CN111108816A

CN111108816A - Circuit board

Info

Publication number: CN111108816A
Application number: CN201880058828.9A
Authority: CN
Inventors: 西村功; 宫木伸行; 门田敏明; 藤冨晋太郎; 篠田智隆
Original assignee: JSR Corp
Current assignee: JSR Corp
Priority date: 2017-09-15
Filing date: 2018-09-10
Publication date: 2020-05-05
Also published as: EP3684146A4; EP3684146A1; US11582860B2; WO2019054335A1; JP2019054242A; TWI784050B; US20200344870A1; TW201921505A; KR20200054194A

Abstract

The invention provides a circuit board which has excellent smoothness and can reduce transmission loss of high-frequency electric signals. The circuit board of the present invention is characterized in that: the wiring part comprises a metal layer and a resin layer, the non-wiring part comprises a resin layer, the relative dielectric constant of the resin layer at 23 ℃ under the frequency of 10GHz is 2-3, and when the maximum value of the thickness in the wiring part is A (mum) and the minimum value of the thickness in the non-wiring part is B (mum), the relation of (A-B)/B being less than or equal to 0.1 is satisfied.

Description

Circuit board

Technical Field

The present invention relates to a circuit board including a wiring portion having a resin layer and a metal layer.

Background

With the recent increase in the performance of information terminal devices and the dramatic progress in network technology, the frequency of electrical signals handled in the field of information communication has been increasing for high-speed and large-capacity transmission. To cope with this, the printed wiring board used also transmits and processes high-frequency signals or high-speed digital signals, and has a low dielectric constant (low ∈) that reduces transmission loss, which is a problem_r) And low dielectric loss tangent (low tan δ) materials (see, for example, patent documents 1 to 4).

As a printed wiring board, a flexible printed circuit board (hereinafter, also referred to as "fpc" (flexible printed circuit)) or a flexible flat cable (hereinafter, also referred to as "ffc" (flexible cable)) is used in electronic and electric devices. The FPC is manufactured through the following steps: after a copper-clad laminate (CCL) including an insulator layer and a copper foil layer is processed to form an electric circuit, an adhesive portion including a Cap Layer (CL) including an insulator layer and an adhesive layer is mounted on the circuit portion in order to protect the circuit portion. The FFC is an electric circuit obtained by using a base material including an insulator layer and an adhesive layer and a conductor such as a copper foil formed in a wiring shape, and arranging and bonding a plurality of conductors between adhesive portions of the base material.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2014-197611

Patent document 2: japanese patent laid-open No. 2015-176921

Patent document 3: japanese patent laid-open publication No. 2016-087799

Patent document 4: japanese patent laid-open No. 2016-032098

Disclosure of Invention

Problems to be solved by the invention

However, the higher the frequency of the electric signal, the more easily the electric signal is attenuated, and the transmission loss tends to be large. Therefore, in the next-generation mounting substrate for high-frequency (10GHz or more), low dielectric loss characteristics for reducing crosstalk between wirings and low dielectric loss characteristics for suppressing transmission loss of electric signals are essential characteristics for the insulator material. In addition, in order to suppress transmission loss of an electric signal, it is also important that the mounting substrate has excellent smoothness. In particular, in FPC or FFC, an adhesive is used for laminating a resin layer and a metal layer, but the adhesive layer formed of the adhesive is considered to be a factor that impairs the low dielectric loss characteristics or smoothness of the mounting substrate.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a circuit board having excellent smoothness and capable of reducing transmission loss of a high-frequency signal.

Means for solving the problems

The present invention is made to solve at least part of the above problems, and can be realized in the following embodiments or application examples.

[ application example 1]

One embodiment of the circuit board of the present invention is characterized in that:

comprises a wiring part and a non-wiring part,

the wiring part has a metal layer and a resin layer,

the non-wiring portion has a resin layer,

a relative dielectric constant of 2 to 3 at a frequency of 10GHz of the resin layer at 23 ℃,

when the maximum value of the thickness in the wiring portion is A (mum) and the minimum value of the thickness in the non-wiring portion is B (mum),

satisfies the relationship of (A-B)/B being less than or equal to 0.1.

[ application example 2]

The circuit substrate according to application example 1, wherein

The metal layer and the resin layer in the wiring portion may be laminated in contact with each other.

[ application example 3]

The circuit substrate according to application example 1 or application example 2, wherein

The dielectric loss tangent at a frequency of 10GHz of the resin layer at 23 ℃ may be 0.001 to 0.01.

[ application example 4]

The circuit substrate according to any one of application examples 1 to 3, wherein

The elastic coefficient of the resin layer may be 0.1GPa to 3 GPa.

[ application example 5]

The circuit substrate according to any one of application examples 1 to 4, wherein

The peel strength between the resin layer and the metal layer may be 5N/cm or more.

[ application example 6]

The circuit substrate according to any one of application examples 1 to 5, wherein

The resin layer may have a thickness of 10 to 100 μm, and the metal layer may have a thickness of 10 to 50 μm.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the circuit board of the present invention, smoothness is excellent and transmission loss of high frequency signals can be reduced.

Drawings

Fig. 1 is a cross-sectional view schematically showing a circuit board according to the present embodiment.

FIG. 2 is a plan view taken along line C-C' of FIG. 1.

Fig. 3A is a cross-sectional view schematically showing step a1 in manufacturing example a of the laminate for high-frequency circuits.

Fig. 3B is a cross-sectional view schematically showing step a2 in manufacturing example a of the laminate for high-frequency circuits.

Fig. 3C is a cross-sectional view schematically showing step a3 in example a of manufacturing the laminate for high-frequency circuits.

Fig. 3D is a cross-sectional view schematically showing step a4 in example a of manufacturing the laminate for high-frequency circuits.

Fig. 4A is a cross-sectional view schematically showing step B1 in manufacturing example B of the laminate for high-frequency circuits.

Fig. 4B is a cross-sectional view schematically showing step B2 in manufacturing example B of the laminate for high-frequency circuits.

Fig. 4C is a cross-sectional view schematically showing step B3 in example B of manufacturing the laminate for high-frequency circuits.

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described in detail. The present invention is not limited to the embodiments described below, and it should be understood that the present invention also includes various modifications that are implemented within a scope not changing the gist of the present invention.

In the present specification, the numerical range described by "to" is used to include numerical values described before and after "to" as the lower limit value and the upper limit value.

1. Circuit board

Terms used in the present specification are defined as follows.

The "high-frequency signal" refers to an electric signal or radio wave having a frequency of 10GHz or more.

The "laminate for high-frequency circuits" is a laminate used for manufacturing high-frequency circuits that are driven at a frequency of 10GHz or more.

The "B-stage resin layer" refers to a layer in which the resin is in a semi-cured state.

The "C-stage resin layer" refers to a layer in which the resin is completely cured. In the present invention, the "C-stage resin layer" may be simply referred to as "resin layer".

In the present specification, the direction is defined as follows. In other words, three spatial axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. The vertical direction is a direction along the Z-axis direction (Z direction), the vertically downward direction is a-Z direction, and the vertically upward direction is a + Z direction. The plane perpendicular to the Z axis is set as an XY plane.

The circuit board of the present embodiment is characterized in that: the wiring part comprises a metal layer and a resin layer, the non-wiring part comprises a resin layer, the relative dielectric constant of the resin layer at 23 ℃ under the frequency of 10GHz is 2-3, and when the maximum value of the thickness in the wiring part is A (mum) and the minimum value of the thickness in the non-wiring part is B (mum), the relation of (A-B)/B being less than or equal to 0.1 is satisfied. Hereinafter, the circuit board according to the present embodiment will be described in detail with reference to the drawings.

