CN112136368A - 印制线路基材用贴附膜 - Google Patents
印制线路基材用贴附膜 Download PDFInfo
- Publication number
- CN112136368A CN112136368A CN201980030961.8A CN201980030961A CN112136368A CN 112136368 A CN112136368 A CN 112136368A CN 201980030961 A CN201980030961 A CN 201980030961A CN 112136368 A CN112136368 A CN 112136368A
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- Prior art keywords
- film
- layer
- resin
- protective layer
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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Images
Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/00—Printed circuits
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Abstract
印制线路基材用贴附膜包括胶粘剂层111和绝缘保护层112。绝缘保护层112的分离突出谷部与中心部的负载面积率(Smr2)为91%以下。
Description
技术领域
本申请涉及印制线路基材用贴附膜、电磁波屏蔽膜及屏蔽线路基材。
背景技术
为了从电磁噪声保护电子电路,而使用贴附于印制线路基材的电磁波屏蔽膜。电磁波屏蔽膜包括导电性胶粘剂层和绝缘保护层,通过导电性胶粘剂层接合于印制线路基材的接地电路并导通。
出于提高美观及提高印字的可见性等目的,绝缘保护层有时含有着色剂。比如,专利文献1中,使用含黑色类着色剂的绝缘保护层来提高印字的可见性。
现有技术文献
专利文献
专利文献1:日本专利特开2016-143751。
发明内容
发明要解决的技术问题
印制线路基材包括基础层、形成于基础层上的由铜箔构成的电路图形、用于保护电路图形的覆盖膜。通过在印制线路基材贴附电磁波屏蔽膜,也可以期待无法从外部肉眼辨认印制线路基材的电路图形的遮盖效果。近年来,大家追求印制线路基材很薄,覆盖膜处于很薄的倾向。覆盖膜薄的话,覆盖膜的表面易产生反映了电路图形的凸部。本申请发明人发现,覆盖膜薄,凸部高度高的话,以往的电磁波屏蔽膜无法充分遮盖电路图形。
此外,有时也不要求电磁波屏蔽功能,而是要求电路图形的遮盖性。
本申请的技术问题在于,实现一种在覆盖膜很薄的情况下电路图形的遮盖性也良好的电磁波屏蔽膜或印制线路基材用贴附膜。
解决技术问题的技术手段
本申请的印制线路基材用贴附膜的一技术形态包括胶粘剂层和绝缘保护层,绝缘保护层的分离突出谷部与中心部的负载面积率(Smr2)为91%以下。
在印制线路基材用贴附膜的一技术形态中,绝缘保护层的突出谷部高度(Svk)能够为0.45μm以上。
在印制线路基材用贴附膜的一技术形态中,胶粘剂层能具有导电性,且作为电磁波屏蔽膜发挥作用。此时,可以在胶粘剂层和绝缘保护层之间还含有屏蔽层。
本申请的屏蔽线路基材的一技术形态包括:线路基材,含有基础层、设于基础层上的电路图形、以覆盖电路图形的方式与基础层接合的绝缘膜;本申请的电磁波屏蔽膜,接合于绝缘膜上。
发明效果
根据本申请的电磁波屏蔽膜及印制线路基材用贴附膜,在覆盖膜很薄的情况下也能大幅提高电路图形的遮盖性。
附图说明
