CN111132535B - Circuit board mounting module, electronic equipment assembling system and method - Google Patents
Circuit board mounting module, electronic equipment assembling system and method Download PDFInfo
- Publication number
- CN111132535B CN111132535B CN202010221072.4A CN202010221072A CN111132535B CN 111132535 B CN111132535 B CN 111132535B CN 202010221072 A CN202010221072 A CN 202010221072A CN 111132535 B CN111132535 B CN 111132535B
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- circuit board
- stocker
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- circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a circuit board installation module, which relates to the technical field of product processing and comprises an object placing device, a material storing device, a detector, an inductor, a buffer and a material transporting device, wherein the object placing device is used for placing two products, the material storing device is used for placing a circuit board, the detector is suitable for detecting whether the circuit board and the products are qualified or not, the inductor is suitable for monitoring whether the buffer stores the circuit board or not, and the material transporting device is suitable for installing the circuit board to the products. The circuit board installation module provided by the embodiment of the invention has the advantages of efficiency and material utilization rate. The embodiment of the invention also provides an electronic equipment assembly system and an electronic equipment assembly method.
Description
Technical Field
The invention relates to the technical field of product processing, in particular to a circuit board mounting module, an electronic equipment assembling system and an electronic equipment assembling method.
Background
The assembly of electronic devices is often performed manually. The manual efficiency is low, the operation standard is not uniform, and the defective rate is high. And with the continuous increase of the wages of workers, the high investment of the automation equipment becomes acceptable gradually, and the automation equipment is popularized gradually.
However, in the prior art, it is often difficult to achieve both efficiency and material utilization in an automated electronic device assembly system.
Disclosure of Invention
The problem solved by the invention is that an automated electronic equipment assembly system is often difficult to compromise between efficiency and material utilization.
In order to solve the above problems, an embodiment of the present invention provides a circuit board mounting module, configured to mount a circuit board on a product, including an object placing device, a material storing device, a detector, a sensor, a buffer, and a material transporting device, where the object placing device is configured to place two products, the material storing device is configured to place a circuit board, the detector is adapted to detect whether the circuit board and the product are qualified, the sensor is adapted to monitor the number of circuit boards stored in the buffer, and the material transporting device is adapted to mount two circuit boards stored in the buffer to the two products respectively when the two products are both qualified and the two circuit boards are stored; the handler is further adapted to take two circuit boards from the stocker and mount the two circuit boards taken from the stocker to two products respectively when the two products and the two circuit boards taken from the stocker are qualified, when both products are qualified and only one of the two circuit boards obtained from the stocker is qualified, the qualified circuit board of the two circuit boards obtained from the stocker is stored in the buffer and the two circuit boards are obtained from the stocker again, the qualified circuit board of the two circuit boards retrieved from the stocker is mounted to the qualified product of the two products when only one of the two products is qualified and only one of the two circuit boards retrieved from the stocker is qualified, when only one of the two products is qualified and both of the two circuit boards obtained from the stocker are qualified, one of the two circuit boards obtained from the stocker is placed in the buffer and the other of the two circuit boards obtained from the stocker is mounted to the qualified one of the two products.
Preferably, the circuit board mounting module further comprises a feeder, the handler is adapted to place the unqualified circuit board on the feeder, and the feeder is adapted to carry out the unqualified circuit board.
Preferably, the circuit board installation module further comprises a feeding machine, a pin inserting machine, a program burning machine, a board dividing machine and a detecting machine, wherein the feeding machine is suitable for obtaining an undivided circuit board and transmitting the undivided circuit board to the pin inserting machine, the pin inserting machine is suitable for installing electronic components on the circuit board and transmitting the circuit board with the installed electronic components to the program burning machine, the program burning machine is suitable for burning programs on the circuit board and transmitting the circuit board with the burned programs to the board dividing machine, the board dividing machine is suitable for dividing the circuit board and transmitting the divided circuit board to the stocker, and the detecting machine is suitable for detecting whether products with the circuit board are qualified or not.
The circuit board installation module provided by the embodiment of the invention is provided with the storage device, the storage device and the buffer, wherein the material conveying device acquires two circuit boards from the storage device each time, two products are placed on the storage device, the detector detects whether the circuit boards and the products are qualified or not, and the qualified circuit boards are installed on the products or temporarily stored in the buffer according to the detection result.