Fig. 1 is a sectional view schematically showing a circuit board according to the present embodiment. Fig. 2 is a plan view taken along line C-C' of fig. 1. As shown in fig. 1, the circuit board 100 includes a resin layer 12 and a metal layer 14 on a substrate 10 (+ Z direction). In the example of fig. 1, since the resin layer 12 is laminated on the metal layer 14 (+ Z direction), the resin layer 14 existing above the metal layer 14 is in a state of being protruded in the + Z direction than the resin layers 14 other than the metal layer.

The substrate 10 is not particularly limited, and a multilayer circuit board may be used as the substrate when a multilayer circuit board is manufactured, in addition to a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, a fluororesin substrate, and the like.

In the circuit board of the present embodiment, the metal layer 14 and the portion of the resin layer 12 (i.e., the region 16) stacked above (in the + Z direction) the metal layer 14 shown in fig. 1 are defined as "wiring portions", and the portion of the resin layer 12 other than the wiring portions is defined as "non-wiring portions".

The circuit board of the present embodiment satisfies the relationship (A-B)/B.ltoreq.0.1, where A (μm) is the maximum value of the thickness in the wiring portion and B (μm) is the minimum value of the thickness in the non-wiring portion. (A-B) is Δ H in FIG. 1. (A-B)/B is preferably 0.09 or less, more preferably 0.08 or less, still more preferably 0.07 or less, still more preferably 0.06 or less, and particularly preferably 0.05 or less. In such a circuit board, the resin layer 12 stacked above the metal layer 14 (in the + Z direction) as a convex portion of the wiring portion does not have a large step, and the surface of the entire resin layer 14 is smooth. Therefore, even if circuit boards are laminated, high positioning accuracy can be satisfied, and a plurality of layers of circuits can be integrated.

In the present invention, when such a circuit board is laminated to produce a multilayer circuit board, the maximum value a (μm) of the thickness in the wiring portion and the minimum value B (μm) of the thickness in the non-wiring portion are also defined for each resin layer.

In the circuit board of the present embodiment, the metal layer 14 and the resin layer 12 are preferably laminated in contact with each other. That is, it is preferable that an adhesive layer such as an undercoat resin layer is not interposed between the metal layer and the resin layer. In a general circuit board, an adhesive layer is interposed between a resin layer and a metal layer in order to improve the adhesion between the metal layer having a conductive function and the resin layer having an insulating function. The adhesive layer is formed mainly by using an adhesive containing a polymer having a polar functional group by a method such as coating. However, since such an adhesive layer has poor electrical characteristics, the effective dielectric constant or effective dielectric loss of the resin layer having an insulating function is increased, and thus the adhesive layer is not suitable for a high-frequency circuit. In contrast, in the circuit board of the present embodiment, adhesion between the metal layer and the resin layer is good even without using an adhesive, and the circuit board suitable for a high-frequency circuit without deteriorating effective electrical characteristics of the resin layer is successfully obtained by laminating the metal layer and the resin layer in contact with each other.

The peel strength between the resin layer and the metal layer of the circuit board of the present embodiment is preferably 5N/cm or more, more preferably 5.3N/cm or more, and particularly preferably 6N/cm or more. The circuit board of the present embodiment has a peel strength in the above range, and therefore, the adhesion between the metal layer and the resin layer is good even without using an adhesive. The peel strength can be measured by the method described in IPC-TM-6502.4.9.

The configuration and manufacturing method of each layer constituting the circuit board of the present embodiment will be described in detail below.

1.1. Resin layer

The circuit board of the present embodiment includes a resin layer. The coefficient of elasticity of the resin layer is preferably 0.1GPa to 3GPa, more preferably 0.2GPa to 2.5 GPa. When the elastic modulus of the resin layer is in the above range, the circuit board has excellent flexibility, and thus the circuit board can be manufactured under more free conditions. Here, the elastic modulus of the resin layer is a tensile elastic modulus, and can be measured in accordance with Japanese Industrial Standards (JIS) K7161.

The resin layer has a relative dielectric constant of 2 to 3, preferably 2.1 to 2.8 at a frequency of 10GHz at 23 ℃. When the relative permittivity at 10GHz is within the above range, a circuit board having excellent high-frequency characteristics can be manufactured. The dielectric loss tangent of the resin layer at a frequency of 10GHz at 23 ℃ is preferably 0.001 to 0.01, more preferably 0.002 to 0.009. When the dielectric loss tangent at 10GHz is in the above range, a circuit board having more excellent high-frequency characteristics can be produced. The relative permittivity and the dielectric loss tangent at 10GHz were measured using a cavity resonator perturbation dielectric constant measuring apparatus.

The thickness of the resin layer is preferably 10 to 100. mu.m, more preferably 20 to 90 μm, and particularly preferably 25 to 80 μm.

In the invention of the present application, the resin layer also includes an embodiment including a plurality of different resin layers. When the resin layer includes a plurality of resin layers, the elastic modulus, the relative permittivity, and the dielectric loss tangent of each resin single layer are not necessarily limited to the preferred ranges described above, and may be set to the preferred ranges as a whole.

The method for producing such a resin layer is not particularly limited, but it can be produced by a method of applying the composition for a resin layer to a substrate such as a release layer or a metal foil, and performing extrusion molding to produce a self-supporting film.

The composition of the resin layer composition is not particularly limited as long as the resin layer obtained satisfies the above-mentioned relative dielectric constant, but preferably contains a polymer, a curable compound, a curing assistant and a solvent as required.

1.1.1. Composition for resin layer

< Polymer >

As the polymer that can be contained in the composition for a resin layer, for example, a known material having low dielectric constant and low dielectric loss tangent characteristics such as epoxy resin, polyimide, polyarylene, etc. can be suitably used, but particularly, a polymer having a repeating unit represented by at least one of the following formulae (1-1), (1-2), and (1-3), etc. can be preferably used.

[ solution 1]

[ formula (1-1) to formula (1-3) wherein R¹Independently represents a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a nitro group, a cyano group, a primary to tertiary amino group, or a salt of a primary to tertiary amino group. n is an integer of 0 to 2. In the case where n is 2, a plurality of R¹May be the same or different, or may be bonded in any combination to form a part of a ring structure ]

R¹Preferably a halogen atom, a monovalent hydrocarbon group having 1 to 6 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 6 carbon atoms, a nitro group, a cyano group, a primary to tertiary amino group, or a salt of a primary to tertiary amino group, and more preferably a fluorine atom, a chlorine atom, a methyl group, a nitro group, a cyano group, a tert-butyl group, a phenyl group, or an amino group. n is preferably 0 or 1, more preferably 0.

The position of one of the bonds of the repeating unit relative to the other bond is not particularly limited, and a meta-position is preferable from the viewpoint of improving the polymerization reactivity of the monomer providing the repeating unit. The repeating unit is preferably a structural unit represented by the formula (1-2) having a pyrimidine skeleton.

The polymer may optionally have a repeating unit other than the repeating unit represented by at least one of the above formulae (1-1), (1-2) and (1-3), but when the total of all the structural units in the polymer is 100 mol%, the content of the repeating unit represented by at least one of the formulae (1-1), (1-2) and (1-3) in the polymer is preferably 5 mol% to 95 mol%, more preferably 10 mol% to 60 mol%.

The method for synthesizing the polymer having the repeating unit represented by at least one of the above-mentioned formulae (1-1), (1-2) and (1-3) is not particularly limited, and a known method can be used. For example, the compound can be synthesized by heating a monomer providing a repeating unit represented by at least one of the above formulae (1-1), (1-2) and (1-3) and optionally another monomer in an organic solvent together with an alkali metal or the like.

