CN207918942U - Vacuum deposition apparatus and its evaporator head - Google Patents
Vacuum deposition apparatus and its evaporator head Download PDFInfo
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- CN207918942U CN207918942U CN201721643780.7U CN201721643780U CN207918942U CN 207918942 U CN207918942 U CN 207918942U CN 201721643780 U CN201721643780 U CN 201721643780U CN 207918942 U CN207918942 U CN 207918942U
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Abstract
The utility model provides a kind of vacuum deposition apparatus and its evaporator head.The evaporator head includes evaporator head cavity, further includes that multiple injection directions are different and the mutually disjoint nozzle of injection direction, the multiple nozzle are connected to the evaporator head cavity.Utility model has multiple nozzles using evaporator head, and substrate while the purpose of vapor deposition need to be deposited by realizing multiple.In addition, the utility model reduces the size of mask plate compared with prior art, it is possible to reduce or the excessive caused deformation problems of mask plate are avoided, while being conducive to improve using the mask plate after diminution and aligning precision and product resolution ratio.
Description
Technical field
The utility model is related to vacuum evaporation field more particularly to a kind of vacuum deposition apparatus and its evaporator head.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Display, abbreviation OLED) is using a base
In the own light source display screen technology of organic film, there is fast self-luminous, refresh rate, low energy consumption, high contrast, low-temperature characteristics
The advantages such as good and curling application, are a kind of very promising display technologies, are referred to as " dreamlike display ".With OLED rows
Industry develops, higher and higher for OLED requirements, such as large scale, high-resolution, high stability, long-life and low cost.
Vapor deposition is the important component of OLED manufacturing process, is by metal mask plate (FMM, also referred to as mask plate)
Accurate trepanning will luminous organic material vapor deposition on substrate (such as glass substrate).In the application of display screen, consumer gets over
Resolution ratio, the especially appearance of virtual reality technology (Virtual Reality, abbreviation VR) are more paid close attention to, even more to resolution ratio
Harsh requirement is proposed, this requires metal mask plates must break through high-resolution problem.
In addition, inventor is the study found that development with from OLED to large scale direction, if using existing vacuum evaporation
Device then needs adaptability to configure large-sized mask plate, it would be desirable to which higher throw the net precision and vapor deposition alignment precision are kept away simultaneously
Exempt from the excessive caused deformation problems of mask plate occur.
In addition, inventor also found, existing vacuum deposition apparatus can only once realize a need in a deposited chamber
The vapor deposition of substrate is deposited, production capacity is relatively low.
Utility model content
One of the purpose of this utility model is, providing one kind in a deposited chamber while can realize that multiple need to be deposited
Substrate is deposited, to improve the vacuum deposition apparatus and its evaporator head of production capacity.
The another object of the utility model is that aligning accuracy caused by mask plate deformation can be effectively improved by providing one kind
The relatively low and lower vacuum deposition apparatus of product resolution ratio and its evaporator head.
A further object of the utility model is, provides a kind of vacuum that the uniformity of film that can improve after being deposited is poor
Evaporation coating device and its evaporator head.
To achieve the above object, the first aspect of the utility model provides a kind of evaporator head of vacuum deposition apparatus, is used for
Evaporation material, including evaporator head cavity are sprayed to substrate need to be deposited, which is characterized in that are further included multiple injection directions differences and sprayed
The mutually disjoint nozzle in direction is penetrated, the multiple nozzle is connected to the evaporator head cavity.
Optionally, the quantity of the nozzle is two, and the injection direction of two nozzles is opposite.
Optionally, the evaporator head cavity is cuboid, square, column structure, ellipsoid structure or chondritic, institute
The structure that nozzle is the both ends open surrounded by polylith baffle is stated, one end of the nozzle is fixed on the evaporator head cavity,
The other end of the nozzle makes institute towards the need vapor deposition substrate being correspondingly arranged by the through-hole being set on the evaporator head cavity
Multiple nozzles are stated to be connected to the evaporator head cavity.
Optionally, further include the component for the supercharging being set in the evaporator head cavity, the spray for increasing evaporation material
Penetrate intensity.
The second aspect of the utility model provides a kind of vacuum deposition apparatus, and the vacuum deposition apparatus includes evaporator head.
Optionally, the vacuum deposition apparatus further includes：Evaporation source, for solid-state evaporation material to be converted to gaseous state vapor deposition
Material；Deposited chamber, for providing gaseous state evaporation material vapor deposition to the environment that need to be deposited in substrate；And delivery pipe, connect institute
Evaporation source and the evaporator head are stated, for conveying gaseous state evaporation material to the evaporator head.
Optionally, the vacuum deposition apparatus further includes：Evaporator head fixed mechanism, for fixing evaporator head and institute can be driven
State evaporator head movement；Mask plate fixation mechanism, for fixing mask plate and the mask plate can be driven to move；And substrate is fixed
Mechanism need to be deposited substrate for fixation and the substrate that need to be deposited can be driven to move.
Optionally, mask plate fixation mechanism and a substrate there are one being correspondingly arranged on the injection direction of each nozzle
Fixed mechanism.
Optionally, the mask plate, need to be deposited it is arranged in parallel between substrate, evaporator head.
Optionally, it the mask plate and substrate need to be deposited is each perpendicular to horizontal plane or is parallel to horizontal plane.
Optionally, the angle between the injection direction of the nozzle and the mask plate being correspondingly arranged is between 45~90 degree.
Optionally, the mask plate and substrate need to be deposited is rectangle；
The length of side of the mask plate long side is identical as the length of side that substrate long side need to be deposited, and the length of side of the mask plate short side
It is the 1/n for the length of side that substrate short side need to be deposited；Alternatively, the length of side of the mask plate long side is that the length of side of substrate long side need to be deposited
1/n, and the length of side of the mask plate short side is identical as the length of side that substrate short side need to be deposited；
Wherein, n is the integer more than 1.
Optionally, to the distance that substrate need to be deposited and the area ratio of substrate need to be deposited between 4~6 in the evaporator head.
The third aspect of the utility model provides a kind of vacuum deposition method, including：Deposited chamber maintains under vacuum conditions,
Solid-state evaporation material is converted to gaseous state evaporation material by evaporation source, and gaseous state evaporation material is delivered to evaporator head by delivery pipe, and is passed through
Substrate injection evaporation material need to be deposited by being sprayed to by multiple nozzles on evaporator head.
Optionally, evaporator head, mask plate and it need to be deposited between substrate three and carry out relative motion, meanwhile, gaseous state vapor deposition
Material is delivered to the evaporator head and is sprayed onto mask plate via multiple nozzles of the evaporator head, with to it is described need to be deposited substrate into
Row scanning vapor deposition.
Optionally, the angle between the injection direction of the nozzle and the mask plate being correspondingly arranged is between 45~90 degree.
The utility model has significant advantages and beneficial effects compared with prior art, is in particular in following side
Face：
1. being provided with multiple injection directions differences on the evaporator head of vacuum deposition apparatus provided by the utility model and spraying
The mutually disjoint nozzle in direction is penetrated, while realizing that the vapor deposition of substrate need to be deposited in multiple, to improve production capacity.
2. the size of the mask plate used in vacuum deposition apparatus provided by the utility model, which is less than, need to be deposited substrate
Size, that is, reduce the size of mask plate compared with prior art, it is possible to reduce or avoid the excessive caused deformation of mask plate
Problem, while being conducive to improve using the mask plate after diminution and aligning precision and product resolution ratio.
3. in vacuum deposition method provided by the utility model by adjusting evaporator head to need to be deposited between substrate away from
From and evaporator head, mask plate and the relative motion that need to be deposited between substrate, improve vapor deposition after uniformity of film.
Description of the drawings
Fig. 1 is the diagrammatic cross-section of the vacuum deposition apparatus of the utility model embodiment one；
Fig. 2 is the use state diagram of the vacuum deposition apparatus of the utility model embodiment one；
Fig. 3 is the mobile schematic diagram of the vacuum deposition method of the utility model embodiment one；
Fig. 4 is the opposing stationary with evaporator head when substrate need to be deposited of the vacuum deposition method of the utility model embodiment one
When, evaporation source to the asynchronous film thickness distribution simulation drawing of substrate distance；
Fig. 5 is the utility model embodiment one when substrate and evaporator head relative motion need to be deposited, evaporation source to substrate
Apart from asynchronous film thickness distribution simulation drawing；
Fig. 6 is the work flow diagram of the vacuum deposition apparatus of the utility model embodiment one；
Fig. 7 is the stereoscopic schematic diagram of the vacuum evaporation head of the utility model embodiment one；
Fig. 8 is the diagrammatic cross-section of the vacuum deposition apparatus of the utility model embodiment two；
Fig. 9 is the mobile schematic diagram of the vacuum deposition apparatus of the utility model embodiment two.
Specific implementation mode
Vacuum evaporatation is also referred to as vacuum evaporation, its principle is to heat the raw material of film to be formed, makes its atom
Or from surface, gasification escapes molecule, forms steam stream, is incident on substrate (substrate or substrate) surface, condensation forms solid film.
Evaporation process is widely used in the plated film production process of electronic device.
As stated in the background art, inventor is the study found that existing vacuum deposition apparatus is larger because of substrate need to be deposited, therefore
Need same larger mask plate so that mask plate easily deforms upon, and the resolution ratio for generating product is relatively low, precision of throwing the net is relatively low
And vapor deposition process takes longer problem.Meanwhile during vacuum evaporation, uniform film is obtained that need to be deposited in substrate,
It is not only the key of plated film, and prepares the key of device, however existing vacuum deposition apparatus is formed by uniformity of film
It is ideal not enough.
Based on the studies above, the utility model is by being arranged multiple injection directions differences and the mutually disjoint spray of injection direction
Mouth is on evaporator head, and substrate need to be deposited by realizing while multiple being deposited, to improve production capacity.In addition, by using mask plate
Size be less than the scheme of the size that substrate need to be deposited, be conducive to improve resolution ratio and throw the net precision.In addition, by adjusting evaporation
Head improves vapor deposition to the distance between substrate and evaporator head, mask plate need to be deposited and the relative motion between substrate need to be deposited
Rear film uniformity.
Below in conjunction with the drawings and specific embodiments to the evaporator head, vacuum deposition apparatus and vacuum evaporation side of the utility model
Method is described in further detail.According to following explanation and claims, will be become apparent from feature the advantages of the utility model.It needs
Illustrate, attached drawing is all made of very simplified form and uses non-accurate ratio, only to convenient, lucidly auxiliary is said
The purpose of bright the utility model embodiment.
Embodiment one
Fig. 1 is the diagrammatic cross-section of the vacuum deposition apparatus of the present embodiment.As shown in Figure 1, present embodiment discloses one kind
Vacuum deposition apparatus, the vacuum deposition apparatus include deposited chamber 1.Deposited chamber 1 can maintain vacuum shape by exhaust gas inside
Under state, for providing evaporation material vapor deposition to the environment in substrate.
The vacuum deposition apparatus further includes evaporation source 7.Evaporation source 7 may be provided at outside deposited chamber 1, for steaming solid-state
Plating material heating is converted to gaseous state evaporation material.The quantity of evaporation source 7 is either one or more.In the present embodiment,
Vacuum deposition apparatus includes an evaporation source 7.
The vacuum deposition apparatus further includes delivery pipe 8.Delivery pipe 8 connects the evaporation source 7 and the evaporator head 2, uses
In to the evaporator head convey gaseous state evaporation material.It can be that a delivery pipe 8 connects an evaporation source 7, can also be multiple
Delivery pipe 8 connects an evaporation source 7 jointly, can also be that multiple delivery pipes 8 connect multiple evaporation sources 7, wherein delivery pipe quantity
It is at least identical as evaporation source quantity.In the present embodiment, a delivery pipe 8 connects an evaporation source 7.
Fig. 7 is the stereoscopic schematic diagram of the vacuum evaporation head of the present embodiment, as shown in fig. 7, the vacuum deposition apparatus also wraps
Include evaporator head 2.The evaporator head 2 includes evaporator head cavity 21, further includes that multiple injection directions are different and the mutual not phase of injection direction
The nozzle of friendship.The multiple nozzle is connected to the evaporator head cavity 21.The evaporator head cavity 21 is, for example, cuboid, pros
Body, column structure, ellipsoid structure or chondritic.It is provided on two faces that the evaporator head cavity 21 is oppositely arranged several
Through-hole 21a, the evaporator head cavity 21 are connected to by the through-hole 21a with the nozzle.In the present embodiment, as shown in Figure 1,
There are two the nozzles 91 and 92 that injection direction is opposite and is mutually parallel, the evaporator head 2 to pass through nozzle for setting on the evaporator head 2
Gaseous state evaporation material is sprayed, while realizing that the vapor deposition of substrate need to be deposited in multiple.The nozzle 91,92 is by polylith baffle example
One end of the structure for the both ends open that four block baffle in this way surrounds, the nozzle 91,92 is fixed on the evaporator head cavity 21,
Evaporation material in evaporator head cavity 21 is sprayed via through-hole 21a and nozzle 91,92.Optionally, 2 inside of the evaporator head is gone back
It is provided with a pressurizing pack (not shown), sprays intensity for increasing evaporation material.
