CN111010848A - Preparation method of GHP heat conduction and dissipation material - Google Patents
Preparation method of GHP heat conduction and dissipation material Download PDFInfo
- Publication number
- CN111010848A CN111010848A CN201911165989.0A CN201911165989A CN111010848A CN 111010848 A CN111010848 A CN 111010848A CN 201911165989 A CN201911165989 A CN 201911165989A CN 111010848 A CN111010848 A CN 111010848A
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- Prior art keywords
- ghp
- heat
- heat conduction
- dissipation
- stamping
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- 239000000463 material Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000004917 carbon fiber Substances 0.000 claims abstract description 6
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 229910021382 natural graphite Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 238000007670 refining Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 4
- 239000000835 fiber Substances 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a preparation method of a GHP heat conduction and dissipation material, and belongs to the technical field of heat conduction and dissipation. The invention directly utilizes natural graphite to extract C6Material, then at C6The carbon fibers and the metal wires are inserted into the material, then the GHP material containing the carbon fibers and the metal wires is extruded, the GHP material and the PI or the copper foil are attached or pressed by a tool, and finally the appearance of the GHP heat-conducting and heat-dissipating material is manufactured by using the stamping pressure of 6-8 atmospheres. The invention can effectively cool and connect the temperatures of different heat source points, so that the temperature of the electronic product is homogenized, and the use experience of customers is enhanced.
Description
Technical Field
The invention relates to the technical field of heat conduction and heat dissipation, in particular to a preparation method of a GHP heat conduction and heat dissipation material.
Background
With the development of electronic consumer products and the application of 5G, the power requirements of users on various electronic product parts are higher and higher. The layout space of electronic products is more and more complicated, and the heat source points of the electronic products are more and more high in power and are separated, and are not linearly distributed. Therefore, electronic products have higher quality requirements, especially the requirement of conductivity, for the existing heat conducting products, and not only need to conduct heat quickly, but also need to distribute heat uniformly so as to meet the requirement of reducing the temperature of a heat source point. The existing heat-conducting products can be roughly divided into silica gel heat dissipation, copper aluminum foil heat dissipation, graphite heat dissipation, copper tube VC heat dissipation and the like.
1. The heat conductivity of silica gel heat dissipation and copper aluminum foil heat dissipation is not satisfactory, the soaking effect is poor, and meanwhile, the concave-convex connection between heat source points of electronic products cannot be satisfied;
2. the heat conductivity of natural graphite in graphite heat dissipation is not satisfactory, and the conduction speed is low;
3. the heat-conducting property of the artificially synthesized graphite in the graphite heat dissipation meets the requirement, but the concave-convex connection between heat source points of electronic products cannot be met;
4. the VC heat-conducting property of the copper pipe meets the requirement, but the concave-convex connection between heat source points of electronic products cannot be met, and the cost is high;
these four types of products have been slowly unable to satisfy the user's heat dissipation and heat conduction demand to electronic product, weaken customer's use experience, can not reduce electronic product's temperature.
Disclosure of Invention
The invention aims to solve the technical problem of developing a heat-conducting and heat-dissipating material which can effectively cool and connect the temperatures of different heat source points, so that the temperature of an electronic product is homogenized, and the use experience of a customer is enhanced.
In order to solve the technical problems, the invention adopts the following scheme: a preparation method of a GHP heat conduction and dissipation material comprises the following specific steps:
the first step is as follows: refining C6Material, refining C from natural graphite6A material;
the second step is that: inserting a thread in C6Carbon fibers and metal wires are inserted in the material;
the third step: pressing to obtain GHP material containing two materials;
the fourth step: bonding, bonding or pressing the GHP material and the PI or the copper foil by using a tool fixture;
the fifth step: and (5) stamping the shape, and manufacturing the shape of the GHP heat conduction and dissipation material by pressure.
As a further scheme of the invention, the metal wire in the second step is a copper wire, an aluminum wire or a tungsten wire.
As a further scheme of the invention, the thickness range of the GHP material in the third step is 20-1000 um.
As a further aspect of the present invention, the fifth step of stamping the outer shape includes: and pressing the shape of the GHP heat conduction and dissipation material by using a stamping device.
As a further scheme of the invention, the pressure range of the stamping equipment is 6 atm-8 atm.
The invention has the advantages and positive effects that: due to the adoption of the technical scheme, a GHP heat conduction and dissipation material product with the thickness of 20-1000 um can be manufactured, the temperature difference of the product between 100mm in width is lower than 4 ℃ under a heat source of 10W, heat can be rapidly transferred out, and meanwhile, the GHP heat conduction and dissipation material has a good heat equalizing effect.
Drawings
Fig. 1 is a flowchart of a method for preparing a GHP heat conductive and dissipating material according to the present invention.
Fig. 2 is a schematic structural diagram of a method for preparing a GHP heat conductive and dissipating material according to the present invention.
Fig. 3 is a graph showing the soaking effect of the sample of the present invention.
In the figure: 100 is PI, 200 is GHP material, and 300 is copper foil.
Detailed Description
The technical solution of the present invention is described in full and clearly below by way of example applications.
Examples
As shown in FIGS. 1-2, C is extracted directly from natural graphite6Material, then at C6The method comprises the steps of inserting a carbon fiber and one of metal silk threads such as a copper wire, an aluminum wire or a tungsten wire into a material, pressing the material into a GHP material which is 20-1000 um thick and contains the carbon fiber and the one of the metal silk threads through a rolling device, attaching or pressing the GHP material and a PI or copper foil through a tool, placing a GHP material 200 between a PI 100 and a copper foil 300, finally using a stamping device to manufacture the appearance of the GHP heat-conducting and heat-dissipating material through a die at 6-8 atmospheric pressures by using stamping pressure of a stamping device, so that the GHP heat-conducting and heat-dissipating material can be manufactured, and testing shows that the temperature difference of the product is lower than 4 ℃ between 100mm in width under a heat source of 10W.
