CN111037370A - 一种圆晶倒角工艺 - Google Patents
一种圆晶倒角工艺 Download PDFInfo
- Publication number
- CN111037370A CN111037370A CN201911204663.4A CN201911204663A CN111037370A CN 111037370 A CN111037370 A CN 111037370A CN 201911204663 A CN201911204663 A CN 201911204663A CN 111037370 A CN111037370 A CN 111037370A
- Authority
- CN
- China
- Prior art keywords
- round
- chamfering
- round crystal
- crystal
- rotating speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000001154 acute effect Effects 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 15
- 239000000110 cooling liquid Substances 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911204663.4A CN111037370B (zh) | 2019-11-29 | 2019-11-29 | 一种圆晶倒角工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911204663.4A CN111037370B (zh) | 2019-11-29 | 2019-11-29 | 一种圆晶倒角工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111037370A true CN111037370A (zh) | 2020-04-21 |
CN111037370B CN111037370B (zh) | 2021-04-27 |
Family
ID=70233644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911204663.4A Active CN111037370B (zh) | 2019-11-29 | 2019-11-29 | 一种圆晶倒角工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111037370B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111604756A (zh) * | 2020-06-26 | 2020-09-01 | 房书明 | 一种玻璃板的弧边倒角方法 |
CN112658865A (zh) * | 2020-12-29 | 2021-04-16 | 杭州中欣晶圆半导体股份有限公司 | 树脂砂轮开沟槽的方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004154880A (ja) * | 2002-11-05 | 2004-06-03 | Hitachi Zosen Corp | 円盤状ワーク外周部研磨装置 |
CN1901172A (zh) * | 2005-07-21 | 2007-01-24 | 硅电子股份公司 | 半导体晶片及制造半导体晶片的工艺 |
EP1962335A1 (en) * | 2005-12-15 | 2008-08-27 | Shin-Etsu Handotai Co., Ltd. | Method of processing chamfered portion of semiconductor wafer and method of correcting groove shape of grindstone |
CN104952719A (zh) * | 2014-03-25 | 2015-09-30 | 株洲南车时代电气股份有限公司 | 一种半导体芯片台面造型方法 |
CN105164752A (zh) * | 2013-04-30 | 2015-12-16 | Hoya株式会社 | 磁盘用玻璃基板的制造方法和磁盘的制造方法、以及磁盘用玻璃基板的端面研磨装置 |
JP2016190284A (ja) * | 2015-03-31 | 2016-11-10 | 株式会社東京精密 | 面取り基板の製造方法及びそれに用いられる面取り装置 |
JP2017159421A (ja) * | 2016-03-11 | 2017-09-14 | 株式会社東京精密 | 面取り加工装置 |
CN107838772A (zh) * | 2017-12-01 | 2018-03-27 | 成都益睿信科技有限公司 | 一种多角度打磨磨具 |
CN108177044A (zh) * | 2017-12-22 | 2018-06-19 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角技术 |
-
2019
- 2019-11-29 CN CN201911204663.4A patent/CN111037370B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004154880A (ja) * | 2002-11-05 | 2004-06-03 | Hitachi Zosen Corp | 円盤状ワーク外周部研磨装置 |
CN1901172A (zh) * | 2005-07-21 | 2007-01-24 | 硅电子股份公司 | 半导体晶片及制造半导体晶片的工艺 |
EP1962335A1 (en) * | 2005-12-15 | 2008-08-27 | Shin-Etsu Handotai Co., Ltd. | Method of processing chamfered portion of semiconductor wafer and method of correcting groove shape of grindstone |
CN105164752A (zh) * | 2013-04-30 | 2015-12-16 | Hoya株式会社 | 磁盘用玻璃基板的制造方法和磁盘的制造方法、以及磁盘用玻璃基板的端面研磨装置 |
CN104952719A (zh) * | 2014-03-25 | 2015-09-30 | 株洲南车时代电气股份有限公司 | 一种半导体芯片台面造型方法 |
JP2016190284A (ja) * | 2015-03-31 | 2016-11-10 | 株式会社東京精密 | 面取り基板の製造方法及びそれに用いられる面取り装置 |
JP2017159421A (ja) * | 2016-03-11 | 2017-09-14 | 株式会社東京精密 | 面取り加工装置 |
CN107838772A (zh) * | 2017-12-01 | 2018-03-27 | 成都益睿信科技有限公司 | 一种多角度打磨磨具 |
CN108177044A (zh) * | 2017-12-22 | 2018-06-19 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角技术 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111604756A (zh) * | 2020-06-26 | 2020-09-01 | 房书明 | 一种玻璃板的弧边倒角方法 |
CN112658865A (zh) * | 2020-12-29 | 2021-04-16 | 杭州中欣晶圆半导体股份有限公司 | 树脂砂轮开沟槽的方法 |
Also Published As
Publication number | Publication date |
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CN111037370B (zh) | 2021-04-27 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Round crystal chamfering process Effective date of registration: 20220105 Granted publication date: 20210427 Pledgee: Agricultural Bank of China Limited by Share Ltd. Shanghai Minhang branch Pledgor: SHANGHAI PANMENG ELECTRONIC MATERIALS CO.,LTD. Registration number: Y2022310000003 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231212 Granted publication date: 20210427 Pledgee: Agricultural Bank of China Limited by Share Ltd. Shanghai Minhang branch Pledgor: SHANGHAI PANMENG ELECTRONIC MATERIALS CO.,LTD. Registration number: Y2022310000003 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231220 Address after: 333000 South of Gongye Fourth Road, High tech Zone, Jingdezhen City, Jiangxi Province (within Jingdezhen Shangyi Technology Co., Ltd.) Patentee after: Jiangxi Panmeng Semiconductor Technology Co.,Ltd. Address before: 201600 Building 2, 399 changta Road, Songjiang District, Shanghai Patentee before: SHANGHAI PANMENG ELECTRONIC MATERIALS CO.,LTD. |
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TR01 | Transfer of patent right |