KR20170059333A - Plane evaporation source and plane source evaporator deposition equipments for OLED device production - Google Patents

Plane evaporation source and plane source evaporator deposition equipments for OLED device production Download PDF

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KR20170059333A
KR20170059333A KR1020150163592A KR20150163592A KR20170059333A KR 20170059333 A KR20170059333 A KR 20170059333A KR 1020150163592 A KR1020150163592 A KR 1020150163592A KR 20150163592 A KR20150163592 A KR 20150163592A KR 20170059333 A KR20170059333 A KR 20170059333A
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South Korea
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source
evaporation
deposition
substrate
metal
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KR1020150163592A
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Korean (ko)
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KR101984345B1 (en
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진중 김
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황창훈
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    • H01L51/56—
    • H01L21/203—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L51/0008—
    • H01L2251/56—

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention relates to a surface evaporation coating device of organic diodes in high vacuum which comprises: a substrate loading chamber; a substrate unloading chamber; a double surface evaporation deposition chamber; and a double top-down metal deposition chamber, wherein a surface evaporation source is a metal surface having a frame and a roller mounting part and improves the rate of use of an organic material due to easy transfer and deposition, and a surface evaporation device further improves an efficiency of use of the organic material because double surface evaporation deposition is possible with reduced waiting time of a linear evaporation source during surface evaporation. A metal surface source in an evaporation deposition chamber may be reused since the metal surface source may be cooled in-situ at the high speed using a cooling plate after heating evaporation. A core deposition process may be implemented at the high speed for flexible OLED diodes and large OLED TVs since substrate deposition is possible with top-down surface evaporation, and a large substrate does not sag, and, thereby, deposition is possible with an organic thin film patterned in a high resolution. As it is possible to scan a substrate having an organic thin film and to do metal thin film deposition twice using top-down evaporation source, metal thin film deposition is possible at the high speed without sagging of a large organic diode substrate.

Description

[0001] The present invention relates to a planar evaporation source and a planar evaporation deposition apparatus for organic device production,

The present invention relates to an organic thin film evaporation source (surface source) and a surface evaporation deposition apparatus for a large area substrate used in a top-down evaporator for mass production of a large-area (5th to 10th generation) organic thin film OLED A first step of vapor-depositing an organic thin film on the lower surface of the metal surface, heating the back surface of the metal surface with a surface heater, and re-evaporating the organic thin film to form a vertical gas beam, And thus the deposition phenomenon is reduced, thereby making it possible to produce a high-resolution organic device. Especially, it prevents the deflection of a large-area substrate and effectively mass-produces a high-resolution organic thin film, and is a key process for producing a flexible OLED device and an OLED TV at a high speed. will be.

The OLED display is not only a post LCD display but also a surface emitting device for illumination, and its energy efficiency and low cost have been proved worldwide. As a key process technology of an OLED light emitting device, a thermal evaporation deposition process in which an organic light emitting material is vaporized by vaporization and deposited on a glass substrate in a high vacuum state to produce an organic thin film is mainly used.

The thermal evaporation process is a source for evaporating organic matter. The substrate tray for fixing the evaporation source and the substrate, which is a gas induced evaporation device by thermal radiation, and the open mask and the shield mask device for producing the shape of the thin film, And used in the chamber.

Especially recently, in order to lower the unit cost of the OLED product, there has been a need for a technique of manufacturing a larger size of a substrate, followed by cutting a small piece into several pieces. For example, if an organic thin film is formed by depositing a 5th generation or a 10th generation substrate and cut into 2 inch or 4 inch or 55 inch or 65 inch depending on the application, the productivity is improved and the manufacturing cost is lowered. However, recently, in order to mass-produce high-resolution (75 inches or more) large-sized OLED TVs, a glass substrate having a size of 8th generation (2200 mm × 2500 mm) or more is used. At this time, large substrate deflection is serious, In this case, the degree of deterioration due to the mask is significant, and the productivity is significantly reduced.

