CN111066130A - 相对于第二物体来定位第一物体的装置和方法 - Google Patents

相对于第二物体来定位第一物体的装置和方法 Download PDF

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CN111066130A
CN111066130A CN201880058440.9A CN201880058440A CN111066130A CN 111066130 A CN111066130 A CN 111066130A CN 201880058440 A CN201880058440 A CN 201880058440A CN 111066130 A CN111066130 A CN 111066130A
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scale
movable body
bonding
camera
head
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CN111066130B (zh
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歌野哲弥
野口勇一郎
瀬山耕平
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Shinkawa Ltd
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Shinkawa Ltd
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Abstract

本发明的安装装置(100)具备相对于基板(16)而直线移动的基座(10)、安装于基座(10)的接合头(20)、安装于基座(10)且指定基板(16)的位置的照相机(25)、沿着移动方向具有多个刻度的直线刻度尺(33)、接合头侧编码器头(31)、以及照相机侧编码器头(32)，且控制部(50)使基座(10)移动至接合头侧编码器头(31)检测刻度位置的位置。由此，提高半导体裸片(15)相对于基板(16)的定位精度。

Description

相对于第二物体来定位第一物体的装置和方法
技术领域
本发明涉及一种相对于第二物体来定位第一物体的装置和方法。
背景技术
举例而言，在半导体装置的制造中，一直使用将半导体裸片(die)等电子零件安装于基板或其他半导体裸片的安装装置、或将引线(wire)接合于半导体裸片的电极及基板的电极的打线接合(wire-bonding)装置等多种接合装置。接合装置具备搭载于XY台上的接合头(bonding head)、安装于接合头且使接合工具(bonding tool)在上下方向上移动的接合臂(bonding arm)、及安装于接合头且检测基板的接合位置的位置检测用照相机。接合工具的中心线与位置检测用照相机的光轴是仅远离既定的偏位距离(offset distance)而配置。而且，大多情况下将位置检测用照相机的光轴对准接合位置后，使接合头仅以偏位距离移动而使接合工具的中心线移动至接合位置进行接合。
另一方面，若持续进行接合动作，则偏位距离因温度上升而变化。因此，有时即便将位置检测用照相机的光轴对准接合位置后使接合头仅以偏位距离移动，接合工具的中心线也未到达接合位置。因此，提出有通过在接合动作的中途校正偏位距离而提高了定位精度的接合装置(例如参照专利文献1)。
现有技术文献
专利文献
专利文献1：日本专利特开2001-203234号公报
发明内容
发明所要解决的问题
然而，对于专利文献1所记载的现有技术的接合装置而言，为了校正偏位量而需要使接合头移动至参照构件的位置。所述接合装置存在以下问题：在移动接合头时接合头等的温度变化而偏位距离也变化，因此定位精度不充分等。
因此，本发明的目的在于提高第一物体相对于第二物体的定位精度。
解决问题的技术手段
