CN107863415B - 一种热氧化结合pecvd提升太阳能电池片转化效率的方法 - Google Patents
一种热氧化结合pecvd提升太阳能电池片转化效率的方法 Download PDFInfo
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- CN107863415B CN107863415B CN201710937776.XA CN201710937776A CN107863415B CN 107863415 B CN107863415 B CN 107863415B CN 201710937776 A CN201710937776 A CN 201710937776A CN 107863415 B CN107863415 B CN 107863415B
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- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000009466 transformation Effects 0.000 title claims abstract description 22
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 31
- 230000003647 oxidation Effects 0.000 claims abstract description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 23
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 18
- 210000002268 wool Anatomy 0.000 claims abstract description 11
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- 229910020776 SixNy Inorganic materials 0.000 claims abstract description 7
- 229910020782 SixNyO Inorganic materials 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 6
- 235000008216 herbs Nutrition 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000004140 cleaning Methods 0.000 claims abstract description 3
- 238000009792 diffusion process Methods 0.000 claims abstract description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 3
- 239000011574 phosphorus Substances 0.000 claims abstract description 3
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 238000002310 reflectometry Methods 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 6
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 4
- 235000013842 nitrous oxide Nutrition 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 229910052681 coesite Inorganic materials 0.000 description 12
- 229910052906 cristobalite Inorganic materials 0.000 description 12
- 229910052682 stishovite Inorganic materials 0.000 description 12
- 229910052905 tridymite Inorganic materials 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 8
- 238000002161 passivation Methods 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
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- 229910021529 ammonia Inorganic materials 0.000 description 2
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- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
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- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
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- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
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Abstract
Description
常规工艺膜厚/nm | 72.5 | 72.1 | 73.8 | 75.5 | 71.2 | 74.3 |
常规工艺折射率 | 2.071 | 2.075 | 2.062 | 2.052 | 2.054 | 2.052 |
实施例1膜厚/nm | 80.1 | 79.6 | 77.5 | 78.3 | 78.8 | 79.5 |
实施例1折射率 | 2.021 | 2.022 | 2.023 | 2.025 | 2.025 | 2.023 |
Claims (6)
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CN201710937776.XA CN107863415B (zh) | 2017-10-10 | 2017-10-10 | 一种热氧化结合pecvd提升太阳能电池片转化效率的方法 |
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CN201710937776.XA CN107863415B (zh) | 2017-10-10 | 2017-10-10 | 一种热氧化结合pecvd提升太阳能电池片转化效率的方法 |
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CN112133788B (zh) * | 2020-09-21 | 2022-12-16 | 横店集团东磁股份有限公司 | 一种提高perc电池开压的热氧化工艺方法及得到的perc电池片 |
CN115101622B (zh) * | 2022-06-02 | 2024-02-06 | 浙江晶科能源有限公司 | 一种太阳能电池及其制作方法、光伏组件 |
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US7193325B2 (en) * | 2004-04-30 | 2007-03-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects |
CN101882650B (zh) * | 2010-06-29 | 2012-01-18 | 常州大学 | 带有电荷埋层的太阳电池的制备方法 |
CN103413841A (zh) * | 2013-08-28 | 2013-11-27 | 中电投西安太阳能电力有限公司 | 太阳能电池表面钝化层结构及其制备方法 |
CN103996720A (zh) * | 2014-05-20 | 2014-08-20 | 奥特斯维能源(太仓)有限公司 | 一种晶硅电池表面钝化膜及其制备方法 |
CN105470341A (zh) * | 2014-09-05 | 2016-04-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种廉价无序宽谱广角减反结构及其制作方法 |
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Denomination of invention: A method for improving the conversion efficiency of solar cells by thermal oxidation combined with PECVD Effective date of registration: 20210804 Granted publication date: 20190319 Pledgee: Dongyang Branch of China Construction Bank Co.,Ltd. Pledgor: HENGDIAN GROUP DMEGC MAGNETICS Co.,Ltd. Registration number: Y2021330001068 |
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Date of cancellation: 20230628 Granted publication date: 20190319 Pledgee: Dongyang Branch of China Construction Bank Co.,Ltd. Pledgor: HENGDIAN GROUP DMEGC MAGNETICS Co.,Ltd. Registration number: Y2021330001068 |