CN203904446U - OLED (organic light-emitting diode) linear evaporation source device - Google Patents
OLED (organic light-emitting diode) linear evaporation source device Download PDFInfo
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- CN203904446U CN203904446U CN201420316433.3U CN201420316433U CN203904446U CN 203904446 U CN203904446 U CN 203904446U CN 201420316433 U CN201420316433 U CN 201420316433U CN 203904446 U CN203904446 U CN 203904446U
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Abstract
The utility model discloses an OLED (organic light-emitting diode) linear evaporation source device comprising an evaporation source and a plurality of main spray nozzles, wherein the evaporation source is used for accommodating a vapor deposition material and is provided with a first surface facing a base plate; the plurality of main spray nozzles are arranged on the first surface of the evaporation source along a first direction; the evaporation source moves along a second direction to perform vapor deposition; at least one compensating spray nozzle is further respectively arranged on two sides of each main spray nozzle along the second direction of the evaporation source perpendicular to the first direction. According to the OLED linear evaporation source device, the compensating spray nozzles are arranged on the two sides of each main spray nozzle, a spherical material sprayed from each compensating spray nozzle can be compensated to an area with small material quantity sprayed by each main spray nozzle from an area with relatively large top-end material quantity so as to ensure that a film layer is uniform after the material is sprayed from each spray nozzle. Therefore, when organic materials are doped, film layer figures of all the materials evaporated on the base plate can be better matched so as to improve the doping effect and further improve the device effect.
Description
Technical field
The present invention, about a kind of linear evaporation source apparatus, refers in particular to a kind of linear evaporation source apparatus that can ensure OLED rete homogeneity.
Background technology
Vacuum vapour deposition is under vacuum condition, evaporating for the metallic element of evaporation and depositing to substrate surface, thereby forms film; This kind of method, according to the difference of evaporation thermal source, can be divided into point source evaporation and line source evaporation.Point source evaporation is and utilizes thermal source make every kind of elements vaporization and deposit on substrate respectively, and every kind of element wherein only has single evaporation mouth; Line source evaporation is to use the linear container that comprises multiple evaporation mouths, the same time is evaporated deposition material deposit to substrate from multiple evaporation mouthful, line source evaporation has higher material use efficiency in comparison, and can reduce the distance between source and substrate, reduction equipment size.
Shown in Figure 1, existing linear evaporation source apparatus comprises the evaporation source 90 for accommodating deposition material, and be arranged at the multiple nozzles 91 on evaporation source 90 along the length direction (being a direction shown in figure) of evaporation source 90, material evaporates in evaporation source 90, then is deposited on substrate 92 by nozzle 91 ejections.When evaporation, evaporation source 90 moves (shown in figure, being b direction) along its width.By to multiple nozzles 91 position on evaporation source 90 length directions adjust, the rete of evaporation on substrate 92 can ensure the homogeneity of rete on the length direction of evaporation source 90.
But shown in Fig. 2, under microcosmic, observe, within the scope of the evaporation of nozzle 91, material can present a spherical steam ball 93 in the time that nozzle 91 sprays, as can be seen from Figure, the maximum retes of tip material amount that this spherical steam ball 93 is spherical are the thickest, and the fewer rete of more past peripheral material is thinner.So shown in Figure 3, for material after evaporation on substrate 92 along the thicknesses of layers schematic diagram on evaporation source 90 widths, in figure, x direction represents the position on evaporation source 90 widths, y direction represents the thickness of rete, due to along only having a nozzle 91 on evaporation source 90 widths, so can produce crest phenomenon.Although can improve the problem of thicknesses of layers inequality when evaporation source 90 moves, but in the time need to using two or more material doped evaporations, due to the existence of crest phenomenon, be difficult to make the overlapping or wave mode coupling of the crest location of every kind of material, will greatly affect the effect of organic materials doping, and then affect device effect.
Therefore, need to new improvement be proposed to existing linear evaporation source apparatus.
Summary of the invention
Because the problems referred to above the object of the present invention is to provide a kind of OLED linear evaporation source apparatus, comprising:
Evaporation source, for accommodating deposition material, described evaporation source has a first surface to substrate just;
A plurality of main jets, are arranged at along a first direction on the described first surface of described evaporation source;
And described evaporation source is along moving and carry out evaporation perpendicular to a second direction of described first direction;
Along in the second direction of described evaporation source, the both sides of described main jet are further respectively equipped with at least one compensating jet.
Further improvement of the present invention is, the jet size of described compensating jet is less than the jet size of described main jet.
Further improvement of the present invention is, along in the second direction of described evaporation source, the both sides of described main jet are respectively equipped with a described compensating jet.
Further improvement of the present invention is, between described compensating jet and the first surface of described evaporation source, sandwiched forms a pitch angle.
The present invention arranges compensating jet by the both sides at main jet, can be by the regional compensation more spherical material tip material amount being sprayed by compensating jet to the less region of the quantity of material being sprayed by main jet, thereby it is uniform making material rete from nozzle ejection, like this, in the time that organic materials adulterates, every kind of material evaporation rete figure on substrate can better match, and has improved doping effect, and then has improved device effect.
Brief description of the drawings
Fig. 1 is the schematic perspective view of existing linear evaporation source apparatus.
Fig. 2 is the side-view of deposition material by the nozzle ejection of existing linear evaporation source apparatus.
Fig. 3 be utilize after existing linear evaporation source apparatus evaporation material on substrate along the thicknesses of layers schematic diagram on evaporation source width.
