CN110214383A - It is equipped with the cluster volume production equipment of the high-resolution AMOLED element using vertical plane evaporation source - Google Patents
It is equipped with the cluster volume production equipment of the high-resolution AMOLED element using vertical plane evaporation source Download PDFInfo
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- CN110214383A CN110214383A CN201880000412.1A CN201880000412A CN110214383A CN 110214383 A CN110214383 A CN 110214383A CN 201880000412 A CN201880000412 A CN 201880000412A CN 110214383 A CN110214383 A CN 110214383A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 246
- 230000008020 evaporation Effects 0.000 title claims abstract description 241
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 95
- 229920001621 AMOLED Polymers 0.000 title claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 239000005416 organic matter Substances 0.000 claims abstract description 72
- 238000007740 vapor deposition Methods 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000000843 powder Substances 0.000 claims description 49
- 238000003860 storage Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000012636 effector Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000007665 sagging Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 60
- 238000010586 diagram Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 5
- 238000010025 steaming Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005019 vapor deposition process Methods 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000001550 time effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to be equipped with can volume production high-resolution AMOLED film vertical plane evaporation source evaporator cluster volume production equipment, it is by utilizing vertical evaporation source after organic film is deposited in vertical metal face evaporation source in high vacuum vapor deposition case, it is transferred to the cabinet for being equipped with vertical substrate and vertical shading mask, and the cluster volume production equipment of the outfit AMOLED element in substrate vapor deposition fine pattern film by organic film re-evaporation.Difficult phenomenon is deposited in fine pattern caused by the present invention is spread when can effectively overcome vapor deposition fine pattern on substrate because of organic gas, it prevents large area substrates and mask from generating sagging simultaneously and greatly reduces shade phenomenon using the fine spatial between substrate and mask, and reduces the idle period by free of discontinuities work continuously and improve organic matter service efficiency, simultaneously sustainable maintenance high vacuum environment and greatly shorten the production time, along with promotion finished product proportion of production while having the effect of substantially reducing whole production cost and time without face evaporation source vapor deposition direction switching apparatus and process.
Description
Technical field
The present invention relates to be equipped with can volume production high-resolution AMOLED film vertical plane evaporation source evaporator cluster volume production
Organic film is deposited in vertical metal face evaporation source using vertical evaporation source more specifically in high vacuum vapor deposition case in equipment
Afterwards, it is transferred to the cabinet for being equipped with vertical substrate and vertical shading mask, and organic film re-evaporation is subtle in substrate vapor deposition
The cluster volume production equipment of the outfit AMOLED element of patterned films.
Background technique
Existing LCD element is separately to need the structure of the Back light such as LED unit, therefore film-type or curling is made
Still there is certain restrictions in terms of form.In addition, LCD element is slower to the liquid crystal molecule reply speed for the electric field that is allowed, so as to cause
The disadvantages of reaction speed is slow and video drive is slower, and in addition there are separately need filter etc. structure is complicated, production process is more.
AMOLED (the Active Matrix to attract attention as the display device of new generation for replacing original LCD element
Organic Lighting Emitted Diode), it is the self-emission device supplying power supply and being shone by organic substance, instead
It answers speed to be exceedingly fast and supports fine pattern structure.In addition, AMOLED element is without filter and Back light unit, production
Process also very simple, while supporting superthin structure and being suitble to the ultra-thin display screen of production.Due to this characteristic, AMOLED element mesh
It is preceding to be just widely used in smart phone and large size TV, and the utilization rate in terms of folded form and curled display screen is also higher,
It is currently the object of South Korea, China, Japan and other countries competitively developmental research and production.
The universal production method of AMOLED display screen is after constituting TFT in glass substrate or PI substrate, by electrode and more
Negative electrode layer is deposited again after layer organic substance high vacuum vapor deposition, finally encapsulation is completed.Wherein the organic film of core the most exists
After high vacuum case evaporated organic powder, the organic molecule being evaporated will penetrate through subtle shadow mask or metal mask, most
It is deposited on substrate afterwards and forms subtle patterned films.
In order to complete high vacuum thermal evaporation vapor deposition as above, must have organic matter powder evaporation source, base in high vacuum case
Device and the subtle shadow mask of precise alignment and the collating unit of TFT substrate etc. is arranged in piece.In addition, metal mask (FMM:
Fine metal mask) it is made of nickeliferous ferroalloy invar alloy (invar), manufacture craft is etching or radium-shine, for exploitation
High-resolution mask then needs to be formed uniformly the technology of pole micro pattern.Moreover, it is also necessary to arrange TFT substrate and subtle mask
Required backstage technology and sub-micron grade precision control technique.
In addition, it is also necessary to which exploitation can be while being uniformly deposited organic film on large area substrates, extremely quick to temperature
The high vacuum hot evaporation technology of precise temperature control is carried out under the premise of the organic molecule of sense is not impaired.Moreover, because of production steaming
Plating machine connects tens high vacuum casees and uses, and also needs have the components for maintaining high vacuum environment and cabinet design, production skill
Art and anti-acrobatics art and automatic technology.
Especially, the clarity about 600ppi of smart phone AMOLED element, and utilize quantum dot (Quantum
Dot) substance cannot achieve high-resolution, therefore deploy fierce contention in terms of AMOLED clarity is improving in many countries, by
This may determine that the heyday of AMOLED element will maintain for a long time.In addition, the market VR also has the demand in terms of short distance sighting distance,
To deepen the demand degree of high-resolution display device exploitation.For example, when the clarity of AMOLED can just welcome VR up to 2250ppi
The heyday in generation, and there is not yet can produce the AMOLED production equipment development technique that clarity reaches 2250ppi at present, this explanation
To can the clear AMOLED element of volume production superelevation production equipment and engineering technology demand it is very urgent.