The lower limit of the weight average molecular weight (Mw) of the polymer having the repeating unit represented by at least one of the above-mentioned formulae (1-1), (1-2) and (1-3) is preferably 500, more preferably 1,000, still more preferably 10,000, and particularly preferably 30,000. The upper limit of the weight average molecular weight (Mw) is preferably 600,000, more preferably 400,000, still more preferably 300,000, and particularly preferably 200,000.

The lower limit of the glass transition temperature (Tg) of the polymer having the repeating unit represented by at least one of the formulae (1-1), (1-2) and (1-3) is preferably 150 ℃ and more preferably 180 ℃. The upper limit of the glass transition temperature (Tg) is preferably 320 ℃ and more preferably 300 ℃.

The polymer preferably further has a repeating unit represented by the following general formula (2).

[ solution 2]

(in the formula (2), R³And R⁴Independently represents a halogen atom, a nitro group, a cyano group or a monovalent organic group having 1 to 20 carbon atoms, c and d independently represent an integer of 0 to 8, e, f and y independently represent an integer of 0 to 2, L represents a single bond, -O-, -S-, -CO-, -SO-, -SO₂Or a divalent organic group having 1 to 20 carbon atoms)

As R³And R⁴Examples of the halogen atom include: fluorine atom, chlorine atom, bromine atom, iodine atom, etc.

As R³And R⁴Examples of the monovalent hydrocarbon group having 1 to 20 carbon atoms include: monovalent chain hydrocarbon groups, monovalent alicyclic hydrocarbon groups, monovalent aromatic hydrocarbon groups, and the like.

Examples of the monovalent chain hydrocarbon group include: an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, or an n-pentyl group; alkenyl groups such as vinyl, propenyl, butenyl and pentenyl; alkynyl groups such as ethynyl, propynyl, butynyl and pentynyl.

Examples of the monovalent alicyclic hydrocarbon group include: monocyclic cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl and cyclohexyl; polycyclic cycloalkyl groups such as norbornyl and adamantyl; monocyclic cycloalkenyl such as cyclopropenyl, cyclobutenyl, cyclopentenyl and cyclohexenyl; and polycyclic cycloalkenyl groups such as norbornenyl.

Examples of the monovalent aromatic hydrocarbon group include: aryl groups such as phenyl, tolyl, xylyl, naphthyl, and anthracenyl; aralkyl groups such as benzyl, phenethyl, phenylpropyl, and naphthylmethyl.

As R³And R⁴Examples of the monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms include those represented by R as represented by a halogen atom such as a fluorine atom, chlorine atom, bromine atom, iodine atom and the like³And R⁴Examples of the group include groups in which hydrogen atoms of monovalent hydrocarbon groups having 1 to 20 carbon atoms are partially or completely substituted.

Examples of the divalent organic group having 1 to 20 carbon atoms represented by L include: a divalent chain hydrocarbon group having 1 to 20 carbon atoms, a divalent fluorinated chain hydrocarbon group having 1 to 20 carbon atoms, a divalent aromatic hydrocarbon group having 6 to 20 carbon atoms, a divalent fluorinated aromatic hydrocarbon group having 6 to 20 carbon atoms, or the like.

Examples of the divalent chain hydrocarbon group include: methylene, ethylene, n-propylene, isopropylene, n-butylene, sec-butylene, tert-butylene, neopentylene, 4-methyl-pentane-2, 2-diyl, nonane-1, 9-diyl, and the like.

Examples of the divalent alicyclic hydrocarbon group include: monocyclic cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl and cyclohexyl; polycyclic cycloalkyl groups such as norbornyl and adamantyl; monocyclic cycloalkenyl such as cyclopropenyl, cyclobutenyl, cyclopentenyl and cyclohexenyl; and polycyclic cycloalkenyl groups such as norbornenyl.

Examples of the divalent aromatic hydrocarbon group include: aryl groups such as phenyl, tolyl, xylyl, naphthyl, and anthracenyl; aralkyl groups such as benzyl, phenethyl, phenylpropyl, and naphthylmethyl.

Examples of such polymers include those described in Japanese patent laid-open Nos. 2015-209511, 2016/143447, 2017-024725 and 2018-024827.

The content of the polymer in the resin layer composition is preferably 10 parts by mass or more and 90 parts by mass or less with respect to 100 parts by mass of the total of the curable compound and the polymer, which will be described later.

< curable Compound >

The curable compound is a compound that is cured by irradiation with heat or light (for example, visible light, ultraviolet light, near infrared light, far infrared light, electron beam, or the like), and may be one that requires a curing aid described later. Examples of such a curable compound include: epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, acrylic compounds, methacrylic compounds, urethane compounds. These may be used alone or in combination of two or more. Among these, from the viewpoint of characteristics such as compatibility with the polymer and heat resistance, at least one of an epoxy compound, a cyanate ester compound, a vinyl compound, a silicone compound, an oxazine compound, a maleimide compound, and an allyl compound is preferable, and at least one of an epoxy compound, a cyanate ester compound, a vinyl compound, an allyl compound, and a silicone compound is more preferable.

The content ratio of the curable compound in the resin layer composition is preferably 10 parts by mass or more and 90 parts by mass or less, and more preferably 20 parts by mass or more and 80 parts by mass or less, with respect to 100 parts by mass of the resin layer composition.

Hardening aid

Examples of the curing aid include polymerization initiators such as photoreaction initiators (photo radical generators, photo acid generators, and photobase generators). Specific examples of the curing assistant include: onium salt compounds, sulfone compounds, sulfonate compounds, sulfonimide compounds, disulfonyl diazomethane compounds, disulfonyl methane compounds, oxime sulfonate compounds, hydrazine sulfonate compounds, triazine compounds, nitrobenzyl compounds, benzyl imidazole compounds, organic halides, metal salts of octylic acid, disulfones, and the like. These curing aids may be used singly or in combination of two or more kinds, regardless of the kind.

The content ratio of the curing aid in the resin layer composition is preferably 5 parts by mass or more and 20 parts by mass or less, and more preferably 5 parts by mass or more and 10 parts by mass or less, with respect to 100 parts by mass of the resin layer composition.

< solvent >

The composition for the resin layer may optionally contain a solvent. Examples of the solvent include amide solvents such as N, N-dimethylacetamide, N-dimethylformamide, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, and 1, 3-dimethyl-2-imidazolidinone; ester solvents such as γ -butyrolactone and butyl acetate; ketone solvents such as cyclopentanone, cyclohexanone, methyl ethyl ketone, and benzophenone, ether solvents such as 1, 2-methoxyethane and diphenyl ether, and polyfunctional solvents such as 1-methoxy-2-propanol and propylene glycol methyl ether acetate; examples of the sulfone solvent such as sulfolane, dimethyl sulfoxide, diethyl sulfoxide, dimethyl sulfone, diethyl sulfone, diisopropyl sulfone and diphenyl sulfone include methylene chloride, benzene, toluene, xylene, dialkoxybenzene (having 1 to 4 carbon atoms in the alkoxy group), trialkoxybenzene (having 1 to 4 carbon atoms in the alkoxy group), and the like. These solvents may be used alone or in combination of two or more.

When the composition for a resin layer contains a solvent, the amount is preferably 2000 parts by mass or less, and more preferably 200 parts by mass or less, per 100 parts by mass of the composition for a resin layer excluding the solvent.

< other ingredients >

The composition for the resin layer may contain other components as necessary. Examples of the other components include: antioxidants, reinforcing agents, lubricants, flame retardants, antibacterial agents, colorants, mold release agents, foaming agents, polymers other than the above-mentioned polymers, and the like.

