CN107868939A - A kind of evaporation coating method and evaporated device of line style evaporation source - Google Patents
A kind of evaporation coating method and evaporated device of line style evaporation source Download PDFInfo
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- CN107868939A CN107868939A CN201610854758.0A CN201610854758A CN107868939A CN 107868939 A CN107868939 A CN 107868939A CN 201610854758 A CN201610854758 A CN 201610854758A CN 107868939 A CN107868939 A CN 107868939A
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- evaporation
- line style
- evaporation source
- framework
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Abstract
The invention discloses a kind of evaporation coating method and evaporated device of line style evaporation source, include the evaporation part of at least one line style evaporation source by controlling along the scanning direction parallel to each framework short side, while control at least one line style evaporation source to be evaporated internal deposition material；Substrate to be deposited is fixed on framework, and the length of line style evaporation source is more than or equal to the length of substrate long side to be deposited.A kind of evaporation coating method of line style evaporation source provided in an embodiment of the present invention, by controlling evaporation part along the scanning direction parallel to each framework short side, shorten the scanning pattern of evaporation part, the sweep time of evaporation part can thus be reduced, reduce the mechanicalness loss of evaporated device, and improve the service efficiency of deposition material.
Description
Technical field
The present invention relates to the manufacturing technology field of display device, the evaporation coating method and evaporation of espespecially a kind of line style evaporation source are set
It is standby.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) is to utilize to form having for p-n junction
Machine film layer, the device to be lighted after being combined from the electronics (Electron) in the hole (Hole) of injection anode and negative electrode, has and rings
Answer speed fast, in light weight, pliability is good, and visual angle is wide, is the Display Technique of new generation of great development prospect the advantages that low-power consumption.
When making OLED, transparent ITO (the Indium Tin Oxide) electricity of anode effect has been sequentially formed on the glass substrate
Pole layer, the different multiple organic matter layers of conveying capacity, and play the metal electrode layer of cathodic process.Wherein, organic matter layer includes：
Hole injection layer (HIL), hole transporting layer (HTL), luminescent layer (EML) hole blocking layer (HBL), electron supplying layer (ETL), electricity
Sub- implanted layer (EIL) etc..When manufacturing OLED, organic material price occupies the considerable part of manufacturing cost, therefore, is
Reduction manufacturing cost, it is essential to improve organic matter utilization rate and reduce organic matter usage amount.
Existing OLED evaporated devices are after loading two glass substrates in a process cavity, to be existed using an evaporation source
The mode of evaporation process is carried out on two glass substrates on demand.But be generally scanned with the short direction of glass, i.e., line style is steamed
The scanning direction risen perpendicular to glass short side, the traveling time of this scan mode not only evaporation source it is long but also mobile away from
From length, cause deposition material utilization rate low, and cause the mechanicalness problem of aging of deposition system.
The content of the invention
The embodiments of the invention provide a kind of evaporation coating method and evaporated device of line style evaporation source, to solve prior art
Present in grown due to evaporation source scanning distance, caused by deposition material utilization rate is low and the mechanicalness aging of deposition system
Problem.
The embodiments of the invention provide a kind of evaporation coating method of line style evaporation source, including：
Control includes the evaporation part of at least one line style evaporation source along the scanning direction parallel to each framework short side, simultaneously
At least one line style evaporation source is controlled to be evaporated internal deposition material；
The substrate to be deposited is fixed on the framework, and the length of the line style evaporation source is more than or equal to described treat
The length of substrate long side is deposited.
In a kind of possible implementation, in a kind of evaporation coating method of line style evaporation source provided in an embodiment of the present invention
In, control the evaporation part to be specifically included along the scanning direction parallel to each framework short side：
The evaporation part is controlled to be carried out along the direction parallel to each framework short side to substrate to be deposited each described past
Return scanning.