The embodiment of the invention also provides an electronic equipment assembly system which comprises the circuit board installation module, the feeding module and the transportation track, wherein the storage device of the circuit board installation module is placed on the transportation track and is suitable for being transported by the transportation track, the transportation track is connected with the feeding module and the circuit board installation module, the feeding module comprises a feeding robot, a rotary marking device and a turner, the feeding robot is suitable for obtaining a product and placing the product on the rotary marking device, the rotary marking device is suitable for marking the product and driving the product to rotate, and the turner obtains the marked product from the rotary marking device and places the product on the storage device of the circuit board installation module through turning.
Preferably, the electronic equipment assembly system further comprises an upper cover mounting module, a curing module and a sealing ring mounting module, wherein the transportation rail is connected with the upper feeding module, the circuit board mounting module, the upper cover mounting module, the curing module and the sealing ring mounting module, the upper cover mounting module is suitable for mounting the upper cover to a product provided with a circuit board, the curing module is suitable for heating and cooling the product provided with the upper cover, and the sealing ring mounting module is suitable for mounting the sealing ring to the heated and cooled product.
According to the electronic equipment assembly system provided by the embodiment of the invention, the products are processed by the feeding module and then are transported to the circuit board installation module through the transportation rail, two products are placed on the placing device placed on the rail, the material transporting device acquires two circuit boards from the material storage device each time, the detector detects whether the circuit boards and the products are qualified, and the qualified circuit boards are installed on the products or temporarily stored in the buffer memory according to the detection result, on one hand, each action can install the two circuit boards on the two products, so that the efficiency is improved, on the other hand, the waste of the materials is avoided, and therefore, the efficiency and the material utilization rate are.
An embodiment of the present invention further provides an electronic device assembling method, where a product is assembled by using the electronic device assembling system provided in the embodiment of the present invention, two products are placed on a storage device of the electronic device assembling system, and a circuit board is placed on a stocker of the electronic device assembling system, the electronic device assembling method including:
monitoring the number of buffer memory circuit boards of the electronic equipment assembly system through a sensor of the electronic equipment assembly system;
detecting whether the two products are qualified or not by a detector of the electronic equipment assembly system;
when the two products are qualified and the two circuit boards are stored in the buffer, the two circuit boards stored in the buffer are installed on the two products through a material conveying device of the electronic equipment assembling system;
acquiring two circuit boards from a stocker through a material conveyor;
detecting whether the two circuit boards obtained from the stocker are qualified or not by a detector;
mounting the two circuit boards obtained from the stocker to the two products by the handler when the two products and the two circuit boards obtained from the stocker are both qualified;
when both the two products are qualified and only one of the two circuit boards acquired from the stocker is qualified, placing the qualified circuit board in the buffer memory and acquiring the two circuit boards from the stocker again through the material conveyer;
when only one of the two products is qualified and only one of the two circuit boards obtained from the stocker is qualified, mounting the qualified circuit board of the two circuit boards obtained from the stocker to the qualified product of the two products by the material conveyor;
when only one of the two products is qualified and both of the two circuit boards retrieved from the stocker are qualified, one of the two circuit boards retrieved from the stocker is placed in the buffer by the handler and the other of the two circuit boards retrieved from the stocker is mounted to the qualified one of the two products.
Preferably, the electronic device assembling method further includes:
placing the unqualified circuit board on a blanking device of the electronic equipment assembly system through a material conveying device;
and transporting the unqualified circuit board out of the circuit board mounting module of the electronic equipment assembly system through the blanking device.
Preferably, the electronic device assembling method further includes:
obtaining an undivided circuit board through a feeding machine of the electronic equipment assembly system and transmitting the undivided circuit board to a pin inserting machine of the electronic equipment assembly system;
installing electronic components on the circuit board through a pin inserting machine and transmitting the circuit board with the installed electronic components to a program burning machine of an electronic equipment assembling system;
burning a program on the circuit board through a program burning machine and transmitting the circuit board with the burned program to a board separator of the electronic equipment assembly system;
dividing the circuit board through a board dividing machine and transmitting the divided circuit board to a stocker;
whether the product provided with the circuit board is qualified or not is detected through a detection machine.