According to a linear large-area organic device mass production equipment by a top-down thermal induction deposition, which is a patent for a conventional cotton evaporation evaporator (registration number: 1012061620000), primary deposition is performed on a metal surface from a cylindrical evaporation source, The thin film is evaporated downward and surface deposition is attempted on the substrate. According to this patent, when a cylindrical source is used, the material utilization rate is lowered, it can be applied only to a small substrate, and an apparatus for cooling the heated metal surface is installed outside the chamber, which is very inefficient because of a long cooling time. In addition, if mass production equipments are proposed to be in-line type and the back substrate must wait until the previous substrate deposition is completed, or if a problem occurs in one chamber of the line, the production of all in-line equipment should be stopped . That is, it is necessary to improve the material utilization ratio of the surface evaporation evaporator, the productivity improvement, the in-situ cooling of the metal surface, and the structure of the deposition chamber suitable for a large area.

In order to solve the above problem, in the present invention, an organic material is deposited on a large metal surface by using a stationary bottom-up linear organic evaporation source, and a surface source structure for roller transport for smooth transfer of surface sources will be developed. In particular, the metal surface will be scanned for a fixed evaporation source to maximize the material utilization efficiency, and an in-situ cooling plate will be constructed to rapidly heat the metal surface. In addition to the inline type OLED type, it is possible to achieve high productivity of organic devices by devising a cluster type which has already been proved in the mass production of OLEDs. In addition to the top-down type, a variety of designs of a bottom- .

According to the present invention, since a linear evaporation source is used, the distance between the metal surface and the evaporation source is kept very small, so that the material usage rate is remarkably improved, the heated metal surface source is easily cooled, Due to the formation of the gas beam, the sharpening phenomenon is remarkably reduced. In addition, the cluster type mass production equipment can be configured to minimize the idle time of the substrate, thereby reducing the TACT time and improving the flexibility of the process operation of the equipment during the process of the substrate, It has the effect of improving the productivity and reducing the cost.

Fig. 1 shows the phenomenon of vertical evaporation of point-type evaporation and the phenomenon of vertical evaporation of surface evaporation
Fig. 2 is a conceptual diagram of deposition coating of an organic thin film while linearly transferring a surface source
Figure 3 shows a concept of coating an organic thin film while transferring a linear evaporation source to a stationary surface source
Figure 4 is a conceptual illustration of a thin film coating with a linear evaporation source while the metal surface evaporation source is linearly transported on a roller
5 shows the structure of a large area metal surface evaporation source
6 shows the structure of the small area metal surface evaporation source
7 shows the structure of the surface heater for heating the metal surface evaporation source
8 shows a structure of a line heater that scans and heats a metal surface evaporation source
9 shows the structure of the cooling plate for cooling the metal surface evaporation source
10 shows a concept of pattern deposition on a substrate using a shield mask using a surface source
11 is a view showing a concept of performing patterning of an organic thin film in the form of stripes
12 is a conceptual view of a bottom-up surface evaporation evaporator deposited on a substrate using a surface source
13 is a conceptual diagram of a top-down surface evaporation evaporator that deposits onto a substrate using a surface source
14 is a conceptual view of a vertical surface evaporation evaporator that deposits onto a substrate using a surface source
Figure 15 shows the concept of a dual top-side surface source surface evaporator
16 is a conceptual view of a dual top-down surface source-side evaporative evaporator for mass production

FIG. 1 shows an example in which powder 12 of an organic substance by point-type evaporation source 11 is vaporized on a substrate 10 located in a high vacuum chamber and vaporized and evaporated on a substrate. At this time, an angle between the airship of the organic matter and the substrate is generated, and when a patterned organic thin film is formed by attaching a shield mask to the substrate bottom, a shadow phenomenon occurs and a problem arises in the production of a high resolution organic device. If the surface of the organic thin film 13 coated on the cotton evaporation source 14 is evaporated, the vertical surface of the organic substance vapor can be evaporated in order to prevent the deterioration phenomenon.

FIG. 2 shows a method of depositing and coating the organic thin film 24 on the lower surface of the metal surface source 20. Since the metal surface is linearly conveyed to the right by the roller 21 (not shown), it passes over the upper part of the linear evaporation source 22, and thus the thin film is deposited as it meets the evaporated organic gas. The shutter 23 defines the section where the organic gas evaporates.

3 shows another method of generating a surface source, in which the organic thin film 34 is deposited by moving the linear evaporation source 33 to be transported while the metal surface source 30 is stationary. On the left and right sides of the linear evaporation source, shutters 32 fixed in position are formed to prevent the organic gas from flying to the upper portion of the high vacuum chamber.

FIG. 4 shows the appearance of the metal surface evaporation source (source) transferred by the rotating roller 41 at the upper portion of the linear evaporation source 42 fixed in position. The metal surface source is formed with a roller fixing wing portion 45 so that the organic thin film 46 is deposited on the linear evaporation source.

Fig. 5 shows a three-dimensional view of the metal surface source. A rectangular frame 50 having openings 54 is formed and a metal surface 52 in the form of a sheet is attached to a lower portion of the frame 50. The lower surface of the frame is formed with a roller mounting portion 51.

6 shows a metal surface source for fabricating a small-sized organic device, in which a frame 55, on which a "R" -shaped roller mounting portion 56 is formed and a rectangular opening is formed, A luminescent sheet 57 is attached.

7 shows a state in which a linear or planar heater 62 is attached using a heater hook 61 to the surface heater fixing table 60 as a method for effectively heating the rear portion of the surface source. The heater can emit far-infrared rays using a nude heater or a lamp heater. This heater is capable of up-down movement, so that it can radiate infrared radiation as close as possible to the metal sheet.

FIG. 8 shows a line heater 72 fixed to the line heater fixture 70. When the up-down line heater is lowered, the source is heated while scanning the source. When heated by a cotton heater, less heat energy is supplied to the cotton source, which causes the cotton to evaporate, thus keeping the temperature transferred to the substrate and the shield mask low.

9 shows an in situ method for cooling a heated face source 52, wherein a lower cooling cover 83 is placed underneath the face source with a cooling water line 82 planted thereon, And the cooling cover 81 formed with the cooling line 82 is lowered at the upper portion of the surface source so as to cool the surface source while pressing the back surface of the surface source.

10, a shadow mask 91 is placed on the lower part of the stationary substrate 90, a surface source 94 is placed on the lower part of the substrate 90, and a line heater 95 is scan-heated on the lower part thereof . The organic thin film 93 deposited on the surface source is evaporated to penetrate through the opening of the shield mask and fly to the substrate to be formed on the patterned organic thin film. The distance between the substrate and the shadow mask is about 10 μm apart, and the distance between the substrate and the surface source is maintained at about 5 mm to 10 mm.

11, in order to form a strip pattern on the substrate, the substrate 100 is moved to the right and a stationary linear shadow mask 101 is placed under the substrate. At the bottom of the mask, the surface source 104 is transported to the left to cause the surface evaporation of the organic thin film 103. At this time, the line heater 105 is fixed at the bottom of the surface source so as to align with the linear shadow mask.

12 shows the state of a bottom-up surface evaporation evaporator. A substrate 114, a shield mask 113, a metal surface source 112 and a surface heater 111 are sequentially arranged on the upper part of the vacuum deposition chamber 110. A linear evaporation source 115 is formed in a lower portion of the chamber And the organic thin film is deposited on the metal surface in a bottom-up manner. The metal surface source is transported by the rollers and performs inverse motion of the metal surface source from the left and right of the chamber. In the bottom of the chamber, in situ cooling plates 117 and 118 are formed.

FIG. 13 shows a top-down surface evaporation evaporator. A substrate 125, a shield mask 129, a metal surface source 121, and a surface heater 124 are arranged in the upper right portion of the inner side of the high vacuum deposition chamber 120, An organic thin film 127 is deposited on the metal surface in a bottom-up manner. The metal surface source is transported by the rollers and performs an up-down motion of the metal surface source from the left and right of the chamber. An in situ cooling plate 123 is formed on the upper part of the chamber.