Fig. 1 is the citing for producing the existing AMOLED film production evaporation coating technique for the AMOLED element that clarity is 600ppi
Explanation.
As shown in Figure 1, high vacuum case (not shown) top is equipped with substrate (10), it is the mask of proper alignment below substrate
(12), then lower section is the line evaporation source (14) mutually placed across a certain distance, is evaporated upwards and scanning forward and backward organic
Object, and so that the organic gas molecular beam (13) being evaporated is formed fine pattern (11) on substrate by sending angle forth.At this point, by
Line evaporation source spray organic molecule shade phenomenon is generated under the influence of sending angle forth and result in shadow distance (SD) compared with
That is, there is certain limitation in terms of forming superfine pattern in the pattern of (example: 3~8 μm) greatly.In addition, existing AMOLED film
Production evaporator because substrate enlargement caused by sagging or mask sagging due to can not execute subtle arrangement, thus
There is limitation in terms of making the clear element of superelevation, and has eventually led to finished product proportion of production decline the problems such as point.
In addition, from the point of view of with regard to cluster volume production equipment, face evaporation source needed for existing equipment need to adjust one by one each process cabinet
Evaporating surface direction, but also to add the cumbersome process of surfaces of revolution evaporation source, be led due to mechanical equipment and production time expand
Cause production cost rising and the decline of finished product proportion of production.
(existing technical literature)
(patent document 1) publication bulletin the 10-2014-0038844th
Summary of the invention
Technical task
For the present invention for solving the above problems a little and develop, the first object of the present invention is to provide that be equipped with can volume production gram
Fine pattern is deposited caused by taking the organic gas diffusion that fine pattern Shi Yindian evaporation source or line evaporation source are deposited on substrate
Difficult phenomenon, at the same prevent large area substrates and mask generate sagging and using the fine spatial between substrate and mask come
Greatly reduce the cluster volume production equipment of the vertical plane evaporation source evaporator of the high-resolution AMOLED film of shade phenomenon.
Meanwhile the second object of the present invention be to provide be equipped with can volume production on substrate be deposited fine pattern when pass through nothing
Interruption works continuously and reduces the idle period, to improve organic matter service efficiency, persistently maintain high vacuum environment and reduce life
Produce the cluster volume production equipment of the vertical plane evaporation source evaporator of the high-resolution AMOLED film of time.
Meanwhile the third object of the present invention be to provide using without face evaporation source vapor deposition direction switching apparatus and process and
Realize the high-resolution that the vertical plane evaporation source of finished product proportion of production is promoted while whole production cost and time greatly reduce
AMOLED element cluster volume production equipment.
The solution of project
To solve the above-mentioned problems, the high-resolution AMOLED element cluster using vertical plane evaporation source prompted in the present invention
Volume production equipment includes:
Substrate carrying case (61)；The face vapor deposition for having vertical plane evaporation source (20) and vertical organic matter powder evaporation source (30)
Case (62)；Case (63) are deposited in face resource FMM；Cooler bin (64)；Mask safe deposit box (65)；Substrate unloader box (66)；And have
The hexagon module (100) of the robot case (60) of each cabinet is connected, and to be spy in substrate (10) vapor deposition fine pattern film
Point.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (62) are deposited in above-mentioned face,
To have double vertical plane vapor deposition casees, while at least 2 vertical organic matter powder evaporation sources (30) are logical in each cabinet
It crosses left and right or pumps and be scanned and rotate and be at least vapor-deposited in turn to 2 or more vertical plane evaporation sources (20)
With the characteristics of machine film (22).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (62) are deposited in above-mentioned face,
It is scanned and is rotated upper by left and right or up and down motion with above-mentioned vertical organic matter powder evaporation source (30)
It states and is deposited with the characteristics of organic film (22) on the metal decking (S) of vertical plane evaporation source (20).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (62) are deposited in above-mentioned face,
With above-mentioned vertical plane evaporation source (20) it is vertically opposite with vertical organic matter powder evaporation source (30) and by it is above-mentioned hang down
The organic gas vertical flight of straight organic matter powder evaporation source (30) injection and in the metal covering of above-mentioned vertical plane evaporation source (20)
Vapor deposition is with the characteristics of organic film on plate (S).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned vertical organic matter powder evaporation source (30),
To include evaporation source crucible (34)；
It is formed in multiple evaporation nozzles (31) of above-mentioned evaporation source crucible (34) side or more or left and right；
It is connected on the downside of above-mentioned evaporation source crucible (34) and fills organic matter storage crucible (35) of organic matter powder (P)；
The organic matter storage lid (36) being placed at the top of above-mentioned organic matter storage crucible (35)；And
Heating on the outside of above-mentioned evaporation source crucible (34), organic matter storage crucible (35) and organic matter storage lid (35)
With the characteristics of line (32).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned evaporation source crucible (34), organic matter storage crucible (35) and organic matter storage lid (36) are to pass through the 1st connection
Flange (37) and the 2nd connecting flange (38) are connected and with the characteristics of decomposable assemblings.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned evaporation nozzle (31) is with the characteristics of being equipped with the automatic switch over nut cap for preventing organic gas from leaking.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned evaporation nozzle (31) is to be formed in two sides corresponding with above-mentioned evaporation source crucible (34) and hang down with above-mentioned
On the metal decking of the two face evaporation sources (20) of the two sides of straight organic matter powder evaporation source (30) mutually across a certain distance simultaneously
It is deposited with the characteristics of organic film (22).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
The outside of above-mentioned heater wire (32) is to be formed with the entire steaming covered in addition to above-mentioned evaporation nozzle (31) jet port
It rises with the characteristics of the evaporation source outer cover (33) of outer surface.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
To have multiple vertical organic matter powder evaporation sources (30) and the evaporation of multiple vertical planes in above-mentioned face vapor deposition case (62)
With the characteristics of source (20).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (63) are deposited in above-mentioned face resource FMM,
To have substrate (10), mask (12), the face evaporation source (20) that organic film is deposited and the above-mentioned face evaporation source of heating
