CN1763239A - Vapor deposition mask - Google Patents

Vapor deposition mask Download PDF

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Publication number
CN1763239A
CN1763239A CN 200410086951 CN200410086951A CN1763239A CN 1763239 A CN1763239 A CN 1763239A CN 200410086951 CN200410086951 CN 200410086951 CN 200410086951 A CN200410086951 A CN 200410086951A CN 1763239 A CN1763239 A CN 1763239A
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Prior art keywords
vapor deposition
deposition mask
shade
shielding layer
evaporation
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CN 200410086951
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Chinese (zh)
Inventor
叶德郎
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YUECHENG TECH Co Ltd
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YUECHENG TECH Co Ltd
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Priority to CN 200410086951 priority Critical patent/CN1763239A/en
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Abstract

The evaporation coating mask includes masking base plate of glass, quartz, magnesium fluoride, calcium fluoride or other material with heat expansion coefficient not higher than that of the element plate to be processed, and one or several rectangular masking units, which possess inward notched masking layer of 50-500 micron thickness and with certain pattern to form evaporation coating openings and reinforcing ribs to strengthen the masking base plate. The evaporation coating mask has high strength and low heat expansion coefficient, so that it has less deformation with temperature change during evaporation coating and is favorable to obtaining high precision evaporation coated pattern.

