CN107221506A - A kind of preparation method of high-heat conductive efficency graphite composite sheet - Google Patents
A kind of preparation method of high-heat conductive efficency graphite composite sheet Download PDFInfo
- Publication number
- CN107221506A CN107221506A CN201710546970.5A CN201710546970A CN107221506A CN 107221506 A CN107221506 A CN 107221506A CN 201710546970 A CN201710546970 A CN 201710546970A CN 107221506 A CN107221506 A CN 107221506A
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- CN
- China
- Prior art keywords
- graphite
- copper foil
- composite sheet
- heat conduction
- graphite flake
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
Abstract
The present invention discloses a kind of preparation method of high-heat conductive efficency graphite composite sheet, the graphite composite sheet includes graphite flake and the multi-disc heat conduction copper foil through the graphite flake that surface is in contact with thermal source, and the thickness of the heat conduction copper foil is identical with the thickness of the graphite flake;It comprises the following steps:(a)Graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;(b)Copper foil volume is punched into heat conduction copper foil;(c)The heat conduction copper foil is inserted in the through hole.By, through graphite flake is set, its capacity of heat transmission in vertical direction can be so improved, so as to improve heat transfer efficiency so that the thermal conductivity of graphite flake in vertical direction reaches more than 150W/ (mk) in graphite flake.
Description
Technical field
The present invention relates to a kind of graphite composite sheet, and in particular to a kind of preparation method of high-heat conductive efficency graphite composite sheet.
Background technology
In recent years, continuing to develop with electronic technology, electronic product, which is constantly updated, regenerates, the size of its work package
Less and less, the speed and efficiency more and more higher of work, its caloric value are also increasing, therefore it is corresponding not require nothing more than its outfit
Heat abstractor, it is also to be ensured that heat abstractor has stronger heat-sinking capability, is made with ensureing the reliability of properties of product and extending it
Use the life-span.
Graphite heat conducting heat sink material, because of its distinctive low-density (relative to metal class) and high heat conduction and heat radiation coefficient and low-heat
Resistance turns into the preferred material that hyundai electronicses class product solves heat conduction and heat radiation technology.Graphite heat radiation fin can along level, vertical two
Direction heat conduction, but it is relatively poor and easily form focus in the radiating effect of vertical direction, influences the radiating of electronic product
Effect.
The content of the invention
For above-mentioned technical deficiency, it is an object of the invention to provide a kind of system of high-heat conductive efficency graphite composite sheet
Make method.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that:A kind of high-heat conductive efficency graphite composite sheet
Preparation method, graphite flake and led through the multi-disc of the graphite flake that the graphite composite sheet is in contact including surface with thermal source
Hot copper foil, the thickness of the heat conduction copper foil is identical with the thickness of the graphite flake;It comprises the following steps:
(a) graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b) copper foil volume is punched into heat conduction copper foil;
(c) the heat conduction copper foil is inserted in the through hole.
Optimally, it also includes step (d) in another surface mount formation tack coat of the graphite flake.
Optimally, it also includes step (d') product that step (c) is obtained is placed in into 1000~1080 DEG C, under vacuum condition
Insulation is down to room temperature after 10~30 minutes.
Further, in the step (d'), its programming rate be 30~50 DEG C/h, its cooling rate be 50~100 DEG C/
h。
The beneficial effects of the present invention are:The preparation method of high-heat conductive efficency graphite composite sheet of the present invention, by graphite
Through graphite flake is set in piece, its capacity of heat transmission in vertical direction can be so improved, so as to improve heat transfer efficiency, is made
The thermal conductivity of graphite flake in vertical direction is obtained to reach more than 150W/ (mk).
Embodiment
The present invention is described in detail below with reference to shown embodiment:
Embodiment 1
The present embodiment provides a kind of preparation method of high-heat conductive efficency graphite composite sheet, the graphite composite sheet include surface with
Graphite flake 1 that thermal source 4 is in contact, formed be in contact with tack coat 3 in the tack coat 3 on another surface of graphite flake 1 and one end and
The other end extends to the multi-disc heat conduction copper foil 2 through graphite flake 1, and the thickness of heat conduction copper foil 2 is identical with the thickness of graphite flake 1;It
Comprise the following steps:
(a) graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b) copper foil volume is punched into heat conduction copper foil;The thickness of heat conduction copper foil 2 is 20 μm~2mm, a diameter of 1~5mm;
(c) the heat conduction copper foil is inserted in the through hole;
(d) in another surface mount formation tack coat of the graphite flake so that the end of heat conduction copper foil 2 connects with tack coat
Touch without dropping;The vertical heat transfer rate of obtained graphite composite sheet reaches 150W/ (mk), and tensile strength is 700 (test marks
Standard is ASTM F-152).
Embodiment 2
The present embodiment provides a kind of preparation method of high-heat conductive efficency graphite composite sheet, the structure of graphite composite sheet and implementation
It is basically identical in example 1, unlike, it comprises the following steps:
(a) graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b) copper foil volume is punched into heat conduction copper foil;The thickness of heat conduction copper foil 2 is 20 μm~2mm, a diameter of 1~5mm;
(c) the heat conduction copper foil is inserted in the through hole;
(d') product that step (c) is obtained is placed under vacuum condition, and 1000 DEG C are warming up to 30 DEG C/h speed, is then protected
Temperature 10 minutes, then room temperature is down to 50 DEG C/h speed, the vertical heat transfer rate of obtained graphite composite sheet reaches 250W/ (m
K), tensile strength is 750 (testing standard is ASTM F-152).
