40±5um;
(8)背电极、背电场和正电极丝网印刷及烧结,完成电池片制备。
表1:常规工艺方案与发明实施例1的电性能参数对比表
工艺 | Uoc(V) | Isc(A) | Rs(ohm) | Rsh(ohm) | FF(%) | 转换效率(%) |
常规工艺 | 0.6387 | 9.105 | 0.00139 | 465.72 | 80.96 | 19.16% |
实施例1 | 0.6515 | 9.5828 | 0.00163 | 397.25 | 80.37 | 20.27% |
由上表可知,实施例1采用本发明制备的电池片与常规工艺制得的电池片,在各项电性能参数上均更有优势,光电转换效率提高了1.11%,其中开路电压提升了12.8mV,短路电流提升了478mA。
实施例2
一种晶硅太阳能电池片的制备方法,包括以下步骤:
(1)原始硅片预清洗、制绒及酸清洗,硅片制绒后减重控制在0.04g,反射率控制在17%。
(2)高温磷扩散:方阻控制在100±5ohm/squ之间。
(3)湿法刻蚀:减重为0.12g,方阻提升9±1欧姆。
(4)热氧化处理:初始温度750℃,经过700s恒温恒压至680℃,恒温恒压(1000mbar)氧化1300s,氧气流量为380sccm,氮气流量为10000sccm;然后经过550s的冷却,降温至550℃,氮气流量为10000sccm。氧化后方阻较氧化前提升10±2欧姆,水滴扩散直径19cm。
(5)背面镀膜:通入流量为6slm的N2O, 75% 三甲胺液体,经过180s,通入流量为6slm的N2O,流量为180sccm的SiN4,流量为0.8slm的NH3, 经过220s,通入流量为800sccm的SiN4,流量为5slm的NH3,经过280s,再通入流量为800sccm 的SiN4,流量为8slm NH3,经过580s;膜厚控制在110±5nm,折射率控制在2.02~2.05之间。
(6)正面PECVD镀膜:膜厚控制在90±5nm之间,折射率控制在2.08~2.15之间。
(7)激光开槽:槽深控制在180±10nm之间,槽宽控制在35±5um之间。
(8)背电极、背电场和正电极丝网印刷及烧结,完成电池片制备。
表2:常规工艺方案与发明实施例2的热氧化工艺方案的效率对比
工艺 | Uoc(V) | Isc(A) | Rs(ohm) | Rsh(ohm) | FF(%) | 转换效率(%) |
常规工艺 | 0.6378 | 9.1843 | 0.00153 | 669.09 | 80.98 | 19.20% |
实施例2 | 0.6534 | 9.5256 | 0.00154 | 347.29 | 80.74 | 20.29% |
由上表可知,实施例2的电池与常规工艺制得的电池片,在各项电性能上均有显著提高,光电转换效率提高了1.09%,其中开路电压提升了15.5mV,短路电流提升了341mA。
Claims (8)
1.一种晶硅太阳能电池片的制备方法,其特征在于按照以下具体技术方案实施步骤依次为:
(1)原始硅片预清洗、制绒及酸清洗;
(2)高温磷扩散;
(3)湿法刻蚀;
(4)热氧化处理;
(5)背面镀膜处理;
(6)正面PECVD镀膜处理;
(7)激光开槽;
(8)背电极、背电场和正电极丝网印刷及烧结,完成电池片制备。
2.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(1)中,所述硅片制绒减重小于等于0.05g,反射率控制在13%~18%。
3.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(2)中,所述磷扩散后方阻控制在70~120 ohm/squ。
4.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(3)中,所述湿法刻蚀后减重控制在0.1~0.2g,方阻提升在8~15欧姆。
5.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(4)中,所述热氧化处理具体为:初始温度为700~750℃,经过500~700s恒温恒压至680~720℃,恒温恒压(800-1200mbar)氧化800~1500s,氧气流量为300~400sccm,氮气流量为8000~12000sccm;然后经过400~600s的冷却,降温至550~650℃,氮气流量为8000~12000sccm;热氧化后方阻较热氧化前方阻提升5~12欧姆,硅片亲水性强,距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>15cm。
6.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(5)中,所述背面镀膜处理工艺具体为:通入流量为4~6slm 的N2O,70~90% 的三甲胺液体,经过100~200s,通入流量为4~6slm的N2O,流量为100~200sccm的 SiN4,流量为0.2~1slm的 NH3, 经过200~300s处理,通入流量为600~900sccm的SiN4,流量为3~5slm的NH3,经过200~300s,再通入流量为600~900sccm的SiN4,流量为6~8slm的NH3,经过500~600s;膜厚控制在90~200nm,折射率控制在2.0~2.15之间。