< preparation method of composition for resin layer >

The method for producing the composition for a resin layer is not particularly limited, and for example, the composition can be produced by uniformly mixing a polymer, a curable compound, and other additives (for example, other components such as a curing aid, a solvent, and an antioxidant) as needed. The composition may be in the form of liquid, paste, or the like.

1.2. Metal layer

The circuit board of the present embodiment includes a metal layer. The metal layer is preferably a metal foil or a sputtered film. The metal foil is preferably a copper foil. The copper foil may be electrolytic foil or rolled foil, and any of them may be used.

The surface roughness Ra of the metal layer is preferably 10nm to 300nm, more preferably 30nm to 200nm, and particularly preferably 30nm to 100 nm. When the surface roughness Ra of the metal layer is in the above range, the adhesion between the resin layer and the metal layer can be further improved when the circuit board of the present embodiment is manufactured. Further, the thickness of the circuit board in the plane can be made more uniform, and peeling of the resin layer and the metal layer can be suppressed when the circuit board is wound into a roll. The surface roughness Ra of the metal layer is an "arithmetic mean roughness" measured according to JIS B0601-2001.

The thickness of the metal layer is preferably 3 μm to 50 μm, more preferably 5 μm to 40 μm, and particularly preferably 7 μm to 35 μm.

When a metal foil is used as the metal layer, the metal foil may be thinned as it is if the surface roughness Ra of the metal foil falls within the above-described range, but a metal foil whose surface is subjected to a physical or chemical treatment to control the surface roughness Ra to fall within the above-described range may be used. As a method for controlling the surface roughness of the metal foil, there are methods such as etching treatment (acid treatment or the like), laser treatment, electrolytic plating, electroless plating, sputtering treatment, sandblasting, and the like performed on the metal foil, but the method is not limited to these.

1.3. Method for manufacturing circuit board

A circuit board such as an FPC can be manufactured using a laminate for a high-frequency circuit in which a metal layer and a resin layer are laminated. The method for producing the laminate for a high-frequency circuit is not particularly limited as long as the resin layer and the metal layer can be laminated in contact with each other. The term "the resin layer is in contact with the metal layer" is not limited to the case where one surface of the resin layer is in contact with the metal layer over the entire surface thereof, and includes the case where at least a part of one surface of the resin layer is in contact with the metal layer.

The thickness of the laminate for a high-frequency circuit used in the present embodiment is preferably 50 μm to 200 μm, more preferably 60 μm to 180 μm, and particularly preferably 70 μm to 150 μm. When the thickness of the high-frequency circuit laminate is within the above range, not only a high-frequency circuit board that is thinned can be manufactured, but also a winding wrinkle is less likely to occur when the laminate is wound around a winding core.

Hereinafter, preferred production examples of the laminate for a high-frequency circuit will be described.

< production example A >

Fig. 3A to 3D are views schematically showing cross sections in the respective steps of production example a. Production example a will be described with reference to fig. 3A to 3D.

(step A1)

As shown in fig. 3A, a "B-stage resin layer/release layer laminate" (also referred to as a "B-stage sheet") is produced by applying the composition for a resin layer on the release layer 20 and forming a B-stage resin layer 22. As the release layer 20, a known film such as a polyethylene terephthalate (PET) film can be used. The PET film is not particularly limited, and for example, fannpul robusta (panaprotection) MK38S manufactured by fanakg (Panac) gmbh, and the like can be used. The resin layer composition can be applied by a known coating method, and is preferably applied by adjusting the film thickness using a bar coater, for example.

After the release layer 20 is coated with the resin layer composition in this manner, the B-stage resin layer 22 in a semi-cured state is preferably formed using a known heating mechanism such as an oven. The heating temperature is preferably 50 to 150 ℃, more preferably 70 to 130 ℃. The heating may be performed in two stages, for example, at 50 to 100 ℃ and 100 to 150 ℃. The total heating time is preferably less than 30 minutes, and more preferably less than 20 minutes. By heating under the conditions of temperature and time in the above range, the B-stage resin layer 22 having high film thickness uniformity can be produced, and by suppressing the deterioration of the release layer 20, the release layer 20 can be satisfactorily released in the production process.

The surface roughness Ra of the B-stage resin layer 22 exposed on the surface is preferably 1nm to 100nm, more preferably 10nm to 50 nm. When the surface roughness Ra of the B-stage resin layer 22 is in the above range, the adhesion between the resin layer and the metal layer or the resin layer can be further improved in the case of producing the laminate for a high-frequency circuit. The surface roughness Ra of the B-stage resin layer in the present invention is an "arithmetic mean roughness" measured according to JIS B0601-2001.

The maximum value of the elastic modulus (MPa) of the B-stage resin layer 22 at 50 ℃ or higher and less than 80 ℃ under the measurement condition of 1Hz is preferably 1MPa or higher, and more preferably 3MPa or higher. The minimum value of the elastic modulus (MPa) in the temperature range of 80 ℃ to 200 ℃ is preferably 20MPa or less, and more preferably 15MPa or less. When the B-stage resin layer has an elastic modulus in each temperature range, unevenness of the wiring portion and the non-wiring portion can be suppressed and transmission loss can be suppressed in the case of manufacturing the high-frequency circuit laminate by hot pressing.

(step A2)

As shown in fig. 3B, the exposed resin layer surface 23 of the "B-stage resin layer/release layer laminate" produced in step a1 is bonded to the metal layer 24 to produce a "metal layer/B-stage resin layer/release layer laminate". The surface roughness Ra of the metal layer 24 bonded to the resin layer surface 23 is preferably 10nm to 300nm, more preferably 30nm to 200nm, and particularly preferably 30nm to 100 nm.

It is preferable that the resin layer surface 23 of the "B-stage resin layer/release layer laminate" is superposed on the metal layer 24 at the time of bonding, and then heat-pressure bonded using a heated roller (also referred to as "heat roller" in the present specification) or the like. The linear load at the time of heat-pressure bonding is preferably 1kN/m to 19kN/m, more preferably 5kN/m to 18 kN/m. The temperature for the heat-pressure bonding is preferably 50 to 200 ℃, more preferably 50 to 150 ℃, and particularly preferably 70 to 130 ℃.

In step a2, the "metal layer/B-stage resin layer/release layer laminate" immediately after bonding may be brought into contact with a heated roller or passed through a heating furnace to perform an annealing treatment. Such annealing treatment may be carried out at a temperature not lower than the melting point of the resin, and is preferably 100 to 250 ℃, and more preferably 110 to 230 ℃. The heating time is not particularly limited, but is preferably 5 seconds to 600 seconds, and more preferably 10 seconds to 300 seconds. By performing the annealing treatment using a hot roll for a short time of, for example, about 5 seconds to 600 seconds, a B-stage resin layer having high film thickness uniformity can be produced, and the peeling layer can be favorably peeled in the production step by suppressing the deterioration of the peeling layer. The "continuing the metal layer/B-stage resin layer/release layer laminate" immediately after the lamination "is a step of continuing the in-line treatment after the lamination treatment without taking out the laminated laminate from the production line in which the lamination of the laminate is performed.

(step A3)

As shown in fig. 3C, the release layer 20 is peeled from the "metal layer/B-stage resin layer/release layer laminate" produced in step a2, and the exposed resin layer face 21 is bonded to the metal foil 26 as necessary. When the release layer 20 is peeled from the "metal layer/B-stage resin layer/release layer laminate" and the exposed B-stage resin layer surface 21 is bonded to the metal layer 26, it is preferable that the exposed resin layer surface 21 and the metal layer 26 are superposed on each other and further heated and pressure-bonded using a heat roll or the like. The heat crimping is preferably under the same conditions as in step a 2.

The surface roughness Ra of the resin layer surface 21 exposed by peeling the release layer 20 from the "metal layer/B-stage resin layer/release layer laminate" is preferably 1nm to 100nm, more preferably 10nm to 50 nm. When the surface roughness Ra of the B-stage resin layer is in the above range, the adhesion between the resin layer and the metal layer or the resin layer can be further improved in the case of producing the laminate for a high-frequency circuit.

(step A4)

As shown in fig. 3D, the B-stage resin layer 22 is cured to form the C-stage resin layer 28, whereby the high-frequency circuit laminate 200 is obtained. In order to cure the B-stage resin layer 12, the laminate obtained in step a3 is preferably heated at 50 to 200 ℃, more preferably 100 to 200 ℃ using a known heating mechanism such as an oven. The heating may be performed in two stages, for example, at 50 to 100 ℃ and 100 to 200 ℃. The heating time is preferably less than 5 hours, and more preferably less than 3 hours. By heating at a temperature and time within the above ranges, a C-stage resin layer having high uniformity of film thickness can be produced by curing the B-stage resin layer.

< production example B >

Fig. 4A to 4C are views schematically showing cross sections in the respective steps of production example B. Production example B will be described with reference to fig. 4A to 4C.

(step B1)

As shown in fig. 4A, a "metal layer/B-stage resin layer laminate" is produced by applying a resin layer composition to a metal layer 30 and forming a B-stage resin layer 32. The resin layer composition can be applied by a known coating method, and is preferably applied by adjusting the film thickness using a bar coater, for example.

After the composition for a resin layer is applied to the metal layer 30 in this manner, the B-stage resin layer 32 in a semi-cured state is preferably formed using a known heating mechanism such as an oven. The heating temperature is preferably 50 to 150 ℃, more preferably 70 to 130 ℃. The heating may be performed in two stages, for example, at 50 to 100 ℃ and 100 to 150 ℃. The total heating time is preferably less than 30 minutes, and more preferably less than 20 minutes. By heating at the temperature and time within the above ranges, the B-stage resin layer 32 having high film thickness uniformity can be produced.

(step B2)

As shown in fig. 4B, the metal layer 34 is bonded to the exposed resin layer surface 33 of the "metal layer/B-stage resin layer laminate" produced in step B1 to produce a "metal layer/B-stage resin layer/metal layer laminate". When the metal layer 34 is bonded to the exposed resin layer surface 33, it is preferable that the exposed resin layer surface 33 and the metal layer 34 are stacked on each other and then heated and pressure-bonded using a heat roll or the like. The heat crimping is preferably performed under the same conditions as in the step a 2.

In step B2, the "metal layer/B-stage resin layer/metal layer" immediately after bonding may be brought into contact with a heated roller or passed through a heating furnace to perform an annealing treatment. The annealing treatment is preferably the same conditions as in the step a 2.

The surface roughness Ra of the exposed resin layer surface 33 is preferably 1nm to 100nm, more preferably 10nm to 50 nm. When the surface roughness Ra of the B-stage resin layer is in the above range, the adhesion between the resin layer and the metal layer can be further improved in the case of producing a laminate for a high-frequency circuit. The surface roughness Ra of the metal layer 34 bonded to the resin layer surface 33 is preferably 10nm to 300nm, more preferably 30nm to 200nm, and particularly preferably 30nm to 100 nm.

(step B3)

As shown in fig. 4C, the B-stage resin layer 32 is cured to form a C-stage resin layer 36, whereby a high-frequency circuit laminate 300 is obtained. In step B3, the "metal layer/B-stage resin layer/metal layer laminate" produced in step B2 is preferably heated at 50 to 200 ℃, more preferably 100 to 200 ℃, using a known heating means such as an oven. The heating may be performed in two stages, for example, at 50 to 100 ℃ and 100 to 200 ℃. The heating time is preferably less than 5 hours, and more preferably less than 3 hours. By heating at the temperature and time within the above ranges, the C-stage resin layer 36 having high uniformity of film thickness can be produced by curing the B-stage resin layer 32.

The laminate for high-frequency circuits obtained in the above manner can be used for manufacturing a circuit substrate such as an FPC. In such a circuit board, the multilayer body for a high-frequency circuit has at least a part of a multilayer structure, and transmission loss can be reduced even when the circuit board is driven at a high frequency. Such a circuit board may be produced by a known method as long as the laminate for a high-frequency circuit is included as a part of the laminate structure, and may be produced by applying a production process described in, for example, international publication No. 2012/014339 and japanese patent application laid-open No. 2009-231770.

Specifically, the multilayer body for a high-frequency circuit is laminated, or a metal layer of the multilayer body for a high-frequency circuit is patterned by etching, perforated, or cut into a desired size, whereby a circuit board can be manufactured.

Since such a circuit board does not have an adhesive layer interposed therebetween, the resin layer of the metal-clad wiring layer as the projection does not have a large step and the surface of the resin layer is smooth. Therefore, even if the circuits are laminated, high positioning accuracy can be satisfied, and a plurality of layers of circuits can be integrated.

Such a circuit board can be manufactured, for example, by the following steps:

step (a): a step of forming a resin layer by laminating a resin film on a circuit board,

Step (b): a step of flattening the resin layer by heating and pressurizing,

Step (c): and forming a circuit layer on the resin layer.

The method for laminating the resin film on the circuit substrate in the step (a) is not particularly limited, and examples thereof include a method of laminating by using a multi-stage press, a vacuum press, an atmospheric pressure laminator, a laminator which heats and pressurizes under vacuum, and the like, and a method of using a laminator which heats and pressurizes under vacuum is preferable. Thus, even if the circuit board has a fine wiring circuit on the surface, the circuit board can be embedded with resin without any gap between the circuits. The lamination conditions are not particularly limited, but it is preferable that the pressure bonding temperature is 70 to 130 ℃ and the pressure bonding pressure is 1kgf/cm²～11kgf/cm²Under reduced pressure or vacuumAnd (5) laminating. The lamination may be batch type, and may also be continuous type using a roll.

The circuit board is not particularly limited, and a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, a fluororesin substrate, or the like can be used. The circuit surface of the circuit board on which the resin film is laminated may be roughened in advance. The number of circuit layers of the circuit board is not limited. For example, when a printed wiring board for millimeter wave radar is manufactured, 2 to 20 layers or the like can be freely selected according to the design.

In the step (b), the resin film and the circuit board laminated in the step (a) are heated and pressed to be planarized. The conditions are not particularly limited, but the temperature is preferably 100 to 250 ℃, the pressure is preferably 0.2 to 10MPa, and the time is preferably 30 to 120 minutes, and more preferably 150 to 220 ℃.

In the step (c), a circuit layer is formed on the resin layer prepared by heating and pressing the resin film and the circuit board. The method for forming the circuit layer formed on the resin layer in the above manner is not particularly limited, and the circuit layer can be formed by, for example, an etching method such as a subtractive method, a semi-additive method, or the like.

The subtractive method is as follows: an etching resist layer having a shape corresponding to a desired pattern shape is formed on the metal layer, and the metal layer in the portion where the resist is removed is dissolved and removed with a chemical solution by a subsequent developing process, thereby forming a desired circuit.

The semi-addition method is as follows: a metal coating is formed on the surface of the resin layer by electroless plating, a plating resist layer having a shape corresponding to a desired pattern is formed on the metal coating, a metal layer is formed by electrolytic plating, and thereafter, unnecessary electroless plating is removed by a chemical solution or the like, thereby forming a desired circuit layer.

