CN111969083A - 一种抗pid太阳能电池片的制备方法 - Google Patents
一种抗pid太阳能电池片的制备方法 Download PDFInfo
- Publication number
- CN111969083A CN111969083A CN202011002884.6A CN202011002884A CN111969083A CN 111969083 A CN111969083 A CN 111969083A CN 202011002884 A CN202011002884 A CN 202011002884A CN 111969083 A CN111969083 A CN 111969083A
- Authority
- CN
- China
- Prior art keywords
- pid
- solar cell
- temperature
- coating treatment
- controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 230000003647 oxidation Effects 0.000 claims abstract description 18
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims abstract description 8
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000002161 passivation Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 229910021419 crystalline silicon Inorganic materials 0.000 description 6
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 3
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 3
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000036284 oxygen consumption Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Formation Of Insulating Films (AREA)
Abstract
本发明公开了一种抗PID太阳能电池片的制备方法,依次包括有以下步骤:硅片预清洗、高温磷扩散、湿法刻蚀、臭氧处理、热氧化处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结。本发明的抗PID太阳能电池片的制备方法,无需增加任何设备,采用相对简单的工艺,兼顾了多层减反射膜的优势,同时增加减反射膜表面钝化效果,提高了太阳能电池片的转化效率同时降低电池片的PID效应。
Description
技术领域
本发明属于晶硅太阳能电池片生产技术领域,具体涉及一种抗PID太阳能电池片的制备方法。
背景技术
目前,高效晶硅PERC太阳能电池是光伏行业领域的主流产品。PERC技术提升了电池片的转化效率同时进一步增大了电池片各类衰减的风险。电池片的电势诱导衰减(PID)现象是其中的一种。在高温、高湿和高压环境下,晶硅太阳能电池片和组件均易出现PID现象,PERC电池该现象更为显著。PID现象主要是电池片表面存在大量悬挂键、断键等不饱和键,容易在禁带形成复合中心能级,加大载流子在表面复合消失速率。通过晶硅表面的钝化技术可以降低晶硅表面的复合速率,提高晶硅太阳能电池的光电转换效率,降低电池片的PID效应。常见的表面钝化技术使用臭氧在硅基底表面形成一层致密的氧化层或通过热氧氧化的方式在硅的表面形成一层一定厚度的氧化层。臭氧氧化法电池片的PID现象较为稳定但电池片转化效率低,热氧氧化法电池片的转化效率高但电池片的PID稳定性差。
发明内容
为解决上述技术问题,本发明采用的技术方案是:一种抗PID太阳能电池片的制备方法,依次包括有以下步骤:硅片预清洗、高温磷扩散、湿法刻蚀、臭氧处理、热氧化处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结。
作为上述技术方案的优选,所述臭氧处理步骤中使用臭氧处理装置,臭氧处理装置中氧气用量为3-6L/min,氮气的压力为0.2-0.3MPa。
作为上述技术方案的优选,所述热氧化处理步骤中:初始温度为700~750℃,经过700~900s恒温恒压至650~700℃,氧化800~1200s,氧气流量为1200~1700sccm,然后经过300~500s的冷却,降温至550~650℃。
作为上述技术方案的优选,所述背面镀膜处理步骤中:通入流量为4~6slm的N2O,70~90%的三甲胺液体,经过50-80s,膜厚度控制在100~150nm,折射率控制在2.0~2.15之间。
作为上述技术方案的优选,所述正面PECVD镀膜处理步骤中膜厚控制在75~95nm之间,折射率控制在2.0~2.15之间。
本发明的有益效果是:本发明的抗PID太阳能电池片的制备方法,无需增加任何设备,采用相对简单的工艺,兼顾了多层减反射膜的优势,同时增加减反射膜表面钝化效果,提高了太阳能电池片的转化效率同时降低电池片的PID效应。
具体实施方式
下面将对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