(20) heater heater wire (23) and arranged in sequence, while the vapor deposition face of above-mentioned substrate (10) and face evaporation source (20) is organic
Film (22) it is opposite by plumbness and mutually across a certain distance with the characteristics of.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (63) are deposited in above-mentioned face resource FMM,
To be made of and the intracorporal substrate of each case (10), mask (12), face double vertical plane evaporation source FMM vapor deposition case (63)
With the characteristics of evaporation source (20) and heater heater wire (23) vertical arrangement.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned heater heater wire (23) is to cover the entire back side of above-mentioned face evaporation source (20), while above-mentioned heater adds
The infrared ray that hot line (23) back side is formed with heater outer cover (24) and discharges heater heater wire (23) is only oriented towards face evaporation
With the characteristics of source (20) back side.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case (63) are deposited in above-mentioned face resource FMM,
With the characteristics of the collating unit (50) for separately having the arrangement of subtle adjustment substrate (10) and mask (12) and spacing.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned collating unit (50),
With by can to the backstage 1XYZ that aforementioned mask (12) are finely adjusted by the direction XYZ (51) with can be to above-mentioned substrate
(10) it is constituted by the backstage 2XYZ (52) that the direction XYZ is finely adjusted,
And the above-mentioned backstage 1XYZ (51) connect with mask bracket support axis (53) and aforementioned mask bracket support axis (53)
Both ends be formed with can vertical support mask (12) up and down direction mask bracket (55)；
The above-mentioned backstage 2XYZ (52) connect with mask bracket support axis (54) and aforementioned mask bracket support axis (54) two
End be formed with can vertical support substrate (10) up and down direction substrate carrier (56) with the characteristics of.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned cooler bin (64),
Have coldplate (40) with inside, and the above-mentioned vertical plane evaporation source of organic film (22) evaporation of vapor deposition will be made
(20) heating metal diaphragm plate (S) is tightly attached to above-mentioned coldplate (45) with the characteristics of being rapidly cooled.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned cooler bin (64),
The pusher head to move reciprocatingly including vertical cooling plate (40) and the above-mentioned coldplate (40) of realization by horizontal direction
(42) and the promotion rail (43) that above-mentioned pusher head (42) moves reciprocatingly is realized,
And above-mentioned coldplate (40) is internal with the characteristics of being formed with cooling water pipe (41).
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned robot case (60),
To include vacuum robot main body turning (70) and be connected to the end of above-mentioned vacuum robot main body turning (70)
Actuator (end effector) (71), and substrate (10) passes through with face evaporation source (20), metal decking (S), mask (12)
Above-mentioned robot to each cabinet perpendicularly into and with the characteristics of transporting.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Above-mentioned substrate (10) with by the substrate being made of above-mentioned hexagon module (100) transmit and bake module (101),
Flip and plasma pretreatment module (102), HIL open mask process module (103), HTLR shadow mask pattern module
(104), HTLG shadow mask pattern module (105), HTLB shadow mask pattern module (106), R shadow mask pattern module
(107), the open mask process module of G shadow mask pattern module (108), B shadow mask pattern module (109), ETL/EIL
(110), cathode open mask process module (111), CPL film open mask process module (112), substrate unloading and Flip mould
The processes such as block (113) in proper order with the characteristics of.
In addition, the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
With the characteristics of the face vapor deposition case comprising having multiple vertical plane evaporation sources and multiple vertical organic matter powder evaporation sources.
In addition, in the high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source prompted in the present invention,
Case is deposited in above-mentioned face,
It is scanned with above-mentioned vertical organic matter powder evaporation source by left and right or up and down motion and rotates and hang down above-mentioned
Evaporation source is faced directly to be deposited with the characteristics of organic film.
The effect of invention
Using according to the present invention using the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source when, can have
Effect overcomes fine pattern caused by the organic gas diffusion that fine pattern Shi Yindian evaporation source or line evaporation source are deposited on substrate
Difficult phenomenon is deposited, while acquisition prevents large area substrates and mask from generating sagging and utilizes thin between substrate and mask
Micro- space greatly reduces the effect of shade phenomenon.
Meanwhile volume production equipment according to the present invention is contracted when fine pattern is deposited on substrate by free of discontinuities work continuously
Subtract the idle period, to improve organic matter service efficiency, while there is lasting maintenance high vacuum environment and reduce the production time
Effect.
Meanwhile volume production equipment according to the present invention realizes entirety without face evaporation source vapor deposition direction switching apparatus and process
Production cost and time greatly reduce, while having the effect of promoting finished product proportion of production.
Detailed description of the invention
Fig. 1 scans the process schematic that organic article pattern is deposited on substrate by line evaporation source to be traditional；
(A) of Fig. 2 be according to an embodiment of the present invention by vertical organic matter powder evaporation source vertical plane evaporation source steam
Plate the process schematic of organic film；(B) it is steamed again for the organic film by vertical plane evaporation source according to an embodiment of the present invention
It sends out and the process schematic of organic article pattern is deposited in substrate；
Fig. 3 is vertical organic matter powder evaporation source structural schematic diagram according to an embodiment of the present invention；
Fig. 4 is the hexagon module knot in the organic article pattern of substrate vapor deposition AMOLED production according to an embodiment of the present invention
Structure schematic diagram；
Fig. 5 is the rotation and scanning by vertical organic matter powder evaporation source according to an embodiment of the present invention in 2 faces steamings
It rises and is formed continuously the process schematic of organic film；
Fig. 6 is the mistake that the face evaporation source of heating is pushed to coldplate and is rapidly cooled according to an embodiment of the present invention
Journey schematic diagram；
Fig. 7 be according to an embodiment of the present invention by the substrate being disposed vertically and mask by substrate carrier and mask bracket into
The backstage 1XYZ and the backstage the 2XYZ structural schematic diagram of row fine tuning；
Fig. 8 is the AMOLED component structure schematic diagram for completing all process steps according to an embodiment of the present invention；
Fig. 9 is the volume production device structure schematic diagram by multiple hexagon module compositions according to an embodiment of the present invention.