In a kind of possible implementation, in a kind of evaporation coating method of line style evaporation source provided in an embodiment of the present invention
In, after the evaporation part simple scanning, and before opposite direction scanning is carried out, in addition to：
Detect the evaporation rate of the line style evaporation source；
The evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style is steamed
Rise and keep uniform evaporation rate.
In a kind of possible implementation, in a kind of evaporation coating method of line style evaporation source provided in an embodiment of the present invention
In, the evaporation part is being controlled along before the scanning direction parallel to each framework short side, in addition to：
Detect the evaporation rate of the line style evaporation source；
The evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style is steamed
Rise and keep uniform evaporation rate.
The embodiment of the present invention additionally provides a kind of evaporated device of line style evaporation source, including：Vaporization chamber, it is arranged on the steaming
The multiple frameworks and the evaporation part that are used to fix substrate to be deposited of hair chamber interior；Wherein,
Each framework is arranged side by side on the direction parallel with the framework short side；
The evaporation part includes at least one line style evaporation source, and the length of the line style evaporation source is more than or equal to described treat
The length of substrate long side is deposited, and each line style evaporation source is set side by side on the bearing of trend perpendicular to the line style evaporation source
Put；
The scanning direction of the evaporation part evaporation is only along the parallel direction of the framework short side.
In a kind of possible implementation, in a kind of evaporated device of line style evaporation source provided in an embodiment of the present invention
In, in addition to：For at least one QCM for the evaporation rate for detecting the line style evaporation source.
In a kind of possible implementation, in a kind of evaporated device of line style evaporation source provided in an embodiment of the present invention
In, the QCM is fixed at least one short side of the line style evaporation source, or, the micro- day of the quartz crystal
It is flat to be fixed on opening position corresponding with least one short side of the line style evaporation source between the two neighboring framework.
In a kind of possible implementation, in a kind of evaporated device of line style evaporation source provided in an embodiment of the present invention
In, the QCM is line style QCM；
The line style QCM is fixed at least one long edge position of the line style evaporation source, or, each described
The inwall that line style QCM is fixed on the vaporization chamber is corresponding with least one long side of the line style evaporation source
Opening position.
In a kind of possible implementation, in a kind of evaporated device of line style evaporation source provided in an embodiment of the present invention
In, in addition to：For the regulating member in the evaporation region for controlling the evaporation part；
The regulating member includes：The first adjustable plate being fixed at two short sides of the line style evaporation source, and/or,
The second adjustable plate being fixed at two long side outer ledges of the evaporation part；
The regulating member also includes：For controlling the angle of inclination of first adjustable plate and second adjustable plate
Control unit；The angle of inclination is first adjustable plate or second adjustable plate and the angle on the evaporation part surface.
In a kind of possible implementation, in a kind of evaporated device of line style evaporation source provided in an embodiment of the present invention
In, in addition to：The distance controlling portion being fixedly connected with the evaporation part；
The distance controlling portion, for the distance between plane where controlling the evaporation part and the framework.
The present invention has the beneficial effect that：
The evaporation coating method and evaporated device of a kind of line style evaporation source provided in an embodiment of the present invention, included at least by control
The evaporation part of one line style evaporation source controls at least one line style to evaporate along the scanning direction parallel to each framework short side
Source is evaporated to internal deposition material；Substrate to be deposited is fixed on framework, and the length of line style evaporation source is more than or equal to
The length of substrate long side to be deposited.A kind of evaporation coating method of line style evaporation source provided in an embodiment of the present invention, evaporated by controlling
Shorten the scanning pattern of evaporation part, thus sweeping for evaporation part can be reduced along the scanning direction parallel to each framework short side in portion
The time is retouched, reduces the mechanicalness loss of evaporated device, and improves the service efficiency of deposition material.
