CN111020518A - Substrate evaporation bearing disc and vacuum evaporation instrument - Google Patents
Substrate evaporation bearing disc and vacuum evaporation instrument Download PDFInfo
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- CN111020518A CN111020518A CN201911405229.2A CN201911405229A CN111020518A CN 111020518 A CN111020518 A CN 111020518A CN 201911405229 A CN201911405229 A CN 201911405229A CN 111020518 A CN111020518 A CN 111020518A
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- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000001704 evaporation Methods 0.000 title claims abstract description 114
- 230000008020 evaporation Effects 0.000 title claims abstract description 109
- 238000007738 vacuum evaporation Methods 0.000 title claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims description 38
- 238000000576 coating method Methods 0.000 claims description 38
- 238000007740 vapor deposition Methods 0.000 claims description 38
- 238000009834 vaporization Methods 0.000 claims description 37
- 230000008016 vaporization Effects 0.000 claims description 37
- 238000007747 plating Methods 0.000 abstract description 39
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to the technical field of machinery, and discloses a substrate evaporation bearing disc and a vacuum evaporation instrument. The substrate evaporation bearing disc is used in a vacuum evaporation instrument and comprises a base disc and a baffle plate assembly, wherein a plurality of bearing parts for placing substrates are arranged on the base disc; the baffle assembly is arranged below the chassis, can move relative to the chassis and is used for switching whether evaporation plating and switching a required evaporation plating pattern. The baffle plate assembly in the substrate evaporation bearing disc can shield evaporation patterns to prevent the corresponding substrate from being evaporated, and can also switch the evaporation patterns according to the evaporation requirements of each substrate, so that an evaporation instrument can simultaneously evaporate a plurality of and various substrates, the types and the number of the evaporation substrates are increased, and the space utilization rate of the substrate evaporation bearing disc and the evaporation efficiency of the evaporation instrument are improved.
Description
Technical Field
The invention relates to the technical field of machinery, in particular to a substrate evaporation bearing disc and a vacuum evaporation instrument.
Background
The vacuum thermal evaporation coating technology is widely applied to the manufacturing of flat panel displays such as organic light-emitting display screens and the like, and the technology is also widely applied to the industrialization of corresponding thin film devices. The basic principle is that the raw material to be formed into the film is heated and evaporated by a heating means, the raw material is changed into a gas phase from condensation phase, molecules or atoms of the raw material are gasified and escaped from the surface to form a steam flow, the steam flow is incident to the surface of a base plate (substrate), and finally the evaporated molecules or atoms are deposited on the base plate (substrate) and condensed to form a solid film.
In the organic light emitting display device, an organic light emitting layer emitting visible light and an organic layer adjacent to the organic light emitting layer are formed by using various methods. Especially, the vacuum deposition method is frequently used due to its simple process. In the vacuum deposition method, a deposition material in a powder or solid state is filled into a furnace, and a deposition film is formed on a desired region by heating the furnace. The existing substrate evaporation bearing plate can only be used for placing two substrates, the types of the evaporation substrates are few, and the space on the substrate evaporation bearing plate cannot be fully utilized.
Disclosure of Invention
The invention aims to provide a substrate evaporation bearing disc and a vacuum evaporation instrument, which can be used for placing a plurality of substrates, have various evaporation substrates and improve the space utilization rate of the substrate evaporation bearing disc.
In order to achieve the purpose, the invention adopts the following technical scheme:
a substrate evaporation bearing disc is used in a vacuum evaporation instrument and comprises:
the substrate positioning device comprises a base plate, a positioning device and a positioning device, wherein a plurality of bearing parts for placing substrates are arranged on the base plate;
the baffle assembly is arranged below the chassis and can move relative to the chassis, and the baffle assembly is used for switching whether evaporation is carried out or not and switching a required evaporation pattern.
Preferably, the baffle assembly comprises a plurality of baffles and a fixing piece, the baffles are slidably connected with the fixing piece, the baffles are arranged along the circumferential direction of the chassis and are in one-to-one correspondence with the bearing parts, and the baffles are connected with a driving assembly for driving the baffles to move relative to the chassis.
Preferably, the baffle is parallel to and connected with the bottom surface of the chassis in a sliding mode, and the baffle moves towards or away from the center of the chassis.