Specific embodiment
Embodiment according to the present invention is described in detail below with reference to attached drawing.The embodiment of the present invention can be various
Form changes, and the scope of the present invention is not limited to following embodiments.In addition, for the need that drawing is described in detail
It asks, there may be exaggerations to show for the shape of shown each factor.
(A) of Fig. 2 be according to an embodiment of the present invention by vertical organic matter powder evaporation source vertical plane evaporation source steam
Plate the process schematic of organic film；(B) it is steamed again for the organic film by vertical plane evaporation source according to an embodiment of the present invention
It sends out and the process schematic of organic article pattern is deposited in substrate；Fig. 3 is vertical organic matter powder steaming according to an embodiment of the present invention
Rise structural schematic diagram；Fig. 4 is the hexagonal in the organic article pattern of substrate vapor deposition AMOLED production according to an embodiment of the present invention
Shape modular structure schematic diagram；Fig. 5 is the rotation and scanning by vertical organic matter powder evaporation source according to an embodiment of the present invention
The process schematic of organic film is formed continuously in 2 face evaporation sources；Fig. 6 is the face steaming by heating according to an embodiment of the present invention
Rise the process schematic for pushing to coldplate and being rapidly cooled；Fig. 7 is will be disposed vertically according to an embodiment of the present invention
Substrate and the backstage 1XYZ that is finely adjusted by substrate carrier and mask bracket of mask and the backstage 2XYZ structural schematic diagram；
Fig. 8 is the AMOLED component structure schematic diagram of 6 fine pattern film process of execution according to an embodiment of the present invention；Fig. 9 be according to
According to the volume production device structure schematic diagram of the hexagon module composition by volume production AMOLED element of the embodiment of the present invention.
As shown in Figures 1 to 7, the high-resolution AMOLED element collection using vertical plane evaporation source according to an embodiment of the present invention
Group's volume production equipment is to realize that fine pattern film is deposited on substrate (10), by substrate carrying case (61)；Has vertical plane evaporation
Source (20) and the face of vertical organic matter powder evaporation source (30) vapor deposition case (62)；Case (63) are deposited in face resource FMM；Cooler bin
(64)；Mask safe deposit box (65)；And substrate unloader box (66) is constituted, and the machine including having each cabinet of connection for being set to center
The hexagon module (100) of people's case (60).Wherein, substrate (10), face evaporation source (20) and mask can pass through robot case (60)
Interior robot is mobile to other cabinets.
Substrate carrying case (61) has the substrate (10) not being deposited, and substrate unloader box (66) has the base for completing vapor deposition
Piece (10).
Face vapor deposition case (62) is scanned by vertical organic matter powder evaporation source (30) with controlling or pumping
And it rotates and organic film (22) is deposited on the metal decking of vertical plane evaporation source (20) (S).
Vertical plane evaporation source (20) forms organic film (22) and organic matter is deposited on metal decking (S), need to be with
The metal decking being disposed vertically is mutually perpendicular to relatively, to make by having the vertical organic matter powder evaporation that can scan entire panel
The organic gas horizontal flight of source (30) injection is simultaneously deposited in metal decking (S).
Vertical organic matter powder evaporation source (30) need to connect cylinder-shaped evaporation source crucible (34) and be formed in evaporation source crucible
(34) multiple evaporation nozzles (31) above and below side and evaporation source crucible (34) bottom, and including filling organic matter powder (P)
Barrel-shaped organic matter storage crucible (35) in quadrangle；It is placed in the organic matter storage lid (36) on organic matter storage crucible (35) top；And add
Hot line (32), and realize that the parallel orbit that can be separated by according to the metal decking with face evaporation source (20) moves back and forth and can sweep
Retouch entire metal decking.
Wherein, evaporation source crucible (34), organic matter storage crucible (35) and organic matter store the 1st connecting flange of lid reason
(37) it is connected with the 2nd connecting flange (38) and supports to decompose and assemble, and is easy to keeping organic matter powder (P) and cleans hang down
Straight organic matter powder evaporation source (30).
In addition, being formed in mountable on multiple evaporation nozzles (31) of evaporation source crucible (34) side or more is to prevent from not spraying
The automatic open-close type nut cap (not shown) for phenomenon of losing heart is generated when penetrating organic gas by evaporation nozzle (31).
Organic gas is created on organic matter powder (P) gasification in organic matter storage crucible (35).
Wherein, as shown in figure 3, multiple evaporations nozzle (31) can be arranged in the evaporation source crucible (34) for erecting length by up and down direction
Surface, and be scanned on face evaporation source (20) metal decking and be injected on entire panel from left to right or from right to left
Machine gas, or lateral evaporation source crucible (34) surface can be arranged in by left and right directions, and on face evaporation source (20) metal decking
It from top to bottom or is from the bottom to top scanned and sprays organic gas on entire panel.
In addition, evaporation nozzle (31) can be arranged vertically in the two sides opposite with evaporation source crucible (34), and realizes and setting
In being deposited organic film simultaneously on two face evaporation source (20) metal deckings of vertical organic matter powder evaporation source (30) two sides
(22)。
In addition, heater wire (32) need to cover evaporation source crucible (34), organic matter storage crucible (35) and organic matter storage lid
(35) outside.The heater wire (32) for being released effectively infrared ray need to carry out heating gas to the organic matter powder (39) in storage crucible
Change, while it is cured to play the role of the organic gas generation for preventing from gasifying in evaporation source crucible (34) and evaporation nozzle (31).