In addition, a hole such as a through hole may be formed in the resin layer as necessary. The method of forming the holes is not limited, and NC drilling, carbon dioxide laser, UV laser, YAG laser, plasma, or the like can be applied.

2. Examples of the embodiments

The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In examples and comparative examples, "part(s)" and "%" are based on mass unless otherwise specified.

2.1. Synthesis of Polymer

< Synthesis example 1 >

1, 1-bis (4-hydroxyphenyl) -3,3, 5-trimethylcyclohexane (BisTMC) (18.6g, 60.0mmol), 4, 6-dichloropyrimidine (Pym) (8.9g, 60.0mmol) and potassium carbonate (11.1g, 81.0mmol) were charged into a four-neck separable flask equipped with a stirrer, N-methyl-2-pyrrolidone (64g) was added, and the mixture was reacted at 130 ℃ for 6 hours under a nitrogen atmosphere. After completion of the reaction, N-methyl-2-pyrrolidone (368g) was added, and after removing salts by filtration, the solution was poured into methanol (9.1 kg). The precipitated solid was separated by filtration, washed with a small amount of methanol, again separated by filtration and recovered, and then dried at 120 ℃ for 12 hours under reduced pressure using a vacuum drier to obtain a polymer P-1 having a structural unit represented by the following formula (P-1) (yield; 20.5g, yield; 90%, weight-average molecular weight (Mw); 32,000, glass transition temperature (Tg); 206 ℃).

[ solution 3]

The glass transition temperature (Tg) was measured at a frequency of 1Hz and a temperature rise rate of 10 ℃/min using a dynamic viscoelasticity measuring apparatus (product of Seiko instruments, Ltd. "DMS 7100") and the loss tangent was extremely high. The loss tangent is a value obtained by dividing the storage modulus of elasticity by the loss modulus of elasticity.

The weight average molecular weight (Mw) was measured under the following conditions using a Gel Permeation Chromatograph (GPC) apparatus ("HLC-8320" from tokoa).

The column is prepared by connecting TSK gel α -M of Tosoh corporation and TSK gel protection column α of Tosoh corporation

Developing solvent: n-methyl-2-pyrrolidone

Temperature of the pipe column: 40 deg.C

Flow rate: 1.0mL/min

Sample concentration: 0.75% by mass

Sample injection amount: 50 μ L

A detector: differential refractometer

Standard substance: monodisperse polystyrene

< Synthesis example 2 >

1, 1-bis (4-hydroxyphenyl) -3,3, 5-trimethylcyclohexane (BisTMC) (10.7g, 34.5mmol), 3, 6-dichloropyridazine (Pyd) (5.1g, 34.2mmol) and potassium carbonate (6.5g, 47.0mmol) were charged in a four-neck separable flask equipped with a stirrer, N-methyl-2-pyrrolidone (36g) was added, and the mixture was reacted at 145 ℃ for 9 hours under a nitrogen atmosphere. After completion of the reaction, N-methyl-2-pyrrolidone (150g) was added to dilute the solution, and after removing salts by filtration, the solution was poured into methanol (3 kg). The precipitated solid was separated by filtration, washed with a small amount of methanol, separated by filtration again and recovered, and then dried under the same conditions as in Synthesis example 1 to obtain Polymer P-2 having a structural unit represented by the following formula (P-2) (yield 7.6g, yield 48%, weight-average molecular weight (Mw); 30,000, glass transition temperature (Tg); 232 ℃). The weight average molecular weight and the glass transition temperature were measured in the same manner as in synthesis example 1.

[ solution 4]

< Synthesis example 3 >

1, 1-bis (4-hydroxyphenyl) -3,3, 5-trimethylcyclohexane (BisTMC) (18.6g, 60.0mmol), 4, 6-dichloro-2-phenylpyrimidine (PhPym) (13.7g, 61.1mmol) and potassium carbonate (11.4g, 82.5mmol) were charged in a four-neck separable flask equipped with a stirrer, and N-methyl-2-pyrrolidone (75g) was added and reacted at 130 ℃ for 6 hours under a nitrogen atmosphere. After completion of the reaction, N-methyl-2-pyrrolidone (368g) was added to dilute the solution, and after removing salts by filtration, the solution was poured into methanol (9.1 kg). The precipitated solid was separated by filtration, washed with a small amount of methanol, separated by filtration again and recovered, and then dried under the same conditions as in Synthesis example 1 to obtain Polymer P-3 having a structural unit represented by the following formula (P-3) (yield 20.5g, yield 90%, weight-average molecular weight (Mw); 187,000, glass transition temperature (Tg); 223 ℃). The weight average molecular weight and the glass transition temperature were measured in the same manner as in synthesis example 1.

[ solution 5]

< Synthesis example 4 >

1, 1-bis (4-hydroxyphenyl) -3,3, 5-trimethylcyclohexane (BisTMC) (12.4g, 40.0mmol), 2-bis (4-hydroxyphenyl) -propane (BisA) (2.3g, 10.0mmol), 1-bis (4-hydroxyphenyl) -nonane (BisP-DED) (3.3g, 10.0mmol), 4, 6-dichloro-2-phenylpyrimidine (PhPym) (13.7g, 61.1mmol), and potassium carbonate (11.4g, 82.5mmol) were charged into a four-neck separable flask equipped with a stirrer, and N-methyl-2-pyrrolidone (75g) was added thereto and reacted at 130 ℃ for 6 hours under a nitrogen atmosphere. After completion of the reaction, N-methyl-2-pyrrolidone (368g) was added to dilute the solution, and after removing salts by filtration, the solution was poured into methanol (9.1 kg). The precipitated solid was separated by filtration, washed with a small amount of methanol, separated by filtration again and recovered, and then dried under the same conditions as in Synthesis example 1 to obtain Polymer P-4 having a structural unit represented by the following formula (P-4) (yield 23.5g, yield 87%, weight-average molecular weight (Mw); 165,000, glass transition temperature (Tg); 196 ℃ C.). The weight average molecular weight and the glass transition temperature were measured in the same manner as in synthesis example 1.

[ solution 6]

< Synthesis example 5 >

1, 1-bis (4-hydroxyphenyl) -3,3, 5-trimethylcyclohexane (BisTMC) (12.4g, 40.0mmol), 4' - (1, 3-dimethylbutylidene) bisphenol (BisP-MIBK) (2.7g, 10.0mmol), 1-bis (4-hydroxyphenyl) -nonane (BisP-DED) (3.3g, 10.0mmol), 4, 6-dichloro-2-phenylpyrimidine (PhPym) (13.7g, 61.1mmol), and potassium carbonate (11.4g, 82.5mmol) were charged in a four-neck separable flask equipped with a stirrer, N-methyl-2-pyrrolidone (75g) was added, and the reaction was carried out at 130 ℃ for 6 hours under a nitrogen atmosphere. After completion of the reaction, N-methyl-2-pyrrolidone (368g) was added to dilute the solution, and after removing salts by filtration, the solution was poured into methanol (9.1 kg). The precipitated solid was separated by filtration, washed with a small amount of methanol, separated by filtration again and recovered, and then dried under the same conditions as in Synthesis example 1 to obtain Polymer P-5 having a structural unit represented by the following formula (P-5) (yield 23.8g, yield 88%, weight-average molecular weight (Mw); 157,000, glass transition temperature (Tg); 190 ℃). The weight average molecular weight and the glass transition temperature were measured in the same manner as in synthesis example 1.