Mask plate fixation mechanism and a substrate fix machine there are one being correspondingly arranged on the injection direction of each nozzle
Structure.The mask plate fixation mechanism, for fixing mask plate and the mask plate can be driven to move.The substrate fixed mechanism,
Substrate need to be deposited for fixation and the substrate that need to be deposited can be driven to move.In the present embodiment, 91 corresponding direction of nozzle is provided with
Mask plate fixation mechanism 31 and substrate fixed mechanism 41；92 corresponding direction of nozzle is provided with mask plate fixation mechanism 32 and substrate is solid
Determine mechanism 42.Mask plate fixation mechanism 31, for fixing mask plate 51 and the mask plate can be driven to move；Mask plate is fixed
Mechanism 32, for fixing mask plate 52 and the mask plate can be driven to move.Substrate fixed mechanism 41 needs to be deposited for fixation
Substrate 61 simultaneously can drive the substrate that need to be deposited to move；Substrate fixed mechanism 42 need to be deposited substrate 62 for fixation and can drive
It is described that substrate movement need to be deposited.Wherein, mask plate 51 can be identical with the shape and size of mask plate 52, and substrate need to be deposited
61 can be identical with the shape and size that substrate 62 need to be deposited.Certainly, the shape and size of mask plate 51 and mask plate 52
It can differ, substrate 61 need to be deposited can not also be identical with the shape and size that substrate 62 need to be deposited.From the foregoing, it will be observed that this implementation
Two need vapor deposition substrates can be deposited in example simultaneously, improve production capacity.
Fig. 2 is the use state diagram of the vacuum deposition apparatus of the present embodiment, as shown in Fig. 2, the vacuum evaporation fills
It further includes evaporator head fixed mechanism 10 to set, for fixing evaporator head and the evaporator head can be driven to move.In the present embodiment, evaporation
First 2 are fixed on evaporator head fixed mechanism 10, and evaporator head fixed mechanism 10 installs i.e. 10 edge of evaporator head fixed mechanism perpendicular to the ground
The directions Z are installed and the horizontal plane defined by the directions XY, and certainly, evaporator head 2 can vertically telescopic moving (Z up and down
Move in direction), evaporator head 2 can also move (X-direction or Y-direction movement) in the horizontal direction, evaporator head 2 can also carry out twisting or
It swings.
The evaporator head 2, mask plate 51 and it need to be deposited arranged in parallel between substrate 61 and can be movable relatively, equally,
The evaporator head 2, mask plate 52 and it need to be deposited arranged in parallel between substrate 62 and can be movable relatively.In the present embodiment, such as
Shown in Fig. 1, the mask plate and substrate need to be deposited arrange (be each perpendicular to horizontal plane) in the horizontal direction.The injection side of the nozzle
To the angle between the mask plate being correspondingly arranged for example between 45~90 degree.It can be by adjusting 31 He of mask plate fixation mechanism
The position of substrate fixed mechanism 41 and angle make mask plate 51 and need to be deposited that substrate 61 is horizontally arranged and vertical level is set
It sets, meanwhile, injection direction and the mask plate 51 of nozzle 91 are mutually perpendicular to, i.e. the injection direction of nozzle and the mask plate being correspondingly arranged
Between angle be 90 °；It can to cover by the position and angle for adjusting mask plate fixation mechanism 32 and substrate fixed mechanism 42
Template 52 and need to be deposited substrate 62 horizontally arranged and be arranged in a vertical horizontal plane, meanwhile, injection direction and the mask plate 52 of nozzle 92
It is mutually perpendicular to, i.e., the angle between the injection direction of nozzle and the mask plate being correspondingly arranged is 90 °.Wherein mask plate 51 and need
Position relationship and the mask plate 52 of substrate 61 is deposited and that the position relationship of substrate 62 need to be deposited is identical.
Fig. 3 is the mobile schematic diagram of the vacuum deposition method of the present embodiment.As shown in figure 3, in the present embodiment, base need to be deposited
Plate 61 is static, evaporator head 2, mask plate 51 and need to be deposited substrate 61 arranged in parallel, mask plate 51 and need to be deposited on substrate 61
Lower movement (e.g. uniform motion from bottom to top)；It is static that substrate 62 need to be deposited, evaporator head 2, mask plate 52 and substrate need to be deposited
62 is arranged in parallel, and mask plate 51 moves up and down (e.g. uniform motion from bottom to top) with substrate 61 need to be deposited.