In addition, needing to be formed with the evaporation for covering the entire evaporation source surface in addition to evaporating nozzle (31) jet port on the outside of heater wire (32)
Source outer cover (33) simultaneously plays insulation effect.
Example is carried out with cylindrical shape to evaporation source crucible (34) in the present invention, but invention scope is by no means restricted to this,
The invention scope of organic matter storage crucible (35) is also not limited to tetragonal tubbiness simultaneously.
Wherein, face vapor deposition case (62) can be deposited case (62) by double vertical planes and constitute, at this time the intracorporal vertical organic matter of each case
Powder evaporation source (30), which is scanned by left and right or up and down motion or is carried out centered on some central axis after determining angle rotation, to be led to
It crosses left and right or moves up and down and be scanned, so that organic film be deposited in turn at least two face evaporation source (20)
(22)。
In addition, as shown in figure 5, vacuum robot will complete the face evaporation source (20) of organic thin-film vapor deposition pass through it is double vertical
During face vapor deposition case (62) is discharged and introduces new face evaporation source (20), vertical organic matter powder evaporation source (30) can revolve in the same old way
Turn and other face evaporation source (25) is scanned by left and right or up and down motion and organic film (22) are deposited.
By being repeated process as above, vertical organic matter powder evaporation source (30) can not continuously carry out operation with resting and
Prevent to dally, to avoid that organic matter powder (P) occurs in internal cured phenomenon and finally improve organic matter powder (P)
Utilization rate.
In the present invention, two face evaporation sources (20) are carried out by vertical organic matter powder evaporation source (30) as shown in Figure 5
The trial of organic film (22) is deposited in turn, but invention scope is not limited to this, can evaporate according to vertical organic matter powder
The rotation angle in source (30) and the arrangement number of face evaporation source, size and with the spacing of powder evaporation source etc. come be deposited three or four or
The face evaporation source (20) of the above quantity.
Case (63) are deposited by heating surface evaporation source in the base for arranging mask in face resource FMM (Fine metal mask)
On piece completes vapor deposition, and wherein substrate (10), mask (12), face evaporation source (20) and heater heater wire (23) need arranged in sequence,
It the vapor deposition face of substrate (10) need to be opposite and separated by a distance with plumbness with the organic film (22) of face evaporation source (20).
Added in addition, face evaporation source (20) back side need to have heater heater wire (23) responsible opposite evaporation source (20)
Heat.
Wherein, resource FMM in face is deposited case (63) and can be made of double vertical plane evaporation source FMM vapor deposition case (63), at this time each case
Intracorporal substrate (10), mask (12), face evaporation source (20) and heater heater wire (23) need to be disposed vertically to be steamed in double vertical planes
The FMM that rises is deposited in case (63), and substrate (10), mask (12) and face evaporation source (20) are drawn by vacuum robot with plumbness
Enter and is discharged.
In addition, heater heater wire (23) needs the entire back side of covering surface evaporation source (20), heater heater wire (23) back
Face can form heater outer cover (24) so that the infrared ray of heater heater wire (23) release is only oriented towards face evaporation source (20) back side.
At this point, heater outer cover (24) can preferably reflect the metal material of infrared ray, wherein headed by the metal materials such as AI
Choosing, with for evaporation source outer cover (33) material.
In double vertical plane evaporation source FMM vapor deposition case (63), it is deposited by heater heater wire (23) in face evaporation source
(20) organic film (22) will evaporate, the organic gas horizontal flight of gasification and by the fine pattern of mask (12) vapor deposition in
Substrate (10).
At this point, make to gasify by face evaporation source preferably by the spacing for shortening face evaporation source (20) and substrate (10)
Organic gas reduces shade phenomenon on vertical substrate, and thus by moving horizontally vapor deposition.
It adds, as above the arrangement of the substrate and mask during vapor deposition and spacing easily lead to shade phenomenon, in order to subtle
The arrangement and spacing of substrate (10) and mask (12) are adjusted, can have arrangement dress in double vertical plane evaporation source FMM vapor depositions case (63)
Set (50).
As shown in fig. 7, collating unit (50) is made of the backstage 1XYZ (51) and the backstage 2XYZ (52), wherein 1XYZ
From the background the effect of (51) be by XYZ directional trim mask (12), and 2XYZ backstage (52) effect be by XYZ directional trim base
Piece (10).
Wherein, the backstage 1XYZ (51) is connected with mask bracket support axis (53), and mask bracket support axis (53) both ends
Be formed with can vertical support mask (12) up and down direction mask bracket (55).In general, mask (12) is being placed in mask frame
(15) process is moved and executed in the state of, therefore mask bracket (55) need to be made can support mask (12) and mask bracket simultaneously
(55) form.
In addition, the backstage 2XYZ (52) is connected with substrate carrier support shaft (54), and substrate carrier support shaft (54) both ends
Be formed with can vertical support substrate (10) up and down direction substrate carrier (56).
It is close to substrate (10) and mask (12) progress high-precision vertical using the backstage 1XYZ (51) and the backstage 2XYZ (52)
Arrangement can firmly consolidate large area substrates (10) and large area mask (12) in above-below direction, thus prevent substrate (10) with
The sagging of mask (12).
Cooler bin (64) is the cabinet that inside has coldplate (40), is responsible for evaporating the organic film (22) for completing vapor deposition
The heating metal diaphragm plate (S) of the face evaporation source (20) finished is tightly attached to coldplate (45) to be quickly cooled down.
The embodiment of rapid cooling is shown in cooler bin in Fig. 6, including vertical cooling plate (40) and with level side
To the pusher head (pusher head) (42) to move back and forth to it.Pusher head (42) be responsible for push metal diaphragm plate (S) with it is cold
But plate (40) is in contact, at this point, the edge of pusher head (42) can it is recessed according to metal diaphragm plate (S) and frame (21) form but
It is not limited to this, it can be any form for capableing of stable push metal diaphragm plate (S) and frame (21).