[图1] 一实施方式涉及的印制线路基材用贴附膜的截面图;
[图2] 一实施方式涉及的屏蔽线路基材的截面图;
[图3] 遮盖性的评价所使用的印制线路基材的俯视图;
[图4] 共聚焦显微镜的观察结果的照片。
具体实施方式
本实施方式的印制线路基材用贴附膜是具有电磁波屏蔽功能的电磁波屏蔽膜101,如图1所示,包括导电性胶粘剂层111和绝缘保护层112,绝缘保护层112的分离突出谷部与中心部的负载面积率(Smr2)为91%以下,优选90%以下。在图1中,在导电性胶粘剂层111和绝缘保护层112之间设有导电性的屏蔽层113,但当导电性胶粘剂层111也作为屏蔽层发挥作用时,能不设屏蔽层113。
本实施方式的电磁波屏蔽膜101如图2所示接合于印制线路基材102。印制线路基材102例如含有基础层121、设于基础层121的表面的电路图形122、以覆盖电路图形122的方式介由胶粘剂层123接合于基础层121的绝缘膜124。
基础层121由绝缘性的材料构成。绝缘性的材料能使用绝缘性树脂组合物、陶瓷等。绝缘性树脂组合物比如能使用选自聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂及聚苯硫醚类树脂的至少一种。
电路图形122由导电性的材料构成。作为导电性的材料,能使用金属箔或印刷了导电性填料与树脂组合物的混合物并使其固化而成的导电性材料,从费用的观点看优选使用铜箔。
电路图形122的厚度无特别限定,优选1μm~100μm,更优选1~50μm。电路图形的厚度为1μm以上能降低印制线路基材102的制造成本。厚度为100μm以下能使印制线路基材102薄型化。
胶粘剂层123由绝缘性的材料构成。绝缘性的材料优选绝缘性树脂组合物,比如能使用选自聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂及聚苯硫醚类树脂的至少一种。
胶粘剂层123的厚度无特别限定,优选1μm~50μm。
绝缘膜124由绝缘性的材料构成。绝缘性的材料优选绝缘性树脂组合物,比如能使用选自聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂及聚苯硫醚类树脂的至少一种。
绝缘膜124的厚度无特别限定,优选1μm~100μm,更优选10μm~25μm。厚度为1μm以上能降低印制线路基材102的制造成本。厚度为100μm以下能使印制线路基材102薄型化。
给绝缘保护层112着色使电磁波屏蔽膜101不透明的话,电路图形122就不能直接肉眼辨认。比如,用全光线透过率优选20%以下、更优选10%以下、进一步优选5%以下的膜覆盖电路图形122的话,则几乎不可能直接肉眼辨认电路图形122。但是,由于电路图形122,绝缘保护层112的表面会形成凹凸。一般的电路图形122由铜线形成,高度为几μm~十几μm。线存在的部分和线不存在的部分的高度差会由于胶粘剂层123及导电性胶粘剂层111的嵌入而变小,因此产生于绝缘保护层112的表面的凹凸的高度为几μm。但是,即使是这样微小的凹凸,在易反射光的有光泽的表面中仍能目视辨认凹凸的存在,无法遮盖电路图形122。
因此,为遮盖电路图形122,可以减小绝缘保护层112表面的光泽度。但是,本申请发明人发现电路图形的遮盖性与85°光泽度不相关。此外,光泽度在很大程度上会受到表面粗糙度的影响,但本申请发明人发现,电路图形的遮盖性与一般的表面粗糙度的指标即以国际标准化组织(ISO)25178为基准的三维算术平均高度(Sa)也不相关。
另一方面,本申请发明人发现,电路图形的遮盖性与以国际标准化组织(ISO)25178为基准的分离突出谷部与中心部的负载面积率(Smr2)良好相关,当Smr2为91%以下、优选90%以下时,电路图形的遮盖性优越。这是因为,在一定程度上存在从中心部偏离的谷部,会使入射光更易散射。此外,Smr2优选70%以上、更优选80%以上、更优选85%。Smr2为70%以上的话,谷部的比率少,能抑制在谷底的表面反射提高遮盖性。