The mask plate and substrate need to be deposited is rectangle.The length of side of the mask plate long side and substrate long side need to be deposited
The length of side it is identical, and the length of side of the short side of the mask plate is the 1/n for the length of side that substrate short side need to be deposited；Alternatively, the mask
The length of side of plate long side is the 1/n for the length of side that substrate long side need to be deposited, and the length of side of the short side of the mask plate and substrate need to be deposited
The length of side of short side is identical.Wherein, n is the integer more than 1.In the present embodiment, the length of side a1 of 51 long side of mask plate and base need to be deposited
The side length b 1 of 61 long side of bottom is identical, and the length of side a1 ' of the short side of mask plate 51 is the 1/2 of the side length b 1 ' that substrate short side need to be deposited；It covers
The length of side a2 of 52 long side of template is identical as the side length b 2 that 62 long side of substrate need to be deposited, and the length of side a2 ' of the short side of mask plate 52 is to need
It is deposited the 1/2 of the side length b 2 ' of substrate short side.Mask plate 51 is identical with 52 shape of mask plate simultaneously, and substrate 61 need to be deposited and need to steam
It is identical to plate 62 shape of substrate.Therefore, mask plate 51 is identical with 52 size shape of mask plate, and substrate 61 need to be deposited and need to steam
It is identical to plate 62 size shape of substrate.
It is (traditional that the vacuum deposition apparatus of the present embodiment can be seen that mask board size is obviously reduced compared with prior art
The shape and size of mask plate are usually identical with the shape and size that substrate need to be deposited), it can be effectively improved mask in this way
The problem of plate deformation.Also, being obviously reduced due to mask board size during evaporation process so that precision of throwing the net, contraposition essence
Degree and product resolution ratio are obtained for improvement.
Please continue to refer to Fig. 4, Fig. 4 be when need to be deposited substrate and evaporator head it is opposing stationary when, evaporation source to substrate distance not
Film thickness distribution simulation drawing simultaneously, as shown,
First, film thickness uniformity is Max-Min (%), meets following relational expression：
Wherein, Max and Min respectively represents the maximum value and minimum value that film thickness within the scope of substrate need to be deposited.
Evaporator head 2 is to the distance h1 that substrate 61 need to be deposited, evaporator head 2 to the distance that substrate 62 need to be deposited in the present embodiment
H2, h1=h2；The area s1 of substrate 61 need to be deposited, the area s2, s1=s2 of substrate 62 need to be deposited.It is static when that substrate need to be deposited
When, dimensionless H variations meet relational expression：And value is respectively 0.5,1,2 and 5, it is assumed that gas molecule along rectilinear flight,
Intermolecular not collide, gaseous molecules deposit is condensed immediately to need to be deposited in substrate, and renewable hair phenomenon does not occur, pass through cover it is special
The growth of Caro method simulation thin film obtains Fig. 4, can be seen that dimensionless H from Fig. 4 using the relational expression of film thickness thickness evenness
In the case of different four kinds of value, the uniformity of film thickness by difference to the sequence (H=0.5) got well<(H=1)<(H=2)<(H=
5).It is found through experiment that the evaporator head is imitated to the distance that substrate need to be deposited and the area ratio that substrate need to be deposited between 4~6
Fruit is preferable, and the film thickness uniformity after being especially deposited as H=5 is ideal.
Please continue to refer to Fig. 5, Fig. 5 be when substrate and evaporator head relative motion need to be deposited, evaporation source to substrate distance not
Film thickness distribution simulation drawing simultaneously, need to be deposited substrate and be equally applicable to film thickness uniformity relational expression of evaporator head when opposing stationary
Substrate and film thickness uniformity when evaporator head relative motion need to be deposited.When that basement movement need to be deposited, dimensionless H variations and value
Respectively 0.5,1,2 and 5, it is assumed that gas molecule is intermolecular not collide along rectilinear flight, and gaseous molecules deposit is to needing to be deposited
It is condensed immediately in substrate, renewable hair phenomenon does not occur, Fig. 5 is obtained by the growth of Monte-carlo Simulation film, is utilized from Fig. 5
In the case of the relational expression of film thickness thickness evenness can be seen that different four kinds of dimensionless H values, the uniformity of film thickness by difference
To good sequence (H=0.5)<(H=1)<(H=2)<(H=5).Equally, the evaporator head to the distance that substrate need to be deposited and needs
The area ratio of vapor deposition substrate effect between 4~6 is preferable, the non-convention of film thickness uniformity after being especially deposited as H=5
Think.