Preferably, the chassis comprises:
the mask disc is provided with a plurality of evaporation patterns along the circumferential direction, the baffle is arranged below the mask disc, the fixing piece is fixedly connected with the mask disc, and the baffle is used for shielding the evaporation patterns;
and the substrate disc is coaxially arranged with the mask disc, and the mask disc can rotate relative to the substrate disc.
Preferably, the base plate comprises a substrate disc, the bearing part is arranged on the substrate disc, the baffle plate assembly is arranged below the substrate disc, and the baffle plate assembly can move relative to the substrate disc.
Preferably, the baffle assembly comprises a plurality of baffles, the baffles are arranged along the circumferential direction of the substrate disc and are in one-to-one correspondence with the bearing parts, the plurality of evaporation patterns are arranged on the baffles, and the baffles move relative to the substrate disc to switch whether evaporation is performed or not and switch the required evaporation patterns.
Preferably, the baffle is rotatably connected with the substrate tray, the rotating axis of the baffle is parallel to the central line of the substrate tray, and the baffle is provided with a plurality of evaporation patterns along the circumferential direction.
Preferably, the baffle is connected with the substrate tray in a sliding mode, the baffle moves towards or away from the center of the substrate tray, and the plurality of evaporation patterns are arranged on the baffle along the moving direction of the baffle.
Preferably, the bearing part comprises a groove arranged on the base plate, a vapor deposition hole is formed at the bottom of the groove, and the groove is used for placing the substrate.
A vacuum evaporation instrument comprises the substrate evaporation bearing disc.
The invention has the beneficial effects that:
the baffle plate assembly in the substrate evaporation bearing disc can shield evaporation patterns to prevent the corresponding substrate from being evaporated, and can also switch the evaporation patterns according to the evaporation requirements of each substrate, so that an evaporation instrument can simultaneously evaporate a plurality of and various substrates, the types and the number of the evaporation substrates are increased, and the space utilization rate of the substrate evaporation bearing disc and the evaporation efficiency of the evaporation instrument are improved.
The vacuum evaporation plating instrument provided by the invention adopts the substrate evaporation plating bearing disc, can simultaneously evaporate a plurality of and various substrates, increases the types and the number of the evaporation plating substrates, and improves the efficiency of substrate evaporation plating.
Drawings
Fig. 1 is a schematic structural diagram of a first view angle of a substrate evaporation loading tray according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second viewing angle of a substrate evaporation loading tray according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a portion of a driving assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first viewing angle of a substrate evaporation loading tray according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second viewing angle of a substrate evaporation loading tray according to a second embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a baffle assembly according to a second embodiment of the present invention;
fig. 7 is a schematic structural diagram of a first viewing angle of a substrate evaporation loading tray according to a third embodiment of the present invention;
fig. 8 is a schematic structural diagram of a second viewing angle of a substrate evaporation tray according to a third embodiment of the present invention.
In the figure:
11. a substrate tray; 12. a mask disk;
2. a bearing part; 21. a groove; 22. evaporating and plating holes;
3. a baffle assembly; 31. a baffle plate; 32. a fixing member; 33. a rotating shaft;
4. evaporating and plating patterns;
51. a push rod; 52. a hook structure; 53. a handle.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Example one
This embodiment provides a substrate evaporation plating bears dish for among the vacuum evaporation plating appearance, this substrate evaporation plating bears dish can place a plurality of substrates, and the kind of evaporation plating substrate is many, has improved the space utilization that the dish was born in the substrate evaporation plating.
Specifically, as shown in fig. 1 and fig. 2, the substrate vapor deposition bearing plate includes a chassis and a baffle assembly 3, the chassis is provided with a plurality of bearing portions 2 for placing substrates, the baffle assembly 3 is disposed below the chassis, the baffle assembly 3 can move relative to the chassis, and the baffle assembly 3 is used for switching whether vapor deposition is performed or not and switching a desired vapor deposition pattern 4. In the coating by vaporization in-process, baffle subassembly 3 can shelter from coating by vaporization figure 4 and make the substrate that corresponds not coating by vaporization figure, can also require to switch coating by vaporization figure 4 to the coating by vaporization of every substrate, has increased the kind and the number of coating by vaporization substrate, has improved the space utilization of substrate coating by vaporization carrier dish and the coating by vaporization efficiency of coating by vaporization appearance.
