CN111186187A - 一种聚酰亚胺基复合导热绝缘片及其制备方法 - Google Patents
一种聚酰亚胺基复合导热绝缘片及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种聚酰亚胺基复合导热绝缘片,为三层结构,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,PET保护膜层层厚为0.05‑0.1mm,导热硅胶绝缘层层厚为0.25‑1mm,聚酰亚胺层层厚为0.03‑0.075mm。本发明的有益效果是:本发明聚酰亚胺基复合导热绝缘片由高导热有机硅聚合物与聚酰亚胺膜一次成型方法制得,生产效率高,生产过程环保无污染。该导热绝缘片具有高导热系数、低热阻系数、优良的抗刺穿能力、优良的抗撕裂能力、高的耐电击穿能力,适用于高温高压的电子元件器的散热绝缘装配,可以提高发热电子元件的寿命与稳定性。
Description
技术领域
本发明涉及导热绝缘片,尤其涉及一种聚酰亚胺基复合导热绝缘片及其制备方法。
背景技术
本发明涉及导热绝缘片领域。电子元器件随着小型化与超薄化发展,发热电子元器件与散热元件之间的热传递、耐高压、绝缘的性能需要考虑的最关键因素。导热绝缘片可用于装备电子工业的散热器缝隙、装配发热元件的外包保护等,具有极高的耐电压击穿、耐高温能力和良好的导热能力。适用于高温高压的电子元件器的散热绝缘装配,可以提高发热电子元件的寿命与稳定性。可在-40-200℃长期使用,安全环保,使用方便。
聚酰亚胺基复合导热绝缘片使用方便,耐高温且导热效果好。在高温高压电子元器件领域应用日益广泛。然而,目前该领域使用的产品主要存在的问题是:一、高导热胶层与聚酰亚胺薄膜粘接力不足,导致产品在装配过程中导热胶层容易脱落;二、在高温高压(150℃、5KV)使用环境下容易产生针眼、电击穿、降解等不良,易引起高发热电子元件失效;三、普通的导热绝缘片耐电击穿能力不足,耐电击穿能力难以超过25KV/mm。
发明内容
本发明针对现有聚酰亚胺基复合导热绝缘片综合性能低的问题,提供一种聚酰亚胺基复合导热绝缘片及其制备方法。
本发明聚酰亚胺基复合导热绝缘片为三层结构,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,所述PET保护膜层层厚为0.05-0.1mm,所述导热硅胶绝缘层层厚为0.25-1mm,所述聚酰亚胺层层厚为0.03-0.075mm。
导热硅胶绝缘层导热率为3W/m·k,由以下重量份的组分组成:乙稀基硅油80-120份、含氢硅油15-20份、铂金催化剂0.1-0.2份、粘接力促进剂1-3份、抑制剂0.6-1份、氧化铝粉体700-800份和氧化锌粉体100-200份;其中,所述乙稀硅油的粘度150-1500mPa·s,乙稀基含量1.8%-2.5%;所述含氢硅油粘度为200-1000mPa·s,含氢量为0.12%-0.8%;所述铂金催化剂铂含量为3000-5000ppm;所述粘接力促进剂选自γ-(甲基丙烯酰氧)丙基三甲氧基硅烷、乙稀基三甲氧基硅烷或乙稀基三乙氧基硅烷中的一种;所述氧化铝粉体粒径为5-10μm;所述氧化锌粉体粒径为0.2-0.5μm。
本发明聚酰亚胺基复合导热绝缘片的制备方法为:设置搅拌釜真空度≤0.9MPa,将乙稀基硅油、含氢硅油加入搅拌釜中,50-70rpm搅拌0.5h,然后加入偶联剂,20-50rpm搅拌0.5h,加入氧化铝和氧化锌继续搅拌1h,加入催化剂和粘接力促进剂,50-70rpm搅拌0.5h,常温出料,得导热硅胶物料;将导热硅胶物料均匀压延在PET保护膜和聚酰亚胺膜之间,在80-130℃下固化30-60min,即得。
本发明的有益效果是:本发明聚酰亚胺基复合导热绝缘片由高导热有机硅聚合物与聚酰亚胺膜一次成型方法制得,生产效率高,生产过程环保无污染。该导热绝缘片具有高导热系数、低热阻系数、优良的抗刺穿能力、优良的抗撕裂能力、高的耐电击穿能力,适用于高温高压的电子元件器的散热绝缘装配,可以提高发热电子元件的寿命与稳定性。
具体实施方式
以下结合实例对本发明进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
实施例1
一种聚酰亚胺基复合导热绝缘片,为三层结构,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,PET保护膜层层厚为0.05mm;导热硅胶绝缘层层厚为0.25mm,导热率为3W/m·k,由以下重量份的组分组成:乙稀基硅油80份、含氢硅油20份、铂金催化剂0.1份、粘接力促进剂3份、抑制剂0.6份、氧化铝粉体800份和氧化锌粉体200份,其中,乙稀硅油的粘度150mPa·s,乙稀基含量1.8%,含氢硅油粘度为1000mPa·s,含氢量为0.8%,铂金催化剂铂含量为3000ppm,粘接力促进剂为γ-(甲基丙烯酰氧)丙基三甲氧基硅烷,氧化铝粉体粒径为5μm,氧化锌粉体粒径为0.5μm;聚酰亚胺层层厚为0.03mm。
实施例2