Preferably, the electronic device assembling method further includes:
the method comprises the steps that a feeding robot of an electronic equipment assembly system obtains a product and places the product on a rotary marking device of the electronic equipment assembly system;
marking the product by a rotary marker and driving the product to rotate;
the method comprises the steps of obtaining marked products from a rotary marking device through a turner of an electronic equipment assembly system, placing the products on a storage device through turning action, and placing the storage device on a transportation rail of the electronic equipment assembly system and being suitable for being transported by the transportation rail.
Preferably, the electronic device assembling method further includes:
mounting an upper cover to a product mounted with a circuit board through an upper cover mounting module of an electronic equipment mounting system;
heating and cooling the product with the upper cover through a curing module of the electronic equipment assembly system;
the seal ring is mounted to the heated and cooled product by a seal ring mounting module of the electronic equipment assembly system.
According to the electronic equipment assembling method provided by the embodiment of the invention, on one hand, the number of the circuit boards stored in the buffer is monitored, and the circuit boards stored in the buffer are installed on a product according to the result; on the other hand, whether the products and the circuit boards are qualified is detected, and the qualified circuit boards are installed on the products or temporarily stored in the buffer memory according to the detection results, so that on one hand, each action can install the two circuit boards on the two products, the efficiency is improved, on the other hand, the waste of materials is avoided, and the efficiency and the material utilization rate are both considered.
Drawings
FIG. 1 is a schematic diagram of an electronic device mounting system according to a preferred embodiment of the invention.
Fig. 2 is an exploded view of the assembled product in accordance with the preferred embodiment of the present invention.
Fig. 3 is a schematic structural diagram of the feeding module in fig. 1.
Fig. 4 is a partial structural schematic diagram of the feeding module.
Fig. 5 is a partial structural schematic diagram of the feeding module.
Fig. 6 is a schematic perspective view of the circuit board mounting module of fig. 1.
Fig. 7 is a perspective view of a partial structure of the circuit board mounted module of fig. 6.
Fig. 8 is a perspective view of a partial structure of the circuit board mounted module of fig. 6.
Description of reference numerals:
1000-an electronic device assembly system;
1100-feeding module, 1110-feeding robot, 1130-rotary marker, 1150-turner;
1300-circuit board installation module, 1301-feeding machine, 1303-pin inserting machine, 1305-program burning machine, 1307-board separating machine, 1311-object placing machine, 1317-buffer, 1319-material conveying machine, 1321-material discharging machine and 1323-detecting machine;
1500-upper cover installation module;
1700-curing module;
1800-sealing ring installation module;
1900-a transport track;
3000-product, 3100-base, 3300-circuit board, 3500-upper cover; 3700 sealing ring.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the description of the present invention, it should be noted that terms such as "upper", "lower", "front", "rear", and the like in the embodiments indicate orientation words, which are used for simplifying the description of positional relationships based on the drawings of the specification, and do not represent that elements, devices, and the like which are referred to must operate according to specific orientations and defined operations and methods, configurations in the specification, and such orientation terms do not constitute limitations of the present invention.
In addition, the terms "first" and "second" mentioned in the embodiments of the present invention are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
Referring to fig. 1, an embodiment of the invention provides an electronic device assembling system 1000.
Electronic device assembly system 1000 is used to assemble product 3000, and referring to fig. 2, product 3000 includes base 3100, circuit board 3300, cover 3500, and seal 3700.
The electronic device assembling system 1000 includes a loading module 1100, a circuit board mounting module 1300, a cover mounting module 1500, a curing module 1700, a seal ring mounting module 1800, and a transportation rail 1900, where the transportation rail 1900 connects the loading module 1100, the circuit board mounting module 1300, the cover mounting module 1500, the curing module 1700, and the seal ring mounting module 1800.
Specifically, the loading module 1100, the circuit board installation module 1300, the upper cover installation module 1500, the curing module 1700 and the sealing ring installation module 1800 are arranged in a production line, a plurality of articles 1311 are arranged on the transportation track 1900, and the product 3000 is placed on the articles 1311. The transportation rail 1900 passes through the loading module 1100, the circuit board mounting module 1300, the cover mounting module 1500, the curing module 1700, and the sealing ring mounting module 1800, and the loading module 1100, the circuit board mounting module 1300, the cover mounting module 1500, the curing module 1700, and the sealing ring mounting module 1800 perform operations of corresponding processes on the product 3000 placed on the placement device 1311.