实施例1:按照硅片预清洗、高温磷扩散、湿法刻蚀、臭氧处理、热氧化处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结的步骤制备电池片,其中硅片预清洗、高温磷扩散、湿法刻蚀、激光开槽、丝网印刷、烧结步骤按常规处理工艺进行。臭氧处理步骤中,采用申请人在专利ZL201621307688.9中公开的制备具有抗PID效应的装置。其中氧气用量为4L/min,其中氮气的压力为0.25MPa。处理完成后进行抽检,在被抽检的硅片距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>8cm,肉眼观略有亲水性。热氧化处理步骤中,初始温度为700~750℃,经过800s恒温恒压至680℃,氧化900s,氧气流量为1600sccm,然后经过350s的冷却,降温至650℃。测试表明,热氧化后方阻较热氧化前方阻提升4~10欧姆。热氧化处理步骤后进行抽检,距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>22cm,表明硅片亲水性强。背面镀膜处理步骤中,通入80%的TMA,沉积时间为65s。通入流量为5slm的N2O,80%的三甲胺液体,经过65s,膜厚度控制在100~150nm,折射率控制在2.0~2.15之间。正面PECVD镀膜处理步骤中膜厚控制在75~95nm之间,折射率控制在2.0~2.15之间。
对比例1:按照硅片预清洗、高温磷扩散、湿法刻蚀、臭氧处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结的步骤制备电池片。其中臭氧处理步骤中氧气用量为10L/min,其中氮气的压力为0.15MPa。臭氧处理完成后抽检,距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>20cm。在背面镀膜处理步骤中通入流量为5slm的N2O,通入80%的三甲胺液体,沉积时间为110s。其余步骤与实施例1中各处理步骤相同。
对比例2:按照硅片预清洗、高温磷扩散、湿法刻蚀、热氧化处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结的步骤制备电池片。热氧化处理步骤中,初始温度为700~750℃,经过800s恒温恒压至680℃,氧化900s,氧气流量为1600sccm,然后经过350s的冷却,降温至650℃。热氧化处理后电池片方阻较热氧化前方阻提升4~10欧姆。硅片亲水性强,距离硅片表面2cm处,滴一滴水滴,水滴扩散直径>20cm。在背面镀膜处理步骤中通入流量为5slm的N2O,通入80%的三甲胺液体,沉积时间为110s。其余步骤与实施例1中各处理步骤相同。
将实施例1生产的电池片和对比例1生产的电池片和对比例2生产的电池片分别进行性能测试,测试结果如下表所述。
Type | Uoc(V) | Isc(A) | Rs(ohm) | Rsh(ohm) | FF(%) | Eta(%) | PID |
对比例1 | 0.6482 | 9.378 | 0.00169 | 401 | 80.69 | 20.00% | 2.19% |
对比例2 | 0.6533 | 9.418 | 0.00172 | 455 | 80.60 | 20.10% | 3.11% |
实施例1 | 0.6547 | 9.426 | 0.00176 | 422 | 80.58 | 20.17% | 1.73% |
从上表结果可以看出,在本发明工艺范围内的实施例1得到的电池片的电性能参数明显优于对比例1和对比例2。可见采用本发明特定的工艺,制得的太阳能电池电性能参数较优,提高了太阳能电池的光电转化效率,同时降低了电池片的PID现象。
值得一提的是,本发明专利申请涉及的硅片预清洗、高温磷扩散、湿法刻蚀、激光开槽、丝网印刷、烧结等技术特征应被视为现有技术,这些技术特征的具体工艺参数、控制条件等采用本领域的常规选择即可,不应被视为本发明专利的发明点所在,本发明专利不做进一步具体展开详述。
以上详细描述了本发明的较佳具体实施例,应当理解,本领域的普通技术人员无需创造性劳动就可以根据本发明的构思做出诸多修改和变化,因此,凡本技术领域中技术人员依本发明的构思在现有技术的基础上通过逻辑分析、推理或者有限的实验可以得到的技术方案,皆应在由权利要求书所确定的保护范围内。
Claims (5)
1.一种抗PID太阳能电池片的制备方法,其特征在于,依次包括有以下步骤:硅片预清洗、高温磷扩散、湿法刻蚀、臭氧处理、热氧化处理、背面镀膜处理、正面PECVD镀膜处理、激光开槽、丝网印刷和烧结。
2.如权利要求1所述的抗PID太阳能电池片的制备方法,其特征在于,所述臭氧处理步骤中使用臭氧处理装置,臭氧处理装置中氧气用量为3-6L/min,氮气的压力为0.2-0.3MPa。
3.如权利要求2所述的抗PID太阳能电池片的制备方法,其特征在于,所述热氧化处理步骤中:初始温度为700~750℃,经过700~900s恒温恒压至650~700℃,氧化800~1200s,氧气流量为1200~1700sccm,然后经过300~500s的冷却,降温至550~650℃。
4.如权利要求3所述的抗PID太阳能电池片的制备方法,其特征在于,所述背面镀膜处理步骤中:通入流量为4~6slm的N2O,70~90%的三甲胺液体,经过50-80s,膜厚度控制在100~150nm,折射率控制在2.0~2.15之间。
5.如权利要求4所述的抗PID太阳能电池片的制备方法,其特征在于,所述正面PECVD镀膜处理步骤中膜厚控制在75~95nm之间,折射率控制在2.0~2.15之间。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011002884.6A CN111969083A (zh) | 2020-09-22 | 2020-09-22 | 一种抗pid太阳能电池片的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011002884.6A CN111969083A (zh) | 2020-09-22 | 2020-09-22 | 一种抗pid太阳能电池片的制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111969083A true CN111969083A (zh) | 2020-11-20 |