此外,突出谷部越深,入射光越易散射,因此以国际标准化组织(ISO)25178为基准的突出谷部高度Svk优选0.45μm以上,更优选0.49μm以上,进一步优选0.60μm以上,进一步优选0.70μm以上。此外,Svk优选3.0μm以下,更优选2.0μm以下,进一步优选1.5μm以下,进一步优选1.0μm以下。使Svk为3.0μm以下,从而在使赋予了凹凸形状的剥离性基板的表面的形状转印至绝缘保护层,制作具有凹凸形状的绝缘保护层时,剥离性基板从绝缘保护层的剥离性良好。
为使绝缘保护层112的Smr2为91%以下,能在形成绝缘保护层112的树脂中添加微粒子。
添加至绝缘保护层112的微粒子无特别限定,比如能使用树脂微粒子或无机微粒子。树脂微粒子能够是丙烯酸树脂微粒子、聚丙烯腈微粒子、聚氨酯微粒子、聚酰胺微粒子以及聚酰亚胺微粒子等。另外,无机微粒子能够是碳酸钙微粒子、硅酸钙微粒子、粘土、瓷土、滑石、二氧化硅微粒子、玻璃微粒子、硅藻土、云母粉、氧化铝微粒子、氧化镁微粒子、氧化锌微粒子、硫酸钡微粒子、硫酸铝微粒子、硫酸钙微粒子以及碳酸镁微粒子等。这些树脂微粒子及无机微粒子能单独使用,也能复数个组合使用。
为使绝缘保护层112的Smr2为91%以下,优选在表面设置凹凸。在表面设置凹凸的方法比如有如下方法:在通过压纹加工等而赋予了凹凸形状的剥离性基板的表面涂布绝缘保护层112用的树脂组合物并使其干燥,从而使剥离性基板的凹凸形状转印至绝缘保护层112。作为压纹加工的代替,也能使在表面设置了表面具有凹凸的哑光层的膜为剥离性基板。能通过将含微粒子的树脂组合物涂布于膜表面,或对形成于膜表面的树脂层压纹加工形成哑光层。
此外,除了使用具有凹凸的剥离性基板,还可以列举出在屏蔽层的表面涂布含微粒子的树脂组合物,使其干燥形成具有凹凸形状的绝缘保护层112的方法、将干冰等喷射于绝缘保护层112的表面的方法、在屏蔽层表面涂覆活性能量射线固化性组合物后按压具有凹凸形状的模具,使该固化性组合物层固化,并剥离模具的方法等公知的方法。
此外,优选对绝缘保护层112施加黑色颜料或将复数个颜料减色混合而黑色化的混合颜料等黑色类着色剂。黑色颜料比如能够是碳黑、科琴黑(Ketjen black)、碳纳米管(CNT)、苝黑、钛黑、铁黑及苯胺黑等的任意者或这些的组合。混合颜料比如能够混合并使用红色、绿色、蓝色、黄色、紫色、青色及品红等颜料。
构成绝缘保护层112的树脂成分比如能够是热塑性树脂、热固性树脂或活性能量射线固化性树脂等。
热塑性树脂无特别限定,能够使用苯乙烯类树脂、醋酸乙烯酯类树脂、聚酯类树脂、聚乙烯类树脂、聚丙烯类树脂、酰亚胺类树脂或丙烯酸类树脂等。热固性树脂无特别限定,能使用苯酚类树脂、环氧类树脂、聚氨酯树脂、三聚氰胺类树脂、聚酰胺类树脂或醇酸类树脂等。活性能量射线固化性树脂无特别限定,例如能够使用分子中至少有2个(甲基)丙烯酰氧基的聚合性化合物等。绝缘保护层112可由单独的材料形成,也可以由2种以上的材料形成。此外,绝缘保护层112也能够是材质或硬度或弹性模量等物化性质不同的2层以上的层压体。此时,只要控制最上层的表面的Smr2等为一定值即可。
根据需要绝缘保护层112可含有固化促进剂、增黏剂、抗氧化剂、颜料、染料、可塑剂、紫外线吸收剂、消泡剂、整平剂、填充剂、阻燃剂、黏度改进剂及防粘连剂等的至少一者。
绝缘保护层112的厚度无特别限定,能根据需要恰当设定,能设定为,优选1μm以上、更优选4μm以上,优选20μm以下、更优选10μm以下、进一步优选5μm以下。通过使绝缘保护层112的厚度为1μm以上就能充分保护导电性胶粘剂层111及屏蔽层113。绝缘保护层112的厚度为20μm以下,能确保电磁波屏蔽膜101的屈曲性,使电磁波屏蔽膜101轻松地适用于需要屈曲性的构件。