本发明的装置相对于第二物体来定位第一物体，并且其特征在于具备：移动体，相对于第二物体而直线移动；保持部，安装于移动体且保持第一物体；位置指定机构，沿着移动体的移动方向与保持部隔开既定的间隔而安装于移动体，且指定第二物体的位置；刻度尺，沿着移动体的移动方向而配置，且沿着移动方向具有多个刻度；第一位置检测部，与保持部对应地安装于移动体，且根据刻度而检测保持部的位置；第二位置检测部，与位置指定机构对应地与第一位置检测部隔开既定的间隔而安装于移动体，且检测与所指定的第二物体的位置对应的刻度尺的刻度位置；以及控制部，使移动体移动至第一位置检测部检测刻度位置的位置，相对于第二物体来定位第一物体。
在本发明的装置中，也可使第一物体为半导体裸片，第二物体为供安装半导体裸片的基板或其他半导体裸片，且装置将第一物体定位于第二物体的预定区域。
在本发明的装置中，也可使位置指定机构为以光学方式指定第二物体的位置的照相机，且控制部使移动体移动至第一位置，所述第一位置是使位置指定机构第二物体的指定区域进入位置指定机构的视场的位置，利用第二位置检测部检测第一位置的刻度尺的刻度位置，根据利用位置指定机构拍摄第二物体的指定区域所得的图像来检测位置指定机构相对于指定区域的第一相对位置，根据第一相对位置，算出相对于第二物体来定位第一物体时的修正移动体的位置的修正量。
在本发明的装置中，也可还具备保持位置指定机构，所述保持位置指定机构配置于保持部的保持面侧，且指定第一物体相对于保持面的第二相对位置，控制部根据第二相对位置而算出相对于第二物体来定位第一物体时的修正移动体的位置的修正量。
在本发明的装置中，控制部也可根据修正量而算出刻度尺的目标刻度位置。
本发明的相对于第二物体来定位第一物体的方法的特征在于包括：通过保持部来保持第一物体的步骤；移动步骤，使设有保持第一物体的保持部及位置指定机构的移动体移动至既定的位置；位置指定步骤，通过沿着移动体的移动方向与保持部隔开既定的间隔而安装于移动体的位置指定机构，来指定第二物体的位置；位置检测步骤，通过与位置指定机构对应地与第一位置检测部隔开既定的间隔而安装于移动体的第二位置检测部，来检测与所指定的第二物体的位置对应的刻度尺的刻度位置；以及定位步骤，通过配置于移动体的第一位置检测部来读取刻度尺的刻度，使保持部移动至检测刻度位置的位置，相对于第二物体来定位第一物体。
发明的效果
本发明可提高第一物体相对于第二物体的定位精度。
附图说明
图1为表示实施方式的安装装置的系统构成的系统图。
图2为表示图1所示的安装装置中直线刻度尺发生热膨胀的情形时的基本动作的说明图，(a)表示第一位置时的状态，(b)表示以接合头侧编码器头的中心线对准由照相机侧编码器头所检测出的直线刻度尺的刻度位置的方式移动基座所得的状态。
图3为表示图1所示的安装装置中基座发生热膨胀的情形时的基本动作的说明图，(a)表示第一位置时的状态，(b)表示以接合头侧编码器头的中心线对准由照相机侧编码器头所检测出的直线刻度尺的刻度位置的方式移动基座所得的状态。
图4为表示图1所示的安装装置的运行的流程图。
图5为表示在图4所示的安装装置的运行中的说明图，(a)表示基座位于第一位置的状态的立面图、(b)表示接合工具的中心位置与吸附于接合工具的半导体裸片的相对位置的说明图、及(c)表示第一位置时的照相机的视场的说明图。
图6为表示在图4所示的安装装置的运行中的说明图，(a)表示以接合头侧编码器头的中心线对准由照相机侧编码器头所检测出的直线刻度尺的刻度位置的方式移动基座所得的状态的立面图、及(b)表示此时的接合工具与基板的对准标记的位置关系的说明图。
图7为表示图1所示的安装装置的其他运行的流程图。
图8为表示图1所示的安装装置的其他运行的流程图。
图9为在图8所示的安装装置的运行中的说明图，(a)表示以接合头侧编码器头的中心线对准目标刻度位置的方式移动基座所得的状态的立面图、及(b)表示此时的接合工具与基板的对准标记的位置关系的说明图。
图10为表示图1所示的安装装置的其他运行的流程图。
具体实施方式
＜安装装置的构成＞
以下，作为相对于第二物体来定位第一物体的装置，以将半导体裸片15安装于基板16等的安装装置100为例进行说明。如图1所示，本实施方式的安装装置100将作为第一物体的半导体裸片15定位于作为第二物体的基板16或作为未图示的第二物体的其他半导体裸片的预定区域并进行安装。安装装置100具备作为移动体的基座10、作为保持半导体裸片15的保持部的接合头20、作为指定基板16的位置的位置指定机构的照相机25、作为第一位置检测部的接合头侧编码器头31、作为第二位置检测部的照相机侧编码器头32、具有多个刻度34的直线刻度尺33、控制部50、下照相机40、及吸附固定基板16的接合平台13。此处，安装装置100例如可为使半导体裸片15反转后安装于基板16的倒装芯片接合装置，或也可为不使半导体裸片15不反转而安装于基板16的裸片接合装置。
基座10受到在左右方向即X方向上延伸的导轨11导引而在X方向上直线移动。另外，在基座10上安装有在X方向上驱动基座10的线性马达12。
在基座10上安装有接合头20及照相机25。接合头20使真空吸附半导体裸片15并接合于基板16的安装工具即接合工具21在上下方向即Z方向上移动。图1的符号22z表示接合头20的Z方向的中心线。另外，接合工具21是与接合头20的Z方向的中心线22z同轴地配置，因此中心线22z也为通过接合工具21的中心的线。照相机25自基板16上方进行拍摄而取得其图像，以光学方式指定基板16的位置。图1的符号26z表示照相机25的光轴。关于接合头20与照相机25，使接合头20的Z方向的中心线22z与照相机25的光轴26z在基座10的移动方向即X方向上仅远离既定的间隔ΔH而安装于基座10。此处，既定的间隔ΔH为偏位距离。
另外，在基座10上安装有接合头侧编码器头31及照相机侧编码器头32。如图1所示，接合头侧编码器头31是以中心线31a与接合头20的Z方向的中心线22z成为相同位置的方式安装于基座10。另外，照相机侧编码器头32是以中心线32a与照相机25的光轴26z的位置C成为相同位置的方式安装于基座10。因此，接合头侧编码器头31与照相机侧编码器头32是在基座10的移动方向即X方向上仅远离既定的间隔ΔH而安装于基座10。
在与接合头侧编码器头31及照相机侧编码器头32相向的位置，配置有在基座10的移动方向即X方向上延伸的通用的直线刻度尺33。直线刻度尺33以既定的间隔而刻有刻度34。接合头侧编码器头31及照相机侧编码器头32以光学方式读取所述刻度34，检测直线刻度尺33上的位置。另外，接合头侧编码器头31根据以光学方式读取的刻度34而检测接合头20的位置，照相机侧编码器头32以光学方式检测与所指定的基板16的位置对应的刻度34。
接合平台13真空吸附基板16。
如图1所示，下照相机40配置于稍许远离接合平台13的位置，自下方拍摄接合工具21及吸附于接合工具21的下表面的半导体裸片15。下照相机40为指定半导体裸片15相对于接合工具21的下表面的相对位置的保持位置指定机构。
如图1所示，线性马达12及接合头20连接于控制部50，根据控制部50的指令而运行。另外，接合头侧编码器头31、照相机侧编码器头32连接于控制部50，所检测出的直线刻度尺33的刻度位置的数据被输入至控制部50中。另外，照相机25、下照相机40也连接于控制部50，照相机25、下照相机40所拍摄的图像被输入至控制部50中。
控制部50为在内部含有进行信息处理的中央处理器(Central Processing Unit，CPU)及存储有运作程序、数据的存储器的计算机，调整基座10的X方向位置。
图1所示的安装装置100的导轨11、直线刻度尺33通过未图示的Y方向驱动机构而可成一体地在Y方向上移动。Y方向驱动机构连接于控制部50，根据控制部50的指令而运行。再者，Y方向为与X方向正交的水平方向。
再者，本实施方式的安装装置100中，以如下方式进行说明，即，接合头侧编码器头31以中心线31a与接合头20的Z方向的中心线22z成为相同位置的方式安装于基座10，且照相机侧编码器头32以中心线32a与照相机25的光轴26z成为相同位置的方式安装于基座10，但不限于此。只要接合头侧编码器头31与照相机侧编码器头32在X方向上仅远离既定的间隔ΔH而配置，则也可将接合头侧编码器头31配置于接合头20的附近，将照相机侧编码器头32配置于照相机25的附近。
＜安装装置的基本运行＞
继而，一方面参照图2、图3一方面对本实施方式的安装装置100的基本运行进行说明。图2(a)表示基座10位于第一位置的情形。在图2、图3的说明中，以如下方式进行说明，即，第一位置为照相机25的光轴26z的位置C与基板16的指定区域即接合区域的中心位置S一致的位置，接合工具21的中心位置BH与半导体裸片15的中心位置D一致，吸附于接合工具21的半导体裸片15的中心位置D位于接合头20的Z方向的中心线22z上。
如图2(a)所示，在第一位置，照相机25的光轴26z的位置C(x,y)与接合区域的中心位置S(x,y)一致。在第一位置，照相机侧编码器头32的中心线32a位于直线刻度尺33的第N号刻度的位置。在控制部50中，自照相机侧编码器头32输入照相机侧编码器头32的中心线32a位于直线刻度尺33的第N号刻度的位置的数据。继而，控制部50通过图1所示的线性马达12在X方向上移动基座10。此时，控制部50通过接合头侧编码器头31来检测直线刻度尺33的刻度的数据。而且，控制部50在X方向上移动基座10直至通过接合头侧编码器头31所检测出的直线刻度尺33的刻度位于第N号刻度位置。如图2(b)所示那样，若通过接合头侧编码器头31所检测出的直线刻度尺33的刻度成为第N号刻度位置，则接合头20的中心线22z、半导体裸片15的中心位置D成为直线刻度尺33的刻度为第N号的刻度位置、即接合区域的中心位置S。本实施方式的安装装置100可如此那样使半导体裸片15的中心位置D与接合区域的中心位置S一致。
在图2(a)、图2(b)中，虚线所示的直线刻度尺33'、刻度34'表示直线刻度尺33发生热膨胀的状态。在直线刻度尺33发生热膨胀的情形时，在第一位置，照相机侧编码器头32所检测的刻度位置成为N'。而且，控制部50在X方向上移动基座10直至通过接合头侧编码器头31所检测出的直线刻度尺33的刻度成为第N'号刻度位置。由此，可使半导体裸片15的中心位置D对准直线刻度尺33的刻度为第N号的刻度位置、即接合区域的中心位置S。
如以上所说明，对于本实施方式的安装装置100而言，即便直线刻度尺33发生热膨胀，也可不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S。
图3(a)、图3(b)表示基座10在X方向上发生热膨胀的情形。如图3(a)所示，在第一位置，照相机25的光轴26z的位置C(x,y)与接合区域的中心位置S(x,y)一致。在第一位置，照相机侧编码器头32的中心线32a位于直线刻度尺33的第N号刻度的位置。此时，接合头20的中心线22z位于在X方向上自照相机25的光轴26z仅远离ΔH'的位置。
与参照图2(b)所说明同样地，控制部50在X方向上移动基座10直至通过接合头侧编码器头31所检测出的直线刻度尺33的刻度成为第N号刻度位置。于是，半导体裸片15的中心位置D成为直线刻度尺33的刻度为第N号的刻度位置、即接合区域的中心位置S。如此那样，对于本实施方式的安装装置100而言，即便基座10发生热膨胀，也可不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S。
＜安装装置的实际运行＞
在图2、图3中，以如下方式进行说明，即，第一位置为照相机25的光轴26z的位置C(x,y)与接合区域的中心位置S(x,y)一致的位置，接合工具21的中心位置BH与半导体裸片15的中心位置D一致，吸附于接合工具21的半导体裸片15的中心位置D位于接合头20的中心线22z上，但实际上，在第一位置，照相机25的光轴26z的位置C与接合区域的中心位置S有偏离，吸附于接合工具21的半导体裸片15的中心位置D与接合工具21的中心位置BH也有偏离。因此，继而一方面参照图4～图6一方面对安装装置100的实际运行(电子零件安装方法)进行说明。
如图4的步骤S101所示，控制部50使接合头20移动至未图示的晶片固持器或中间平台上方，使半导体裸片15吸附于接合工具21而拾取半导体裸片15，并通过接合工具21保持半导体裸片15(保持步骤)。
继而，如图4的步骤S102所示，控制部50使接合头20移动至下照相机40的上方，通过下照相机40而取得接合工具21及半导体裸片15的图像。此时，在下照相机40的视场41中，如图5(b)中实线所示那样拍摄接合工具21及半导体裸片15的图像。如图5(b)所示，在视场41中，接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)仅偏差位置差ΔBH(x,y)。再者，在图5(b)中，符号22x、符号22y表示接合头20的X方向的中心线、Y方向的中心线。因此，中心线22x与中心线22y的交点成为接合工具21的中心位置BH(x,y)。再者，下照相机40自下侧拍摄接合工具21，因此在视场41中，X轴的正方向与图5(c)所示的自上方向拍摄基板16的照相机25的视场27的X轴的方向相反。
控制部50对图5(b)所示的图像进行处理，检测第二位置差、即接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)的位置差ΔBH(x,y)。位置差ΔBH为半导体裸片15相对于保持面即接合工具21的下表面的第二相对位置。
继而，如图4的步骤S103所示，控制部50使基座10移动至第一位置，第一位置是基板16的对准标记17进入图5(c)所示的照相机25的视场27中的位置(移动步骤)。然后，如图4的步骤S104所示，在第一位置，控制部50通过照相机侧编码器头32而检测直线刻度尺33的刻度位置。如图5(a)所示，在第一位置，照相机侧编码器头32的中心线32a位于直线刻度尺33的第N号刻度位置，因此在控制部50中，自照相机侧编码器头32输入照相机侧编码器头32的中心线32a位于直线刻度尺33的第N号刻度的位置的数据(位置检测步骤)。
继而，如图4的步骤S105所示，控制部50通过照相机25而取得包含对准标记17的接合区域的图像。在图5(c)中，26x、26y为与光轴26z正交的视场27的中心线，X方向中心线26x与Y方向中心线26y的交点成为照相机25的光轴26z的位置C(x,y)。而且，将两个对准标记17连结的线的中央成为接合区域的中心位置S(x,y)。控制部50对图5(c)所示的图像进行处理，检测第一位置差、即光轴26z的位置C(x,y)与接合区域的中心位置S(x,y)的位置差ΔC(x,y)(位置指定步骤)。位置差ΔC为照相机25相对于指定区域即接合区域的第一相对位置。
继而，如图4的步骤S106所示，控制部50通过图1所示的线性马达12在X方向上移动基座10。此时，控制部50通过接合头侧编码器头31而检测直线刻度尺33的刻度的数据。而且，控制部50在X方向上移动基座10直至通过接合头侧编码器头31所检测出的直线刻度尺33的刻度成为第N号刻度位置。如图6(a)所示，若通过接合头侧编码器头31所检测出的直线刻度尺33的刻度成为第N号刻度位置，则与接合头20的中心线22z为相同位置的接合工具21的中心位置BH(x,y)移动至直线刻度尺33的刻度为第N号刻度位置、即此前照相机25的光轴26z所处的位置C(x,y)。
图6(b)为自上方向观看所述状态下的接合工具21的中心位置BH(x,y)、接合区域的中心位置S(x,y)、半导体裸片15的中心位置D(x,y)的图。再者，图6(b)中的半导体裸片15的中心位置D(x,y)与图5(b)成为左右反转的位置的原因在于：图6(b)为自上方向观看的图，相对于此，图5(b)为自下方向观看的图。
如图6(b)所示，接合工具21的中心位置BH(x,y)位于此前照相机25的光轴26z所处的位置C(x,y)的位置，半导体裸片15的中心位置D(x,y)自接合工具21的中心位置BH(x,y)朝向左下仅远离位置差ΔBH(x,y)。另外，接合区域的中心位置S(x,y)自接合工具21的中心位置BH(x,y)朝向左下仅远离位置差ΔC(x,y)。另外，半导体裸片15的中心位置D(x,y)位于相对于接合区域的中心位置S(x,y)仅在右上远离位置差(ΔC(x,y)－ΔBH(x,y))的位置。
因此，若使接合头20的中心线22z的位置朝向X方向左侧仅移动(ΔC(x)－ΔBH(x))，且朝向Y方向下侧仅移动(ΔC(y)－ΔBH(y))，则半导体裸片15的中心位置D(x,y)与接合区域的中心位置S(x,y)一致。
因此，如图4的步骤S107所示，控制部50通过线性马达12使基座10的位置朝向X方向左侧仅移动(ΔC(x)－ΔBH(x))，且通过未图示的Y方向驱动机构使基座10的位置朝向Y方向下侧仅移动(ΔC(y)－ΔBH(y))。如此，控制部50使基座10仅移动如下距离，即，和接合区域的中心位置S(x,y)与光轴26z的位置C(x,y)的位置差ΔC(x,y)、及接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)的位置差ΔBH(x,y)相应的距离(定位步骤)。
然后，控制部50进入图4的步骤S108，通过接合头20使接合工具21降下而将半导体裸片15接合于基板16上。
如以上所说明，本实施方式的安装装置100可不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S，进行接合。
继而，一方面参照图7一方面对安装装置100的其他运行进行说明。对于与上文中参照图4所说明的相同的步骤，标注相同符号而省略说明。
图7所示的运行表示如下情形的运行，即，不通过下照相机40来进行接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)的位置差ΔBH(x,y)的检测。在所述情形时，如图7所示，控制部50在图7的步骤S106中使基座10移动后，如图7的步骤S110所示，使基座10仅移动和接合区域的中心位置S(x,y)与光轴26z的位置C(x,y)的位置差ΔC(x,y)相应的距离。即，控制部50通过线性马达12使基座10的位置朝向X方向左侧仅移动(ΔC(x))，且通过未图示的Y方向驱动机构使基座10的位置朝向Y方向下侧仅移动(ΔC(y))。
本运行也可与上文中参照图4所说明的运行同样地，不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S，进行接合。
继而，一方面参照图8一方面对安装装置100的其他运行进行说明。对于与上文中参照图4所说明的运行相同的运行，简单进行说明。
图8所示的步骤S201～步骤S205与图4的步骤S101～S105相同。本运行在图8的步骤S206中，根据接合区域的中心位置S(x,y)与光轴26z的位置C(x,y)的位置差ΔC(x,y)、及接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)的位置差ΔBH(x,y)，对直线刻度尺33的刻度位置进行修正，算出目标刻度位置N2，如图8的步骤S207所示，以接合头侧编码器头31的中心线31a到达目标刻度位置N2的方式使基座10移动。
图9表示半导体裸片15的中心位置D(x,y)与接合区域的中心位置S(x,y)一致的状态。如上文中参照图6(b)所说明，在将接合工具21的中心位置BH(x,y)设为此前照相机25的光轴26z所处的位置C(x,y)的位置的情形时，半导体裸片15的中心位置D(x,y)成为相对于接合区域的中心位置S(x,y)仅在右上远离位置差(ΔC(x,y)－ΔBH(x,y))的位置。因此，若将接合工具21的中心位置BH(x,y)设为自此前照相机25的光轴26z所处的位置C(x,y)仅在左下远离位置差(ΔC(x,y)－ΔBH(x,y))的位置，则半导体裸片15的中心位置D(x,y)与接合区域的中心位置S(x,y)一致。
因此，控制部50计算目标刻度位置N2，所述目标刻度位置N2是对此前照相机25的光轴26z所处的位置C(x,y)的直线刻度尺33的刻度位置N仅以与(ΔC(x)－ΔBH(x))对应的刻度程度进行修正所得。继而，如图9所示，使基座10移动至接合头侧编码器头31的中心线31a的位置成为目标刻度位置N2的位置、即接合头侧编码器头31所检测出的直线刻度尺33的刻度位置成为目标刻度位置N2的位置(定位步骤)。由此，可使半导体裸片15的中心位置D(x)与接合区域的中心位置S(x)一致。此处，此前照相机25的光轴26z所处的位置C(x,y)的直线刻度尺33的刻度位置N与目标刻度位置N2的刻度差为基座10的位置的修正量。
另外，控制部50同时仅使基座10朝向Y方向下侧移动(ΔC(y)－ΔBH(y))。由此，可使半导体裸片15的中心位置D(x,y)与接合区域的中心位置S(x,y)一致。
参照图8的运行可在X方向上通过一次运行使半导体裸片15的中心位置D(x)与接合区域的中心位置S(x)一致，故而可较上文中参照图4所说明的运行更高速地进行对位。另外，本运行中，也可不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S，进行接合。
图10为表示以下情形的运行：在图8所示的运行中，与图7所示的运行同样地，不通过下照相机40来进行接合工具21的中心位置BH(x,y)与半导体裸片15的中心位置D(x,y)的位置差ΔBH(x,y)的检测。
如以上所说明，本实施方式的安装装置100可不进行偏位距离即既定的间隔ΔH的校正而使半导体裸片15的中心位置D对准接合区域的中心位置S，进行接合，因此可不进行偏位距离即既定的间隔ΔH的校正而提高接合精度。另外，由于无需进行偏位距离的校正，故而可提高接合的生产性。
以上，以安装装置100为例对本发明的实施方式进行了说明，但本发明不限于倒装芯片接合装置或裸片接合装置，可应用于各种装置。例如，可应用于打线接合装置、工业用机器人、搬送装置。可不限于搬送或安装的对象物、对象物的大小、对象物的技术领域而应用于所有装置。
符号的说明
10：基座
11：导轨
12：线性马达
13：接合平台
15：半导体裸片
16：基板
17：对准标记
20：接合头
21：接合工具
22x、22y、22z、31a、32a：中心线
25：照相机
26x：X方向中心线
26y：Y方向中心线
26z：光轴
27：视场
31：接合头侧编码器头
32：照相机侧编码器头
33、33'：直线刻度尺
34、34'：刻度
40：下照相机
41：视场
50：控制部
100：安装装置
BH、D、S：中心位置
C：位置
N：刻度位置
N2：目标刻度位置
ΔBH、ΔC：位置差
ΔH：间隔

Claims (9)

1.一种相对于第二物体来定位第一物体的装置，包括：
移动体，相对于所述第二物体而直线移动；
保持部，安装于所述移动体且保持所述第一物体；
位置指定机构，沿着所述移动体的移动方向与所述保持部隔开既定的间隔而安装于所述移动体，且指定所述第二物体的位置；
刻度尺，沿着所述移动体的所述移动方向而配置，且沿着所述移动方向具有多个刻度；
第一位置检测部，与所述保持部对应地安装于所述移动体，且根据所述刻度而检测所述保持部的位置；
第二位置检测部，与所述位置指定机构对应地与所述第一位置检测部隔开所述既定的间隔而安装于所述移动体，且检测与所指定的所述第二物体的位置对应的所述刻度尺的刻度位置；以及
控制部，使所述移动体移动至所述第一位置检测部检测所述刻度位置的位置，相对于所述第二物体来定位所述第一物体。
2.根据权利要求1所述的装置，其特征在于所述第一物体为半导体裸片，
所述第二物体为供安装所述半导体裸片的基板或其他半导体裸片，
所述装置为将所述第一物体定位于所述第二物体的预定区域的装置。
3.根据权利要求1所述的装置，其中所述位置指定机构为以光学方式指定所述第二物体的位置的照相机，
所述控制部使所述移动体移动至第一位置，所述第一位置是使所述位置指定机构所述第二物体的指定区域进入所述位置指定机构的视场的位置，利用第二位置检测部来检测所述第一位置的所述刻度尺的所述刻度位置，
根据利用所述位置指定机构拍摄所述第二物体的所述指定区域所得的图像来检测所述位置指定机构相对于所述指定区域的第一相对位置，
根据所述第一相对位置，算出相对于所述第二物体来定位所述第一物体时的修正所述移动体的位置的修正量。
4.根据权利要求2所述的装置，其中所述位置指定机构为以光学方式指定所述第二物体的位置的照相机，
所述控制部使所述移动体移动至第一位置，所述第一位置是使所述位置指定机构所述第二物体的指定区域进入所述位置指定机构的视场的位置，利用第二位置检测部来检测所述第一位置的所述刻度尺的所述刻度位置，
根据利用所述位置指定机构拍摄所述第二物体的所述指定区域所得的图像来检测所述位置指定机构相对于所述指定区域的第一相对位置，
根据所述第一相对位置，算出相对于所述第二物体来定位所述第一物体时的修正所述移动体的位置的修正量。
5.根据权利要求1至4中任一项所述的装置，还包含保持位置指定机构，所述保持位置指定机构配置于所述保持部的保持面侧，且指定所述第一物体相对于保持面的第二相对位置，
所述控制部根据所述第二相对位置而算出相对于所述第二物体来定位所述第一物体时的修正所述移动体的位置的修正量。
6.根据权利要求3所述的装置，其中所述控制部根据所述修正量而算出所述刻度尺的目标刻度位置。
7.根据权利要求4所述的装置，其中所述控制部根据所述修正量而算出所述刻度尺的目标刻度位置。
8.根据权利要求5所述的装置，其中所述控制部根据所述修正量而算出所述刻度尺的目标刻度位置。
9.一种相对于第二物体来定位第一物体的方法，包括：
通过保持部来保持所述第一物体的步骤；
移动步骤，使设有保持所述第一物体的所述保持部及位置指定机构的移动体移动至既定的位置；
位置指定步骤，通过沿着所述移动体的移动方向与所述保持部隔开既定的间隔而安装于所述移动体的所述位置指定机构，来指定所述第二物体的位置；
位置检测步骤，通过与所述位置指定机构对应地与第一位置检测部隔开所述既定的间隔而安装于所述移动体的第二位置检测部，来检测与所指定的所述第二物体的位置对应的刻度尺的刻度位置；以及
定位步骤，通过配置于所述移动体的第一位置检测部来读取所述刻度尺的刻度，使所述保持部移动至检测所述刻度位置的位置，相对于所述第二物体来定位所述第一物体。
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