In the preferred embodiment of the present invention, the article placing device 1311 is a flat article placing tray, and each article placing tray is provided with two article placing positions, and each article placing position is suitable for placing a product.
Referring to fig. 3 to 5, the feeding module 1100 includes a feeding robot 1110, a rotary marker 1130, and a flipper 1150. The feeder robot 1110 is adapted to acquire a product 3000 and place the product 3000 on the rotary marker 1130, specifically, the feeder robot 1110 is adapted to acquire a base 3100 of the product 3000. The rotary marker 1130 marks the product 3000 and drives the product 3000 to rotate, and the flipper 1150 obtains the marked product 3000 from the rotary marker 1130 and places the product 3000 on the storage device 1311 of the circuit board mounting module 1300 through flipping. The stocker 1311 is placed on the transportation rail 1900 and adapted to be transported by the transportation rail 1900, and after the product 3000 is placed on the stocker 1311, the stocker 1311 is transported by the transportation rail 1900 to the circuit board mounting module 1300.
Specifically, the feeding robot 1110 is a robot arm adapted to pick up the product 3000 and place the product 3000 on the rotary marker 1130 by a rotating action. Rotatory marker 1130 includes a carousel and a marker, and material loading robot 1110 places product 3000 in the carousel back, and product 3000's bottom is up, and the carousel anticlockwise rotates 90 degrees, and the marker is beaten product 3000, prints the two-dimensional code in product 3000's bottom. After the marker marks product 3000, the turntable rotates 90 degrees counterclockwise again. The turner 1150 picks up the product 3000 and places the product 3000 on the storage 1311 by turning, and the turner 1150 turns the product 3000 180 degrees by turning, with the bottom of the product 3000 facing downward.
In the preferred embodiment of the present invention, the loading robot 1110 takes two products 3000 per motion and places the two products 3000 on the rotary marker 1130, and the flipper 1150 takes two marked products 3000 per motion from the rotary marker 1130 and places the two products 3000 on the placement device 1311 of the circuit board mounting module 1300 by flipping.
Referring to fig. 6 to 8, the circuit board mounting module 1300 is used for mounting a circuit board 3300 on a product 3000, and includes a loader 1301, a pin inserter 1303, a program recorder 1305, a board separator 1307, a stocker (not shown), a storage 1311, a detector (not shown), a sensor (not shown), a buffer 1317, a handler 1319, a handler 1321, and a detector 1323.
The feeder 1301, the pin inserter 1303, the program recorder 1305, the board separator 1307, and the stocker (not shown) are distributed in a pipeline, the feeder 1301, the pin inserter 1303, the program recorder 1305, and the board separator 1307 perform operations of corresponding processes on the circuit board 3300, and after the processes are completed, the circuit board 3300 is placed on the stocker.
The loader 1301 is adapted to obtain an undivided circuit board 3300 and transfer the undivided circuit board 3300 to the pin machine 1303, the pin machine 1303 is adapted to mount electronic components on the circuit board 3300 and transfer the circuit board 3300 with the mounted electronic components to the program writer 1305, the program writer 1305 is adapted to write a program on the circuit board 3300 and transfer the circuit board 3300 with the written program to the board separator 1307, and the board separator 1307 is adapted to divide the circuit board 3300 and transfer the divided circuit board 3300 to a stocker (not shown).
The stocker (not shown), the buffer 1317, and the stocker 1311 are located on the same plane, the buffer 1317 is located between the stocker (not shown) and the stocker 1311, and the detector (not shown) and the handler 1319 are located above the stocker (not shown), the buffer 1317, and the stocker 1311.
The detector (not shown) is adapted to detect whether the circuit board 3300 and the product 3000 are acceptable. Specifically, the detector is a camera adapted to capture images of the circuit board 3300 and the product 3000 and determine whether the circuit board 3300 and the product 3000 are acceptable through image analysis.
The buffer 1317 is adapted to store unused qualified circuit boards 3300, and the sensor (not shown) is adapted to monitor whether the buffer 1317 stores circuit boards 3300. Specifically, the buffer 1317 is a flat buffer tray, and the buffer 1317 includes two buffer bits, each of which is adapted to store one circuit board 3300. The buffer 1317 is provided with two sensors, the two sensors are disposed on two sides of the buffer 1317, each sensor is configured to monitor whether a buffer location stores a circuit board 3300, and the sensor is specifically a light detector.
