CN114318237A - Evaporation plating device - Google Patents
Evaporation plating device Download PDFInfo
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- CN114318237A CN114318237A CN202111641823.9A CN202111641823A CN114318237A CN 114318237 A CN114318237 A CN 114318237A CN 202111641823 A CN202111641823 A CN 202111641823A CN 114318237 A CN114318237 A CN 114318237A
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Abstract
The embodiment of the application discloses evaporation device, the crucible includes the crucible body, main nozzle and vice nozzle, main nozzle intercommunication crucible body can follow first direction output material, vice nozzle intercommunication crucible body can follow second direction output material, second direction and first direction are alternately, main nozzle and vice nozzle all are used for the orientation to treat evaporation plating base plate output material, through setting up along first direction and along a plurality of nozzles of second direction orientation treatment evaporation plating base plate output material, make just to correspond the region of crucible and the non-just region to the crucible on treating the evaporation plating base plate, the formation vapor deposition layer that all can be better, can eliminate just to corresponding the regional rete thickness of crucible and the difference of the regional rete thickness of non-just to corresponding crucible, make vapor deposition layer thickness homogeneous, thereby solve the technical problem that display panel exists the demonstration colour difference.
Description
Technical Field
The application relates to the field of display, concretely relates to coating by vaporization device.
Background
An organic light emitting display panel (OLED) has been widely used in life, an evaporation process is required in a production process of an organic light emitting display panel, for example, various light emitting materials in a red light emitting device, a green light emitting device, and a blue light emitting device need to be formed through the evaporation process, and the evaporation process needs an evaporation apparatus, as shown in fig. 1 and 2, fig. 1 is a schematic diagram of an evaporation apparatus in the prior art, and fig. 2 is a schematic diagram of an effect of an evaporation film layer of an evaporation apparatus in the prior art, as shown in fig. 1, the evaporation apparatus 1000 includes a housing 1001 and a housing cavity 1002 located in the housing 1001, the evaporation apparatus 1000 further includes a substrate setting table 10 and a crucible set 40 arranged in the housing cavity 1002, the crucible set 40 includes a plurality of crucibles 41, the substrate 100 to be evaporated is arranged on the substrate setting table, when the evaporation process is performed, the substrate 100 to be evaporated moves in a direction perpendicular to the plurality of crucibles 41, the plurality of crucibles 41 constitute a line source (linear evaporation source), the nozzles 408 of the crucibles 41 output the material to form the evaporation coating layer 111 on the surface of the substrate 100 to be evaporated, and the evaporation coating layer 111 includes a first region 101 corresponding to the crucible 41 and a second region 102 between the adjacent first regions 101.
However, the vapor deposition film 111 formed by the vapor deposition device of the prior art has the problem that the thickness of the film in the first region 101 corresponding to the crucible 41 is not uniform with the thickness of the film in the second region 102 between the adjacent first regions 101, and the difference between the thicknesses of the vapor deposition film in the two regions is too large, so that the display panel has display color difference (mura).
Disclosure of Invention
The embodiment of the application provides an evaporation device, can solve the technical problems that the difference between the thickness of a film layer which just corresponds to a crucible area and the thickness of a film layer which does not just correspond to the crucible area is too large, the thickness of the evaporation film layer is not uniform and the display panel has display color difference in the evaporation film layer formed by the evaporation device in the prior art.
The embodiment of the application provides a coating by vaporization device, include the shell, be located holding the chamber in the shell, and set up in hold the intracavity:
a crucible set comprising a plurality of crucibles;
the crucible comprises a crucible body, a main nozzle and an auxiliary nozzle, wherein the main nozzle is communicated with the crucible body and can output materials along a first direction, the auxiliary nozzle is communicated with the crucible body and can output the materials along a second direction, the second direction is crossed with the first direction, and the main nozzle and the auxiliary nozzle are both used for outputting the materials towards a substrate to be evaporated.
Optionally, in some embodiments of the present application, the main nozzle includes a main nozzle and a main discharge port, the secondary nozzle includes a secondary nozzle and a secondary discharge port, the secondary nozzle is connected to the main nozzle, and the secondary nozzle communicates with the crucible body through the main nozzle.
Optionally, in some embodiments of the present application, at least one of the secondary nozzles is disposed on a first side of the primary nozzle, and at least one of the secondary nozzles is disposed on a second side of the primary nozzle, the first side being opposite the second side.
Optionally, in some embodiments of the present application, the number of secondary nozzles on the first side of the primary nozzle is the same as the number of secondary nozzles on the second side of the primary nozzle.
Optionally, in some embodiments of the present application, the secondary nozzles of the first side of the primary nozzle are symmetrically disposed with respect to the secondary nozzles of the second side of the primary nozzle.
Optionally, in some embodiments of the present application, a plurality of the crucibles are arranged in parallel along a third direction, and the auxiliary nozzle, the main nozzle, and the auxiliary nozzle of the first side and the second side of each crucible are arranged along the third direction.
Optionally, in some embodiments of the present application, the third direction is perpendicular to a moving direction of the substrate to be evaporated.
Optionally, in some embodiments of the present application, a plurality of the secondary nozzles are disposed on a first side of the primary nozzle, and the plurality of secondary nozzles on the first side are sequentially disposed on the primary nozzle of the primary nozzle along a first direction;
the plurality of auxiliary nozzles are arranged on a second side of the main nozzle, and the plurality of auxiliary nozzles on the second side are sequentially arranged on the main nozzle of the main nozzle along the first direction.
Optionally, in some embodiments of the present application, the main discharge port of the main nozzle and the auxiliary discharge port of the auxiliary nozzle are located on the same plane.
Optionally, in some embodiments of the present application, the secondary nozzle has a secondary nozzle pipe having a straight line shape or a curved line shape.
In the embodiment of the application, the embodiment of the application provides an evaporation device, in the evaporation device, a crucible comprises a crucible body, a main nozzle and an auxiliary nozzle, the main nozzle is communicated with the crucible body and can output materials along a first direction, the auxiliary nozzle is communicated with the crucible body and can output materials along a second direction, the second direction is crossed with the first direction, the main nozzle and the auxiliary nozzle are both used for outputting materials towards a substrate to be evaporated, by arranging a plurality of nozzles which output the material towards the substrate to be evaporated along the first direction and along the second direction, so that the area of the substrate to be evaporated, which is opposite to the corresponding crucible, and the area of the substrate not opposite to the crucible can well form an evaporation coating film layer, can eliminate the difference between the thickness of the film layer of the crucible area which is just opposite to the crucible area and the thickness of the film layer of the crucible area which is not just opposite to the crucible area, the thickness of the vapor deposition film layer is uniform, and the technical problem of display chromatic aberration of the display panel is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a prior art evaporation apparatus;
FIG. 2 is a schematic diagram illustrating an effect of a vapor deposition film layer of a vapor deposition apparatus in the prior art;
fig. 3 is a schematic view of a first structure of an evaporation apparatus according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a second evaporation apparatus according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a vapor deposition apparatus according to an embodiment of the present disclosure;
fig. 6 is a schematic vapor deposition diagram of a vapor deposition device having a first structure according to an embodiment of the present application;
fig. 7 is a view illustrating a vapor deposition layer on a substrate to be vapor deposited after vapor deposition by using a vapor deposition apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a coating by vaporization device, coating by vaporization device include the shell, be located the chamber that holds of shell to and set up in holding the intracavity: a crucible set including a plurality of crucibles; wherein, the crucible includes crucible body, main nozzle and vice nozzle, and the main nozzle intercommunication crucible body can follow first direction output material, and vice nozzle intercommunication crucible body can follow the second direction output material, and second direction and first direction are alternately, and main nozzle and vice nozzle all are used for the orientation to treat the evaporation plating base plate output material.
The embodiment of the application provides an evaporation device. The following will describe in detail a plurality of examples. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
The first embodiment,
Referring to fig. 3, fig. 4, fig. 5, and fig. 6, fig. 3 is a schematic view illustrating a first structure of an evaporation apparatus 1000 according to an embodiment of the present disclosure; fig. 4 is a second structural schematic diagram of an evaporation apparatus 1000 according to an embodiment of the present disclosure; fig. 5 is a schematic structural diagram of a vapor deposition apparatus 1000 according to an embodiment of the present disclosure; fig. 6 is a schematic view of a vapor deposition apparatus 1000 having a first structure according to an embodiment of the present application, and fig. 7 is an illustration of a vapor deposition layer on a substrate to be vapor deposited after vapor deposition by using the vapor deposition apparatus 1000 according to the embodiment of the present application.
The embodiment of the application provides an evaporation device 1000, which comprises a housing 1001, a containing cavity 1002 positioned in the housing 1001, and a crucible set 40 arranged in the containing cavity 1002, wherein the crucible set 40 comprises a plurality of crucibles 41; the crucible 41 comprises a crucible body 411, a main nozzle 412 and an auxiliary nozzle 413, the main nozzle 412 is communicated with the crucible body 411 and can output materials along a first direction E, the auxiliary nozzle 413 is communicated with the crucible body 41 and can output materials along a second direction F, the second direction F is intersected with the first direction E, and the main nozzle 412 and the auxiliary nozzle 413 are both used for outputting materials towards the substrate 100 to be evaporated.
Specifically, the evaporation device 1000 includes a crucible set 40, the crucible set 40 includes a plurality of crucibles 41, it can be understood that the crucibles 41 are point sources (point evaporation sources), the plurality of crucibles 41 form one crucible set 40, and the crucible set 40 is a line source (line evaporation source), which is not described herein again.
Specifically, each crucible 41 includes a crucible body 411, a main nozzle 412 and an auxiliary nozzle 413, and it is understood that the number of the main nozzles 412 is one, and the number of the auxiliary nozzles may be one or more, which will be described in detail in the following embodiments.
Specifically, the main nozzle 412 is communicated with the crucible body 411 and can output the material along the first direction E, and the main nozzle 412 is used for outputting the evaporation source material in the crucible body 411 to the substrate 100 to be evaporated along the first direction E.
Specifically, the sub-nozzle 413 is communicated with the crucible body 41 and can output the material along the second direction F, and the sub-nozzle 413 is used for outputting the evaporation source material in the crucible body 411 along the second direction F to the substrate 100 to be evaporated.
Specifically, the second direction F intersects the first direction E, the main nozzle 412 and the sub-nozzle 413 are both used for outputting the material toward the substrate 100 to be evaporated, and the main nozzle 412 and the sub-nozzle 413 are both used for outputting the material toward one side of the substrate 100 to be evaporated.
Specifically, the first direction E may be a main direction, and the second direction F may be an auxiliary direction.
Specifically, the first direction E may mainly form a vapor deposition film layer on the substrate 100 to be vapor deposited, which is opposite to the first region 101 of the crucible 41.
Specifically, the second direction F may mainly form the vapor deposited film layer on the substrate to be vapor deposited 100 not directly facing the second region 102 of the corresponding crucible 41, i.e., compensate the thickness of the vapor deposited film layer 111 directly facing the second region 102 between the first regions 101 of the crucibles 41.
In this embodiment, in the evaporation apparatus, the crucible 41 includes a crucible body 411, a main nozzle 412 and an auxiliary nozzle 413, the main nozzle 412 can output the material along a first direction E, the auxiliary nozzle 413 can output the material along a second direction F, the second direction F intersects with the first direction E, both the main nozzle 412 and the auxiliary nozzle 413 are used for outputting the material towards the substrate 100 to be evaporated, by providing a plurality of nozzles that output the material along the first direction E and along the second direction F towards the substrate 100 to be evaporated, the region of the substrate 100 to be evaporated that is directly opposite to the crucible 41 and the region that is not directly opposite to the crucible 41 can both well form the evaporation film layer 111, the difference between the film thickness of the region to be directly opposite to the crucible and the film thickness of the region that is not directly opposite to the crucible can be eliminated, the thickness of the evaporation film layer 111 is uniform, and the technical problem that the display panel has color difference can be solved.
Example II,
The present embodiment is the same as or similar to the above-described embodiments, but differs therefrom in further explaining the structure of the vapor deposition device 1000, that is, explaining the structure of the vapor deposition device in fig. 3 and 4 in detail.
In some embodiments, the main nozzle 412 includes a main nozzle 4121 and a main discharge hole 4122, the secondary nozzle 413 includes a secondary nozzle 4131 and a secondary discharge hole 4132, the secondary nozzle 4131 is connected to the main nozzle 4121, and the secondary nozzle 413 communicates with the crucible body 411 through the main nozzle 412.
Specifically, as shown in fig. 3 and 4, the auxiliary nozzle 4131 is connected or communicated with the main nozzle 4121, and the auxiliary nozzle 4131 is communicated to the crucible body 411 through the main nozzle 4121.
Specifically, in the evaporation process, the evaporation material in the crucible body 411 is simultaneously output from the main discharge port 4122 and the sub-discharge port 4132 through the main nozzle 4121.
In some embodiments, at least one secondary nozzle 413 is disposed on a first side 412A of primary nozzle 412, and at least one secondary nozzle 413 is disposed on a second side 412B of primary nozzle 412, the first side 412A being opposite the second side 412B.
Specifically, the first side 412A and the second side 412B are located on opposite sides of the main nozzle 412.
In some embodiments, the number of secondary nozzles 413 on a first side 412A of primary nozzle 412 is the same as the number of secondary nozzles 413 on a second side 412B of primary nozzle 412.
Specifically, the number of the sub-nozzles 413 of the first side 412A is the same as the number of the sub-nozzles 413 of the second side 412B, so that the vapor deposited film layers on both sides of the crucible 41, that is, the vapor deposited film layer of the second region 102, can be uniformly compensated.
In some embodiments, the secondary nozzles 413 of the first side 412A of the primary nozzle 412 are symmetrically disposed with respect to the secondary nozzles 413 of the second side 412B of the primary nozzle 412.
Specifically, the sub-nozzles 413 of the first side 412A are symmetrically arranged with respect to the sub-nozzles 413 of the second side 412B, so that the evaporated film layers on both sides of the crucible 41, i.e., the evaporated film layer of the second region 102, can be more uniformly compensated.
In some embodiments, the plurality of crucibles 41 are arranged side by side along the third direction x, and the sub-nozzles 413 of the first side 412A, the main nozzles 412, and the sub-nozzles 413 of the second side 412B of each crucible 41 are arranged along the third direction x.
Specifically, the plurality of crucibles 41 are arranged in parallel along the third direction x to form a line source, and at this time, the auxiliary nozzle 413 of the first side 412A, the main nozzle 412, and the auxiliary nozzle 413 of the second side 412B of each crucible 41 are all arranged along the third direction x, so that vapor-deposited films with uniform thickness can be formed at each part of the line source extending in the third direction x.
In some embodiments, the third direction x is perpendicular to the moving direction z of the substrate to be evaporated 100.
Specifically, in the evaporation process, the substrate 100 to be evaporated moves, and the moving direction z of the substrate 100 to be evaporated is perpendicular to the third direction x, i.e., the moving direction z of the substrate 100 to be evaporated is perpendicular to the extending direction of the line source, so that an evaporation film layer with uniform thickness can be formed well.
In some embodiments, a plurality of secondary nozzles 413 are disposed on a first side 412A of the primary nozzle 412, the plurality of secondary nozzles 413 of the first side 412A being sequentially disposed on the primary nozzles 4121 of the primary nozzle 412 along the first direction E; the plurality of sub-nozzles 413 are disposed on the second side 412B of the main nozzle 412, and the plurality of sub-nozzles 413 on the second side 412B are sequentially disposed on the main nozzle 4121 of the main nozzle 412 in the first direction y.
Specifically, as shown in fig. 4, for example, the plurality of sub-nozzles 413 of the first side 412A include a first sub-nozzle 413A and a second sub-nozzle 413B, the first sub-nozzle 413A, the second sub-nozzle 413B and the main nozzle 412 are in the same plane, and the first sub-nozzle 413A and the second sub-nozzle 413B are sequentially arranged and disposed on the main pipe 4121 of the main nozzle 412 along the first direction E. Similarly, the plurality of sub-nozzles 413 on the second side 412B are arranged in the same manner as the plurality of sub-nozzles 413 on the first side 412A, and are not described herein again.
In some embodiments, primary exit 4122 of primary nozzle 412 is coplanar with secondary exit 4132 of secondary nozzle 413.
Specifically, the main discharge hole 4122 of the main nozzle 412 and the sub-discharge hole 4132 of the sub-nozzle 413 are located on the same plane, or the distance from the main discharge hole 4122 of the main nozzle 412 to the substrate 100 to be vapor-deposited is the same as the distance from the sub-discharge hole 4132 of the sub-nozzle 413 to the substrate 100 to be vapor-deposited, so that the distances from the main discharge hole 4122 and the sub-discharge hole 4132 to the substrate to be vapor-deposited are the same, and a vapor-deposited film layer with a more uniform thickness can be formed.
In some embodiments, the secondary nozzle is linear or curvilinear.
Specifically, the shape of the sub nozzle 4131 of the sub nozzle 413 is not limited herein, and the shape of the sub nozzle 4131 may be linear or curved, and is not limited herein.
Specifically, referring to fig. 6 and 7, fig. 6 is a schematic diagram of an evaporation apparatus 1000 having a first structure according to an embodiment of the present application, and fig. 7 is an illustration of an evaporation film layer on a substrate to be evaporated after evaporation by using the evaporation apparatus 1000 according to the embodiment of the present application.
Specifically, in fig. 6 and 7, the main nozzle 412 outputs a material along a first direction E, the auxiliary nozzle 413 outputs a material along a second direction F, the second direction F intersects with the first direction E, and both the main nozzle 412 and the auxiliary nozzle 413 are used for outputting a material towards the substrate 100 to be evaporated, and by providing a plurality of nozzles for outputting a material towards the substrate 100 to be evaporated along the first direction E and the second direction F, the area of the substrate 100 to be evaporated, which is directly opposite to the corresponding crucible 41, and the area of the substrate to be evaporated, which is not directly opposite to the crucible 41, can both well form the evaporation film layer 111, and the difference between the film thickness of the area of the corresponding crucible and the film thickness of the area of the non-corresponding crucible can be eliminated, so that the thickness of the evaporation film layer 111 is uniform, and the technical problem that the display panel has display color difference is solved.
Example III,
The present embodiment is the same as or similar to the above-mentioned embodiments, but the difference is that the structure of the vapor deposition device 1000, that is, the structure of the vapor deposition device in fig. 5, is further described in detail.
Different from the second embodiment, the secondary nozzle 413 may also be directly connected to the crucible body 411 without first connecting to the primary nozzle 4121 of the primary nozzle 412 and then connecting to the crucible body 411, which is the same or similar to the second embodiment in other respects and will not be described again here.
It should be noted that, in the second embodiment, the main nozzle 4121 of the main nozzle 412 needs to be extended and lengthened to facilitate the arrangement of the secondary nozzle 413.
It should be noted that, in the above embodiment, the auxiliary nozzle 413 is added to reduce the concentration of the material output by the main nozzle 412, and the auxiliary nozzle 413 is provided to increase the coverage of the material output by the crucible 41 to increase the material concentration at the edge of the radiation range of the main nozzle 412, so that the thickness of the vapor deposition film layer on the substrate 100 to be vapor deposited can be made uniform, and the color difference on the display panel can be eliminated.
The evaporation device provided by the embodiment of the present application is described in detail above, and the principle and the embodiment of the present application are explained by applying specific examples herein, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The evaporation device is characterized by comprising a shell, a containing cavity positioned in the shell, and a vapor deposition device arranged in the containing cavity, wherein the vapor deposition device comprises:
a crucible set comprising a plurality of crucibles;
the crucible comprises a crucible body, a main nozzle and an auxiliary nozzle, wherein the main nozzle is communicated with the crucible body and can output materials along a first direction, the auxiliary nozzle is communicated with the crucible body and can output the materials along a second direction, the second direction is crossed with the first direction, and the main nozzle and the auxiliary nozzle are both used for outputting the materials towards a substrate to be evaporated.
2. The evaporation apparatus according to claim 1, wherein the main nozzle comprises a main nozzle and a main discharge port, and the secondary nozzle comprises a secondary nozzle and a secondary discharge port, the secondary nozzle is connected to the main nozzle, and the secondary nozzle communicates with the crucible body through the main nozzle.
3. The vapor deposition apparatus according to claim 2, wherein at least one of the sub-nozzles is provided on a first side of the main nozzle, and at least one of the sub-nozzles is provided on a second side of the main nozzle, the first side being opposite to the second side.
4. The vapor deposition apparatus according to claim 3, wherein the number of the sub-nozzles on the first side of the main nozzle is the same as the number of the sub-nozzles on the second side of the main nozzle.
5. The vapor deposition device according to claim 4, wherein the sub-nozzle on the first side of the main nozzle is provided symmetrically to the sub-nozzle on the second side of the main nozzle.
6. The evaporation apparatus according to any one of claims 3 to 5, wherein a plurality of the crucibles are arranged in parallel in a third direction, and the sub-nozzle on the first side, the main nozzle, and the sub-nozzle on the second side of each crucible are arranged in the third direction.
7. The evaporation device according to claim 6, wherein the third direction is perpendicular to a moving direction of the substrate to be evaporated.
8. The vapor deposition apparatus according to claim 6, wherein a plurality of the sub-nozzles are provided on a first side of the main nozzle, and the plurality of sub-nozzles on the first side are sequentially provided on a main nozzle of the main nozzle in a first direction;
the plurality of auxiliary nozzles are arranged on a second side of the main nozzle, and the plurality of auxiliary nozzles on the second side are sequentially arranged on the main nozzle of the main nozzle along the first direction.
9. The vapor deposition device according to claim 2, wherein the main discharge port of the main nozzle and the sub-discharge port of the sub-nozzle are located on the same plane.
10. The vapor deposition apparatus according to claim 1, wherein the sub-nozzle has a straight or curved sub-nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111641823.9A CN114318237A (en) | 2021-12-29 | 2021-12-29 | Evaporation plating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111641823.9A CN114318237A (en) | 2021-12-29 | 2021-12-29 | Evaporation plating device |
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| CN114318237A true CN114318237A (en) | 2022-04-12 |
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| CN202111641823.9A Pending CN114318237A (en) | 2021-12-29 | 2021-12-29 | Evaporation plating device |
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