一种聚酰亚胺基复合导热绝缘片,为三层结构,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,PET保护膜层层厚为0.07mm;导热硅胶绝缘层层厚为0.6mm,导热率为3W/m·k,由以下重量份的组分组成:乙稀基硅油100份、含氢硅油17份、铂金催化剂0.15份、粘接力促进剂1-3份、抑制剂0.6-1份、氧化铝粉体750份和氧化锌粉体150份,其中,乙稀硅油的粘度800mPa·s,乙稀基含量2.1%,含氢硅油粘度为1200mPa·s,含氢量为0.45%,铂金催化剂铂含量为4000ppm,粘接力促进剂为乙稀基三甲氧基硅烷,氧化铝粉体粒径为7μm;氧化锌粉体粒径为0.35μm;聚酰亚胺层层厚为0.05mm。
实施例3
一种聚酰亚胺基复合导热绝缘片,为三层结构,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,PET保护膜层层厚为0.1mm;导热硅胶绝缘层层厚为1mm,导热率为3W/m·k,由以下重量份的组分组成:乙稀基硅油120份、含氢硅油15份、铂金催化剂0.2份、粘接力促进剂1份、抑制剂1份、氧化铝粉体700份和氧化锌粉体100份,其中,乙稀硅油的粘度1500mPa·s,乙稀基含量12.5%,含氢硅油粘度为200mPa·s,含氢量为0.12%,铂金催化剂铂含量为5000ppm,粘接力促进剂为乙稀基三乙氧基硅烷,氧化铝粉体粒径为10μm,氧化锌粉体粒径为0.2μm;聚酰亚胺层层厚为0.075mm。
实施例1-3聚酰亚胺基复合导热绝缘片的制备为:设置搅拌釜真空度≤0.9MPa,将乙稀基硅油、含氢硅油加入搅拌釜中,50-70rpm搅拌0.5h,然后加入偶联剂,20-50rpm搅拌0.5h,加入氧化铝和氧化锌继续搅拌1h,加入催化剂和粘接力促进剂,50-70rpm搅拌0.5h,常温出料,得导热硅胶物料;将导热硅胶物料均匀压延在PET保护膜和聚酰亚胺膜之间,在80-130℃下固化30-60min,即得。
将实施例1-3所得聚酰亚胺基复合导热绝缘片按以下设备及方法检测其性能:1、使用Hot Disk TPS2500S导热系数测试仪进行导热率的测试,测试条件:发热功率200mw,时间5秒;2、使用瑞领LW-9389热阻仪进行热阻的测试,测试条件:热端面温度80℃,端面压力40psi;3、使用HJC-50KV计算机控制电压击穿试验仪进行耐击穿电压的测试。测试结果如表1所示。
表1.实施例1-3所得聚酰亚胺基复合导热绝缘片性能检测
实施例1 | 实施例2 | 实施例3 | |
导热系数(W/m·k) | 3.10 | 3.02 | 3.15 |
热阻(in2W/℃) | 0.321 | 0.346 | 0.351 |
耐击穿电压(KV/mm) | 36 | 38 | 39 |
高温脱落 | 无 | 无 | 无 |
从表1数据可以看出,实施例1-3所得聚酰亚胺基复合导热绝缘片具有较高的导热系数,耐电击穿能力不低于36KV/mm,且高温不脱落。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (3)
1.一种聚酰亚胺基复合导热绝缘片,为三层结构,其特征在于,由上向下依次为PET保护膜层、导热硅胶绝缘层和聚酰亚胺层,所述PET保护膜层层厚为0.05-0.1mm,所述导热硅胶绝缘层层厚为0.25-1mm,所述聚酰亚胺层层厚为0.03-0.075mm。
2.根据权利要求1所述的聚酰亚胺基复合导热绝缘片,其特征在于,所述导热硅胶绝缘层导热率为3W/m·k,由以下重量份的组分组成:
乙稀基硅油80-120份、含氢硅油15-20份、铂金催化剂0.1-0.2份、粘接力促进剂1-3份、抑制剂0.6-1份、氧化铝粉体700-800份和氧化锌粉体100-200份;
其中,所述乙稀硅油的粘度150-1500mPa·s,乙稀基含量1.8%-2.5%;所述含氢硅油粘度为200-1000mPa·s,含氢量为0.12%-0.8%;所述铂金催化剂铂含量为3000-5000ppm;所述粘接力促进剂选自γ-(甲基丙烯酰氧)丙基三甲氧基硅烷、乙稀基三甲氧基硅烷或乙稀基三乙氧基硅烷中的一种;所述氧化铝粉体粒径为5-10μm;所述氧化锌粉体粒径为0.2-0.5μm。
3.一种如其录取1或2所述的聚酰亚胺基复合导热绝缘片的制备方法,其特征在于,制备步骤为:设置搅拌釜真空度≤0.9MPa,将乙稀基硅油、含氢硅油加入搅拌釜中,50-70rpm搅拌0.5h,然后加入偶联剂,20-50rpm搅拌0.5h,加入氧化铝和氧化锌继续搅拌1h,加入催化剂和粘接力促进剂,50-70rpm搅拌0.5h,常温出料,得导热硅胶物料;将导热硅胶物料均匀压延在PET保护膜和聚酰亚胺膜之间,在80-130℃下固化30-60min,即得。
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CN113290894A (zh) * | 2021-05-20 | 2021-08-24 | 哈工大机器人集团(无锡)科创基地研究院 | 一种表面柔软的一体化聚酰亚胺导热网格膜/导热硅胶复合材料的制备装置及制备方法 |
CN114058180A (zh) * | 2021-12-29 | 2022-02-18 | 苏州艾乐格新材料有限公司 | 一种pi导热绝缘复合材料及其制备方法和应用 |
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