TABLE 10.8 mm GHP Heat transfer and Heat sink Material samples at test points test conditions
Table 1 and as shown in fig. 3, the GHP heat conductive and heat dissipating material sample of the present invention resulted in a product temperature difference of less than 4 ℃ between 100mm width under a heat source of 10W.
Although specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely examples and that many variations or modifications may be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (5)
1. A preparation method of a GHP heat conduction and dissipation material is characterized by comprising the following steps: the method comprises the following specific steps:
the first step is as follows: refining C6Material, refining C from natural graphite6A material;
the second step is that: inserting a fiber thread at C6Carbon fibers and metal wires are inserted in the material;
the third step: pressing to obtain GHP material containing two materials;
the fourth step: bonding, bonding or pressing the GHP material and the PI or the copper foil by using a tool fixture;
the fifth step: and (5) stamping the shape, and manufacturing the shape of the GHP heat conduction and dissipation material by pressure.
2. The method of claim 1, wherein the GHP thermal conductive material is selected from the group consisting of: the metal wire in the second step is a copper wire, an aluminum wire or a tungsten wire.
3. The method of claim 1, wherein the GHP thermal conductive material is selected from the group consisting of: and the thickness range of the GHP material in the third step is 20 um-1000 um.
4. The method of claim 1, wherein the GHP thermal conductive material is selected from the group consisting of: the fifth step of stamping the appearance comprises the following steps: and pressing the shape of the GHP heat conduction and dissipation material by using a stamping device.
5. The method of claim 1, wherein the GHP thermal conductive material is selected from the group consisting of: the pressure range of the stamping equipment is 6 atm-8 atm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911165989.0A CN111010848A (en) | 2019-11-25 | 2019-11-25 | Preparation method of GHP heat conduction and dissipation material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911165989.0A CN111010848A (en) | 2019-11-25 | 2019-11-25 | Preparation method of GHP heat conduction and dissipation material |
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| Publication Number | Publication Date |
|---|---|
| CN111010848A true CN111010848A (en) | 2020-04-14 |
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|---|---|---|---|
| CN201911165989.0A Pending CN111010848A (en) | 2019-11-25 | 2019-11-25 | Preparation method of GHP heat conduction and dissipation material |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906015A (en) * | 2011-02-09 | 2013-01-30 | 创业发展联盟技术有限公司 | Method for producing multilayer graphene coated substrate |
| CN104519723A (en) * | 2014-12-24 | 2015-04-15 | 无锡格菲电子薄膜科技有限公司 | Graphene-based heat conducting piece |
| CN106336618A (en) * | 2016-09-12 | 2017-01-18 | 中电科芜湖钻石飞机制造有限公司 | High-heat-conductivity carbon fiber composite material and preparation method thereof |
| TW201803804A (en) * | 2016-01-07 | 2018-02-01 | 威廉馬許萊斯大學 | Facile preparation of carbon nanotube hybrid materials by catalyst solutions |
| CN107984838A (en) * | 2017-11-27 | 2018-05-04 | 南京航空航天大学 | A kind of preparation method of impact resistance heat conduction aluminium alloy-carbon fiber-graphene layer plywood |
| CN108410136A (en) * | 2018-05-02 | 2018-08-17 | 北京大学 | Novel high heat conduction graphene or graphite film/carbon fibre composite preparation method |
| CN109734468A (en) * | 2019-02-26 | 2019-05-10 | 航天材料及工艺研究所 | A kind of graphene paper enhancing carbon/carbon compound material and preparation method thereof |
-
2019
- 2019-11-25 CN CN201911165989.0A patent/CN111010848A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906015A (en) * | 2011-02-09 | 2013-01-30 | 创业发展联盟技术有限公司 | Method for producing multilayer graphene coated substrate |
| CN104519723A (en) * | 2014-12-24 | 2015-04-15 | 无锡格菲电子薄膜科技有限公司 | Graphene-based heat conducting piece |
| TW201803804A (en) * | 2016-01-07 | 2018-02-01 | 威廉馬許萊斯大學 | Facile preparation of carbon nanotube hybrid materials by catalyst solutions |
| CN106336618A (en) * | 2016-09-12 | 2017-01-18 | 中电科芜湖钻石飞机制造有限公司 | High-heat-conductivity carbon fiber composite material and preparation method thereof |
| CN107984838A (en) * | 2017-11-27 | 2018-05-04 | 南京航空航天大学 | A kind of preparation method of impact resistance heat conduction aluminium alloy-carbon fiber-graphene layer plywood |
| CN108410136A (en) * | 2018-05-02 | 2018-08-17 | 北京大学 | Novel high heat conduction graphene or graphite film/carbon fibre composite preparation method |
| CN109734468A (en) * | 2019-02-26 | 2019-05-10 | 航天材料及工艺研究所 | A kind of graphene paper enhancing carbon/carbon compound material and preparation method thereof |
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Effective date of registration: 20210705 Address after: 516000 No.4, Xingping East Road, Dongxing District, Dongjiang Science Park, Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant after: Huizhou Zhidong Precision Technology Co.,Ltd. Address before: 215100 No.68 Caixing Road, Cailian village, Linhu Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: Suzhou Yingshun insulating material Co.,Ltd. |
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Application publication date: 20200414 |