7.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(6)中,所述正面PECVD镀膜膜厚控制在75~95nm之间,折射率控制在2.0~2.15之间。
8.根据权利要求1所述的一种晶硅太阳能电池片的制备方法,其特征在于:所述的步骤(7)中,所述激光开槽,槽深控制在100~200nm之间,槽宽控制在20~60um之间。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811555750.XA CN111341878A (zh) | 2018-12-19 | 2018-12-19 | 一种晶硅太阳能电池片的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811555750.XA CN111341878A (zh) | 2018-12-19 | 2018-12-19 | 一种晶硅太阳能电池片的制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111341878A true CN111341878A (zh) | 2020-06-26 |
Family
ID=71185010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811555750.XA Pending CN111341878A (zh) | 2018-12-19 | 2018-12-19 | 一种晶硅太阳能电池片的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111341878A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111969083A (zh) * | 2020-09-22 | 2020-11-20 | 浙江鸿禧能源股份有限公司 | 一种抗pid太阳能电池片的制备方法 |
-
2018
- 2018-12-19 CN CN201811555750.XA patent/CN111341878A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111969083A (zh) * | 2020-09-22 | 2020-11-20 | 浙江鸿禧能源股份有限公司 | 一种抗pid太阳能电池片的制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112349816B (zh) | 一种基于PECVD技术的高效低成本N型TOPCon电池的制备方法 | |
CN101548395B (zh) | 具有改进的表面钝化的晶体硅太阳能电池的制造方法 | |
CN110164759B (zh) | 一种区域性分层沉积扩散工艺 | |
CN107681018B (zh) | 一种太阳能电池片的低压氧化工艺 | |
CN109004038B (zh) | 太阳能电池及其制备方法和光伏组件 | |
CN105355723B (zh) | 晶体硅太阳电池二氧化硅钝化膜的制备方法 | |
KR20120092184A (ko) | 도핑된 영역을 세정하고 도핑된 영역 위에 음으로 대전된 패시베이션 층을 형성하는 방법 | |
KR20130129818A (ko) | 실리콘 웨이퍼들 상에 n+pp+ 또는 p+nn+ 구조를 준비하는 방법 | |
CN102931283B (zh) | 一种高效晶体硅太阳电池背面钝化的方法 | |
CN114597267B (zh) | 一种TOPCon电池及其制备方法 | |
Balaji et al. | Surface passivation schemes for high-efficiency c-Si solar cells-A review | |
CN105355707A (zh) | 一种高效晶硅太阳能电池及其制备方法 | |
CN111509090A (zh) | 电池边缘钝化方法 | |
CN111129221A (zh) | 一种perc太阳能电池碱抛光制备方法 | |
CN116741871A (zh) | 一种扩硼SE结构的N型TOPCon电池制作方法 | |
CN113161447B (zh) | 一种铸造单晶或多晶类硅片的磷氢退火预处理方法 | |
CN110965044A (zh) | 降低perc电池电致衰减的介质钝化膜及其制备方法 | |
CN114023636A (zh) | 一种硼扩SE结构的高效N型TOPCon电池制作方法 | |
CN111341878A (zh) | 一种晶硅太阳能电池片的制备方法 | |
CN110391319B (zh) | 一种抗pid效应的高效黑硅电池片的制备方法 | |
CN107863415B (zh) | 一种热氧化结合pecvd提升太阳能电池片转化效率的方法 | |
CN103456838A (zh) | 太阳能电池钝化膜的制作方法及太阳能电池的制作方法 | |
CN102169924A (zh) | 晶体硅太阳能电池及其钝化方法 | |
CN114583016A (zh) | 一种TOPCon电池及其制备方法 | |
CN115566100A (zh) | 一种太阳能电池及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200626 |