Description

Vapor deposition mask
Technical field
The present invention is relevant a kind of shade that uses in the plated film course of processing, refers to a kind of vapor deposition mask that forms high degree of accuracy plated film pattern usefulness that possesses especially.
Background technology
Known evaporation processing procedure is widely used in the production process of electronic component, for example a kind ofly possess luminous, wide viewing angle ' high organic light emitting display (Organic LightEmitting Display to advantages such as resolution when are good, OLED), and at the be exactly organic EL (electroluminescentdevices) with evaporation processing procedure produced of this each pixel of organic light emitting display employing as luminous element; As known, the formation of aforementioned organic EL, (for example being glass) is provided with by indium tin oxide target (indium tin oxide normally on a substrate, the anode that transparency electrode constituted such as ITO), and between the negative electrode that metal electrode constituted of low work functions such as aluminium, magnesium or calcium alloy, and between this anode and negative electrode the luminescent layer of lamination one organic materials; Wherein, this organic luminous layer and metal electrode promptly are to adopt evaporation coating method to form.When evaporation, utilize to have and the corresponding evaporation hole of the desired predetermined pattern of each layer in the vapor deposition mask setting, with qualification evaporation zone, thereby lamination becomes required pattern on substrate.
Usually the evaporation processing procedure is in vacuum chamber,, and vapor deposition mask is disposed between the evaporation face and evaporation source of substrate as the evaporation face with the bottom surface of substrate, when carrying out evaporation, be that the evaporation source heating is made the deposition material evaporation, and make the evaporation face of its attached work in substrate via the evaporation hole on the shade.
In the processing procedure of evaporation, in order on substrate, to form plated film pattern accurately, except must possess on this vapor deposition mask have with the corresponding high degree of accuracy evaporation of predetermined pattern hole, and because vapor deposition mask is that be disposed at can be to sail under the higher temperatures state near heated evaporation source part and evaporated material, vapor deposition mask must bear these evaporated material temperature so cover the vapor deposition mask of evaporation thing, so also must have the characteristic of thermotolerance and low thermal distortion.
For possessing aforementioned need, known present vapor deposition mask mostly is the metal cover that adopts by nickel constituted; Yet in actual evaporation processing procedure, find, because the thermal distortion of nickel shade, the evaporation aperture position that can cause presetting is offset, cause the shortcoming of formation pattern that can't high degree of accuracy, especially, form in the element of pattern, for example: the organic light emitting display that each elemental area is very little at the ask for something high-fineness, shade thermal distortion and cause the pattern shift of organic layer will become very large problem; In addition, maximization at display panel, and adopt the large-area mother substrate of use with in the manufacture that forms so-called multiaspect orientations such as a plurality of display panels, its evaporation face broad, and adopt large-scale shade as vapor deposition mask, when the area of vapor deposition mask is big,, shade increases so position offset problem becomes remarkable because producing heat distortion amount; In addition; this larger area metal cover; because the extremely thin weight of shade of adding of cover plate thickness own; not only be difficult for being arranged on obediently on the evaporation face; also regular meeting is because the distortion that the effect of gravity causes; therefore make the extremely thin shade of thickness must use the technology of throwing the net when mounted, cause shade to be installed to applying on the supporting frame and become difficult with spot welding.
Summary of the invention
Main purpose of the present invention is that a kind of vapor deposition mask that can high degree of accuracy forms the plated film pattern is provided in the evaporation coating technique field; It is to utilize glass or the quartzy shade that comes substituted metal or metal alloy compositions as film-plating process, low-expansion material behavior that possesses by glass or quartz, to avoid a large amount of thermal distortions of the shade that high temperature is caused in the evaporation processing procedure, cause the position skew of plated film pattern, obtain the plated film pattern of high degree of accuracy thus.
According to the present invention, this vapor deposition mask is to adopt that to have thermal expansivity or material it under identical with processed device substrate be the shade substrate, for example be glass or quartz, and on this shade substrate configuration one or more be the shade working cell of matrix kenel configuration, and this shade working cell tool one sets to the concave in the shielding layer of shade substrate, make the thickness of this shielding layer formation about 50~500 μ m, and in this shielding layer be provided with the corresponding hole slot that runs through of desired predetermined pattern as the evaporation hole, and with respect to this thin shielding layer, periphery in the shade working cell forms the flank with big thickness, thereby the function that this shade substrate is had reinforcement and prevents to be out of shape, especially on the shade substrate that disposes a plurality of shades working cell, whole shade is connected with each other to form through the broadwise reinforced ribs that is crisscross arranged by the flank with each shade working cell of matrix kenel configuration, can reach increase shade substrate intensity and prevent the effectiveness of being out of shape.