Brief description of the drawings
Fig. 1 is a kind of flow chart of the evaporation coating method of line style evaporation source provided in an embodiment of the present invention；
Fig. 2 a are one of scanning pattern of evaporation coating method of the prior art；
Fig. 2 b are the two of the scanning pattern of evaporation coating method of the prior art；
Fig. 2 c are the scanning pattern of evaporation coating method provided in an embodiment of the present invention；
Fig. 3 is a kind of upward view of the evaporated device of line style evaporation source provided in an embodiment of the present invention；
Fig. 4 a are the top view of the evaporation part in the embodiment of the present invention；
Fig. 4 b are the side view of the evaporation part in the embodiment of the present invention；
Fig. 5 is a kind of side view of the evaporated device of line style evaporation source provided in an embodiment of the present invention.
Embodiment
For present in prior art due to evaporation source scanning distance grow, caused by deposition material utilization rate it is low and steam
The mechanicalness aging of plating system the problem of, the embodiments of the invention provide a kind of evaporation coating method of line style evaporation source and evaporation to set
It is standby.
Below in conjunction with the accompanying drawings, the evaporation coating method to a kind of line style evaporation source provided in an embodiment of the present invention and evaporated device
Embodiment is described in detail.The size and shape of each part does not reflect actual proportions in accompanying drawing, and purpose is simply shown
Meaning explanation present invention.
The embodiments of the invention provide a kind of evaporation coating method of line style evaporation source, as shown in figure 1, including：
Swept along the direction parallel to each framework short side the evaporation part that S101, control include at least one line style evaporation source
Retouch, while control at least one line style evaporation source to be evaporated internal deposition material；
Substrate to be deposited is fixed on framework, and the length of line style evaporation source is more than or equal to the length of substrate long side to be deposited
Degree.
The evaporation coating method of a kind of line style evaporation source provided in an embodiment of the present invention, by controlling evaporation part along parallel to each
The scanning direction of framework short side, shortens the scanning pattern of evaporation part, thus can reduce the sweep time of evaporation part, reduces and steams
The mechanicalness loss of coating apparatus, and improve the service efficiency of deposition material.In addition, the length of line style evaporation source is arranged to big
In or equal to substrate long side to be deposited length, ensure that evaporation part can cover whole substrate to be deposited in scanning.
In the specific implementation, above-mentioned evaporation part includes at least one line style evaporation source (being preferably 1-3), when evaporation part is wrapped
When including multiple line style evaporation sources, each line style evaporation source is arranged side by side on the bearing of trend perpendicular to line style evaporation source, and
When being scanned, multiple line style evaporation sources form an evaporation part and moved together.
Above-mentioned evaporation part is along the scanning direction parallel to each framework short side, including a variety of scanning situations, with scanning two
Exemplified by substrate to be deposited, for example, substrate two to be deposited can be scanned, reverse scan is to be deposited according to substrate one to be deposited is scanned
Substrate two, reverse scan substrate one to be deposited；Or can be according to scanning substrate one to be deposited, reverse scan substrate to be deposited
One, scan substrate two to be deposited, reverse scan substrate two to be deposited.Also, can be with to the scanning times of a substrate to be deposited
It is adjusted according to being actually needed, the particular order to scanning and the scanning times to substrate to be deposited do not limit herein
It is fixed.
At least one line style evaporation source is controlled to be evaporated internal deposition material while evaporation part is scanned, so that
Deposition material falls on film forming on substrate to be deposited, by controlling speed that evaporation part scans and the evaporation capacity of line style evaporation source can
To control the film forming thickness of substrate to be deposited.
Specifically, in the evaporation coating method of above-mentioned line style evaporation source provided in an embodiment of the present invention, controlled in above-mentioned steps S101
Evaporation part processed specifically includes along the scanning direction parallel to each framework short side：
Control evaporation part carries out coming and going scanning along the direction parallel to each framework short side to each substrate to be deposited.
By carrying out coming and going scanning to each substrate to be deposited, when evaporation part is completed to a substrate evaporation to be deposited
Afterwards, when being scanned in evaporation part to other substrates to be deposited, the substrate to be deposited that evaporation is completed is taken out, so that evaporation part energy
It is enough to be persistently scanned along certain scanning pattern, improve the use effect of deposition material of the evaporation part in scanning process
Rate.