如果设置屏蔽层113,则屏蔽层113能够由金属箔、蒸镀膜及导电性填料等形成。
金属箔无特别限定,能够是镍、铜、银、锡、金、钯、铝、铬、钛及锌等的任意者或由包含二者以上的合金构成的箔。
金属箔的厚度无特别限定,优选0.5μm以上,更优选1.0μm以上。金属箔的厚度为0.5μm以上的话,向屏蔽印制线路基材传送10MHz~100GHz的高频信号时,能抑制高频信号的衰减量。此外,金属箔的厚度优选12μm以下,更优选10μm以下,进一步优选7μm以下。金属层的厚度为12μm以下的话,能确保良好的断裂伸长率。
蒸镀膜无特别限定,能够通过蒸镀镍、铜、银、锡、金、钯、铝、铬、钛及锌等而形成。蒸镀能够使用电镀法、无电解镀覆法、溅射法、电子束蒸镀法、真空蒸镀法、化学气相沉积(CVD)法或金属有机气相沉积(MOCVD)法等。
蒸镀膜的厚度无特别限定,优选0.05μm以上,更优选0.1μm以上。蒸镀膜的厚度为0.05μm以上的话,屏蔽印制线路基材中电磁波屏蔽膜屏蔽电磁波的特性优越。此外,蒸镀膜的厚度优选不足0.5μm,更优选不足0.3μm。蒸镀膜的厚度不足0.5μm的话,电磁波屏蔽膜的柔韧性优越,能抑制由于设于印制线路基材的高低差而破坏屏蔽层。
如果采用的是导电性填料,能通过将配混了导电性填料的溶剂涂布于绝缘保护层112的表面并干燥,从而形成屏蔽层113。导电性填料能够使用金属填料、金属被覆树脂填料、碳类填料及这些的混合物。金属填料能够使用铜粉、银粉、镍粉、银包铜粉、金包铜粉、银包镍粉及金包镍粉等。这些金属粉能够通过电解法、雾化法、还原法制成。金属粉的形状可列举出球状、薄片状、纤维状、树枝状等。
本实施方式中,屏蔽层113的厚度根据所需要的电磁屏蔽效果及耐反复弯曲・滑动性恰当选择即可,若采用的是金属箔,从确保断裂伸长率的观点来看优选12μm以下。
本实施方式中,导电性胶粘剂层111含有热塑性树脂、热固性树脂及活性能量射线固化性树脂的至少一者和导电性填料。
当导电性胶粘剂层111含有热塑性树脂时,热塑性树脂例如能够使用苯乙烯类树脂、醋酸乙烯酯类树脂、聚酯类树脂、聚乙烯类树脂、聚丙烯类树脂、酰亚胺类树脂及丙烯酸类树脂等。这些树脂可以1种单独使用,也可2种以上并用。
当导电性胶粘剂层111含有热固性树脂时,热固性树脂例如能够使用苯酚类树脂、环氧类树脂、聚氨酯树脂、三聚氰胺类树脂、聚酰胺类树脂、聚酰亚胺类树脂及醇酸类树脂等。活性能量射线固化性树脂无特别限定,例如能够使用分子中至少有2个(甲基)丙烯酰氧基的聚合性化合物等。这些树脂可以1种单独使用,也可2种以上并用。
热固性树脂比如包含有反应性的第1官能团的第1树脂成分、和第1官能团反应的第2树脂成分。第1官能团例如能够是环氧基、酰胺基或羟基等。第2官能团根据第1官能团选择即可,例如第1官能团是环氧基时,第2官能团能够是羟基、羧基、环氧基及氨基等。具体来说,例如当第1树脂成分为环氧树脂时,第2树脂成分能够使用环氧基改性聚酯树脂、环氧基改性聚酰胺树脂、环氧基改性丙烯酸树脂、环氧基改性聚氨酯聚脲树脂、羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性丙烯酸树脂、羧基改性聚氨酯聚脲树脂、及聚氨酯改性聚酯树脂等。其中优选羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性聚氨酯聚脲树脂及聚氨酯改性聚酯树脂。另外,第1树脂成分是羟基时,第2树脂成分能够使用环氧基改性聚酯树脂、环氧基改性聚酰胺树脂、环氧基改性丙烯酸树脂、环氧基改性聚氨酯聚脲树脂、羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性丙烯酸树脂、羧基改性聚氨酯聚脲树脂及聚氨酯改性聚酯树脂等。其中优选羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性聚氨酯聚脲树脂及聚氨酯改性聚酯树脂。