Family
ID=73387123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011002884.6A Pending CN111969083A (zh) | 2020-09-22 | 2020-09-22 | 一种抗pid太阳能电池片的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111969083A (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104821345A (zh) * | 2015-05-05 | 2015-08-05 | 广东爱康太阳能科技有限公司 | 一种抗电势诱导衰减太阳能电池的制备方法 |
US20180138334A1 (en) * | 2016-11-14 | 2018-05-17 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
CN109004038A (zh) * | 2018-07-26 | 2018-12-14 | 东莞南玻光伏科技有限公司 | 太阳能电池及其制备方法和光伏组件 |
CN110459615A (zh) * | 2019-08-19 | 2019-11-15 | 通威太阳能(成都)有限公司 | 一种复合介电钝化层结构太阳电池及其制备工艺 |
CN111341878A (zh) * | 2018-12-19 | 2020-06-26 | 浙江鸿禧能源股份有限公司 | 一种晶硅太阳能电池片的制备方法 |
-
2020
- 2020-09-22 CN CN202011002884.6A patent/CN111969083A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104821345A (zh) * | 2015-05-05 | 2015-08-05 | 广东爱康太阳能科技有限公司 | 一种抗电势诱导衰减太阳能电池的制备方法 |
US20180138334A1 (en) * | 2016-11-14 | 2018-05-17 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
CN109004038A (zh) * | 2018-07-26 | 2018-12-14 | 东莞南玻光伏科技有限公司 | 太阳能电池及其制备方法和光伏组件 |
CN111341878A (zh) * | 2018-12-19 | 2020-06-26 | 浙江鸿禧能源股份有限公司 | 一种晶硅太阳能电池片的制备方法 |
CN110459615A (zh) * | 2019-08-19 | 2019-11-15 | 通威太阳能(成都)有限公司 | 一种复合介电钝化层结构太阳电池及其制备工艺 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111029438B (zh) | 一种n型钝化接触太阳能电池的制备方法 | |
CN109087956B (zh) | 一种双面perc太阳能电池结构及其制备工艺 | |
CN116525708B (zh) | 正面宽带隙掺杂的联合钝化背接触太阳电池及其制备方法 | |
CN115621333B (zh) | 双面隧穿氧化硅钝化的背接触太阳能电池及其制备方法 | |
CN107681018B (zh) | 一种太阳能电池片的低压氧化工艺 | |
CN111029436B (zh) | 可改善LeTID现象的P型单晶PERC电池及其制作方法 | |
CN101548395A (zh) | 具有改进的表面钝化的晶体硅太阳能电池的制造方法 | |
CN105810779B (zh) | 一种perc太阳能电池的制备方法 | |
CN110391318B (zh) | 一种p型单晶perc电池及其制作方法 | |
CN105355723B (zh) | 晶体硅太阳电池二氧化硅钝化膜的制备方法 | |
CN112635591A (zh) | 一种太阳能电池的制备方法以及太阳能电池 | |
CN109103081A (zh) | 一种晶体硅太阳能电池的扩散工艺 | |
CN110854240A (zh) | Perc电池及其制备方法 | |
CN102856174A (zh) | 氮化硅的膜制备方法、具有氮化硅膜的太阳能电池片及其制备方法 | |
CN108987505A (zh) | 一种太阳能电池及其制备方法 | |
CN109285896A (zh) | 一种太阳能电池及其制备方法 | |
CN104882516A (zh) | 一种高温低压的硅片扩散方法 | |
CN112820801A (zh) | 一种减小se激光损伤的厚氧化层扩散工艺 | |
CN102983214A (zh) | 一种选择性发射极晶体硅太阳电池的制备方法 | |
CN111139448B (zh) | 一种pecvd镀膜工艺 | |
CN110739366B (zh) | 一种修复perc太阳能电池背膜激光开槽损伤的方法 | |
CN111969083A (zh) | 一种抗pid太阳能电池片的制备方法 | |
CN111628044A (zh) | 一种硅太阳能电池的表面钝化处理方法和系统 | |
CN115312624B (zh) | 一种背接触太阳能电池的制备方法 | |
CN208889671U (zh) | 一种太阳能电池 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201120 |
|
RJ01 | Rejection of invention patent application after publication |