In the specific implementation, it is single in evaporation part in the evaporation coating method of above-mentioned line style evaporation source provided in an embodiment of the present invention
It is also shown in FIG. 1 to after scanning, and before opposite direction scanning is carried out, it can also include：
S102, the evaporation rate for detecting line style evaporation source；
The evaporation rate that S103, basis detect is adjusted to the evaporation rate of each line style evaporation source, so that each line style is evaporated
Source keeps uniform evaporation rate.
After the simple scanning of evaporation part, and before reverse scan, due to changing the scanning direction of evaporation part, line style
The state of evaporation source can change therewith, so needing that the evaporation rate of line style evaporation source is detected and adjusted, so that line style is steamed
Uniform evaporation rate can be kept by rising.Carried out it is thus possible to make evaporation part after scanning direction is changed with uniform evaporation rate
Scanning, ensure the stability of evaporation part evaporation rate during evaporation.
In the specific implementation, in the evaporation coating method of above-mentioned line style evaporation source provided in an embodiment of the present invention, evaporated in control
Portion can also include along before the scanning direction parallel to each framework short side：
Detect the evaporation rate of line style evaporation source；
The evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style evaporation source is kept
Uniform evaporation rate.
By before evaporation part is scanned, detecting the evaporation rate of line style evaporation source, and according to the evaporation rate detected
The evaporation rate of each line style evaporation source is adjusted, so that each line style evaporation source keeps uniform evaporation rate.It is thus possible to make steaming
Hair portion is scanned with uniform evaporation rate, ensures the stability of evaporation part evaporation rate during evaporation.
Reference picture 2a- Fig. 2 c, are compared below by way of with evaporation coating method of the prior art, to further illustrate this hair
The evaporation coating method for the line style evaporation source that bright embodiment provides, and using in vaporization chamber 101 comprising two framework 102A and 102B as
Example illustrates, and two frameworks are arranged side by side in vaporization chamber 101 along parallel to framework short side direction.
Fig. 2 a and Fig. 2 b are the scan mode of deposition system in the prior art, the scanning direction of evaporation part be along parallel to
The direction of each framework long side, the scanning pattern figure for the substrate to be deposited that Fig. 2 a enter for maintenance certain angle, two bases to be deposited
Plate is separately fixed on framework 102A and framework 102B, and at an angle, evaporation part exists framework 102A and framework 102B long side
Corresponding position of the initial position between two frameworks before being deposited, to be deposited on framework 102A to being fixed on
When substrate is scanned, evaporation part is moved to the opening position of substrate short side to be deposited from initial position first, i.e. road in Fig. 2 a
Footpath (1), because framework 102A has certain angle, so evaporation part needs to turn an angle just be moved to substrate to be deposited
Opening position where short side, i.e. path (1) are curve；Along path (2) after the short side opening position of evaporation part arrival substrate to be deposited
Simple scanning is carried out to substrate to be deposited, after simple scanning, reverse scan is carried out to substrate to be deposited along path (3), reversely swept
Initial position is returned to along path (4) after the completion of retouching, then the substrate to be deposited on framework 102B is scanned, scanning pattern edge
(5)-(8), the scanning process is similar with the scanning process of the substrate to be deposited on framework 102A, and here is omitted.
Scanning pattern in Fig. 2 b is similar with Fig. 2 a scanning pattern, and difference is, the length of two frameworks in Fig. 2 b
Side is parallel, so evaporation part is in scanning process, it is not necessary to carries out curve movement, i.e. path (1) (4) (5) (8) in Fig. 2 b is
Rectilinear movement.Evaporation part in Fig. 2 a and Fig. 2 b is along the scanning direction parallel to each framework long side, this scan mode
Scanning pattern is grown, and sweep time is grown, and easily causes deposition system mechanicalness aging.