The handler 1319 is adapted to mount the two circuit boards 3300 stored by the buffer 1317 to the two products 3000 when the two products 3000 are both qualified and the buffer 1317 stores the two circuit boards 3300; the handler 1319 is further adapted to take two circuit boards 3300 from a stocker (not shown) and mount the two circuit boards 3300 taken from the stocker (not shown) to two products 3000 when both the two products 3000 and the two circuit boards 3300 taken from the stocker (not shown) are qualified; the handler 1319 is further adapted to, when both products 3000 are qualified and only one of the two circuit boards 3300 retrieved from the stocker (not shown) is qualified, place the qualified circuit board 3300 of the two circuit boards 3300 retrieved from the stocker (not shown) in the buffer 1317 and retrieve the two circuit boards 3300 again from the stocker (not shown); the handler 1319 is further adapted to mount the qualified circuit board 3300 of the two circuit boards 3300 retrieved from the stocker (not shown) to the qualified product 3000 of the two products 3000 when only one of the two products 3000 is qualified and only one of the two circuit boards 3300 retrieved from the stocker (not shown) is qualified; the handler 1319 is further adapted to place one of the two circuit boards 3300 retrieved from the stocker (not shown) in the buffer 1317 and mount the other of the two circuit boards 3300 retrieved from the stocker (not shown) to the qualified product 3000 of the two products 3000, when only one of the two products 3000 is qualified and both of the two circuit boards 3300 retrieved from the stocker (not shown) are qualified.
The inspection machine 1323 is adapted to inspect whether the product 3000 mounted with the circuit board 3300 is qualified.
The upper cover mounting module 1500 is adapted to mount the upper cover 3500 to a product 3000 mounted with a circuit board 3300.
The curing module 1700 is adapted to heat and cool the product 3000 with the upper cover 3500 mounted.
The seal ring installation module 1800 is adapted to install a seal ring 3700 to the heated and cooled product 3000.
An embodiment of the present invention further provides an electronic device assembling method, where the electronic device assembling system 1000 provided by the embodiment of the present invention is used to assemble a product 3000, two products 3000 are placed on a storage 1311 of the electronic device assembling system 1000, and a circuit board 3300 is placed on a stocker (not shown) of the electronic device assembling system 1000, including the following steps:
causing a sensor (not shown) of electronic device assembly system 1000 to monitor the number of memory circuit boards 3300 in buffer 1317 of electronic device assembly system 1000;
a detector (not shown) of the electronic equipment assembly system 1000 detects whether the two products 3000 are qualified;
when both products 3000 are qualified and the buffer 1317 stores two circuit boards 3300, the handler 1319 of the electronic device assembling system 1000 is caused to mount the two circuit boards 3300 stored by the buffer 1317 to the two products 3000;
causing handler 1319 to pick up two circuit boards 3300 from a magazine (not shown);
a detector (not shown) is used to detect whether the two circuit boards 3300 obtained from the stocker (not shown) are qualified;
when both of the two products 3000 and the two circuit boards 3300 retrieved from the stocker (not shown) are qualified, causing the handler 1319 to mount the two circuit boards 3300 retrieved from the stocker (not shown) to the two products 3000;
when both of the two products 3000 are qualified and only one of the two circuit boards 3300 retrieved from the stocker (not shown) is qualified, causing the handler 1319 to place the qualified circuit board 3300 of the two circuit boards 3300 retrieved from the stocker (not shown) in the buffer 1317 and retrieve the two circuit boards 3300 again from the stocker (not shown);
when only one of the two products 3000 is qualified and only one of the two circuit boards 3300 retrieved from the stocker (not shown) is qualified, causing the handler 1319 to mount the qualified circuit board 3300 of the two circuit boards 3300 retrieved from the stocker (not shown) to the qualified product 3000 of the two products 3000;
when only one of the two products 3000 is qualified and both of the two circuit boards 3300 retrieved from the stocker (not shown) are qualified, the handler 1319 is caused to place one of the two circuit boards 3300 retrieved from the stocker (not shown) in the buffer 1317 and mount the other of the two circuit boards 3300 retrieved from the stocker (not shown) to the qualified product 3000 of the two products 3000.