FIG. 14 shows a vertical surface evaporation apparatus. A vertical substrate 131, a vertical type mask 132, a vertical metal surface source 133 and a vertical surface heater 134 are arranged in order on the inner right side of the high vacuum deposition chamber 130, A linear evaporation source 136 is formed at a central lower portion of the substrate to deposit an organic thin film on a metal surface in a bottom-up manner. The metal surface source is conveyed by a roller, and in situ cooling plates 135 and 137 are formed on the upper part of the chamber.

FIG. 15 shows a view of a high vacuum dual-top surface source deposition chamber 200. The chamber is divided into two parts and a first surface heater 203, a first surface source 204, a first substrate 207 and a first screen mask 206 are formed in the first deposition unit 201, A second side heater 209, a second substrate 211 and a second side mask 210 are formed on the second evaporation part 202 and a linear evaporation source 205, The transfer device 212 is used to alternately deposit the first surface source and the second surface source. After the first surface source is deposited, the surface source is transported toward the substrate to cause surface evaporation, and the linear evaporation source is transported below the other surface source to deposit the surface source, resulting in a dual surface vapor deposition process, The linear evaporation source is not deposited, and the waiting time is saved, so that the evaporation efficiency of the organic material is improved.

FIG. 16 shows an example of a production apparatus for a quadrangular cluster of organic thin film devices. The substrate loading chamber 229 and the substrate unloading chamber 230, the double-down-side surface evaporation evaporator 220 and the double-down-type metal film evaporator 231 are gathered around a central robot chamber (not shown). The interior of the double-bottomed surface evaporation evaporator is divided into two parts using a separation wall 232, and a first deposition part 221 and a second deposition part 222 are provided. The linear evaporation source 225 alternates between the first surface source and the second surface source, and the organic thin film is alternately supplied to the first surface source and the second surface source. The surface evaporation source 225 is formed by arranging the surface sources 223 and 224, the surface heater, the substrates 226 and 227, Respectively. The substrate on which the organic thin film is formed by the surface evaporation deposition is introduced to the double-down type metal thin film evaporator by the arm robot 228, and the substrate is deposited and deposited on the metal thin film while scanning. A top-down point evaporation source 234 is arranged on top of the metal thin-film evaporator or a linear top-down evaporation source 233 is arranged. Since a plurality of organic thin films are formed to produce organic devices, in practice, a plurality of double bottom-side surface evaporation evaporators and a double top-down metal thin film evaporator are required. In this case, depending on the number of evaporators to be added, Production equipment.

10: substrate 11: point-type evaporation source
12: organic powder 13: organic thin film
14: organic thin film cotton evaporation source
20: conveying metal surface evaporation source 21: conveying roller
22: Linear evaporation source 23: Movable evaporation source shutter
24: deposited organic thin film

30: stationary metal surface evaporation source 31: surface evaporation source conveying roller
32: fixed evaporation source shutter 33: linear evaporation source for transfer
34: deposited organic thin film
40: metal surface evaporation source 41: rotating roller
42: fixed linear evaporation source 43: organic powder crucible part
44: roller rotating shaft 45: roller mounting blade
46: organic thin film
50: cotton evaporation source frame 51: roller mounting part
52: metal face sheet 53: metal face sheet back
54: heating heater inlet opening 55: surface source frame
56: " a " roller fastening portion 57: Ta (tantalum) sheet
60: Cotton heater holder 61: Heater holder
62: Linear / Sectional Heater
70: Line heater fixture 71: Line heater fixture
72: Line heater
80: cooling jacket fixing table 81: cooling cover
82: Cooling water line 83: Lower cooling cover
90: Stationary substrate 91: Sedou mask
92: opening 93: organic thin film
94: cotton evaporator 95: line heater
100: substrate to be transferred 101: linear shadows mask
102: Slot type hole pattern 103: Organic thin film
104: face source 105: linear heater
110: High vacuum chamber 111: Up-down surface heater
112: cotton evaporation source 113: Sedou mask
114: substrate 115: linear evaporation source
116: Feed roller 117: Up down cooling jacket
118: Lower cooling plate
120: high vacuum chamber 121: cotton evaporation source
122: Feed roller 123: Up down cooling jacket
124: face heater 125: substrate
126: substrate table 127: linear evaporation source
128: Separation wall 129: Sedou mask
130: high vacuum deposition chamber 131: vertical substrate
132: vertical type shadow mask 133: vertical type surface vapor source
134: Vertical surface heater 135: Up-down cooling plate
136: linear organic evaporation source 137: lower cooling plate
200: high vacuum double-side source deposition chamber 201: first deposition unit
201: second deposition unit 203: first side heater
204: first side source 205: linear evaporation source
206: first-order dough mask 207: first substrate
208: second surface heater 209: second surface source
210: second-type dowel mask 211: second substrate
212: linear source transport device
220: organic thin film top down source deposition chamber
221: first deposition unit 222: second deposition unit
223: first side source 224: second side source
225: Linear evaporation source for transfer 226: First substrate
227: second substrate 228: substrate transfer arm robot
229: substrate loading chamber 230: substrate unloading chamber
231: Double-down metal thin film deposition chamber
232: separating wall 233: top-down metal thin film linear evaporator
234: Top-down point metal evaporator