Substrate and film thickness uniformity ratio when evaporator head relative motion need to be deposited it can be seen from Fig. 4 and Fig. 5 need to be deposited base
Film thickness uniformity is good when bottom is opposing stationary with evaporator head, especially when substrate need to be deposited with evaporator head relative motion and H=5,
Film thickness uniformity after vapor deposition is preferable.It can be seen from the above, evaporation source, mask plate in the present embodiment and the distance of substrate need to be deposited
Setting and their relative motion improve the film thickness uniformity after vapor deposition.
Although vertically (Z-direction) moves from bottom to top using evaporation source in the present embodiment, evaporation can also be used
Source vertical direction (Z-direction) moves from top to bottom；Alternatively, evaporation source can also be used, (X-direction or Y-direction) is moved in the horizontal direction
It is dynamic, it moves e.g. from right to left, from left to right, from the front to the back, from the front to the back.
Although the angle between using the injection direction of nozzle in the present embodiment and the mask plate that is correspondingly arranged is opposite for 90 °
Movement, as long as but actually angle meet that angle effect when between 45 °~90 ° is ideal, and certain the utility model is simultaneously
The not angle between the injection direction of limits nozzle and the mask plate being correspondingly arranged might be less that 45 °.
Although to be including two nozzles using evaporation source in the present embodiment, substrate need to be deposited and be by realizing while being deposited two
Example, however it should be readily apparent to one skilled in the art that multiple nozzles can also be used, substrate need to be deposited by realizing while multiple being deposited；
Two nozzles are mutually parallel in the present embodiment, however it should be readily apparent to one skilled in the art that evaporation source includes multiple injection directions
The different and mutually disjoint nozzle of injection direction, realizes that multiple need to be deposited substrate while be deposited.
Although using two groups of identical mask plates and substrate need to be deposited in the present embodiment, actually mask plate and need to be deposited
The quantity of substrate is not limited to foregoing description, can also be arranged three groups, four groups or more and organize mask plates and substrate, example need to be deposited
Such as, it can be provided only with one group of nozzle on a face of evaporator head cavity 21, it can also be on a face of evaporator head cavity 21
It is arranged there are two towards different nozzles, this face is correspondingly arranged on two groups of mask plates and substrate need to be deposited.It is, of course, also possible to have
More versions, it is numerous to list herein.
Also, the size between multigroup mask plate can it is identical can not also be identical, similarly, multigroup ruler that substrate need to be deposited
It is very little can it is identical can not also be identical.
Although substrate is static using need to be deposited in the present embodiment, the mode of evaporator head and mask plate movement, however this field
Technical staff is readily appreciated that, meets evaporator head, mask plate and the mode of substrate relative motion need to be deposited in addition, evaporation may be used
Head and mask plate are static, and the mode of basement movement need to be deposited；Alternatively, it is static to may be used mask plate, evaporator head and base need to be deposited
The mode that bottom moves toward one another；Alternatively, may be used, evaporator head is static, mask plate and the mode etc. that substrate moves toward one another need to be deposited.
It is, of course, also possible to have more versions, it is numerous to list herein.
The present embodiment also provides a kind of vacuum deposition method, includes the following steps：
Deposited chamber is maintained under vacuum conditions by exhaust gas inside, and evaporation source is converted to evaporation material by solid-state heating
Gaseous evaporation material is delivered to evaporator head by gaseous state, delivery pipe, is sprayed via multiple nozzles of evaporator head.The vacuum evaporation side
Multiple, which can be deposited, in method simultaneously need to be deposited substrate, improve production capacity.It is understood that the nozzle that evaporation source has is covered with corresponding
Template and it need to be deposited that substrate is more, while achievable while vapor deposition need vapor deposition substrate is more, production capacity is higher.
Fig. 6 is the work flow diagram of the vacuum deposition method of the present embodiment.The present embodiment is discussed in detail with reference to Fig. 6
The working method of vacuum deposition apparatus.
Step 1：Mask plate, i.e., be fixed on mask plate fixation mechanism, and aligned to mask plate by fixed mask plate,
Contraposition is successfully entered in next step, and contraposition, which unsuccessfully returns to previous step and aligned or unloaded again mask plate and reload one, to be covered
Template.
Wherein the length of side a1 of 51 long side of mask plate is identical as the side length b 1 that 61 long side of substrate need to be deposited, the short side of mask plate 51
Length of side a1 ' be the 1/2 of the side length b 1 ' that substrate short side need to be deposited；The length of side a2 of 52 long side of mask plate is grown with substrate 62 need to be deposited
The side length b 2 on side is identical, and the length of side a2 ' of the short side of mask plate 52 is the 1/2 of the side length b 2 ' that substrate short side need to be deposited.Mask simultaneously
Plate 51 is identical with 52 shape of mask plate, and it is identical with 62 shape of substrate need to be deposited that substrate 61 need to be deposited.That is, mask plate 51 and mask plate
52 size shapes are identical, and it is identical with 62 size shape of substrate need to be deposited that substrate 61 need to be deposited.
Step 2：Substrate need to be deposited in fixation, and substrate need to be deposited and aligned with mask plate, and contraposition is successfully entered in next step,
Contraposition, which unsuccessfully returns to previous step and aligned or unloaded again substrate need to be deposited reload need, is deposited substrate.The steaming
Head is sent out to the distance that substrate need to be deposited and the area ratio that substrate need to be deposited between 4~6, film thickness uniformity after vapor deposition compared with
Good, evaporator head is to the distance that substrate need to be deposited and when the area ratio of substrate need to be deposited is 5 in the present embodiment, the film thickness after vapor deposition
Uniformity is preferable.
Step 3：Heating evaporation source 7.The quantity of evaporation source can be one or more.
Step 4：Evaporator head, mask plate and need to be deposited substrate e.g. arranged in parallel, and evaporator head, mask plate and
It need to be deposited between substrate three and carry out relative motion, meanwhile, gaseous evaporation material is delivered to evaporator head and via evaporator head
Multiple nozzles are ejected to mask plate to be scanned vapor deposition to substrate need to be deposited, wherein between the injection direction and mask plate of nozzle
Angle it is preferred between 45~90 degree.
Step 5：Substrate after unloading vapor deposition.
It can while be deposited in the same deposited chamber according to the above flow as described above, substrate need to be deposited in multiple.
Embodiment two
Fig. 8 is the diagrammatic cross-section of the vacuum deposition apparatus of the present embodiment.As shown in figure 8, the present embodiment and embodiment one
Difference lies in, on the one hand, the evaporator head 2 in the vacuum deposition apparatus is parallel to ground (horizontal plane) installation, and evaporator head 2 is solid
It is scheduled on evaporator head fixed mechanism 10,10 parallel ground of evaporator head fixed mechanism, evaporator head fixed mechanism 10 can drive evaporator head
2 (such as X-direction) movements in the horizontal direction, and evaporator head 2 can be rotated or swing；On the other hand, it mask plate 51 and needs to be deposited
Substrate 61, which is mutually parallel and is parallel to ground, places (i.e. vertically arrange), equally, mask plate 52 with substrate 62 need to be deposited
It is mutually parallel and is parallel to ground placement.
Please continue to refer to Fig. 9, Fig. 9 is the mobile schematic diagram of the vacuum deposition apparatus of the present embodiment, as shown in figure 9, this reality
Applying example and embodiment one, difference lies in evaporator head 2, mask plate 51 and need to be deposited substrate 61 in X direction mutually in the present embodiment
It is parallel.Evaporator head 2 is static, the uniform motion parallel with 62 negative direction of substrate need to be deposited of mask plate 52 i.e. mask plate 52 in X direction by
The uniform motion from right to left in X direction of substrate 62 need to be deposited in from left to right uniform motion.Compared with embodiment one, evaporation is provided
Head, mask, another installation fixed form that substrate need to be deposited.In addition, the size relationship of each component in embodiment one, position
It is equally applicable to embodiment two to set relationship and relative motion, does not repeat again herein.
In conclusion using the vacuum deposition apparatus and its evaporator head of the utility model, multiple can be made substrate need to be deposited same
When be deposited, while solve mask plate it is larger caused by deformation problems, improve product resolution ratio so that product is had better competitiveness.Root
According to required application and desired effect, can arbitrarily be combined according to embodiment one and embodiment two, in this practicality
Within novel protection domain.
Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model
Calmly, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content, belong to right and want
Seek the protection domain of book.
Claims (13)
1. a kind of evaporator head, including evaporator head cavity, which is characterized in that further include that multiple injection directions are different and injection direction is mutual
Disjoint nozzle, the multiple nozzle are connected to the evaporator head cavity.
2. evaporator head as described in claim 1, which is characterized in that the quantity of the nozzle is two, two nozzles
Injection direction is opposite.