In a preferred embodiment of the present invention, the method for assembling an electronic device further comprises the steps of:
placing the unqualified circuit board 3300 on the feeder 1321 of the electronic device assembling system 1000 by the loader 1319;
causing the unloader 1321 to carry the rejected circuit board 3300 out of the circuit board mounting module 1300 of the electronic equipment mounting system 1000.
In a preferred embodiment of the present invention, the method for assembling an electronic device further comprises the steps of:
causing the feeder 1301 of the electronic device assembly system 1000 to take the undivided circuit board 3300 and transfer the undivided circuit board 3300 to the pin machine 1303 of the electronic device assembly system 1000;
causing the pin machine 1303 to mount electronic components on the circuit board 3300 and to transmit the circuit board 3300 on which the electronic components are mounted to the program burner 1305 of the electronic equipment mounting system 1000;
enabling the program burner 1305 to burn programs on the circuit board 3300 and transmitting the circuit board 3300 with the burned programs to the board separator 1307 of the electronic device assembling system 1000;
the board separator 1307 divides the circuit board 3300 and transfers the divided circuit board 3300 to a stocker (not shown);
the inspection machine 1323 is caused to inspect whether the product 3000 mounted with the circuit board 3300 is qualified.
In a preferred embodiment of the present invention, the method for assembling an electronic device further comprises the steps of:
a feeding robot 1110 of the electronic device assembling system 1000 is caused to acquire a product 3000 and place the product 3000 on a rotary marker 1130 of the electronic device assembling system 1000;
enabling the rotary marking device 1130 to mark the product 3000 and drive the product 3000 to rotate;
the flipper 1150 of the electronic device assembly system 1000 is caused to take the marked product 3000 from the rotary marker 1130 and place the product 3000 on the placement device 1311 by flipping, the placement device 1311 being placed on the transport track 1900 of the electronic device assembly system 1000 and adapted to be transported by the transport track 1900.
In a preferred embodiment of the present invention, the method for assembling an electronic device further comprises the steps of:
causing the upper cover mounting module 1500 of the electronic device mounting system 1000 to mount the upper cover 3500 to the product 3000 mounted with the circuit board 3300;
causing the curing module 1700 of the electronic device assembling system 1000 to heat and cool the product 3000 mounted with the upper cover 3500;
the seal ring installation module 1800 of the electronic device assembly system 1000 is caused to install the seal ring 3700 to the heated and cooled product 3000.
According to the circuit board mounting module, the electronic equipment mounting system and the electronic equipment mounting method provided by the embodiment of the invention, two circuit boards are mounted on two products each time, whether the circuit boards and the products are qualified or not is detected before mounting, the unused qualified circuit boards are temporarily stored by using the buffer, and the qualified circuit boards are mounted on the qualified products, so that the waste of materials is avoided, and the efficiency and the material utilization rate are considered.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A circuit board mounting module for mounting a circuit board (3300) to a product (3000) is characterized by comprising a stocker (1311), a stocker, a detector, a sensor, a buffer (1317), and a handler (1319),
the placing device (1311) is used for placing two products (3000),
the stocker is used for placing the circuit boards (3300),
said detector being adapted to detect whether said circuit board (3300) and said product (3000) are acceptable,
the sensor is adapted to monitor the number of the circuit boards (3300) stored by the buffer (1317),
the handler (1319) is adapted to mount the two circuit boards (3300) stored in the buffer (1317) to the two products (3000), respectively, when the two products (3000) are both qualified and the buffer (1317) stores the two circuit boards (3300);
the handler (1319) is further adapted to take two of the circuit boards (3300) from the stocker and mount the two circuit boards (3300) taken from the stocker to two of the products (3000) respectively when the two products (3000) and the two circuit boards (3300) taken from the stocker are both qualified; when both of the two products (3000) are qualified and only one of the two circuit boards (3300) retrieved from the stocker is qualified, storing the qualified circuit board (3300) of the two circuit boards (3300) retrieved from the stocker in the buffer (1317) and retrieving the two circuit boards (3300) from the stocker again; mounting the qualified circuit board (3300) of the two circuit boards (3300) retrieved from the stocker to the qualified product (3000) of the two products (3000) when only one of the two products (3000) is qualified and only one of the two circuit boards (3300) retrieved from the stocker is qualified; when only one of the two products (3000) is qualified and both of the two circuit boards (3300) taken from the stocker are qualified, one of the two circuit boards (3300) taken from the stocker is stored in the buffer (1317) and the other of the two circuit boards (3300) taken from the stocker is mounted to the qualified one of the two products (3000).