Wherein, the cross section at the formed evaporation hole of this shielding layer is slightly to be
Figure A20041008695100064
Figure A20041008695100065
Has the structure shape of jagged hole surface etc. structure shape or this evaporation hole, in view of the above to reach the effect that promotes evaporation efficient and evaporation precision.
In addition, according to the present invention, each shielding layer of this vapor deposition mask and flank be connected with each other integrally formed, therefore but these flanks with higher-strength are at the support frame of this double as for enhancement shade intensity, and shade more easily is installed in the supporting mechanism, apply processing procedure to save the difficulty that known shade is installed in supporting frame; Working cell (being shielding layer) because of this shade is a same material with support frame (being flank) again, has identical thermal expansivity, therefore the temperature that is caused in the evaporation processing procedure rises, can between the working cell of this shade and support frame, not produce excessive thermal stress and cause distortion, so that even the precision that the plated film pattern that detracts forms is the damage of shade member.
Again, vapor deposition mask of the present invention is except adopting aforesaid glass or quartzy for the material of shade substrate, and magnesium fluoride (MgF2) and Calcium Fluoride (Fluorspan) materials such as (CaF2) also can be applicable in this scope.
Description of drawings
For further specifying technology contents of the present invention, will be next to the back with a specific embodiment and accompanying drawing go on to say as after, wherein:
Fig. 1 shows a kind of partial view that the matrix kenel disposes the vapor deposition mask planar configuration of a plurality of shades working cell that is;
Fig. 2 shows that vapor deposition mask is configured in the diagrammatic cross-section that evaporation is carried out in processed device substrate below;
Fig. 3 is the sectional view that Fig. 2 W portion amplifies, and the shielding layer that is presented at this shade working cell is provided with and is the evaporation hole;
Fig. 4 A is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100071
Structure shape;
Fig. 4 B is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100072
Structure shape;
Fig. 4 C is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100073
Structure shape;
Fig. 4 D is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100081
Structure shape; And
Fig. 4 E is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100082
Structure shape;
Fig. 4 F is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of cross section of evaporation hole slightly is
Figure A20041008695100083
Structure shape;
Fig. 4 G is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of turbination evaporation hole is to have jagged hole surface structure shape;
Fig. 4 H is the sectional view that Fig. 3 M portion amplifies, and shows that a kind of conical evaporation hole is to have jagged hole surface structure shape.
Embodiment
In known multiple evaporation processing procedure mode, show the ventricumbent evaporation processing procedure of a kind of vapor deposition mask at Fig. 2, processed device substrate 2 is installed in the deposited chamber of vacuum deposition apparatus, be provided with one group by 3 fixed vapor deposition masks 1 of supporting mechanism in the evaporation face of this substrate 2 below, and between the evaporation face that makes this substrate 2 and this vapor deposition mask 1 almost being to have no to be configured to gap whole to contact; Below vapor deposition mask 1, dispose evaporation element 4 in addition, this evaporation element 4 can be along the horizontal plane do displacement all around that the position is set, and evaporating materials heating made the material evaporation, so that evaporation element 4 carries out the evaporation operation in mobile the time, can be from these evaporation element 4 materials evaporated by the evaporation hole 13 on this vapor deposition mask 1, make the attached work of evaporating materials on the evaporation face of processed device substrate 2, therefore on this evaporation face, form and the corresponding evaporation layer of these evaporation hole 13 patterns.
Again from the planar configuration legend of the vapor deposition mask of Fig. 1, and Fig. 2, in the vapor deposition mask side cut-away view of Fig. 3, show that the embodiment of the invention disposes a plurality of shades working cell 11 with the matrix kenel on this shade substrate, in discrete shade working cell 11, form the shielding layer 12 of a thickness with the kenel that is arranged with to shade substrate inside about 50-500 μ m, and on this shielding layer 12, engraved with the corresponding hole slot that runs through of desired predetermined pattern as evaporation hole 13, and with respect to this thin shielding layer 12, periphery in this shade working cell 11 forms has the flank 14 of big thickness about 50 μ m-numbers centimeter (cm), and utilize these flanks 14 to be connected with each other to form through the broadwise reinforced ribs that is crisscross arranged with each shade working cell of matrix kenel configuration, to constitute the support frame function of shade 1, reach the purpose that prevents the shade body distortion.
In this embodiment, this vapor deposition mask 1 is that employing glass is the shade material; As known, glass is a kind of non-metal inorganic material, structurally be a kind of inorganic thermoplastic polymer, when being higher than 650 ℃, can be shaped to have characteristics such as transparent, corrosion-resistant, wear-resisting, resistance to compression after the cooling, and glass is the poor conductor of electricity and heat, also be a kind of amorphous thing of living crisp, its proportion: 2.64~2.5, straight line expand coefficient: 9-10 * 10-6/ ℃ (~350 ℃), specific heat: 0.2 (0~50 ℃), practical surperficial tensile strength; About 500kg/cm2, the more important thing is, glass has this existing lower thermal expansivity of metal or alloy material as shade, for example the about 3 * 10-6/ of the thermal expansivity of pyrex ℃, quartzy thermal expansivity is lower than 5 * 10-7/ ℃ especially: and the existing nickel or the thermal expansivity scope of nickelalloy as the shade material ℃ all has from 30 * 10-7/ ℃~300 * 10-7/, YEF42 (52Ni alloy for example, the alloy of Fe+42%Ni) thermal expansivity is 48 * 10-7/ ℃, this material has been to belong to oneself to have known in the alloy that is applied to the shade material thermal expansivity materials with smaller, other YEF426 (426 alloys that like, the alloy of Fe+42%Ni+6%Cr) thermal expansivity is 90 * 10-7/ ℃, the thermal expansivity of YEF 52 (52Ni alloy, the alloy of Fe+52%Ni) is 102 * 10-7/ ℃; Comparatively speaking, the thermal expansivity of glass is lower than the nickel or the nickel alloy material of known shade, even has only low reaching about 1/3.
Therefore, the shade material coefficient of thermal expansion rate that present embodiment adopted with almost be identical or lower by the coefficient of thermal expansion of the substrate 2 of evaporation machine component (normally glass), in the evaporation processing procedure, this vapor deposition mask 1 has only the very small heat distortion amount of generation, and almost can ignore the problem that the evaporation aperture position is offset, so formation plated film pattern on the glass substrate 2 of this processed element that can be correct.
Again, from another viewpoint, to make the thermal expansion of the glass substrate 2 of the thermal expansion of this vapor deposition mask l and processed element reach same degree at the heat of evaporation processing procedure, therefore the deflection of this vapor deposition mask l offsets because of the distortion of glass substrate 2 same degree that are subjected to this processed element, can reach the purpose that improves pattern precision more in view of the above.
In addition, in present embodiment, the intensity that has appropriateness for the shielding layer 12 that makes this vapor deposition mask, in order to avoid be easy to damage, therefore the thickness of this shielding layer 12 is set between about 50-500 μ m, this compares with the processed device substrate 2 about the about 0.7mm of general thickness, though be extremely thin, but, find from the practice of evaporation processing procedure, when the shielding layer 12 of vapor deposition mask is thicker, so the evaporation material of wafting from vergence direction can't pass through on this shielding layer evaporation hole 13 with attached work on the evaporation face of processed device substrate 2, this result will cause the decline of evaporation efficient and evaporation precision; For fear of aforementioned unfavorable feature, the present invention offers into the cross section with the evaporation hole 13 of this shielding layer slightly to be
Figure A20041008695100101
Figure A20041008695100103
Figure A20041008695100106
Has the structure shape (shown in Fig. 4 G~Fig. 4 H) of jagged hole surface etc. structure shape (shown in Fig. 4 A~Fig. 4 F) or this evaporation hole 13, the evaporation material that these evaporation hole 13 tolerables are wafted from vergence direction passes through, and attached work is to the evaporation face of processed device substrate 2, keep suitable depth (intensity) to reach the shielding layer 12 that can make this vapor deposition mask, can avoid the thickness institute deutero-reduction evaporation efficient of this shielding layer 12 and the shortcoming of evaporation precision again.
In the above-described embodiments, though be used as the material of shade 12 with glass/quartz, but so long as coefficient of thermal expansion is near or below the processed device substrate 2 that this is selected for use, and have abundant stable on heating material and all can use, for example, magnesium fluoride (MgF2, thermal expansivity: 8.48~13.7 * 10-6/K), (CaF2, thermal expansivity: 18.85 * 10-6/K) is also highly desirable for Calcium Fluoride (Fluorspan).
In addition, according to the present invention, this vapor deposition mask 1 can adopt the substrate of thickness about 50 μ m~several centimeters, utilize etching then, laser processing, hot pressing, making method such as chemical vapour deposition or physical vapor deposition, so that on the substrate of this vapor deposition mask, form each required shade working cell 11, therefore each shielding layer 12 on this vapor deposition mask 1 and flank 14 be connected with each other integrally formed, and the thickness of these flanks 14 is about 50 μ m~several centimeters (cm), so have higher-strength, also can use the support frame of promoting shade intensity as at this, and this shade 1 more easily is installed in the supporting mechanism 3, apply processing procedure to save the difficulty that known shade is installed in supporting frame; Working cell 11 (being shielding layer 12) because of this shade is a same material with support frame (being flank 14) again, has identical thermal expansivity, therefore the temperature that is caused in the evaporation processing procedure rises, can not cause distortion in the working cell of this shade and the generation excessive thermal stress between the support frame, so that even the precision that the plated film pattern that detracts forms is the damage of shade member.
Always this is improved by vapor deposition mask 1 of the present invention, can obtain the evaporation pattern of high degree of accuracy on processed device substrate 2.Again; the present invention is not stubborn the above form that is limited to; clearly; with regard to the personage who has the knack of this technology,, more improvement and variation can be arranged with reference to after the above-mentioned explanation; be with; all have in that identical creation spirit is following do relevant any modification of the present invention or change, all must be included in the category that the invention is intended to protect, and give Chen Ming.

Claims (13)

1, a kind of vapor deposition mask, be to adopt that to have thermal expansivity or material it under identical with processed device substrate be the shade substrate, and on this shade substrate configuration one or more be the shade working cell of matrix kenel configuration, it is characterized in that: this shade working cell tool one sets to the concave in the shielding layer of shade substrate, and in this shielding layer be provided with the corresponding hole slot that runs through of desired predetermined pattern as the evaporation hole, and with respect to this thin shielding layer, the periphery in the shade working cell forms the flank with big thickness.
2, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, the material of this shade substrate is to be glass or quartz.
3, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, the material of this shade substrate is to be magnesium fluoride or Calcium Fluoride (Fluorspan).
4, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, the thickness of this shade substrate is about 50 μ m-numbers centimeter.
5, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, this shielding layer forms the thickness about 50~500 μ m.
6, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, in the cross section of the formed evaporation hole of this shielding layer be slightly be/structure shape.
7, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, is slightly to be in the cross section of the formed evaporation hole of this shielding layer〉<structure shape.
8, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, is slightly to be in the cross section of the formed evaporation hole of this shielding layer Structure shape.
9, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, is slightly to be in the cross section of the formed evaporation hole of this shielding layer
Figure A2004100869510003C2
Structure shape.
10, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, in the cross section of the formed evaporation hole of this shielding layer be slightly be<structure shape.
11, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, is slightly to be in the cross section of the formed evaporation hole of this shielding layer
Figure A2004100869510003C3
Structure shape.
12, vapor deposition mask as claimed in claim 1 is characterized in that, wherein, is to have jagged hole surface at the formed evaporation hole of this shielding layer.
13, vapor deposition mask as claimed in claim 1, it is characterized in that, wherein, on the shade substrate that disposes a plurality of shades working cell, these flanks with each shade working cell of matrix kenel configuration are to be connected with each other to form through the broadwise reinforced ribs that is crisscross arranged.
CN 200410086951 2004-10-20 2004-10-20 Vapor deposition mask Pending CN1763239A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102268636A (en) * 2010-06-01 2011-12-07 勤友企业股份有限公司 Pattern forming method used in coating technology and substrate bearing equipment using same
CN102485937A (en) * 2010-12-03 2012-06-06 财团法人工业技术研究院 Apparatus and method for depositing thin film pattern
TWI461098B (en) * 2012-01-12 2014-11-11 Dainippon Printing Co Ltd A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor device
CN104846328A (en) * 2014-02-14 2015-08-19 三星显示有限公司 Mask frame assembly and manufacturing method thereof
CN105986225A (en) * 2015-02-16 2016-10-05 上海和辉光电有限公司 Shielding layer for OLED evaporation and manufacturing method thereof
TWI637932B (en) * 2015-07-21 2018-10-11 日商日本輕金屬股份有限公司 Method for producing magnesium fluoride sintered compact, and method for producing neutron modulator
CN111020518A (en) * 2019-12-30 2020-04-17 江苏集萃有机光电技术研究所有限公司 Substrate evaporation bearing disc and vacuum evaporation instrument
CN111850466A (en) * 2020-07-30 2020-10-30 昆山国显光电有限公司 Mask and evaporation device
CN114645246A (en) * 2022-05-23 2022-06-21 浙江众凌科技有限公司 Metal shade

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102268636A (en) * 2010-06-01 2011-12-07 勤友企业股份有限公司 Pattern forming method used in coating technology and substrate bearing equipment using same
CN102485937A (en) * 2010-12-03 2012-06-06 财团法人工业技术研究院 Apparatus and method for depositing thin film pattern
CN102485937B (en) * 2010-12-03 2014-05-28 财团法人工业技术研究院 Apparatus and method for depositing thin film pattern
TWI461098B (en) * 2012-01-12 2014-11-11 Dainippon Printing Co Ltd A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor device
CN104846328A (en) * 2014-02-14 2015-08-19 三星显示有限公司 Mask frame assembly and manufacturing method thereof
CN104846328B (en) * 2014-02-14 2019-02-19 三星显示有限公司 Mask frame and its manufacturing method
CN105986225A (en) * 2015-02-16 2016-10-05 上海和辉光电有限公司 Shielding layer for OLED evaporation and manufacturing method thereof
TWI637932B (en) * 2015-07-21 2018-10-11 日商日本輕金屬股份有限公司 Method for producing magnesium fluoride sintered compact, and method for producing neutron modulator
US10343951B2 (en) 2015-07-21 2019-07-09 Nippon Light Metal Company, Ltd. Magnesium fluoride sintered compact, method for manufacturing magnesium fluoride sintered compact, neutron moderator, and method for manufacturing neutron moderator
CN111020518A (en) * 2019-12-30 2020-04-17 江苏集萃有机光电技术研究所有限公司 Substrate evaporation bearing disc and vacuum evaporation instrument
CN111850466A (en) * 2020-07-30 2020-10-30 昆山国显光电有限公司 Mask and evaporation device
CN114645246A (en) * 2022-05-23 2022-06-21 浙江众凌科技有限公司 Metal shade

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