The bearing part 2 comprises a groove 21 arranged on the chassis, a vapor deposition hole 22 is arranged at the bottom of the groove 21, and the groove 21 is used for placing a substrate. The substrate is placed in recess 21, and the one side orientation that the substrate needs the coating by vaporization hole 22, through evaporating hole 22 with coating by vaporization figure 4 coating by vaporization to the substrate on, simple structure, and conveniently get and put the substrate.
The baffle plate assembly 3 comprises a baffle plate 31 and a fixing piece 32, the baffle plate 31 is connected with the fixing piece 32 in a sliding mode, the baffle plate 31 is provided with a plurality of baffles, the baffles are arranged along the circumferential direction of the chassis and are in one-to-one correspondence with the bearing parts 2, and whether each substrate is evaporated or not can be controlled independently. The flap 31 is connected to a drive assembly which drives the flap 31 in movement relative to the chassis. The driving component drives the baffle 31 to move to switch whether to evaporate or not and switch the required evaporation pattern 4, thereby realizing automatic control of the baffle 31.
In the present embodiment, the baffle 31 is parallel to and slidably connected with the bottom surface of the chassis, and the baffle 31 moves towards or away from the center of the chassis under the driving of the driving assembly. Further, the base plate comprises a mask plate 12 and a substrate plate 11, the substrate plate 11 is arranged coaxially with the mask plate 12, and the mask plate 12 rotates relative to the substrate plate 11. The substrate disc 11 is circumferentially provided with a plurality of grooves 21 for placing substrates, the mask disc 12 is circumferentially provided with a plurality of evaporation patterns 4, the baffle 31 is arranged below the mask disc 12, and when the substrate does not need the evaporation patterns, the baffle 31 is used for shielding the evaporation patterns 4. The mask disk 12 is rotated relative to the substrate disk 11, and the vapor deposition patterns 4 can be switched.
Still further, the fixing member 32 is fixedly mounted on the mask disk 12, and each baffle 31 is correspondingly provided with one fixing member 32, so that the structure is simple, and the installation is convenient. Preferably, the fixing member 32 includes a sliding block, the sliding block is provided with a sliding slot, and the baffle 31 is embedded in the sliding slot and can move in the sliding slot.
The driving assembly for driving the baffle 31 to move comprises a push rod 51, one end of the push rod 51 is used for being connected with the baffle 31, the other end of the push rod 51 is connected with a driving part, the push rod 51 is connected with the baffle 31, and the driving part drives the push rod 51 to further drive the baffle 31 to move towards or away from the center of the chassis. When the baffle 31 needs to shield the evaporation pattern 4, the push rod 51 drives the baffle 31 to move towards the center of the chassis and shield the evaporation pattern 4, and when the baffle 31 does not need to shield the evaporation pattern 4, the push rod 51 drives the baffle 31 to move away from the center of the chassis and does not shield the evaporation pattern 4 any more.
In this embodiment, as shown in fig. 3, one end of the push rod 51 is provided with a hook component 52, one end of the baffle 31 away from the center of the chassis is provided with a connecting part which is connected with the hook component 52 in a matching way, the driving component is a handle 53 arranged at the other end of the push rod 51, the push rod 51 can be rotated by holding the handle 53 by hand, so that the hook component 52 is connected with the connecting part, after the connection, the push rod 51 is pushed forwards and backwards to realize the movement of the baffle 31, and then the handle 53 is rotated, so that the hook component 52 is separated from the connecting part. In this embodiment, only one set of driving assembly is provided, the baffle 31 whose position needs to be changed is moved to the position of the driving assembly by rotating the mask disk 12, and the driving assembly is operated to change the position of the baffle 31, so that the mask device is simple in structure, convenient to operate, and capable of reducing the equipment cost.
This embodiment still provides a vacuum evaporation plating appearance, adopts foretell substrate evaporation plating to bear dish. The substrate evaporation bearing plate can simultaneously evaporate a plurality of and multiple types of substrates, increases the types and the number of the evaporation substrates, and improves the efficiency of the substrate evaporation.
Example two
This embodiment provides a substrate evaporation plating bears dish for among the vacuum evaporation plating appearance, this substrate evaporation plating bears dish can place a plurality of substrates, and the kind of evaporation plating substrate is many, has improved the space utilization that the dish was born in the substrate evaporation plating.
Specifically, as shown in fig. 4 and 5, the substrate vapor deposition bearing plate includes a chassis and a baffle assembly 3, the chassis is provided with a plurality of bearing portions 2 for placing substrates, the baffle assembly 3 is disposed below the chassis, the baffle assembly 3 can move relative to the chassis, and the baffle assembly 3 is used for switching whether vapor deposition is performed or not and switching a desired vapor deposition pattern 4. In the coating by vaporization in-process, baffle subassembly 3 can shelter from coating by vaporization figure 4 and make the substrate that corresponds not coating by vaporization figure, can also require to switch coating by vaporization figure 4 to the coating by vaporization of every substrate, has increased the kind and the number of coating by vaporization substrate, has improved the space utilization of substrate coating by vaporization carrier dish and the coating by vaporization efficiency of coating by vaporization appearance.
In the present embodiment, the substrate tray includes a substrate tray 11, and the carrier 2 is provided on the substrate tray 11. The bearing part 2 comprises a groove 21 arranged on the substrate disc 11, a vapor deposition hole 22 is arranged at the bottom of the groove 21, and the groove 21 is used for placing a substrate. The substrate is placed in recess 21, and the one side orientation that the substrate needs the coating by vaporization hole 22, through evaporating hole 22 with coating by vaporization figure 4 coating by vaporization to the substrate on, simple structure, and conveniently get and put the substrate. The baffle plate assembly 3 is arranged below the substrate disc 11, and the baffle plate assembly 3 can move relative to the substrate disc 11.
Further, the baffle assembly 3 includes a plurality of baffles 31, the baffles 31 are arranged along the circumferential direction of the substrate tray 11 and are in one-to-one correspondence with the carrying portions 2, a plurality of evaporation patterns 4 are arranged on the baffles 31, and the baffles 31 move relative to the substrate tray 11 to switch whether evaporation is performed or not and switch the evaporation patterns 4 required. Whether the evaporation plating and the evaporation plating graph 4 are switched can be achieved through the movement of the baffle 31, the structure of the evaporation plating bearing plate is simplified, and the space utilization rate and the evaporation plating efficiency of the substrate evaporation plating bearing plate are improved.
In this embodiment, the shutter 31 is rotatably connected to the substrate tray 11, and the axis of rotation of the shutter 31 is parallel to the center line of the substrate tray 11, and the shutter 31 is provided with a plurality of vapor deposition patterns 4 in the circumferential direction. The vapor deposition pattern 4 includes a pattern plate for covering the vapor deposition holes 22, and when the substrate does not require a vapor deposition pattern, the pattern plate is made to cover the vapor deposition holes 22. The rotary baffle 31 has a simple structure and is convenient for switching the evaporation pattern 4.
In the present embodiment, as shown in fig. 6, a rotating shaft 33 is connected to the center of the baffle 31, one end of the rotating shaft 33 is connected to the baffle 31, and the other end of the rotating shaft 33 penetrates through the substrate tray 11 and is disposed on the other side of the substrate tray 11. The other end of each rotating shaft 33 can be connected with a driver (not shown in the figure) for driving the rotating shaft 33 to rotate, so that the position of the plurality of baffles 31 can be adjusted simultaneously. Only one driver can be arranged to rotate the substrate disc 11 to a position where the baffle 31 corresponds to the driver, or the driver can be rotated to a position where the baffle 31 corresponds to the baffle 31, and then the driver drives the baffle 31 to rotate to adjust the evaporation patterns 4.
This embodiment still provides a vacuum evaporation plating appearance, adopts foretell substrate evaporation plating to bear dish. The substrate evaporation bearing plate simplifies the structure of an evaporation instrument, can simultaneously evaporate a plurality of and various substrates, increases the types and the number of the evaporation substrates, and improves the efficiency of substrate evaporation.