2. The circuit board mounting module according to claim 1, further comprising a downer (1321), wherein the handler (1319) is adapted to place the rejected circuit board (3300) on the downer (1321), and wherein the downer (1321) is adapted to carry out the rejected circuit board (3300).
3. The circuit board mount module of claim 1, further comprising a loader (1301), a pin machine (1303), a program writer (1305), a board separator (1307), and a tester (1323),
the feeder (1301) is adapted to take the circuit board (3300) undivided and transfer the undivided circuit board (3300) to the pin machine (1303),
the pin machine (1303) is adapted to mount electronic components on the circuit board (3300) and transfer the circuit board (3300) with the mounted electronic components to the program burner (1305),
the program burning machine (1305) is suitable for burning programs on the circuit board (3300) and transmitting the circuit board (3300) with the burned programs to the board dividing machine (1307),
the board separator (1307) is adapted to divide the circuit board (3300) and transfer the divided circuit board (3300) to the stocker,
the inspection machine (1323) is adapted to inspect whether the product (3000) on which the circuit board (3300) is mounted is qualified.
4. An electronic device assembly system, comprising a circuit board mounting module (1300) according to any one of claims 1-3, a loading module (1100) and a transport track (1900), wherein a placement device (1311) of the circuit board mounting module (1300) is placed on the transport track (1900) and adapted to be transported by the transport track (1900), wherein the transport track (1900) connects the loading module (1100) and the circuit board mounting module (1300), wherein the loading module (1100) comprises a loading robot (1110), a rotary marker (1130) and a flipper (1150), wherein the loading robot (1110) is adapted to take a product (3000) and place the product (3000) on the rotary marker (1130), wherein the rotary marker (1130) is adapted to mark the product (3000) and bring the product (3000) to rotation, the flipper (1150) obtains the marked product (3000) from the rotary marker (1130) and places the product (3000) on a placement tool (1311) of the circuit board mounting module (1300) by a flipping action.
5. The electronic device assembly system of claim 4, further comprising a top cover mounting module (1500), a curing module (1700), and a seal ring mounting module (1800), the transportation rail (1900) connecting the top cover module (1100), the circuit board mounting module (1300), the top cover mounting module (1500), the curing module (1700), and the seal ring mounting module (1800), the top cover mounting module (1500) being adapted to mount a top cover (3500) to the product (3000) with a circuit board (3300) mounted thereon, the curing module (1700) being adapted to heat and cool the product (3000) with the top cover (3500) mounted thereon, the seal ring mounting module (1800) being adapted to mount a seal ring (3700) to the heated and cooled product (3000).
6. An electronic equipment mounting method for mounting a product (3000) using an electronic equipment mounting system (1000) according to any one of claims 4 to 5, two of the products (3000) being placed on a rack (1311) of the electronic equipment mounting system (1000), and a circuit board (3300) being placed on a stocker of the electronic equipment mounting system (1000), comprising:
monitoring, by a sensor of the electronic equipment assembly system (1000), a number of the circuit boards (3300) stored by a buffer (1317) of the electronic equipment assembly system (1000);
detecting, by a detector of the electronic equipment assembly system (1000), whether two of the products (3000) are acceptable;
mounting, by a handler (1319) of the electronic equipment assembly system (1000), the two circuit boards (3300) stored in the buffer (1317) to the two products (3000) when the two products (3000) are both qualified and the buffer (1317) stores the two circuit boards (3300);
-taking two of said circuit boards (3300) from said magazine by means of said handler (1319);
-detecting, by means of said detector, whether two of said circuit boards (3300) are eligible for pick-up from said hopper;
mounting two of the circuit boards (3300) retrieved from the stocker to two of the products (3000) by the handler (1319) respectively when the two products (3000) and the two of the circuit boards (3300) retrieved from the stocker are both qualified;
when both of the two products (3000) are qualified and only one of the two circuit boards (3300) taken out from the stocker is qualified, placing the qualified circuit board (3300) of the two circuit boards (3300) taken out from the stocker in the buffer (1317) by the handler (1319) and taking out the two circuit boards (3300) from the stocker again;
when only one of the two products (3000) is qualified and only one of the two circuit boards (3300) retrieved from the stocker is qualified, causing the handler (1319) to mount the qualified circuit board (3300) of the two circuit boards (3300) retrieved from the stocker to the qualified product (3000) of the two products (3000);
when only one of the two products (3000) is qualified and both of the circuit boards (3300) taken out from the stocker are qualified, one of the two circuit boards (3300) taken out from the stocker is placed in the buffer (1317) by the handler (1319) and the other of the two circuit boards (3300) taken out from the stocker is mounted to the qualified one of the two products (3000).