Fig. 2 c are the scanning pattern figure of the evaporation coating method of above-mentioned line style evaporation source provided in an embodiment of the present invention, evaporation part
Scanning direction is changed to along the direction parallel to each framework short side, and initial position of the evaporation part before being deposited can be
Corresponding position between two frameworks, when the substrate to be deposited to being fixed on framework 102A is scanned, evaporation part is
Through opening position corresponding to the long side positioned at substrate to be deposited, it is firstly moved to so eliminating evaporation part at substrate edges to be deposited
Path, thus evaporation part can directly from initial position along path (1) to substrate to be deposited carry out simple scanning, simple scanning
Afterwards, along path (2) to substrate to be deposited carry out reverse scan, after the completion of reverse scan i.e. returned to initial position, eliminate from
The position that scanning is completed returns to the path of initial position, directly the substrate to be deposited on framework 102B can be scanned, swept
It is (3) and (4) to retouch path, and the scanning process is similar with the scanning process of the substrate to be deposited on framework 102A, no longer superfluous herein
State.
By Fig. 2 c compared with Fig. 2 a or Fig. 2 b, it can be clearly seen that, line style evaporation source provided in an embodiment of the present invention
Evaporation coating method, the scanning pattern of evaporation part can be greatlyd save, so as to shorten the sweep time of evaporation part, can also be fitted
When the speed for reducing scanning, to improve the quality of film forming on substrate to be deposited.In the specific implementation, can also be scanned in evaporation part
Before, before and to reverse scan after substrate simple scanning to be deposited, to the evaporation rate of the line style evaporation source in evaporation part
Detected, and the evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style evaporation source
Keep uniform evaporation rate.
Table 1 is the sweep time detail list of the scan mode in Fig. 2 a and Fig. 2 b, and table 2 is sweeping for the scan mode in Fig. 2 c
Retouch time detail list.As shown in table 1, needed along the evaporation coating method of the scanning direction parallel to each framework long side, simple scanning
Scanning distance be about 2400mm (size of substrate to be deposited is about 1500mm × 925mm), sweep speed is about 135mm/sec
It could meet that evaporation requires, and total scanning pattern is long, and the time for scanning a cycle is also long.As shown in table 2,
Along the evaporation coating method of the scanning direction parallel to each framework short side, the scanning distance of simple scanning is about 1900mm, scanning speed
Degree about 80mm/sec cans, which reach to be deposited with Fig. 2 a and Fig. 2 b evaporation coating method identical, to be required, and total scanning pattern
It is shorter, the time also relative reduction of a cycle is scanned, and can also increase before reverse scan after simple scanning
The step of to detection evaporation rate, contrast Tables 1 and 2 is understood, in evaporation coating method provided in an embodiment of the present invention, is reducing scanning
Speed, and add twice detect evaporation rate the step of on the basis of, saved 5s than evaporation coating method of the prior art
Sweep time, in addition, the use of the deposition material in line style evaporation source can also be improved by reducing the speed of evaporation part scanning
Rate.
The sweep time of scan mode in table 1 Fig. 2 a and Fig. 2 b is detailed
The sweep time of scan mode in Fig. 2 c of table 2 is detailed
Based on same inventive concept, the embodiments of the invention provide a kind of evaporated device of line style evaporation source, structure such as Fig. 3
It is shown, including：Vaporization chamber 101, the multiple frameworks and the evaporation that are used to fix substrate to be deposited being arranged on inside vaporization chamber 101
Portion 103；Wherein,
Each framework is arranged side by side on the direction parallel with framework short side；
Evaporation part 103 includes at least one line style evaporation source 1031, and the length of line style evaporation source 1031, which is more than or equal to, to be treated
The length of substrate long side is deposited, and each line style evaporation source 1031 is set side by side on the bearing of trend perpendicular to line style evaporation source 1031
Put；
The scanning direction that evaporation part 103 is deposited is only along the parallel direction of framework short side.
The evaporated device of a kind of linear evaporation source provided in an embodiment of the present invention, by the scanning side for controlling evaporation part 103
To only along the parallel direction of framework short side, the scanning pattern of evaporation part 103 is shortened, thus evaporation part 103 can be reduced
Sweep time, reduce the mechanicalness loss of evaporated device, and improve the service efficiency of deposition material.In addition, line style evaporation source
1031 length is more than or equal to the length of substrate long side to be deposited, ensure that evaporation part can cover in scanning and entirely waits to steam
Plated substrate.
In the specific implementation, above-mentioned vaporization chamber 101 during evaporation, it is necessary to keep vacuum state.Above-mentioned evaporated device
Including multiple frameworks, refer to including at least two frameworks, each framework is arranged on the direction parallel with framework short side simultaneously
Row is set, it is ensured that evaporation part 103 is in scanning process all along the scanning direction parallel to each framework.Above-mentioned evaporation part
103 include at least one line style evaporation source 1031 (being preferably 1-3), when evaporation part 103 includes multiple line style evaporation sources 1031
When, each line style evaporation source 1031 is arranged side by side on the bearing of trend perpendicular to line style evaporation source 1031, so as to be scanned
When, multiple line style evaporation sources 1031 form an evaporation part 103 and moved together.
Left side, right side and middle position, have an evaporation part 103, are not that the deposition system includes respectively in Fig. 3
The meaning of three evaporation parts 103, simply evaporation part 103 is illustrated to be moved to left side, right side and middle position.
In the specific implementation, in above-mentioned evaporated device provided in an embodiment of the present invention, can also include：For detecting line style
At least one QCM 104 (Quartz Crystal Microbalance, QCM) of the evaporation rate of evaporation source.
Specifically, QCM 104 is fixed at least one short side of line style evaporation source 103, or, quartz-crystal
The micro- balance 104 of body is fixed on opening position corresponding with least one short side of line style evaporation source 103 between two neighboring framework.
QCM 104 is arranged at the short side of line style evaporation source 103, can be scanned in evaporation part 103
During detect the evaporation rate of line style evaporation source 1031 always, by QCM 104 be fixed on two neighboring framework it
Between opening position corresponding with least one short side of line style evaporation source 1031, it is right when can be located at initial position in evaporation part 103
The evaporation rate of line style evaporation source 1031 is detected.
Specifically, above-mentioned QCM 104 is line style QCM 105 (Linear QCM)；
Line style QCM 105 is fixed at least one long edge position of line style evaporation source 103, or, each line style stone
English crystal microbalance 105 is fixed on the inwall position corresponding with least one long side of line style evaporation source 1031 of vaporization chamber 101
Place.
In the specific implementation, the length of line style QCM 105 can be set to cover on line style evaporation source 1031
All nozzles, to realize detection to the evaporation rate of each nozzle in line style evaporation source 1031, multiple line style stones can also be set
English crystal microbalance 105 joins end to end to cover the nozzle on line style evaporation source 1031, herein not to the micro- day of line style quartz crystal
Flat 105 length is defined.Line style QCM 105 is fixed on at least one long side of line style evaporation source 1031
Place, the evaporation rate of line style evaporation source 1031 is detected during being scanned in evaporation part 103 always.Each line style quartz crystal is micro-
Balance 105 is fixed on the inwall opening position corresponding with least one long side of line style evaporation source 1031 of vaporization chamber 101, i.e. Fig. 3
The opening position in middle left side or right side, can be before reverse scan after evaporation part 103 is to substrate simple scanning to be deposited, to steaming
The evaporation rate of line style evaporation source 1031 in hair portion 103 is detected.
In the specific implementation, above-mentioned deposition system provided in an embodiment of the present invention, can also include：For controlling evaporation part
The regulating member in 103 evaporation region, as shown in figures 4 a and 4b；
Regulating member includes：The first adjustable plate 1061 being fixed at two short sides of line style evaporation source 1031, and/or,
The second adjustable plate 1062 being fixed at two long side outer ledges of evaporation part 103；
Regulating member also includes：For the control at the angle of inclination for controlling the first adjustable plate 1061 and the second adjustable plate 1062
Portion；Angle of inclination is the first adjustable plate 1061 or the second adjustable plate 1062 and the angle on the surface of evaporation part 103.
, can be with control line by control of the control unit to the first adjustable plate 1061 and the angle of inclination of the second adjustable plate 1062
The injection direction and control evaporation region of type evaporation source 1031.For example, when evaporation part 103 is located at initial position, can pass through
Regulating member suppresses line style evaporation source 1031 and sprays deposition material, such as can carry out pilot injection, Huo Zhechao to substrate to be deposited
To other area sprays of vaporization chamber, after the scanning of evaporation part 103 starts, then by regulating member adjustment evaporation region, so as to keep away
The waste of without evaporation plating material.In practical application, can be used as control unit by motor changes the first adjustable plate 1061 or the second
The angle of inclination of adjustable plate 1062, miscellaneous part can also be used, is not limited herein.
Referring again to Fig. 4 a and Fig. 4 b, demarcation strip 107 can also be set between each line style evaporation source 1031, but in order to
The normal injection of nozzle 1032 is not influenceed, and it is preferably that can not adjust to incline to be arranged on the demarcation strip 107 between line style evaporation source 1031
Rake angle.Can significantly it be found out by Fig. 4 b, by setting the second adjustable plate 1062 and demarcation strip 107 to change nozzle 1032
The direction of injection, the angle of inclination by adjusting the second adjustable plate 1062 can adjust the region that evaporation part 103 is deposited, due to figure
4b is side view, so the first adjustable plate is not drawn, in actual applications, the effect of the first adjustable plate and the second adjustable plate
1062 effect is similar, and only the first adjustable plate is different from the position of the second adjustable plate 1062.
In the specific implementation, above-mentioned deposition system provided in an embodiment of the present invention, can also include：It is solid with evaporation part 103
Surely the distance controlling portion connected；
Distance controlling portion, for the distance between plane where controlling evaporation part 103 and framework.
By setting the distance controlling portion being fixedly connected with evaporation part 103, it is possible to achieve evaporation part 103 where framework with putting down
The distance between face adjusts, and then can control the distance between line style evaporation source 1031 and mother metal, and mother metal refers to mask plate
It is attached to the state of substrate to be deposited.
As shown in figure 5, above-mentioned evaporated device provided in an embodiment of the present invention, can also include：Align part 108, contraposition
Part 108 is used to be bonded between mask plate and substrate to be deposited, and is precisely aligned.As shown in figure 5, general contraposition
Part 108 is located above vaporization chamber 101, and suitable with the quantity of framework.It is similar with Fig. 3, multiple evaporation parts are included in Fig. 5
103 are intended merely to illustrate, and represent that evaporation part 103 can move, and do not represent and include multiple evaporation parts 103.
Due to the evaporated device of line style evaporation source provided in an embodiment of the present invention, the evaporation part is only along parallel to each framework
The scanning direction of short side, so the part of a control evaporation part movement is only needed, compared to scan mode of the prior art,
Reduce the part of control evaporation part movement, thus substantial amounts of space can be saved, be used to detect line style evaporation source with installation
Evaporation rate QCM, regulating member and distance controlling portion etc..
The evaporation coating method and evaporated device of a kind of line style evaporation source provided in an embodiment of the present invention, by controlling evaporation part edge
The scanning direction parallel to each framework short side, shortens the scanning pattern of evaporation part, thus the scanning of evaporation part can be reduced
Time, reduce the mechanicalness loss of evaporated device, and improve the service efficiency of deposition material.In addition, by line style evaporation source
Length is set greater than or the length equal to substrate long side to be deposited, ensure that evaporation part can cover in scanning and entirely waits to steam
Plated substrate.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (10)
- A kind of 1. evaporation coating method of line style evaporation source, it is characterised in that including：Control includes the evaporation part of at least one line style evaporation source along the scanning direction parallel to each framework short side, controls simultaneously At least one line style evaporation source is evaporated to internal deposition material；The substrate to be deposited is fixed on the framework, and the length of the line style evaporation source is more than or equal to described to be deposited The length of substrate long side.
- 2. evaporation coating method as claimed in claim 1, it is characterised in that control the evaporation part along parallel to each framework short side Scanning direction, specifically include：The evaporation part is controlled to carry out round sweep to substrate to be deposited each described along the direction parallel to each framework short side Retouch.
- 3. evaporation coating method as claimed in claim 2, it is characterised in that after the evaporation part simple scanning, and carrying out Before opposite direction scanning, in addition to：Detect the evaporation rate of the line style evaporation source；The evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style evaporation source Keep uniform evaporation rate.
- 4. the evaporation coating method as described in claim any one of 1-3, it is characterised in that control the evaporation part along parallel to Before the scanning direction of each framework short side, in addition to：Detect the evaporation rate of the line style evaporation source；The evaporation rate of each line style evaporation source is adjusted according to the evaporation rate detected, so that each line style evaporation source Keep uniform evaporation rate.
- A kind of 5. evaporated device of line style evaporation source, it is characterised in that including：Vaporization chamber, it is arranged on the evaporation chamber For fixing multiple frameworks and the evaporation part of substrate to be deposited；Wherein,Each framework is arranged side by side on the direction parallel with the framework short side；The evaporation part includes at least one line style evaporation source, and the length of the line style evaporation source is more than or equal to described to be deposited The length of substrate long side, and each line style evaporation source is arranged side by side on the bearing of trend perpendicular to the line style evaporation source；The scanning direction of the evaporation part evaporation is only along the parallel direction of the framework short side.
- 6. evaporated device as claimed in claim 5, it is characterised in that also include：For detecting the steaming of the line style evaporation source At least one QCM of hair rate.
- 7. evaporated device as claimed in claim 6, it is characterised in that the QCM is fixed on the line style and steamed At at least one short side to rise, or, the QCM is fixed between the two neighboring framework and the line Opening position corresponding at least one short side of type evaporation source.
- 8. evaporated device as claimed in claim 6, it is characterised in that the QCM is that line style quartz crystal is micro- Balance；The line style QCM is fixed at least one long edge position of the line style evaporation source, or, each line style QCM is fixed on the inwall position corresponding with least one long side of the line style evaporation source of the vaporization chamber Place.
- 9. evaporated device as claimed in claim 5, it is characterised in that also include：For controlling the evaporation area of the evaporation part The regulating member in domain；The regulating member includes：The first adjustable plate being fixed at two short sides of the line style evaporation source, and/or, it is fixed The second adjustable plate at two long side outer ledges of the evaporation part；The regulating member also includes：For controlling the control at the angle of inclination of first adjustable plate and second adjustable plate Portion；The angle of inclination is first adjustable plate or second adjustable plate and the angle on the evaporation part surface.
- 10. the evaporated device as described in claim any one of 5-9, it is characterised in that also include：Fix and connect with the evaporation part The distance controlling portion connect；The distance controlling portion, for the distance between plane where controlling the evaporation part and the framework.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610854758.0A CN107868939A (en) | 2016-09-27 | 2016-09-27 | A kind of evaporation coating method and evaporated device of line style evaporation source |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610854758.0A CN107868939A (en) | 2016-09-27 | 2016-09-27 | A kind of evaporation coating method and evaporated device of line style evaporation source |
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| CN107868939A true CN107868939A (en) | 2018-04-03 |
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