3. evaporator head as described in claim 1, which is characterized in that the evaporator head cavity is cuboid, square, column knot
Structure, ellipsoid structure or chondritic, the nozzle are the structures of the both ends open surrounded by polylith baffle, the one of the nozzle
End is fixed on the evaporator head cavity, and the other end of the nozzle is towards the need vapor deposition substrate being correspondingly arranged, by being set to
Through-hole on the evaporator head cavity makes the multiple nozzle be connected to the evaporator head cavity.
4. evaporator head as described in claim 1, which is characterized in that further include the supercharging group being set in the evaporator head cavity
Part, the injection intensity for increasing evaporation material.
5. a kind of vacuum deposition apparatus, which is characterized in that including evaporator head according to any one of claims 1 to 4.
6. vacuum deposition apparatus as claimed in claim 5, which is characterized in that further include：
Evaporation source, for solid-state evaporation material to be converted to gaseous state evaporation material；
Deposited chamber, for providing gaseous state evaporation material vapor deposition to the environment that need to be deposited in substrate；And
Delivery pipe connects the evaporation source and the evaporator head, for conveying gaseous state evaporation material to the evaporator head.
7. vacuum deposition apparatus as claimed in claim 5, which is characterized in that further include：
Evaporator head fixed mechanism, for fixing evaporator head and the evaporator head can be driven to move；
Mask plate fixation mechanism, for fixing mask plate and the mask plate can be driven to move；And
Substrate fixed mechanism need to be deposited substrate for fixation and the substrate that need to be deposited can be driven to move.
8. vacuum deposition apparatus as claimed in claim 5, which is characterized in that correspondence is set on the injection direction of each nozzle
Mask plate fixation mechanism and a substrate fixed mechanism there are one setting.
9. vacuum deposition apparatus as claimed in claim 7, which is characterized in that the mask plate, need to be deposited substrate, evaporator head it
Between it is arranged in parallel.
10. vacuum deposition apparatus as claimed in claim 7, which is characterized in that the mask plate with substrate need to be deposited vertical
In horizontal plane or it is parallel to horizontal plane.
11. vacuum deposition apparatus as claimed in claim 7, which is characterized in that the injection direction of the nozzle be correspondingly arranged
Mask plate between angle between 45~90 degree.
12. the vacuum deposition apparatus as described in claim 7,9,10 or 11, which is characterized in that the mask plate and base need to be deposited
Bottom is rectangle；
The length of side of the mask plate long side is identical as the length of side that substrate long side need to be deposited, and the length of side of the mask plate short side is to need
The 1/n of the length of side of substrate short side is deposited；Alternatively, the length of side of the mask plate long side is the 1/n for the length of side that substrate long side need to be deposited,
And the length of side of the mask plate short side is identical as the length of side that substrate short side need to be deposited；
Wherein, n is the integer more than 1.
13. the vacuum deposition apparatus as described in any one of claim 5 to 11, which is characterized in that the evaporator head is to needing to steam
It plates the distance of substrate and the area ratio of substrate need to be deposited between 4~6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721643780.7U CN207918942U (en) | 2017-11-30 | 2017-11-30 | Vacuum deposition apparatus and its evaporator head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721643780.7U CN207918942U (en) | 2017-11-30 | 2017-11-30 | Vacuum deposition apparatus and its evaporator head |
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| Publication Number | Publication Date |
|---|---|
| CN207918942U true CN207918942U (en) | 2018-09-28 |
Family
ID=63613135
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721643780.7U Withdrawn - After Issue CN207918942U (en) | 2017-11-30 | 2017-11-30 | Vacuum deposition apparatus and its evaporator head |
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| Country | Link |
|---|---|
| CN (1) | CN207918942U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570645A (en) * | 2017-11-30 | 2018-09-25 | 上海微电子装备（集团）股份有限公司 | Vacuum deposition apparatus and its evaporator head, vacuum deposition method |
| CN112846604A (en) * | 2019-11-27 | 2021-05-28 | 上海微电子装备（集团）股份有限公司 | Net tensioning device and net tensioning method |
-
2017
- 2017-11-30 CN CN201721643780.7U patent/CN207918942U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570645A (en) * | 2017-11-30 | 2018-09-25 | 上海微电子装备（集团）股份有限公司 | Vacuum deposition apparatus and its evaporator head, vacuum deposition method |
| CN108570645B (en) * | 2017-11-30 | 2023-09-29 | 上海微电子装备（集团）股份有限公司 | Vacuum evaporation device, evaporation head thereof and vacuum evaporation method |
| CN112846604A (en) * | 2019-11-27 | 2021-05-28 | 上海微电子装备（集团）股份有限公司 | Net tensioning device and net tensioning method |
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