Fig. 4 is the schematic perspective view of OLED linear evaporation source apparatus of the present invention
Fig. 5 is OLED linear evaporation source apparatus side-view of the present invention.
Fig. 6 be utilize after OLED linear evaporation source apparatus evaporation of the present invention material on substrate along the thicknesses of layers schematic diagram on evaporation source width.
Fig. 7 is the side-view of a kind of embodiment of OLED linear evaporation source apparatus of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
OLED linear evaporation source apparatus of the present invention, comprising:
Evaporation source 10, for accommodating deposition material, described evaporation source 10 has a first surface 101 to substrate 20 just;
A plurality of main jets 30, are arranged on the first surface 101 of described evaporation source 10 along a first direction (being a direction shown in figure);
And described evaporation source 10 is along the mobile evaporation that carries out of the second direction perpendicular to described first direction (being b direction shown in figure);
Along in the second direction of described evaporation source 10, the both sides of described main jet 30 are further respectively equipped with at least one compensating jet 40, and the jet size of described compensating jet 40 is less than the jet size of described main jet 30.In the embodiment shown in Fig. 4, Fig. 5, preferred, the both sides of described main jet 30 are respectively equipped with a compensating jet 40.
Coordinate referring to shown in Fig. 6, in figure, x direction represents the position in evaporation source 10 second directions, y direction represents the thickness of rete, the point representative of white is through the thickness of over-compensation caudacoria layer, the present invention is by arranging compensating jet 40 in the both sides of main jet 30, can be by the regional compensation more spherical material tip material amount being sprayed by compensating jet 40 to the less region of the quantity of material being sprayed by main jet 30, thereby it is uniform making material rete from nozzle ejection, like this, in the time that organic materials adulterates, every kind of material evaporation rete figure on substrate can better match, improve doping effect, and then improve device effect.
Coordinate referring to shown in 7, preferably, described compensating jet 40 can be arranged to sandwiched between the first surface 101 of described evaporation source 10 and form a tiltangleθ, preferably, described tiltangleθ is 60 °, can more accurately and there is directive property the less region of quantity of material is compensated like this, make compensation effect better.
The above is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, not departing from the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (4)
1. an OLED linear evaporation source apparatus, comprising:
Evaporation source, for accommodating deposition material, described evaporation source has a first surface to substrate just;
A plurality of main jets, are arranged at along a first direction on the described first surface of described evaporation source;
And described evaporation source is along moving and carry out evaporation perpendicular to a second direction of described first direction;
It is characterized in that:
Along in the second direction of described evaporation source, the both sides of described main jet are further respectively equipped with at least one compensating jet.
2. OLED linear evaporation source apparatus as claimed in claim 1, is characterized in that the jet size of described compensating jet is less than the jet size of described main jet.
3. OLED linear evaporation source apparatus as claimed in claim 1, is characterized in that, along in the second direction of described evaporation source, the both sides of described main jet are respectively equipped with a described compensating jet.
4. the OLED linear evaporation source apparatus as described in any one in claim 1-3, is characterized in that between described compensating jet and the first surface of described evaporation source, sandwiched forms a pitch angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420316433.3U CN203904446U (en) | 2014-06-13 | 2014-06-13 | OLED (organic light-emitting diode) linear evaporation source device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420316433.3U CN203904446U (en) | 2014-06-13 | 2014-06-13 | OLED (organic light-emitting diode) linear evaporation source device |
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| CN203904446U true CN203904446U (en) | 2014-10-29 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107868939A (en) * | 2016-09-27 | 2018-04-03 | 合肥欣奕华智能机器有限公司 | A kind of evaporation coating method and evaporated device of line style evaporation source |
| CN108823534A (en) * | 2018-06-25 | 2018-11-16 | 京东方科技集团股份有限公司 | Vacuum evaporation crucible and vacuum evaporation equipment |
| CN110791731A (en) * | 2019-11-20 | 2020-02-14 | 信利(仁寿)高端显示科技有限公司 | Evaporation source assembly |
| CN111148860A (en) * | 2017-09-28 | 2020-05-12 | 夏普株式会社 | Vapor deposition particle injection device, vapor deposition device, and vapor deposition film manufacturing method |
| CN114318237A (en) * | 2021-12-29 | 2022-04-12 | 武汉华星光电半导体显示技术有限公司 | Evaporation plating device |
-
2014
- 2014-06-13 CN CN201420316433.3U patent/CN203904446U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107868939A (en) * | 2016-09-27 | 2018-04-03 | 合肥欣奕华智能机器有限公司 | A kind of evaporation coating method and evaporated device of line style evaporation source |
| CN111148860A (en) * | 2017-09-28 | 2020-05-12 | 夏普株式会社 | Vapor deposition particle injection device, vapor deposition device, and vapor deposition film manufacturing method |
| CN108823534A (en) * | 2018-06-25 | 2018-11-16 | 京东方科技集团股份有限公司 | Vacuum evaporation crucible and vacuum evaporation equipment |
| CN108823534B (en) * | 2018-06-25 | 2020-05-12 | 京东方科技集团股份有限公司 | Vacuum evaporation crucible and vacuum evaporation equipment |
| CN110791731A (en) * | 2019-11-20 | 2020-02-14 | 信利(仁寿)高端显示科技有限公司 | Evaporation source assembly |
| CN114318237A (en) * | 2021-12-29 | 2022-04-12 | 武汉华星光电半导体显示技术有限公司 | Evaporation plating device |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201508, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |