201122132 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種用於鍍膜的鍍骐機。 【先前技術】 [0002]現有的真空離子鍍膜機主要利用電子搶將坩堝内的蒸鍍 材料進行加熱，並將蒸鍍材料蒸發到光學元件表面形成 光學膜◊而現有的蒸鍍材料一般呈顆粒狀，由於顆粒體201122132 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a rhodium plating machine for coating. [Prior Art] [0002] The existing vacuum ion plating machine mainly uses electrons to heat the evaporation material in the crucible, and evaporates the evaporation material to the surface of the optical element to form an optical film, and the existing evaporation material is generally in the form of particles. Shape due to granules
積小，重量輕’所以在加熱的過程中，某些顆粒會被喷 濺出去，沒有完全融化的顆粒會在光學元件表面產生污 點，影響光學元件的品質。為了減少這種現象，一般需 要預先在一個i空的預融機内利用電子搶將粒狀的蒸鍍 材料融化成一體，然後再裝入真空離子鍍膜機中進行鑛 膜。但是，這種鍍膜方式需要莉用兩個政请，而且每次 鍍膜都需要在兩個設備間進行操作，由此將導致製作流 程的加長，不利於提高產品的生摩效率。 【發明内容】 … [0003] 有鑒於此’有必要提供一種高:效;的^膜機。 [0004] —種鍍膜機，其包括坩堝、電子搶、坩堝轉動裝置及承 載板。所述坩堝及電子搶設於所述承載板上，所述坩堝 用於裝載為光學元件鍍膜的蒸锻材料，所述電子槍用於 加熱所述坩堝内的蒸鑛材料，所述坩堝轉動裝置驅動所 述坩堝轉動。所述鍍膜機還包括蓋板及蓋板偏移裝置， 所述蓋板蓋於所述坩堝上方，且與所述坩堝之間存在高 度差，留有供電子搶射線射入的間隙，所述蓋板偏移裝 置驅動蓋板以遮蓋或露出所述坩堝^ 098144909 表單編號A0101 第3頁/共16頁 0982076743-0 201122132 [0005] [0006] [0007] [0008] [0009] 098144909 本發明提供的賴機可以在用電子搶對蒸㈣料進行預 融時，利用蓋板偏移裝置驅動蓋板遮蓋坩堝，防止蒸鍍 材料的濺射；當用電子搶對蒸鍍材料進行蒸發時，利用 盍板偏移裝置驅動蓋板露出坩堝，進行蒸發鍍膜，從而 可以在一台設備中實現預融及鍍膜，以加快產品的生產 流程。 【實施方式】 下面將結合附圖，對本發明作進一步的詳細說明。 請參閱圖1，為本發明提供的鍍膜機loo，所述鍍膜機1〇〇 包括加熱系統1〇、承載系統2〇、離子源30及真空鍍膜 40 〇 所述真二鑛膜室包括底部401及頂部4.0.2。所述離子源 30固定在所述真空鍍膜室40的底部401，所述離子源3〇 用於為蒸發的蒸鍍材料提供動能，使得蒸鍍材料吸附的 更緊實。所述承載系統2〇包丨括轉動軸21、基板承載架22 及基板23。所述轉動軸21正對所述離子源30安裝在所述 真空鍵膜室4〇的頂部402，所述基板承載架22與所述轉動 軸21固定連接。本實施方式中採用螺絲將所述基板承載 架22連接於所述轉動軸21上《所述基板承載架22上裝有 多塊基板23 ’所述基板23用於承載待鍍膜鏡片9。 請一併參閱圖2及圖3，所述加熱系統10包括升降裝置^ 、承載板轉動裝置12、承載板13、坩堝14、電子搶15、 蓋板16、蓋板偏移裝置丨7及坩堝轉動裝置18 ◊所述升降 裝置11固定在所述真空鍍膜室40的底部401，所述升降裝 置11位於所述離子源3〇—侧。本實施方式中，所述升降 表單編號A0101 第4頁/共16頁 201122132 裝置11採用氣•。當然，所述升降裝置 液壓缸或其他動力F 、切以採用 功刀裝置例如馬達等。所 括升降基座11G及伸長部⑴。所述升祕座t置11包 所述真空錄膜室4。的底，所述伸長;：： _降基座做升降運動。所述承載板轉動： 定於所述升降裝置U的伸長部lu上。 :二 述承載板轉動裝置12#牛進雷 、 式中，斤 置12係步進電機，包括電機轉輪121及電 機主體122。所述電機主體122固定連接於所述 111 上。 G [0010] ο [0011] 所述承載板13轉動連接於所述承載板轉動裝置12上。本 實加方式中所述承載板13係一矩形板:^遍雜螺絲8固定 在電機轉轴121上。沿所述承載板^鈞長痺方向的兩端開 設有第一臺階孔131及第二臺階孔132。所述第—臺階孔 131、第二臺階孔132分別用於固定一坩堝14於其中。其 中第一臺階孔131及第二臺階孔132能鉍通過所述承載板 轉動裝置12轉動所述承載板Ϊ3來改變或交換其位置，使 得位於第一臺階孔131或第二臺階孔132中的掛瑪14能夠 c，i Γ ： 位於可以對待鍍膜鏡片9進行鍍膜的位置》 本實施方式中，所述掛竭14係圓盤狀。所述掛塌14包括 坩堝侧壁141及堝底142。所述坩堝側壁141圍成一個用 於盛放蒸鑛材料的盛料槽141a。所述堝底142加工有四個 突塊142a(參圖4)。所述四個突塊142a沿所述坩堝14的 圓周方向排列。 所述兩個電子槍15固定於所述承載板13的一侧’分別對 應所述第一臺階孔131及第二臺階孔132 ’向收容於所述 098144909 表單編號A0101 第5頁/共16頁 0982076743-0 [0012] 201122132 第一玄階孔131及第二臺階孔132内的坩堝14發射射線。 [0013] [0014] 所述蓋板16的直徑大於所述坩堝14的直徑。所述蓋板16 遮盍所述坩堝14，防止所述坩堝14内的鍍膜材料蒸發到 基板承載架22上。所述蓋板16與對應坩堝14之間留有間 隙h，使得位於承載板13側邊的電子搶15的射線[可以順 利的射入坩堝14内。所述蓋板16固定於所述蓋板偏移裝 置17上。所述蓋板偏移裝置17位於所述承載板13兩端， 且與所述第一臺階孔131及第二臺階孔132相對應。所述 蓋板偏移裝置17轉動蓋板16遮蓋或露出坩堝14。所述 蓋板偏移裝置17可以係將所述蓋板16偏轉到坩堝14 一侧 的機構’也可以係將所述蓋板16年移到坩堝14 一側的機 構。本實施方式中，所述蓋板偏移裝置〗7包括蓋板轉轴 170及蓋板支撐桿171。所述蓋板轉轴Γ70豎直立於所述 承載板13—侧，所述蓋板支撐桿i7l7jc準延伸到所述坩堝 14上方’所述蓋板16固定於所述蓋板支撐桿171上。當需 要露出所述坩堝14時’所述蓋板轉軸170水準轉動，平移 所述蓋板16，以霹!5所述坩場14。當需要遮蓋所述坩堝 14時’所述蓋板轉轴170水準轉動，將所述蓋板16平移到 所述坩堝14上方。 