[ solution 7]

2.2. Example 1

2.2.1. production of B-stage resin layer/Release layer laminate

A composition for a resin layer was prepared by mixing 50 parts of polymer P-1, 50 parts of 2,2' -bis (4-cyanophenyl) propane (manufactured by Tokyo chemical Co., Ltd.) as a hardening compound, 5 parts of 1-benzyl-2-methylimidazole (manufactured by Mitsubishi chemical Co., Ltd., product name "BMI 12") as a hardening assistant, and 160 parts of cyclopentanone.

The prepared composition for a resin layer was applied to a PET film (Teijin tetoron film) G2 having a thickness of 100 μm, which is a release layer, using a bar coater so that the cured film thickness became 25 μm, and was heated at 70 ℃ for 10 minutes using an oven and then at 130 ℃ for 10 minutes, thereby obtaining a "B-stage resin layer/release layer laminate" in which a B-stage resin layer was laminated on a PET film.

< surface roughness Ra >

The surface of the resin layer of the thus obtained "B-stage resin layer/release layer laminate" was measured using a white interference microscope (New View)5032 manufactured by Zhazhika (ZYGO), and the "arithmetic average roughness" calculated for a range of 10 μm × 10 μm in accordance with JIS B0601-2001 was defined as the surface roughness Ra. The results are shown in table 1.

< determination of elastic modulus of resin layer at 50 ℃ to 200 >

The release layer (PET film) was peeled from the obtained "B-stage resin layer/release layer laminate", a test piece (3 mm wide × 2cm long) was cut out, and the maximum value of the modulus of elasticity (MPa) in the temperature range of 50 ℃ to less than 80 ℃ and the minimum value of the modulus of elasticity (MPa) in the temperature range of 80 ℃ to 200 ℃ were measured under the measurement conditions of 1Hz and 10 ℃/min using a DMS tester (manufactured by Seiko Instruments). The results are shown in table 1.

2.2.2. Production of Metal layer/B-stage resin layer/Release layer laminate

A copper foil (model number "TQ-M4-VSP", manufactured by Mitsui metals Co., Ltd., surface roughness 110nm) having a thickness of 18 μ M was superimposed on the exposed resin layer of the obtained "B-stage resin layer/release layer laminate", and was pressed by a hot roll at 150 ℃ under a linear load of 10kN/M, thereby producing a "metal layer/B-stage resin layer/release layer laminate" having a laminate structure of copper foil/B-stage resin layer/PET film. The surface roughness Ra of the copper foil was measured using a white interference microscope (New View 5032 manufactured by zhaka kogaku corporation), and the "arithmetic average roughness" calculated for a range of 10 μm × 10 μm in accordance with JIS B0601-2001 was defined as the surface roughness Ra. The results are shown in table 1.

< surface roughness Ra of peeled peel layer >

The release layer (PET film) was peeled from the "metal layer/B-stage resin layer/release layer laminate" obtained as described above, and the surface of the exposed resin layer was measured using a white interference microscope (New View)5032 manufactured by Zhhiko (ZYGO) corporation, and the "arithmetic average roughness" calculated for a range of 10 μm × 10 μm according to JIS B0601-2001 was defined as the surface roughness Ra. The results are shown in table 1.

2.2.3. Production and evaluation of laminate for high-frequency Circuit

The release layer (PET film) was peeled from the "metal layer/B-stage resin layer/release layer laminate" obtained as described above, and the exposed resin layer side was superposed on a copper foil (model "TQ-M4-VSP", manufactured by mitsui metals corporation, surface roughness 110nm) having a thickness of 18 μ M, pressed with a hot roll at 150 ℃ under a line load of 10kN/M, and then heated at 250 ℃ for 3 hours using an oven, thereby producing a laminate for a high-frequency circuit having a laminated structure of "copper foil (film thickness 18 μ M)/C-stage resin layer (film thickness 25 μ M)/copper foil (film thickness 18 μ M)" in which copper foils were laminated on both sides of the C-stage resin layer. The surface roughness Ra of the copper foil (metal layer) was measured using a white interference microscope (New View 5032 manufactured by Zhazhika (ZYGO)), and the "arithmetic average roughness" calculated in a range of 10 μm × 10 μm in accordance with JIS B0601-2001 was defined as the surface roughness Ra. The results are shown in table 1.

< tensile Strength and tensile elongation >

The produced laminate for high-frequency circuit was subjected to etching treatment to remove the copper foil, thereby producing a resin film for evaluation. A dumbbell test piece of JIS K71617 was cut out from the resin film thus obtained, and the resin film was stretched at 5mm/min using "Ez-LX" manufactured by Shimadzu corporation, and the stress at break was measured as the tensile strength and the elongation was measured as the tensile elongation. The results are shown in table 1.

< glass transition temperature (Tg) >

The produced laminate for high-frequency circuit was subjected to etching treatment to remove the copper foil, thereby producing a resin film for evaluation. A test piece (width: 3 mm. times.length: 1cm) was cut out from the prepared resin film, and the glass transition temperature (Tg) was measured using a DMS tester (model "EXSTAR 4000" manufactured by Seiko instruments Co., Ltd.). The results are shown in table 1.

< coefficient of elasticity >

The produced laminate for high-frequency circuit was subjected to etching treatment to remove the copper foil, thereby producing a resin film for evaluation. A JIS K71617 dumbbell was cut out from the resin film thus obtained, and a tensile test was carried out at 5mm/min in accordance with JIS K7161 using "Ez-LX" manufactured by Shimadzu corporation to measure the tensile modulus. The results are shown in table 1.

< Electrical characteristics (relative dielectric constant, dielectric loss tangent) >)

The produced laminate for high-frequency circuit was subjected to etching treatment to remove the copper foil, thereby producing a resin film for evaluation. A test piece (2.6 mm wide. times.80 mm long) was cut out from the prepared resin film, and the relative permittivity and dielectric loss tangent at 10GHz were measured using a cavity resonator perturbation method permittivity measuring apparatus (model "PNA-L network analyzer N5230A", manufactured by Agilent Technologies, Inc., model "CP 531 for Cavity resonator 10GHz, manufactured by Kanto electronics application and development Co., Ltd.). The results are shown in table 1.

< peel strength >

A test piece (width 1 cm. times. length 10cm) was cut out from the prepared laminate for a high-frequency circuit, and the laminate was stretched in the 90-degree direction under the condition of 500mm/min using "Instron" 5567 "manufactured by Instron corporation, and the peel strength was measured according to" IPC-TM-6502.4.9 ". The results are shown in table 1.

2.2.4. Production and evaluation of Circuit Board

On one side of the laminate for high-frequency circuits thus produced, a copper foil was patterned using a photosensitive dry film to produce copper wiring patterns having a pitch of 150 μm and line widths of 40 μm, 45 μm, 50 μm, 55 μm, and 60 μm, respectively, and a pitch of 750 μm and line widths of 200 μm, 220 μm, 240 μm, 260 μm, and 280 μm, respectively. Then, the "B-stage resin layer/release layer laminate" thus produced was placed on the surface of the copper wiring pattern thus produced so that the B-stage resin layer side was in contact with the copper wiring of the patterned laminate for high-frequency circuits, a mirror plate was placed thereon, and after heat and pressure molding under pressing conditions of 120 ℃/3.0MPa/5 minutes, the release layer (PET film) was released and heated at 250 ℃ for 3 hours, thereby producing a circuit board.

< evaluation of step difference >

The cross-sectional shape of the circuit board thus produced was observed using a scanning electron microscope, and the thickness a (μm) of the resin layer at the wiring portion and the thickness B (μm) of the resin layer at the non-wiring portion were measured. The results are shown in table 1. When (A-B)/B is 0.1 or less, the flatness is judged to be good, and when it exceeds 0.1, the flatness is judged to be poor.