热固性树脂也可以含有促进热固化反应的固化剂。热固性树脂含有第1官能团和第2官能团时,固化剂能够根据第1官能团及第2官能团的种类恰当选择。第1官能团是环氧基、第2官能团是羟基时,能够使用咪唑类固化剂、苯酚类固化剂及阳离子类固化剂等。如上物质能够单独使用1种,也能够2种以上并用。其他作为非必须成分也可以含有消泡剂、抗氧化剂、黏度调整剂、稀释剂、防沉剂、整平剂、偶联剂、着色剂及阻燃剂等。
导电性填料无特别限定,例如能够使用金属填料、金属被覆树脂填料、碳类填料及这些的混合物。金属填料能够列举出铜粉、银粉、镍粉、银包铜粉、金包铜粉、银包镍粉及金包镍粉等。这些金属粉能够通过电解法、雾化法或还原法等制作。其中优选银粉、银包铜粉及铜粉的任意者。
从填料之间接触的观点来看,导电性填料的平均粒径优选1μm以上、更优选3μm以上,优选50μm以下、更优选40μm以下。导电性填料的形状无特别限定,能够是球状、薄片状、树枝状或纤维状等。
导电性填料的含有量能够根据用途恰当选择,优选在全部固体成分中占5质量%以上、更优选10质量%以上,优选95质量%以下、更优选90质量%以下。从嵌入性观点来看,优选70质量%以下、更优选60质量%以下。另外,要实现各向异性导电性,优选40质量%以下、更优选35质量%以下。
从嵌入性观点来看,导电性胶粘剂层111的厚度优选1μm~50μm。
导电性胶粘剂层111也能够是在常温(比如20℃)的环境下具有黏着性的、所谓的具有粘着剂性的层。导电性胶粘剂层111在常温环境下具有黏着性,能够在印制线路基材102的任意位置轻松贴附电磁波屏蔽膜101。
当电磁波屏蔽膜101含有由金属箔等构成的屏蔽层113时,全光线透过率通常几乎为0。当未设有屏蔽层113时,通过调整绝缘保护层112和/或导电性胶粘剂层111中添加的着色剂、填料等的量,使全光线透过率优选20%以下、更优选10%以下、进一步优选5%以下即可。全光线透过率为20%以下,从而在使电磁波屏蔽膜101贴附于印制线路基材102时,能难以直接肉眼辨认电路图形122。此外,全光线透过率能以JIS K 7136为基准进行测定。
在本实施方式中示出了印制线路基材用贴附膜为电磁波屏蔽膜的例子,其也能是不具有电磁波屏蔽功能的印制线路基材用贴附膜。此时,能使用不含导电性填料的非导电性的胶粘剂层来代替导电性胶粘剂层。若不需要电磁波屏蔽功能,则可不设屏蔽层。但是,为降低全光线透过率,可将金属箔等设于胶粘剂层与绝缘保护层之间。
实施例
以下用实施例对本申请的印制线路基材贴附膜进行详细说明。以下实施例是示例,没有限定本发明的意图。
<剥离性基板的制作>
在厚度25μm的聚对苯二甲酸乙二醇酯膜(以下称作PET膜)的表面喷射干冰微粒子形成凹凸后,设置由三聚氰胺类树脂构成的剥离层,得到了剥离性基板1。
调整由二氧化硅粒子、三聚氰胺类树脂、甲苯构成的哑光层组合物,在厚度25μm的聚对苯二甲酸乙二醇酯膜的表面使用线棒进行涂布,并加热干燥,得到了含有厚度5μm的哑光层的剥离性基板2。改变二氧化硅粒子的粒径及添加量,同样得到了表面状态不同的剥离基板3~9。剥离性基板1~9的表面(形成遮盖层的面)的表面性状统计显示于表1。
[表1]
<绝缘保护层的制作>
为使固体成分量为20质量%,向甲苯配混双酚 A型环氧类树脂(三菱化学制、jER1256)100质量份、固化剂(三菱化学制、ST14)0.1质量份、作为黑色类着色剂的碳粒子(TOKAICARBON制、Toka black#8300/F)15质量份,制备了绝缘保护层用树脂组合物。将该组合物用线棒涂布于剥离性基板的表面,并加热干燥,在剥离性基板的表面制作了厚度5μm的绝缘保护层。然后在保护层上形成了0.1μm的Ag蒸镀膜作为屏蔽层。