Claims (19)

Characterized in that the substrate loading chamber, the substrate unloading chamber, the double-downward surface evaporation deposition chamber, and the double-downward-type metal film deposition chamber are configured in a quadrangular cluster around the robot chamber as the overall high vacuum maintaining vacuum chambers. Evaporation source for cotton and cotton evaporation
The method of claim 1, wherein the dual vertex surface evaporation chamber and the dual vertex metal film deposition chamber are added to form a hexagonal cluster.
The double-faced surface evaporation deposition chamber is divided into a first deposition unit and a second deposition unit, and each of the deposition units is composed of a surface heater and a metal surface source downward, Characterized in that the substrate is constituted by an organic thin film deposition section, and a linear evaporation source is transported between the respective metal surface sources to deposit the respective surface sources in a bottom-up manner.
[Claim 2] The method according to claim 1, wherein in the double-downward type metal film deposition chamber, a top-down point type evaporation source is arranged in a row in the first deposition section divided by a separation wall, And a top-down metal thin film is deposited while the thin film is transferred from the lower part of the evaporation source to the surface evaporation source and the surface evaporation evaporator
[2] The organic EL device manufacturing method according to claim 1, wherein two robot arms are provided in the robot chamber,
The method according to claim 3, wherein in the production of the metal surface source, the organic thin film is deposited and coated on the metal surface while linearly scanning the surface source at the top of the fixed bottom-up linear organic evaporation source.
The method of claim 3, wherein the bottom-up linear organic evaporation source is fixed to the bottom of the first metal surface in the first deposition unit to deposit an organic thin film on the metal surface, and then moves to the second deposition unit to be fixed to the bottom of the second metal surface, Depositing an organic thin film on the substrate, and moving the organic thin film to the first deposition part again.
[Claim 3] The organic vapor phase evaporation source and the surface evaporation evaporator according to claim 3, characterized in that an organic thin film is deposited under the metal surface while the metal surface source is fixed and the bottom-
The organic thin film deposited on one surface of the metal sheet is heated by a surface heater on the other side of the metal surface to evaporate the organic thin film on the surface in a direction perpendicular to the surface and the organic material evaporated through the opening of the shadow mask A surface evaporation source for fabricating an organic device and a surface evaporation evaporator for depositing an organic thin film patterned on a substrate
[9] The organic vapor phase evaporation source and the surface evaporation evaporator according to claim 9,
[Claim 9] The method according to claim 9, wherein the metal surface evaporation source or the metal surface source is formed by forming the organic thin film while the roller fixing wing portion is formed on the right and left sides,
[Claim 9] The metal surface source according to claim 9, wherein the metal surface source has a rectangular parallelepiped-shaped surface evaporation source frame in which openings are formed, the lower four surfaces of the frame are supported by the surface columns, and the metal sheet is attached along the lower surface of each surface column Surface evaporation source and surface evaporation evaporator for organic device fabrication
[Claim 9] The organic evaporation source according to claim 9, wherein a metal sheet source is formed with a frame having a rectangular roller opening at the left and right and a rectangular opening at the center, and a metal sheet covering the lower part of the frame is attached. Cotton evaporative evaporator
[9] The organic device manufacturing method according to claim 9, wherein a linear or planar heater is installed on the linear or planar fixing table by hooking and is heated while passing through the opening of the metal surface source and stopped on the back surface of the metal surface, Evaporation source and cotton evaporator
[Claim 3] The organic device manufacturing method according to claim 3, wherein, in the deposition chamber, a bottom cooling cover in which a cooling line is formed in a lower portion of the metal surface and an upper cooling jacket in which a cooling line is formed are formed for in- Evaporation source and cotton evaporator
In order to form a stripe pattern on the substrate by the surface source, the substrate is linearly transported, and a linear thin mask having a slot-like opening formed in the lower portion of the substrate is fixed, and a surface source is linearly transported in the direction opposite to the substrate And a linear heater is fixed at a position aligned with the mask at a lower portion of the surface source. The surface evaporation source for fabricating an organic device and the surface evaporation evaporator
[Claim 3] The method according to claim 3, characterized in that the metal surface is conveyed on the roller, the metal surface on which the heat evaporation has been completed is conveyed by the roller, then conveyed to the upper part and then cooled back and reused Evaporation source and evaporator for surface
[Claim 3] The organic thin film according to claim 3, wherein instead of the top surface deposition, a bottom surface source of metal surface deposited is rotated and transferred to form a substrate and a shield mask on top of the chamber, Evaporation source for cotton and cotton evaporation
[Claim 3] The surface evaporation source for fabricating an organic device according to claim 3, wherein instead of the top surface deposition, a metal surface source deposited in a downward direction is transported, a substrate and a shield mask are formed in a vertical direction, and a vertical surface deposition is possible Cotton evaporative evaporator