所述坩堝轉動裝置18驅動所述坩堝14轉動，以使坩堝14 内的蒸鍍材料被電子搶15均勻加熱。所述坩堝轉動裝置 18玎以固定在所述承載板13上，也可以與所述承載板13 分開設置。本實施方式中，所述坩堝轉動裝置18與所述 承載板13分開設置，所述坩堝轉動裝置18固定於所述真 空锻膜室40的底部401，位於所述承載板13的下方。所述 098144909 表單編號A0101 第6頁/共16頁 0982076743-0 201122132 ㈣轉動裝置18包括座體咖及轉㈣181。__# m上開設有四個與所述_14的四個突塊仙相對應 的凹槽181a。所述升降物1改變所述錢㈣的高度 ’以使所賴腿能夠承靠到所料_㈣置18的轉 動部181上’被所述坩堝轉動裝置18轉動。 [0015] Ο 當該錄膜機m銀第-抵待鍍膜鏡片9時，先在所述基板 23上裝滿所述待顏鏡片9，在所述兩㈣龍内裝入蒸 鍍材料，再將所述真空鍍骐室4〇抽成真空。所述升降裝 置11改變所述承載板13的高度使所述輯14承靠到所述 坩堝轉動裝置18的轉動部181上，被所述坩堝轉動裝置18 轉動。所述蓋板偏移裝置17轉動蓋板16遮蓋所述坩堝14 ，所述電子搶15加熱所述坩堝14，使所述兩個坩堝丨斗中 的蒸鍍材料融化，由於有蓋板16 ,所以蒸鍍材料不會濺 射到待鍍膜鏡片9上。當蒸鍍材料融化後，蓋板偏移裝置 17將位於第一臺階孔131上方的蓋板移開，露出所述坩 堝14，並改變對應電子搶15的功率「利角位於第一臺階 it ϊThe product is small and light weight. Therefore, some particles will be sprayed out during the heating process. Particles that are not completely melted will stain the surface of the optical component and affect the quality of the optical component. In order to reduce this phenomenon, it is generally necessary to use an electronic rush to melt the granular vapor deposition material into an integral body in an i-air pre-melting machine, and then load it into a vacuum ion coater for the mineral film. However, this coating method requires two policies, and each coating needs to be operated between two devices, which will lead to an increase in the production process, which is not conducive to improving the efficiency of the product. SUMMARY OF THE INVENTION [0003] In view of this, it is necessary to provide a high-efficiency film machine. [0004] A coating machine comprising a crucible, an electronic grab, a crucible turning device, and a carrier plate. The crucible and the electron are slid on the carrier plate, and the crucible is used for loading a steam forging material coated with an optical element for heating the steaming material in the crucible, and the crucible rotating device is driven The crucible rotates. The coating machine further includes a cover plate and a cover offset device, the cover plate covers the top of the cymbal, and a height difference exists between the cymbal and the cymbal, leaving a gap for electrons to enter the ray. The cover biasing device drives the cover to cover or expose the 坩埚^ 098144909 Form No. A0101 Page 3 / Total 16 Page 0992076743-0 201122132 [0005] [0007] [0008] [0009] 098144909 The present invention provides The screen can be used to cover the crucible by using the cover offset device to prevent the sputtering of the vapor deposition material when the electronic material is used for pre-melting the steam (four) material; The seesaw offset device drives the cover to expose the crucible for evaporation coating, which enables pre-melting and coating in one unit to speed up the production process. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Please refer to FIG. 1 , which is a coating machine loo according to the present invention. The coating machine 1 includes a heating system 1 , a carrying system 2 , an ion source 30 , and a vacuum coating 40 . The true dimine film chamber includes a bottom 401 . And the top 4.0.2. The ion source 30 is fixed to the bottom 401 of the vacuum coating chamber 40, and the ion source 3 is used to provide kinetic energy to the evaporated evaporation material, so that the evaporation material is more compactly adsorbed. The carrying system 2 includes a rotating shaft 21, a substrate carrier 22 and a substrate 23. The rotating shaft 21 is mounted opposite the ion source 30 on the top 402 of the vacuum key film chamber 4, and the substrate carrier 22 is fixedly coupled to the rotating shaft 21. In the embodiment, the substrate carrier 22 is connected to the rotating shaft 21 by screws. The substrate carrier 22 is provided with a plurality of substrates 23 for holding the lens 9 to be coated. Referring to FIG. 2 and FIG. 3 together, the heating system 10 includes a lifting device ^, a carrying plate rotating device 12, a carrying plate 13, a weir 14, an electronic grab 15, a cover plate 16, a cover offset device 丨 7 and a cymbal The rotating device 18 is fixed to the bottom 401 of the vacuum coating chamber 40, and the lifting device 11 is located on the side of the ion source. In the present embodiment, the lifting form number A0101 is 4th page/total 16 pages 201122132 The device 11 uses gas. Of course, the lifting device hydraulic cylinder or other power F is cut to use a power knife device such as a motor or the like. The lifting base 11G and the extension portion (1) are included. The lifting seat t is provided with 11 packages of the vacuum recording film chamber 4. The bottom, the elongation;:: _ down the base to do the lifting movement. The carrier plate rotates: is set on the extension portion lu of the lifting device U. : The carrier board rotating device 12#牛进雷 , , , , , , 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 The motor body 122 is fixedly coupled to the 111. G [0011] The carrier plate 13 is rotatably coupled to the carrier plate rotating device 12. In the embodiment, the carrier plate 13 is a rectangular plate: the screw 8 is fixed on the motor shaft 121. A first stepped hole 131 and a second stepped hole 132 are formed at both ends of the longitudinal direction of the carrier plate. The first stepped hole 131 and the second stepped hole 132 are respectively used for fixing a turn 14 therein. The first stepped hole 131 and the second stepped hole 132 can be rotated or rotated by the carrier plate rotating device 12 to change or exchange the position thereof so as to be located in the first stepped hole 131 or the second stepped hole 132. The hook 14 can be c, i Γ : at a position where the coated lens 9 can be coated. In the present embodiment, the hanging 14 is in the shape of a disk. The collapse 14 includes a side wall 141 and a bottom 142. The crucible side wall 141 encloses a sump 141a for holding the smelting material. The bottom 142 is machined with four projections 142a (see Figure 4). The four projections 142a are arranged in the circumferential direction of the