The promotion rail (pusher rod) (43) for pushing pusher head (42) to move back and forth can be formed in pusher head (42), and
The device for pushing rail (43) need to move back and forth with supports such as hydraulic cylinders is connected, to accurately push pusher head (42) to metal film
Plate (S) and contact metal diaphragm plate (S) uniformly with coldplate (40).
Meanwhile cooling water pipe (41) can be formed with inside coldplate (40), coldplate (40) is made to maintain low-temperature condition and are saved
Go the trouble that cooling equipment is separately filled in cooler bin (64).It introduces or transports metal diaphragm plate (S) to cooler bin (64) internal vertical
Also execution is responsible for by vacuum robot.
Mask safe deposit box (65) is that have multiple cabinets for forming figuratum mask (12), and the mask having can pass through machine
Device people is moved to FMM vapor deposition case.
Case is deposited for convenience of connection substrate carrying case (61), face vapor deposition case (62), face resource FMM in robot case (60)
(63), cooler bin (64), mask safe deposit box (65) and substrate unloader box (66) and hexagon mould is set to hexagon or square
Block (100) center, inside include vacuum robot main body turning (70) and the end effector (end being connected with fuselage
Effector) (71) robot.Wherein, substrate (10), face evaporation source (20), metal decking (S) and mask (12) are true by this
Empty robot is moved to each cabinet.
That is, robot in order to by substrate (10), face evaporation source (20), metal decking (S) and mask (12) in double vertical planes
Vapor deposition case (62), double vertical plane evaporation source FMM vapor deposition case (63) and cooler bin (64) it is interior perpendicularly into transport, vacuum robot
Main body turning (70) need to be fixed on hexagonal robot case (60) and end effector (71) must support relative rotation.Separately
Outside, end effector (71) is to reach to dispose substrate (10), face evaporation source (20), metal decking (S) in each box house or cover
Mould (12) and it is preferred that extensible type airframe structure.In addition, end effector (71) is set to vacuum robot main body turning (70)
One end and can vertical support substrate (10), face evaporation source (20), metal decking (S) or mask (12).
With reference to Fig. 4, to being sequentially described as follows for the interior vapor deposition process of hexagonal module (100):
Substrate (10) is placed in substrate carrying case (61).
Pass through each organic gas of 2 had in two-sided vapor deposition case (62) vertical organic matter powder evaporation source (30) evaporations
Vapor deposition is organic film respectively in the metal diaphragm plate of 2 vertical plane evaporation sources (20), and forms 2 vertical plane evaporation sources
(20)。
After vapor deposition finishes and forms 2 vertical plane evaporation sources (20), robot will be formed by 2 vertical plane evaporation sources
(20) double vertical plane evaporation source FMM vapor depositions case (63) are transferred to respectively with plumbness.
In addition, robot will be from substrate carrying case (61) and mask safe deposit box (65) respectively introduces 2 substrates (10) and 2 are covered
Mould (12), and it is equally transferred to double vertical plane evaporation source FMM vapor depositions case (63) respectively.
To each substrate (10) and mask (12) and vertical plane evaporation source in double vertical plane evaporation source FMM vapor deposition case (63)
(20) after position arrangement carries out subtle adjustment, opposite evaporation source (20) is heated and makes that having in face evaporation source (20) is deposited
Machine film (22) gasifies and is deposited on the substrate after mask.
After vapor deposition, substrate (10) is transferred to substrate unloader box (66) to execute downstream by robot, is heated
Face evaporation source metal decking cooler bin (64) be then transferred to by robot be rapidly cooled.
As shown in figure 4, the substrate carrying case (61) and substrate unloader box (66) of hexagonal module (100) are preferably with hexagonal machine
It is set relatively on the basis of people's case (60), but is not limited to this, it can be appropriately configured according to flowing water line morphology.
In addition, substrate carrying case (61) suggests wrapping with substrate unloader box (66) for convenience of from adjacent module transfer substrate
Containing using conveyer belt substrate mobile means or other can transfer the transport means of substrate (10).
Fig. 8 is the example of the AMOLED component structure with fine pattern formed by process as above, as shown,
AMOLED element on TFT substrate (10) by being laminated HIL (Hole Injection Layer) film (200), HTL (R)
(Hole Transport Layer Red) film (201), HTL (G) (Hole Transport Layer Green) film
(202), HTL (B) (Hole Transport Layer Blue) film (203), Red film (204), Green film (205),
Blue film (206), ETL (Electron Transport Layer) film (207), EIL (Electron Injection
Layer) film (208), metal cathode film (209), CPL (Capping Layer) film (210), 1SiN film
(211), thin polymer film (212), 2SiN film (213) and Barrier layer film (214), and laminated glass base above
Piece (215) and complete.
Wherein, HTL points are each R, G, B layer and the HTL (R), HTL (G), HTL (B) film to show " Cavity effect "
Pattern vapor deposition is carried out, therefore each light emitting layer thickness after vapor deposition is different from.Generally speaking, fine pattern film need to execute 6 altogether
Procedure, and remove other vapor deposition processes other than this 6 fine pattern film process and mainly pass through open mask process and execute.
Fig. 9 is to connect multiple hexagon modules for organic thin-film vapor deposition process suggested by quick execution Fig. 8 and complete
Volume production evaporator structural schematic diagram, volume production equipment according to an embodiment of the present invention as shown in the figure may include substrate transmission
And bake module (101), Flip and plasma pretreatment module (102), HIL open mask process module (103), HTLR shade
Mask pattern module (104), HTLG shadow mask pattern module (105), HTLB shadow mask pattern module (106), R shade are covered
The open mask of mould pattern module (107), G shadow mask pattern module (108), B shadow mask pattern module (109), ETL/EIL
Process module (110), cathode open mask process module (111), CPL film open mask process module (112), substrate unloading
And Flip module (113).