< evaluation of Transmission loss >

The circuit board thus fabricated was measured for transmission loss at a frequency of 20GHz at 25 ℃ using a measuring probe (ACP40GSG250, manufactured by Cascade Microtech), a single (ACP40GSG250) and a vector type network analyzer (Keysight technology) E8363B. the circuit board was judged to be good when the transmission loss was-5 dB/100mm or more.

< evaluation of substrate level Difference >

Both sides of the produced laminate for a high-frequency circuit were etched so that the thickness of the copper foil was 9 μm, and the copper foil was further patterned using a photosensitive dry film to produce a copper wiring pattern having a pitch of 100 μm and a line width of 50 μm.

Next, a release layer (PET film) was peeled from the "metal layer/B-stage resin layer/release layer laminate" prepared as described above, and the resin layer exposed by peeling was placed on both sides so as to be in contact with the prepared copper wiring pattern, sandwiched by mirror plates, heated and pressed under pressing conditions of 120 ℃/1.1MPa/2 min, and further heated at 250 ℃ for 3 hours.

Then, the copper foil was patterned using the photosensitive dry film, and copper wiring patterns having a pitch of 100 μm and a line width of 50 μm were formed on both surfaces.

Finally, a release layer (PET film) was peeled from the prepared "B-stage resin layer/release layer laminate", the resin layer on the release surface was placed on both surfaces so as to be in contact with the prepared copper wiring pattern, and the laminate was sandwiched by mirror plates, and after hot press molding under pressing conditions of 120 ℃/1.1MPa/2 minutes, the laminate was further heated at 250 ℃ for 3 hours, thereby preparing a substrate for evaluation having four copper wirings.

When the cross-sectional shape of the produced evaluation substrate was observed with a scanning electron microscope, it was judged to be practically satisfactory when the difference between the concave portion and the convex portion was 5% or less, and it was judged to be practically unusable and defective when the difference exceeded 5%. The results are shown in table 1.

2.3. Examples 2 to 6 and comparative examples 1 to 3

A circuit board was produced and evaluated in the same manner as in example 1 except that the composition for a resin layer was changed to the composition shown in table 1 and the type of the metal film, the film thickness, and the lamination conditions were changed as shown in table 1. The results are shown in table 1.

2.4. Example 7

The composition for a resin layer prepared in example 1 was applied to a copper foil (model "TQ-M4-VSP", surface roughness 110nm) having a thickness of 18 μ M by using a bar coater so that the cured film thickness became 25 μ M, and was heated at 70 ℃ for 10 minutes and then at 130 ℃ for 10 minutes in an oven, thereby preparing a "metal layer/B-stage resin layer laminate" having a laminate structure of a copper foil/B-stage resin layer.

A copper foil (model number "TQ-M4-VSP", manufactured by Mitsui metals Co., Ltd., surface roughness 110nm) having a thickness of 18 μ M was laminated on the exposed resin layer side of the "metal layer/B-stage resin layer laminate" thus prepared, and the laminate was pressed with a linear load of 10kN/M using a hot roll at 150 ℃ and then heated at 250 ℃ for 3 hours in an oven, thereby preparing a laminate for a high-frequency circuit having a laminated structure of copper foil (film thickness 18 μ M)/C-stage resin layer (film thickness 25 μ M)/copper foil (film thickness 18 μ M) in which copper foils were laminated on both sides of the C-stage resin layer. Using the laminate for a high-frequency circuit produced in the above manner, a circuit board was produced and evaluated in the same manner as in example 1. The results are shown in table 1.

2.5. Comparative example 4

Compositions for a resin layer were prepared in the same manner as in example 1 so as to have the compositions shown in table 1, and the compositions for a resin layer were applied to a copper foil (model "TQ-M4-VSP", manufactured by mitsui metals corporation, surface roughness 110nm) having a thickness of 18 μ M by using a bar coater so that the cured film thickness became 25 μ M, heated at 70 ℃ for 10 minutes by using an oven, heated at 130 ℃ for 10 minutes, and further heated at 250 ℃ for 3 hours.

Then, copper plating was performed on the exposed surface of the resin layer to produce a laminate for high-frequency circuits having a laminate structure of copper foil (18 μm thick)/resin layer (25 μm)/copper layer (1 μm) in which copper layers were laminated on both sides of the resin layer. Using the laminate for a high-frequency circuit produced in the above manner, a circuit board was produced and evaluated in the same manner as in example 1. The results are shown in table 1.

2.6. Evaluation results

Table 1 shows the compositions of the resin layer compositions used in the examples and comparative examples, and the evaluation results of the laminate for high-frequency circuits and the circuit board.

[ Table 1]

In table 1 above, the following abbreviations and the like are supplemented.

< Polymer >

P-6: model "PPO resin powder", manufactured by Sabic basic industries (Sabic), glass transition temperature (Tg); 215 ℃ C

< curable Compound >

Compound a: 2,2' -bis (4-cyanoxyphenyl) propane (manufactured by Tokyo chemical industries, Ltd.)

Compound B: SR-16H (epoxy equivalent, 160g/eq, manufactured by saka pharmaceutical industries, Ltd.)

Compound C: HP-4032D (epoxy equivalent, 141meq/g, manufactured by Diegon (DIC))

Hardening aid

Hardening aid a: 1-benzyl-2-methylimidazole (product name "BMI 12" manufactured by Mitsubishi chemical corporation)

Hardening aid B: 2-Ethyl Zinc caprylate (manufactured by Wako pure chemical industries, Ltd.)

< solvent >

Vehicle a: cyclopentanone (manufactured by Tokyo chemical industry Co., Ltd.)

Vehicle B: dichloromethane (manufactured by Tokyo chemical industry Co., Ltd.)

< Metal layer type >

Electrolytic copper foil a: product number "TQ-M4-VSP" manufactured by Mitsui metals, Inc "

Electrolytic copper foil B: manufactured by Mitsui metals Ltd, trade number "3 EC-M3S-HTE"

Rolled copper foil a: product number "GHY 5-HA" manufactured by JX Metal products Ltd "

From the results shown in table 1, it is understood that the circuit substrates obtained in examples 1 to 7 have excellent smoothness, and can reduce the transmission loss of the electric signal in the high-frequency circuit.

Description of the symbols

10: substrate

12: resin layer

14: metal layer

16: wiring part

20: peeling layer

21: resin layer (exposed surface)

22: b-stage resin layer

23: resin layer (exposed surface)

24: metal layer

26: metal layer

28: c-stage resin layer

30: metal layer

32: b-stage resin layer

33: resin layer (exposed surface)

34: metal layer

36: c-stage resin layer

100: circuit board

200: laminated body for high-frequency circuit

300: laminated body for high-frequency circuit

Claims

1. A circuit board includes a wiring portion and a non-wiring portion,

the wiring part has a metal layer and a resin layer,

the non-wiring portion has a resin layer,

satisfies the relationship of (A-B)/B being less than or equal to 0.1.

2. The circuit substrate according to claim 1, wherein the metal layer in the wiring portion is laminated in contact with the resin layer.

3. The circuit substrate according to claim 1 or 2, wherein the dielectric loss tangent at a frequency of 10GHz of the resin layer at 23 ℃ is 0.001 to 0.01.

4. A circuit substrate according to any one of claims 1 to 3, wherein the resin layer has a coefficient of elasticity of 0.1GPa to 3 GPa.

5. The circuit substrate according to any one of claims 1 to 4, wherein a peel strength of the resin layer from the metal layer is 5N/cm or more.

6. The circuit substrate according to any one of claims 1 to 5, wherein the resin layer has a thickness of 10 to 100 μm, and the metal layer has a thickness of 10 to 50 μm.