crucible 14. The two electron guns 15 are fixed to one side of the carrier plate 13 respectively corresponding to the first stepped hole 131 and the second stepped hole 132 ′ to be accommodated in the 098144909 Form No. A0101 Page 5 / Total 16 Page 0982076743 -0 [0012] 201122132 The first stepped hole 131 and the second stepped hole 132 in the second stepped hole 132 emit radiation. [0014] The diameter of the cover plate 16 is larger than the diameter of the crucible 14. The cover plate 16 conceals the crucible 14 to prevent evaporation of the coating material in the crucible 14 onto the substrate carrier 22. A gap h is left between the cover plate 16 and the corresponding weir 14 so that the electrons on the side of the carrier plate 13 can be rushed into the crucible 14. The cover plate 16 is fixed to the cover biasing means 17. The cover offset device 17 is located at two ends of the carrier plate 13 and corresponds to the first step hole 131 and the second step hole 132. The cover biasing means 17 rotates the cover 16 to cover or expose the crucible 14. The cover biasing means 17 may be a mechanism for deflecting the cover 16 to the side of the crucible 14 or a mechanism for moving the cover 16 to the side of the crucible 14 for a year. In the present embodiment, the cover offset device 7 includes a cover shaft 170 and a cover support rod 171. The cover shaft 70 is vertically erected on the side of the carrier plate 13, and the cover support rods i7l7jc are quasi-extended to the top of the cymbal 14. The cover 16 is fixed to the cover support rod 171. When it is desired to expose the crucible 14, the cover shaft 170 is level rotated, and the cover 16 is translated to 坩!5 the crucible 14. When it is desired to cover the crucible 14, the cover shaft 170 is level rotated to translate the cover 16 above the crucible 14. The crucible turning device 18 drives the crucible 14 to rotate so that the evaporation material in the crucible 14 is uniformly heated by the electrons. The cymbal rotating device 18 is fixed to the carrier plate 13 or may be provided separately from the carrier plate 13. In the present embodiment, the cymbal rotating device 18 is disposed separately from the carrier plate 13, and the cymbal rotating device 18 is fixed to the bottom 401 of the vacuum forging film chamber 40, and is located below the carrier plate 13. The 098144909 Form No. A0101 Page 6 of 16 0982076743-0 201122132 (4) The rotating device 18 includes a body coffee and a turn (4) 181. The __# m is provided with four recesses 181a corresponding to the four projections of the _14. The lifter 1 changes the height of the money (4) so that the trailing leg can bear against the rotating portion 181 of the _(four) set 18 to be rotated by the raking device 18. [0015] Ο When the film recording machine m silver-responds to the coated lens 9, the substrate 23 is first filled with the lens 9 to be filled, and the vapor deposition material is placed in the two (four) dragons, and then The vacuum plating chamber 4 was evacuated to a vacuum. The lifting device 11 changes the height of the carrier plate 13 such that the cassette 14 bears against the rotating portion 181 of the cymbal rotating device 18 and is rotated by the cymbal rotating device 18. The cover offset device 17 rotates the cover plate 16 to cover the cymbal 14 , and the electronic rush 15 heats the cymbal 14 to melt the evaporation material in the two hoppers. Therefore, the evaporation material is not sputtered onto the lens 9 to be coated. After the evaporation material is melted, the cover offset device 17 removes the cover plate located above the first stepped hole 131, exposing the 坩 14 and changing the power of the corresponding electronic grab 15 "the angle is located at the first step it ϊ
G 孔131的坩堝14中的蒸鍍杖料埤&鍍膜。當然，也可以係 先使用位於第一臺階孔131的坩^14中的蒸鍍材料進行鍍 膜。 [0016] 當鍍膜完成後，安裝第二批待鐘膜鏡片9時，將第一臺階 孔131内的坩堝14重新裝入新的蒸鍍材料，再次鍍膜時， 所述升降裝置11增加所述承載板13的高度使所述坩堝14 脫離所述坩堝轉動裝置18的轉動部181，所述承載板轉動 裝置12轉動所述承載板13，交換所述第一臺階孔131及第 二臺階孔132的位置，再利用所述升降裝置11降低所述承 098144909 表單編號A0101 0982076743-0 201122132 載板13的高度使所述坩堝14承靠到所述蚶堝轉動襞置18 的轉動部181上，利用所述坩堝轉動裝置18轉動轉動所述 坩堝14。所述蓋板偏移裝置17將第二臺階孔132上的蓋板 16移開，將第一臺階孔131上的坩堝14遮蓋。利用第二階 孔173上的坩堝14鍍膜，對第一臺階孔131上的坩堝14内 的鍍膜材料進行融化，從而可以一邊鍍膜一邊融化，節 省下一次鍍膜融化材料的時間，進一步提高生產效率。 [0017] 本發明提供的鍍膜機可以在用電子搶對蒸鍍材料進行預 融時，利用蓋板偏移裝置驅動蓋板遮蓋坩禍，防止蒸鍍 材料的濺射；當用電子搶對蒸鍍材料進行蒸發時，利用 蓋板偏移裝置驅動蓋板露出鏺堝，進行蒸發鍵膜，從而 可以在一台設備中實現預融及鑌膜，以加快產品的生產 流程。 [0018] 另外，本領域技術人員可在本發明精神内做其他變化， 但是’凡依據本發明精神實質所做的變化，都應包含在 本發明所要求保護的範圍之内。 . ...... :: .... .： 【圖式簡單說明】 [0019] 圖1為本發明提供的鍍膜機的示意圖； [0020] 圖2為圖1的鍍膜機的加熱系統的組裝圖； [0021] 圖3為圖1的鍍膜機的加熱系統的分解示意圖； [0022] 圖4為圖1的鍍膜機的坩堝及坩堝轉動裝置的示旁圖。 【主要元件符號說明】 [0023] 螺絲 8 098144909 表單編號A0101 第8頁/共16頁 0982076743-0 201122132 ❹ ❹ [0024] 待鍍膜鏡片9 [0025] 鍍膜機100 [0026] 加熱系統10 [0027] 升降裝置11 [0028] 升降基座110 [0029] 伸長部111 [0030] 承載板轉動裝置12 [0031] 電機轉軸121 [0032] 電機主體122 [0033] 承載板13 [0034] 第一臺階孔131 [0035] 第二臺階孔132 % .. i ；! 1 1' [0036] [0037] 坩堝14 坩堝侧壁141 . .. 1 1 i [0038] 盛料槽141a [0039] 堝底142 [0040] 突塊142a [0041] 電子槍15 [0042] 蓋板16 098144909 表單編號A0101 第9頁/共16頁 0982076743-0 201122132 [0043] 蓋板偏移裝置17 [0044] 蓋板轉轴170 [0045] 蓋板支撐桿171 [0046] 坩堝轉動裝置18 [0047] 座體180 [0048] 轉動部181 [0049] 凹槽181a [0050] 承載系統20 [0051] 轉動軸21 [0052] 基板承載架22 [0053] 基板23 [0054] 離子源30· [0055] 真空鍍膜室40 [0056] 底部401 [0057] 頂部402 098144909 表單編號A0101 第10頁/共16頁 0982076743-0The vapor deposition rod in the crucible 14 of the G hole 131 is coated with & Of course, it is also possible to perform the plating using the vapor deposition material in the crucible 14 of the first stepped hole 131. [0016] When the second batch of the film lens 9 is installed, the crucible 14 in the first stepped hole 131 is reloaded into the new vapor deposition material, and when the film is recoated, the lifting device 11 adds the The height of the carrier plate 13 causes the cymbal 14 to be disengaged from the rotating portion 181 of the cymbal rotating device 18, and the carrier rotating device 12 rotates the carrier plate 13 to exchange the first stepped hole 131 and the second stepped