EXAMPLE III
This embodiment provides a substrate evaporation plating bears dish for among the vacuum evaporation plating appearance, this substrate evaporation plating bears dish can place a plurality of substrates, and the kind of evaporation plating substrate is many, has improved the space utilization that the dish was born in the substrate evaporation plating.
Specifically, as shown in fig. 7 and 8, the substrate vapor deposition bearing plate includes a chassis and a baffle assembly 3, the chassis is provided with a plurality of bearing portions 2 for placing substrates, the baffle assembly 3 is disposed below the chassis, the baffle assembly 3 can move relative to the chassis, and the baffle assembly 3 is used for switching whether to perform vapor deposition and switching a desired vapor deposition pattern 4. In the coating by vaporization in-process, baffle subassembly 3 can shelter from coating by vaporization figure 4 and make the substrate that corresponds not coating by vaporization figure, can also require to switch coating by vaporization figure 4 to the coating by vaporization of every substrate, has increased the kind and the number of coating by vaporization substrate, has improved the space utilization of substrate coating by vaporization carrier dish and the coating by vaporization efficiency of coating by vaporization appearance.
In the present embodiment, the substrate tray includes a substrate tray 11, and the carrier 2 is provided on the substrate tray 11. The bearing part 2 comprises a groove 21 arranged on the substrate disc 11, a vapor deposition hole 22 is arranged at the bottom of the groove 21, and the groove 21 is used for placing a substrate. The substrate is placed in recess 21, and the one side orientation that the substrate needs the coating by vaporization hole 22, through evaporating hole 22 with coating by vaporization figure 4 coating by vaporization to the substrate on, simple structure, and conveniently get and put the substrate. The baffle plate assembly 3 is arranged below the substrate disc 11, and the baffle plate assembly 3 can move relative to the substrate disc 11.
Further, the baffle assembly 3 includes a plurality of baffles 31, the baffles 31 are arranged along the circumferential direction of the substrate tray 11 and are in one-to-one correspondence with the carrying portions 2, a plurality of evaporation patterns 4 are arranged on the baffles 31, and the baffles 31 move relative to the substrate tray 11 to switch whether evaporation is performed or not and switch the evaporation patterns 4 required. Whether the evaporation plating and the evaporation plating graph 4 are switched can be achieved through the movement of the baffle 31, the structure of the evaporation plating bearing plate is simplified, and the space utilization rate and the evaporation plating efficiency of the substrate evaporation plating bearing plate are improved.
In the present embodiment, the shutter 31 is slidably attached to the substrate tray 11, and the shutter 31 moves toward or away from the center of the substrate tray 11, and the shutter 31 is provided with a plurality of vapor deposition patterns 4 along the moving direction of the shutter 31. The shutter 31 is longer than the shutter 31 of the first embodiment, and the vapor deposition pattern 4 provided on the shutter 31 includes a pattern for shielding the vapor deposition holes 22, and when the vapor deposition pattern is not required on the substrate, the pattern is used to shield the vapor deposition holes 22.
Further, the baffle plate assembly 3 further comprises a fixing member 32, the fixing member 32 is fixedly mounted on the substrate disc 11, the baffle plates 31 are slidably connected with the fixing member 32, and each baffle plate 31 is correspondingly provided with one fixing member 32, so that the structure is simple, and the installation is convenient. The baffle 31 is connected with a driving assembly for driving the baffle 31 to move relative to the chassis, and the driving assembly drives the baffle 31 to move to switch whether to perform vapor deposition or not and switch the required vapor deposition pattern 4, so that the baffle 31 is automatically controlled. Preferably, the fixing member 32 includes a sliding block, the sliding block is provided with a sliding slot, and the baffle 31 is embedded in the sliding slot and can move in the sliding slot.
The structure of the driving assembly in this embodiment is the same as that in the first embodiment, and will not be described in detail here. In this embodiment, when the position of the baffle 31 is adjusted, the substrate tray 11 is rotated to rotate the baffle 31 to be adjusted to the position of the driving assembly, and after the driving assembly has adjusted the position of the baffle 31, the substrate tray 11 is rotated to adjust the position of the next baffle 31, so as to adjust the baffles one by one.