7. The electronic device assembly method of claim 6, further comprising:
placing the unqualified circuit board (3300) on a feeder (1321) of the electronic equipment assembly system (1000) through the loader (1319);
and the unqualified circuit board (3300) is transported out of a circuit board mounting module (1300) of the electronic equipment assembly system (1000) through the feeder (1321).
8. The electronic device assembly method of claim 6, further comprising:
obtaining the circuit board (3300) which is not divided through a feeding machine (1301) of the electronic equipment assembly system (1000) and transmitting the circuit board (3300) which is not divided to a pin inserting machine (1303) of the electronic equipment assembly system (1000);
a program burning machine (1305) for mounting electronic components on the circuit board (3300) by the pin inserting machine (1303) and transferring the circuit board (3300) on which the electronic components are mounted to the electronic equipment mounting system (1000);
burning a program on the circuit board (3300) through the program burning machine (1305) and transmitting the circuit board (3300) with the burned program to a board dividing machine (1307) of the electronic equipment assembling system (1000);
dividing the circuit board (3300) by the board dividing machine (1307) and transmitting the divided circuit board (3300) to the stocker;
whether the product (3000) with the circuit board (3300) mounted thereon is qualified is detected by a detector (1323) of the electronic equipment assembling system (1000).
9. The electronic device assembly method of claim 6, further comprising:
-acquiring said product (3000) by a feeding robot (1110) of said electronic equipment assembly system (1000) and placing said product (3000) on a rotary marker (1130) of said electronic equipment assembly system (1000);
marking the product (3000) by the rotary marker (1130) and driving the product (3000) to rotate;
-taking the marked product (3000) from the rotary marker (1130) by means of a flipper (1150) of the electronic assembly system (1000) and-placing the product (3000) on the tote (1311) by means of a flipping action, -the tote (1311) being placed on a transport track (1900) of the electronic assembly system (1000) and adapted to be transported by the transport track (1900).
10. The electronic device assembly method of claim 6, further comprising:
mounting an upper cover (3500) to the product (3000) on which the circuit board (3300) is mounted by an upper cover mounting module (1500) of the electronic equipment mounting system (1000);
heating and cooling the product (3000) with the upper cover (3500) installed by a curing module (1700) of the electronic device assembly system (1000);
mounting a seal ring (3700) to the heated and cooled product (3000) by a seal ring mounting module (1800) of the electronic equipment assembly system (1000).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221072.4A CN111132535B (en) | 2020-03-26 | 2020-03-26 | Circuit board mounting module, electronic equipment assembling system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221072.4A CN111132535B (en) | 2020-03-26 | 2020-03-26 | Circuit board mounting module, electronic equipment assembling system and method |
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| CN111132535A CN111132535A (en) | 2020-05-08 |
| CN111132535B true CN111132535B (en) | 2020-07-10 |
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| JP6004973B2 (en) * | 2013-03-13 | 2016-10-12 | ヤマハ発動機株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| CN108282991B (en) * | 2017-12-30 | 2023-12-26 | 广东埃华路机器人工程有限公司 | Automatic PCB production line |
| CN109279290B (en) * | 2018-11-14 | 2024-06-25 | 昆山威典电子有限公司 | Position compensating reflux test line and process flow thereof |
| CN110809396A (en) * | 2019-12-11 | 2020-02-18 | 江苏长江智能制造研究院有限责任公司 | Automatic production line of circuit board |
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