hole 132. The position of the 098144909 Form No. A0101 0982076743-0 201122132 is used to lower the height of the carrier 13 so that the cymbal 14 bears against the rotating portion 181 of the cymbal cymbal 18, utilizing The crucible turning device 18 rotates and rotates the crucible 14. The cover biasing means 17 removes the cover 16 on the second stepped hole 132 to cover the dam 14 on the first stepped hole 131. The coating material in the crucible 14 on the first stepped hole 131 is melted by the coating of the crucible 14 on the second step hole 173, so that the coating material can be melted while being coated, and the time for coating the next melting material can be saved, thereby further improving the production efficiency. [0017] The coating machine provided by the invention can use the cover offset device to drive the cover plate to cover the disaster when the electronic material is used for pre-melting the evaporation material, and prevent the evaporation of the evaporation material; When the plating material is evaporated, the cover plate is used to drive the cover to expose the crucible, and the evaporation key film is performed, so that the pre-melting and boring film can be realized in one device to speed up the production process of the product. In addition, other changes in the spirit of the invention may be made by those skilled in the art, and variations that are made in accordance with the spirit of the invention are intended to be included within the scope of the invention. [0019] FIG. 1 is a schematic view of a coating machine provided by the present invention; [0020] FIG. 2 is a heating system of the coating machine of FIG. [0021] FIG. 3 is an exploded perspective view of the heating system of the coating machine of FIG. 1; [0022] FIG. 4 is a side elevational view of the 坩埚 and 坩埚 rotating device of the coating machine of FIG. [Main component symbol description] [0023] Screw 8 098144909 Form No. A0101 Page 8 / Total 16 page 0982076743-0 201122132 ❹ ❹ [0024] Film to be coated 9 [0025] Coating machine 100 [0026] Heating system 10 [0027] Lifting device 11 [0028] lifting base 110 [0029] extension portion 111 [0030] carrier plate rotating device 12 [0031] motor shaft 121 [0032] motor body 122 [0033] carrier plate 13 [0034] first step hole 131 [0035] Second step hole 132% .. i ;! 1 1 ' [0037] 坩埚 14 坩埚 sidewall 141 . . . 1 1 i [0038] hopper 141a [0039] 埚 bottom 142 [0040] The protrusion 142a [0041] The electron gun 15 [0042] The cover plate 16 098144909 Form number A0101 Page 9 / Total 16 page 0982076743-0 201122132 [0043] Cover offset device 17 [0044] Cover plate shaft 170 [0045] Cover Support Rod 171 [0046] 坩埚 Rotating Device 18 [0047] Seat 180 [0048] Rotating portion 181 [0049] Groove 181a [0050] Carrying System 20 [0051] Rotating Shaft 21 [0052] Substrate Carrier 22 [ [ 0053] Substrate 23 [0054] Ion Source 30 [0055] Vacuum Coating Chamber 40 [0056] Bottom 401 [0057] Top 402 098 144909 Form No. A0101 Page 10 of 16 0982076743-0