<胶粘剂层的制作>
为使固体成分量为20质量%,向甲苯添加双酚 A型环氧类树脂(三菱化学制、jER1256)100质量份、固化剂(三菱化学制、ST14)0.1质量份、平均粒径15μm的树枝状银包铜粉30质量份,搅拌混合制备了胶粘剂层组合物。使用线棒将得到的胶粘剂层组合物涂布于对表面进行了离型处理的PET膜(以下称作支撑膜),并加热干燥,从而在支撑膜表面形成了厚度5μm的胶粘剂层。
<印制线路基材贴附膜的制作>
使剥离性基板的表面所形成的绝缘保护层的Ag蒸镀膜侧的面和支撑膜的表面所形成的胶粘剂层贴合,使用加热至100℃的1对金属辊,以5MPa的压力加压,得到了电磁波屏蔽膜即印制线路基材贴附膜。
<屏蔽线路基材的制成>
使用压制机在温度:170℃、时间:3分钟、压力:2~3MPa的条件下接合所得到的印制线路基材贴附膜和印制线路基材后,剥下剥离性基板,制成屏蔽线路基材。
印制线路基材使用的是在由聚酰亚胺膜构成的基础层121上形成有图4所示的电路图形122而成品。电路图形122由线宽0.1mm、高度12μm的铜箔形成。基础层121上设有厚度25μm的胶粘剂层和由厚度12.5μm的聚酰亚胺膜构成的覆盖膜(绝缘膜)以覆盖电路图形122。
<光泽度的测定>
使用便携式光泽度仪(BYKGardner・micro-gross、东洋精机制作所)以JIS Z 8741为基准进行了85°光泽度的测定。
<表面粗糙度的测定>
使用共聚焦显微镜(Lasertec公司制、OPTELICS HYBRID、物镜20倍),以ISO25178为基准,测定了表面任意5处。之后,使用数据分析软件(LMeye7)进行表面的倾斜补正,测定了Smr2、Svk及Sa。另外,S滤波器的截断波长为0.0025mm、L滤波器的截断波长为0.8mm。此外,各数值为测定表面任意5处的值的平均值。
<遮盖性的评价>
将屏蔽线路基材置于平坦的台面上,屏蔽线路基材的表面的照度为500勒克斯的环境下,以距屏蔽线路基材的高度为30cm, 45度的角度,评价了能否从绝缘保护层侧肉眼辨认电路图形。不能肉眼辨认电路图形的话遮盖性良好(○),能肉眼辨认电路图形的话遮盖性不良(×)。
(实施例1)
通过使用剥离性基板1形成的绝缘保护层制成印制线路基材贴附膜,得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为90.1%,Svk为0.62μm。此外,85°光泽度为33.7,Sa为0.48μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性非常良好。在共聚焦显微镜的观察中,也几乎无法肉眼辨认电路图形。
(实施例2)
除了使用剥离性基板2,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为90.8%,Svk为0.55μm。此外,85°光泽度为28.7,Sa为0.41μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性非常良好。在共聚焦显微镜的观察中,也几乎无法肉眼辨认电路图形。
(实施例3)
除了使用剥离性基板3,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为90.0%,Svk为0.71μm。此外,85°光泽度为32.3,Sa为0.51μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性非常良好。在共聚焦显微镜的观察中,也几乎无法肉眼辨认电路图形。
(实施例4)