Embodiment 3
The present embodiment provides a kind of preparation method of high-heat conductive efficency graphite composite sheet, the structure of graphite composite sheet and implementation
It is basically identical in example 1, unlike, it comprises the following steps:
(a) graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b) copper foil volume is punched into heat conduction copper foil;The thickness of heat conduction copper foil 2 is 20 μm~2mm, a diameter of 1~5mm;
(c) the heat conduction copper foil is inserted in the through hole;
(d') product that step (c) is obtained is placed under vacuum condition, and 1080 DEG C are warming up to 50 DEG C/h speed, is then protected
Temperature 30 minutes, then room temperature is down to 100 DEG C/h speed, the vertical heat transfer rate of obtained graphite composite sheet reaches 450W/ (m
K), tensile strength is 850 (testing standard is ASTM F-152).
Embodiment 4
The present embodiment provides a kind of preparation method of high-heat conductive efficency graphite composite sheet, the structure of graphite composite sheet and implementation
It is basically identical in example 1, unlike, it comprises the following steps:
(a) graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b) copper foil volume is punched into heat conduction copper foil;The thickness of heat conduction copper foil 2 is 20 μm~2mm, a diameter of 1~5mm;
(c) the heat conduction copper foil is inserted in the through hole;
(d') product that step (c) is obtained is placed under vacuum condition, and 1050 DEG C are warming up to 35 DEG C/h speed, is then protected
Temperature 25 minutes, then room temperature is down to 80 DEG C/h speed, the vertical heat transfer rate of obtained graphite composite sheet reaches 350W/ (m
K), tensile strength is 790 (testing standard is ASTM F-152).
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that spirit is made, should all be included within the scope of the present invention.
Claims (4)
1. a kind of preparation method of high-heat conductive efficency graphite composite sheet, the graphite composite sheet includes what surface was in contact with thermal source
Graphite flake and the multi-disc heat conduction copper foil through the graphite flake, the thickness of the heat conduction copper foil and the thickness phase of the graphite flake
Together;Characterized in that, it comprises the following steps:
(a)Graphite volume is punched into graphite flake, and is stamped and formed out multiple through holes;
(b)Copper foil volume is punched into heat conduction copper foil;
(c)The heat conduction copper foil is inserted in the through hole.
2. the preparation method of high-heat conductive efficency graphite composite sheet according to claim 1, it is characterised in that:It also includes step
Suddenly(d)In another surface mount formation tack coat of the graphite flake.
3. the preparation method of high-heat conductive efficency graphite composite sheet according to claim 1, it is characterised in that:It also includes step
Suddenly(d')By step(c)Obtained product be placed in 1000 ~ 1080 DEG C, under vacuum condition insulation be down to room temperature after 10 ~ 30 minutes.
4. the preparation method of high-heat conductive efficency graphite composite sheet according to claim 3, it is characterised in that:The step
(d')In, its programming rate is 30 ~ 50 DEG C/h, and its cooling rate is 50 ~ 100 DEG C/h.
Priority Applications (1)
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CN201710546970.5A CN107221506A (en) | 2017-07-06 | 2017-07-06 | A kind of preparation method of high-heat conductive efficency graphite composite sheet |
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CN201710546970.5A CN107221506A (en) | 2017-07-06 | 2017-07-06 | A kind of preparation method of high-heat conductive efficency graphite composite sheet |
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US11175769B2 (en) | 2018-08-16 | 2021-11-16 | Apple Inc. | Electronic device with glass enclosure |
US11189909B2 (en) | 2018-08-30 | 2021-11-30 | Apple Inc. | Housing and antenna architecture for mobile device |
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US11099649B2 (en) | 2017-03-29 | 2021-08-24 | Apple Inc. | Device having integrated interface system |
US10656714B2 (en) | 2017-03-29 | 2020-05-19 | Apple Inc. | Device having integrated interface system |
US10915151B2 (en) | 2017-09-29 | 2021-02-09 | Apple Inc. | Multi-part device enclosure |
US11550369B2 (en) | 2017-09-29 | 2023-01-10 | Apple Inc. | Multi-part device enclosure |
US11175769B2 (en) | 2018-08-16 | 2021-11-16 | Apple Inc. | Electronic device with glass enclosure |
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US11189909B2 (en) | 2018-08-30 | 2021-11-30 | Apple Inc. | Housing and antenna architecture for mobile device |
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US10705570B2 (en) | 2018-08-30 | 2020-07-07 | Apple Inc. | Electronic device housing with integrated antenna |
US11955696B2 (en) | 2018-08-30 | 2024-04-09 | Apple Inc. | Housing and antenna architecture for mobile device |
US11812842B2 (en) | 2019-04-17 | 2023-11-14 | Apple Inc. | Enclosure for a wirelessly locatable tag |
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Application publication date: 20170929 |
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