KR1020150163592A 2015-11-20 2015-11-20 Plane source evaporator deposition equipments having plane evaporation source for OLED device production KR101984345B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180009327A (en) * 2016-07-18 2018-01-26 황창훈 Circular plane type evaporation source for micro OLED production, and Evaporation device having it
CN110214383A (en) * 2017-12-28 2019-09-06 株式会社Oledon It is equipped with the cluster volume production equipment of the high-resolution AMOLED element using vertical plane evaporation source
WO2019205549A1 (en) * 2018-04-23 2019-10-31 京东方科技集团股份有限公司 Double-sided display panel and preparation method therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070082721A (en) * 2006-02-17 2007-08-22 황창훈 Vertical deposition technique using belt type plane source for oled manufacturing
KR101206162B1 (en) 2005-10-06 2012-11-29 황창훈 Thermal Induced Sublimation Technology with downward evaporation for large-sized OLED manufacturing
KR20140145383A (en) * 2013-06-13 2014-12-23 진중 김 Inline Type OLED Face Up Evaporator for large size OLED

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101206162B1 (en) 2005-10-06 2012-11-29 황창훈 Thermal Induced Sublimation Technology with downward evaporation for large-sized OLED manufacturing
KR20070082721A (en) * 2006-02-17 2007-08-22 황창훈 Vertical deposition technique using belt type plane source for oled manufacturing
KR20140145383A (en) * 2013-06-13 2014-12-23 진중 김 Inline Type OLED Face Up Evaporator for large size OLED

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180009327A (en) * 2016-07-18 2018-01-26 황창훈 Circular plane type evaporation source for micro OLED production, and Evaporation device having it
CN110214383A (en) * 2017-12-28 2019-09-06 株式会社Oledon It is equipped with the cluster volume production equipment of the high-resolution AMOLED element using vertical plane evaporation source
WO2019205549A1 (en) * 2018-04-23 2019-10-31 京东方科技集团股份有限公司 Double-sided display panel and preparation method therefor
US11289564B2 (en) 2018-04-23 2022-03-29 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Double-sided display panel and method for manufacturing the same

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