除了使用剥离性基板4,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为89.6%,Svk为0.49μm。此外,85°光泽度为41.1,Sa为0.42μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性良好。在共聚焦显微镜的观察中,能稍微肉眼辨认电路图形。
(实施例5)
除了使用剥离性基板5,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为90.8%,Svk为0.90μm。此外,85°光泽度为12.6,Sa为0.83μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性非常良好。在共聚焦显微镜的观察中,也几乎无法肉眼辨认电路图形。
(实施例6)
除了使用剥离性基板6,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为89.1%,Svk为0.63μm。此外,85°光泽度为30.0,Sa为0.47μm。在肉眼检查中,无法肉眼辨认电路图形,遮盖性非常良好。在共聚焦显微镜的观察中,也几乎无法肉眼辨认电路图形。
(比较例1)
除了使用剥离性基板7,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为92.1%,Svk为0.39μm。此外,85°光泽度为30.6,Sa为0.45μm。在肉眼检查中,能够肉眼辨认电路图形,遮盖性不良。在共聚焦显微镜的观察中,能清楚肉眼辨认电路图形。
(比较例2)
除了使用剥离性基板8,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为93.9%,Svk为0.29μm。此外,85°光泽度为39.9,Sa为0.43μm。在肉眼检查中,能够肉眼辨认电路图形,遮盖性不良。在共聚焦显微镜的观察中,能清楚肉眼辨认电路图形。
(比较例3)
除了使用剥离性基板9,其余与实施例1同样得到了屏蔽线路基材。除去剥离性基板后的屏蔽线路基材的绝缘保护层的Smr2为92.8%,Svk为0.43μm。此外,85°光泽度为37.0,Sa为0.45μm。在肉眼检查中,能够肉眼辨认电路图形,遮盖性不良。在共聚焦显微镜的观察中,能清楚肉眼辨认电路图形。
表2中示出了各实施例及比较例的绝缘保护层的特性及电路图形的遮盖性。Smr2为91以下时,遮盖性良好。
[表2]
图4中示出了各实施例及比较例中共聚焦显微镜的观察结果。在各实施例中,几乎无法辨认电路图形的形状,而在各比较例中,能清楚辨认电路图形的形状。
实用性
本申请的电磁波屏蔽膜及印制线路基材贴附膜遮盖性优越,在需要遮盖电路图形的用途中是有用的。
附图标记
101电磁波屏蔽膜
102印制线路基材
111导电性胶粘剂层
112绝缘保护层
113屏蔽层
121基础层
122电路图形
123胶粘剂层
124绝缘膜
Claims (5)
1.一种印制线路基材用贴附膜,其特征在于:
包括胶粘剂层和绝缘保护层,
所述绝缘保护层的分离突出谷部与中心部的负载面积率(Smr2)为91%以下。
2.根据权利要求1所述的印制线路基材用贴附膜,其特征在于:
所述绝缘保护层的突出谷部高度(Svk)为0.45μm以上。
3.根据权利要求1或2所述的印制线路基材用贴附膜,其特征在于:
所述胶粘剂层具有导电性,且作为电磁波屏蔽膜发挥作用。
4.根据权利要求3所述的印制线路基材用贴附膜,其特征在于:
在所述胶粘剂层和所述绝缘保护层之间还含有屏蔽层。
5.一种屏蔽线路基材,其特征在于包括:
线路基材,含有基础层、设于所述基础层上的电路图形、以覆盖所述电路图形的方式接合于所述基础层的绝缘膜;
权利要求3或4所述的印制线路基材用贴附膜,所述印制线路基材用贴附膜接合于所述绝缘膜上。
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