Wherein, it bakes module and refers to substrate baking process, Flip then refers to that substrate overturns process.
In addition, substrate transmission and baking module (101), Flip and plasma pretreatment module (102), the open mask of HIL
Process module (103), HTLR shadow mask pattern module (104), HTLG shadow mask pattern module (105), HTLB shade are covered
Mould pattern module (106), R shadow mask pattern module (107), G shadow mask pattern module (108), B shadow mask pattern mould
Block (109), ETL/EIL open mask process module (110), cathode open mask process module (111), the opening of CPL film are covered
Die process module (112), substrate unloading and Flip module (113) by existing sequential connection and will execute operation.
Wherein, the interconnecting piece of each module is using the substrate unloader box (66) of a certain module and the substrate carrying case of next module
(61) form being connected.For example, the substrate unloader box (66) of R shadow mask pattern module (107) is covered with next stage G shade
The substrate carrying case (61) of mould pattern module (108) is connected.
In addition, because the interconnecting piece between each module and each module maintains high vacuum state, therefore executed in each process
In the process without separately setting high vacuum environment and reducing unnecessary trouble.Meanwhile each interconnecting piece has carried out anti-drain process, it can
Stablize and maintains high vacuum environment.
It is within 1 minute by the production TACT time that this volume production equipment is pursued, total cabinet number is 69 and uses
Face resource and FMM process, the AMOLED element clarity pursued are 1200ppi~2250ppi, and used substrate size is
6th generation.Produce by the volume production equipment can effectively prevent substrate sagging with mask and be expected to using the 7th generation.
The content of the present specification only supplies for example, the personnel of being engaged in of the technical field of the invention are appreciated that the present invention can be
The change to other specific forms is realized under the premise of not changing its technical idea or necessary feature.For example, single form explanation
Each element it is dispersible implement, the element being illustrated on the contrary with dispersing morphology can also be implemented by combining form.
Claims (21)
1. a kind of high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source, which is characterized in that it is by substrate
Carrying case (61)；Face vapor deposition case (62) for having vertical plane evaporation source (20) and organic matter powder evaporation source (30)；Face resource FMM
It is deposited case (63)；Cooler bin (64)；Mask safe deposit box (65)；Substrate unloader box (66)；And has and be connected with each cabinet
The hexagon module (100) of robot case (60) is constituted, and fine pattern film is deposited on substrate (10).
2. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Case (62) are deposited in above-mentioned face,
Have double vertical plane vapor deposition casees, while at least 2 vertical organic matter powder evaporation sources (30) pass through left and right in each cabinet
Move up and down be scanned or by certain angle rotate rear left right or up under movement be scanned and at least to 2 or more vertically
Organic film (22) is deposited in face evaporation source (20) in turn.
3. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Case (62) are deposited in above-mentioned face,
After above-mentioned vertical organic matter powder evaporation source (30) is scanned or is rotated by certain angle by left and right or up and down motion
Left and right or up and down motion are scanned and organic film are deposited on the metal decking (S) of above-mentioned vertical plane evaporation source (20)
(22)。
4. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Case (62) are deposited in above-mentioned face,
Above-mentioned vertical plane evaporation source (20) is vertically opposite with vertical organic matter powder evaporation source (30) and by above-mentioned vertical organic
Object powder evaporation source (30) injection organic gas horizontal flight and on the metal decking (S) of above-mentioned vertical plane evaporation source (20)
Vapor deposition is organic film.
5. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Above-mentioned vertical organic matter powder evaporation source (30),
Including evaporation source crucible (34)；
It is formed in multiple evaporation nozzles (31) of above-mentioned evaporation source crucible (34) side or more or left and right；
It is connected on the downside of above-mentioned evaporation source crucible (34) and fills organic matter storage crucible (35) of organic matter powder (P)；
The organic matter storage lid (36) being placed at the top of above-mentioned organic matter storage crucible (35)；And
Heater wire on the outside of above-mentioned evaporation source crucible (34), organic matter storage crucible (35) and organic matter storage lid (35)
(32)。
6. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as claimed in claim 5
It is,
Above-mentioned evaporation source crucible (34), organic matter storage crucible (35) and organic matter storage lid (36) pass through the 1st connecting flange
(37) and the 2nd connecting flange (38) is connected and supports to decompose assembling.
7. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as claimed in claim 5
It is,
Above-mentioned evaporation nozzle (31) is equipped with the automatic switch over nut cap for preventing organic gas from leaking.
8. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as claimed in claim 5
It is,
Above-mentioned evaporation nozzle (31) be formed in two sides corresponding with above-mentioned evaporation source crucible (34) and with it is above-mentioned vertical organic
It is vapor-deposited with simultaneously on the metal decking of the two face evaporation sources (20) of the two sides of object powder evaporation source (30) mutually across a certain distance
Machine film (22).
9. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as claimed in claim 5
It is,
It is formed on the outside of above-mentioned heater wire (32) outside the entire evaporation source covered in addition to above-mentioned evaporation nozzle (31) jet port
The evaporation source outer cover (33) on surface.
10. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Have multiple vertical organic matter powder evaporation sources (30) and multiple vertical plane evaporation sources (20) in above-mentioned face vapor deposition case (62).
11. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Case (63) are deposited in above-mentioned face resource FMM,
Have substrate (10), mask (12), the face evaporation source (20) that organic film is deposited and the above-mentioned face evaporation source (20) of heating
Heater heater wire (23) and arranged in sequence, while the organic film in the vapor deposition face of above-mentioned substrate (10) and face evaporation source (20)
(22) across a certain distance with the opposite simultaneously phase of plumbness.
12. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is, case (63) are deposited in above-mentioned face resource FMM,
It is made of and the intracorporal substrate of each case (10), mask (12), face evaporation source double vertical plane evaporation source FMM vapor deposition case (63)
(20) and heater heater wire (23) is arranged vertically.
13. the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source is utilized as claimed in claim 12, it is special
Sign is,
Above-mentioned heater heater wire (23) covers the entire back side of above-mentioned face evaporation source (20), while above-mentioned heater heater wire
(23) infrared ray that the back side is formed with heater outer cover (24) and discharges heater heater wire (23) is only oriented towards face evaporation source
(20) back side.
14. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Case (63) are deposited in above-mentioned face resource FMM,
Separately have for subtle adjustment substrate (10) and the arrangement of mask (12) and the collating unit (50) of spacing.
15. the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source is utilized as claimed in claim 14, it is special
Sign is,
Above-mentioned collating unit (50),
By can to the backstage 1XYZ that aforementioned mask (12) are finely adjusted by the direction XYZ (51) with above-mentioned substrate (10) can be pressed
The backstage 2XYZ (52) that the direction XYZ is finely adjusted is constituted,
And the above-mentioned backstage 1XYZ (51) connect with mask bracket support axis (53) and aforementioned mask bracket support axis (53) both ends
Be formed with can vertical support mask (12) up and down direction mask bracket (55)；
The above-mentioned backstage 2XYZ (52) connect with substrate carrier support shaft (54) and above-mentioned substrate carrier support shaft (54) both ends shape
The substrate carrier (56) of the up and down direction of Cheng Youke vertical support substrate (10).
16. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Above-mentioned cooler bin (64),
Inside has coldplate (40), and will make vapor deposition organic film (22) evaporation above-mentioned vertical plane evaporation source (20) plus
Thermometal diaphragm plate (S) is tightly attached to above-mentioned coldplate (45) to be rapidly cooled.
17. the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source is utilized as claimed in claim 16, it is special
Sign is,
Above-mentioned cooler bin (64),
Including vertical cooling plate (40) and realize pusher head (42) that above-mentioned coldplate (40) moves reciprocatingly by horizontal direction and
Realize the promotion rail (43) that above-mentioned pusher head (42) moves reciprocatingly,
And cooling water pipe (41) can be formed inside above-mentioned coldplate (40).
18. utilizing the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source, feature as described in claim 1
It is,
Above-mentioned robot case (60),
Including vacuum robot main body turning (70) and the end effector for being connected to above-mentioned vacuum robot main body turning (70)
The robot of (end effector) (71), and substrate (10) and face evaporation source (20), metal decking (S), mask (12) are logical
Cross above-mentioned robot to each cabinet perpendicularly into and transport.
19. the high-resolution AMOLED element cluster using vertical plane evaporation source as described in any one of claim 1 to 18
Volume production equipment, which is characterized in that
Above-mentioned substrate (10) transmit and bake by the substrate that is made of above-mentioned hexagon module (100) module (101), Flip and
Plasma pretreatment module (102), HIL open mask process module (103), HTLR shadow mask pattern module (104), HTLG
Shadow mask pattern module (105), HTLB shadow mask pattern module (106), R shadow mask pattern module (107), G shade
Mask pattern module (108), B shadow mask pattern module (109), ETL/EIL open mask process module (110), cathode are opened
Put mask process module (111), CPL film open mask process module (112), substrate unloads and the works such as Flip module (113)
Sequence is in proper order.
20. a kind of high-resolution AMOLED element cluster volume production equipment using vertical plane evaporation source, which is characterized in that it includes tools
Case is deposited with the face of multiple vertical organic matter powder evaporation sources in standby multiple vertical plane evaporation sources.
21. the high-resolution AMOLED element cluster volume production equipment of vertical plane evaporation source is utilized as claimed in claim 20, it is special
Sign is,
Case is deposited in above-mentioned face,
Above-mentioned vertical organic matter powder evaporation source is scanned by left and right or up and down motion and rotates and steam in above-mentioned vertical plane
It rises and organic film is deposited.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170182310A KR101921648B1 (en) | 2017-12-28 | 2017-12-28 | Cluster type manufacturing equipment using vertical type plane source evaporation for high definition AMOLED devices |
| KR10-2017-0182310 | 2017-12-28 | ||
| PCT/KR2018/002624 WO2019132116A1 (en) | 2017-12-28 | 2018-03-06 | Equipment for mass production of high-resolution amoled elements in cluster type by using vertical plane evaporation source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110214383A true CN110214383A (en) | 2019-09-06 |
Family
ID=64602983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880000412.1A Pending CN110214383A (en) | 2017-12-28 | 2018-03-06 | It is equipped with the cluster volume production equipment of the high-resolution AMOLED element using vertical plane evaporation source |
Country Status (4)
| Country | Link |
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| JP (1) | JP2020506283A (en) |
| KR (1) | KR101921648B1 (en) |
| CN (1) | CN110214383A (en) |
| WO (1) | WO2019132116A1 (en) |
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| KR20200143605A (en) | 2019-06-14 | 2020-12-24 | 삼성전자주식회사 | Method of forming a semiconductor device using a thermally-decomposable layer, a semiconductor fabrication apparatus and the semiconductor device |
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- 2017-12-28 KR KR1020170182310A patent/KR101921648B1/en active IP Right Grant
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- 2018-03-06 JP JP2018520436A patent/JP2020506283A/en active Pending
- 2018-03-06 WO PCT/KR2018/002624 patent/WO2019132116A1/en active Application Filing
- 2018-03-06 CN CN201880000412.1A patent/CN110214383A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2019132116A1 (en) | 2019-07-04 |
| JP2020506283A (en) | 2020-02-27 |
| KR101921648B1 (en) | 2018-11-26 |
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