This embodiment still provides a vacuum evaporation plating appearance, adopts foretell substrate evaporation plating to bear dish. The substrate evaporation bearing plate simplifies the structure of an evaporation instrument, can simultaneously evaporate a plurality of and various substrates, increases the types and the number of the evaporation substrates, and improves the efficiency of substrate evaporation.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a substrate coating by vaporization bears dish for among the vacuum evaporation appearance, its characterized in that includes:
the substrate processing device comprises a chassis, wherein a plurality of bearing parts (2) for placing substrates are arranged on the chassis;
the baffle assembly (3) is arranged below the chassis, the baffle assembly (3) can move relative to the chassis, and the baffle assembly (3) is used for switching whether evaporation is performed or not and switching the required evaporation pattern (4).
2. The substrate vapor deposition carrier plate according to claim 1, wherein the baffle assembly (3) comprises a plurality of baffles (31) and a plurality of fixing members (32), the baffles (31) are slidably connected with the fixing members (32), the plurality of baffles (31) are arranged along the circumferential direction of the base plate and are in one-to-one correspondence with the carrying portions (2), and the baffles (31) are connected with a driving assembly for driving the baffles (31) to move relative to the base plate.
3. A substrate vapor deposition carrier plate according to claim 2, wherein the baffle (31) is parallel to and slidably connected to the bottom surface of the base plate, and the baffle (31) is moved towards or away from the center of the base plate.
4. A substrate evaporation carrier plate according to claim 3, wherein the base plate comprises:
the mask disc (12) is provided with a plurality of evaporation patterns (4) along the circumferential direction, the baffle (31) is arranged below the mask disc (12), the fixing piece (32) is fixedly connected with the mask disc (12), and the baffle (31) is used for shielding the evaporation patterns (4);
a substrate disk (11) arranged coaxially with the mask disk (12), and the mask disk (12) being rotatable relative to the substrate disk (11).
5. Substrate vapor deposition carrier plate according to claim 1, characterized in that the base plate comprises a substrate plate (11), the carrier part (2) is arranged on the substrate plate (11), the baffle assembly (3) is arranged below the substrate plate (11), and the baffle assembly (3) is movable relative to the substrate plate (11).
6. The substrate vapor deposition carrier plate according to claim 5, wherein the baffle assembly (3) comprises a plurality of baffles (31), the plurality of baffles (31) are arranged along the circumferential direction of the substrate plate (11) and are in one-to-one correspondence with the carrying parts (2), the plurality of vapor deposition patterns (4) are arranged on the baffles (31), and the baffles (31) move relative to the substrate plate (11) to switch whether to vapor deposit or not and switch the desired vapor deposition patterns (4).
7. A substrate vapor deposition carrier plate according to claim 6, wherein the baffle plate (31) is rotatably connected with the substrate plate (11), the axis of rotation of the baffle plate (31) is parallel to the center line of the substrate plate (11), and the baffle plate (31) is provided with a plurality of vapor deposition patterns (4) along the circumferential direction.
8. A substrate vapor deposition carrier plate according to claim 6, wherein the shutter (31) is slidably connected to the substrate plate (11) and the shutter (31) is moved towards or away from the center of the substrate plate (11), the shutter (31) being provided with a plurality of vapor deposition patterns (4) in the direction of movement of the shutter (31).
9. A substrate vapor deposition carrier plate according to claim 1, wherein the carrier part (2) comprises a groove (21) formed in the base plate, a bottom of the groove (21) is provided with a vapor deposition hole (22), and the groove (21) is used for placing the substrate.
10. A vacuum evaporation apparatus, comprising the substrate evaporation carrier tray according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911405229.2A CN111020518A (en) | 2019-12-30 | 2019-12-30 | Substrate evaporation bearing disc and vacuum evaporation instrument |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911405229.2A CN111020518A (en) | 2019-12-30 | 2019-12-30 | Substrate evaporation bearing disc and vacuum evaporation instrument |
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| CN111020518A true CN111020518A (en) | 2020-04-17 |
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| CN201911405229.2A Pending CN111020518A (en) | 2019-12-30 | 2019-12-30 | Substrate evaporation bearing disc and vacuum evaporation instrument |
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Cited By (1)
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| CN114752885A (en) * | 2022-04-06 | 2022-07-15 | 重庆臻宝实业有限公司 | Texture baffle capable of reducing stress residue of semiconductor coating film |
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