CN111094500B - 导电性胶粘剂 - Google Patents

导电性胶粘剂 Download PDF

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Publication number
CN111094500B
CN111094500B CN201880060335.9A CN201880060335A CN111094500B CN 111094500 B CN111094500 B CN 111094500B CN 201880060335 A CN201880060335 A CN 201880060335A CN 111094500 B CN111094500 B CN 111094500B
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CN
China
Prior art keywords
conductive adhesive
adhesive layer
conductive
cumulative value
conductive filler
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880060335.9A
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English (en)
Chinese (zh)
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CN111094500A (zh
Inventor
上农宪治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN111094500A publication Critical patent/CN111094500A/zh
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Publication of CN111094500B publication Critical patent/CN111094500B/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN201880060335.9A 2017-10-16 2018-09-10 导电性胶粘剂 Active CN111094500B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017200525A JP6546975B2 (ja) 2017-10-16 2017-10-16 導電性接着剤
JP2017-200525 2017-10-16
PCT/JP2018/033458 WO2019077909A1 (ja) 2017-10-16 2018-09-10 導電性接着剤

Publications (2)

Publication Number Publication Date
CN111094500A CN111094500A (zh) 2020-05-01
CN111094500B true CN111094500B (zh) 2021-12-10

Family

ID=66173561

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880060335.9A Active CN111094500B (zh) 2017-10-16 2018-09-10 导电性胶粘剂

Country Status (5)

Country Link
JP (1) JP6546975B2 (ko)
KR (1) KR102337623B1 (ko)
CN (1) CN111094500B (ko)
TW (1) TWI751333B (ko)
WO (1) WO2019077909A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114269820A (zh) * 2019-08-23 2022-04-01 株式会社Adeka 树脂组合物、固化物的形成方法和固化物
TWI812889B (zh) * 2020-03-03 2023-08-21 日商拓自達電線股份有限公司 電磁波屏蔽膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101271238A (zh) * 2008-05-06 2008-09-24 友达光电股份有限公司 利用具检查标记的基板确认导电胶涂布情况的方法及基板
JP2010168518A (ja) * 2009-01-26 2010-08-05 Tatsuta System Electronics Kk 導電性粘着シート及びそれを備えた電磁波シールド材、プリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100987025B1 (ko) * 2008-04-22 2010-10-11 두성산업 주식회사 자기접착성을 갖는 도전성 시트 및 이의 제조방법
JP5742112B2 (ja) * 2010-01-18 2015-07-01 東洋インキＳｃホールディングス株式会社 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2013053347A (ja) * 2011-09-05 2013-03-21 Mitsui Mining & Smelting Co Ltd デンドライト状銅粉
JP6196131B2 (ja) * 2013-11-15 2017-09-13 三井金属鉱業株式会社 プレス接着用金属箔及び電子部品パッケージ
JP6114883B1 (ja) * 2015-05-20 2017-04-12 積水化学工業株式会社 導電性粘着材及び導電性基材付き導電性粘着材
JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
KR101893248B1 (ko) * 2015-11-26 2018-10-04 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 접속 구조체
WO2017164174A1 (ja) * 2016-03-23 2017-09-28 タツタ電線株式会社 電磁波シールドフィルム
JP6388064B2 (ja) * 2017-02-10 2018-09-12 東洋インキＳｃホールディングス株式会社 電子部品搭載基板、積層体、電磁波遮蔽シートおよび電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101271238A (zh) * 2008-05-06 2008-09-24 友达光电股份有限公司 利用具检查标记的基板确认导电胶涂布情况的方法及基板
JP2010168518A (ja) * 2009-01-26 2010-08-05 Tatsuta System Electronics Kk 導電性粘着シート及びそれを備えた電磁波シールド材、プリント配線板

Also Published As

Publication number Publication date
KR20200071104A (ko) 2020-06-18
JP6546975B2 (ja) 2019-07-17
WO2019077909A1 (ja) 2019-04-25
TWI751333B (zh) 2022-01-01
KR102337623B1 (ko) 2021-12-09
JP2019073622A (ja) 2019-05-16
CN111094500A (zh) 2020-05-01
TW201922999A (zh) 2019-06-16

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