CN110999648A - Cutting seedling method of ivy - Google Patents
Cutting seedling method of ivy Download PDFInfo
- Publication number
- CN110999648A CN110999648A CN201911392801.6A CN201911392801A CN110999648A CN 110999648 A CN110999648 A CN 110999648A CN 201911392801 A CN201911392801 A CN 201911392801A CN 110999648 A CN110999648 A CN 110999648A
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- cutting
- ivy
- seedling
- treatment solution
- broussonetia papyrifera
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G2/00—Vegetative propagation
- A01G2/10—Vegetative propagation by means of cuttings
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G17/00—Cultivation of hops, vines, fruit trees, or like trees
- A01G17/005—Cultivation methods
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G24/00—Growth substrates; Culture media; Apparatus or methods therefor
- A01G24/10—Growth substrates; Culture media; Apparatus or methods therefor based on or containing inorganic material
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G24/00—Growth substrates; Culture media; Apparatus or methods therefor
- A01G24/10—Growth substrates; Culture media; Apparatus or methods therefor based on or containing inorganic material
- A01G24/12—Growth substrates; Culture media; Apparatus or methods therefor based on or containing inorganic material containing soil minerals
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G24/00—Growth substrates; Culture media; Apparatus or methods therefor
- A01G24/10—Growth substrates; Culture media; Apparatus or methods therefor based on or containing inorganic material
- A01G24/12—Growth substrates; Culture media; Apparatus or methods therefor based on or containing inorganic material containing soil minerals
- A01G24/15—Calcined rock, e.g. perlite, vermiculite or clay aggregates
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- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Botany (AREA)
- Soil Sciences (AREA)
- Developmental Biology & Embryology (AREA)
- Cultivation Of Plants (AREA)
Abstract
The invention discloses a cutting seedling raising method of ivy, relating to the technical field of planting and comprising the following steps: selecting 1-2 year-old, strong and semi-lignified branches, cutting into 10-15cm, and removing bottom leaves; immersing the bottom ends of the cutting strips into a root treatment solution for soaking treatment, wherein the root treatment solution is prepared from raw materials including wicker, broussonetia papyrifera leaves and brown sugar; washing the cut surface of the treated cutting with clear water, drying, cutting the cut surface on a seedling substrate, wherein the cutting depth is 1/2-2/3 of the total length of the cutting, compacting the soil around the cutting, watering thoroughly, and placing the cutting in a bright place without direct sunlight; the temperature is controlled to be 15-20 ℃ and the relative humidity is controlled to be 85-90% during the seedling raising period. The method has the advantages of high cuttage survival rate of the ivy, developed root system and good growth vigor of the cultivated ivy seedlings, and the cultivation time can be shortened by about 6 days.
Description
Technical Field
The invention relates to the technical field of planting, in particular to a cutting seedling method of ivy.
Background
Hedera helix is a plant of Hedera helix of Hedera of Araliaceae, and has aerial root. The shape is beautiful and regular, the leaf color is dark green, and the ornamental value is high. Due to the advantages of evergreen, climbing ability, strong adaptability, shade resistance, easy maintenance and management and the like, in recent years, the garden is more and more widely applied, not only can be planted under the forest as a ground cover to fix soil and protect slope, but also can climb on the wall surface, the rockery and the shed frame. In addition, the ivy has strong tolerance and large absorption capacity to formaldehyde, and can beautify the family environment and absorb harmful gases such as formaldehyde by adopting potted plants and hanging pots to be arranged indoors or in front of windows and balconies. Therefore, in recent years, ivy has been widely popularized and applied as an excellent foliage plant, and the demand for seedlings is large.
The propagation method of the ivy includes seed propagation, cutting propagation and layering propagation. At present, cuttage is mostly adopted for propagation and seedling raising. However, the root growth rate is slow, the nutrition supply is insufficient and the root system is not developed by cutting propagation.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a method for raising seedlings of ivy by cutting, the method has the advantages of high survival rate of the ivy by cutting, developed root system and good growth vigor of the raised ivy seedlings, and the raising time can be shortened.
The invention provides a cutting seedling method of ivy, which comprises the following steps:
s1, selection of cuttings: selecting 1-2 year-old, strong and semi-lignified branches, cutting into 10-15cm, and removing bottom leaves;
s2, cutting processing: immersing the bottom ends of the cutting strips into a root treatment solution for soaking treatment, wherein the root treatment solution is prepared from raw materials including wicker, broussonetia papyrifera leaves and brown sugar;
s3, cuttage: washing the cut surface of the treated cutting with clear water, drying, cutting the cut surface on a seedling substrate, wherein the cutting depth is 1/2-2/3 of the total length of the cutting, compacting the soil around the cutting, watering thoroughly, and placing the cutting in a bright place without direct sunlight;
s4, management: the temperature is controlled to be 15-20 ℃ and the relative humidity is controlled to be 85-90% during the seedling raising period.
Preferably, in S1, the distance between the bottom end of the cutting and the nearest internode is 2.5-3 cm.
Preferably, in S2, the root treatment solution is prepared as follows: pulping broussonetia papyrifera leaves, and performing filter pressing to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaf residues, uniformly stirring, compacting, sealing and fermenting for 3-6 days, and performing filter pressing to obtain a filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely ground wicker, soaking for 18-24h, and filtering to obtain the final product.
Preferably, the broussonetia papyrifera leaves are pulped and subjected to pressure filtration, and the water content in the broussonetia papyrifera leaf residues after pressure filtration is controlled to be 45-55%.
Preferably, the mass ratio of the broussonetia papyrifera leaves, the willow twigs and the brown sugar is 100: 10-15: 1-1.5.
Preferably, in S2, the bottom end of the cutting is immersed in the root treatment solution for 3-5 hours for immersion.
Preferably, in S3, the seedling substrate is prepared from vermiculite, perlite, garden soil, turfy soil and slag according to the weight ratio of 1: 1: 7-8: 2-3: 1 mass ratio.
Preferably, in S3, the row spacing of the cuttage is 20-25cm, and the plant spacing is 17-22 cm.
Has the advantages that: the invention provides a cutting seedling raising method of ivy, which is characterized in that when cutting out a cutting, the distance between the bottom end part of the cutting and the nearest internode is controlled, and the cutting depth of the cutting is controlled, so that the position of the node of the cutting in a seedling raising substrate is controlled, and the rooting rate is improved; the cutting is treated by the root treatment solution, the broussonetia papyrifera solution in the treatment solution is rich in nutrient components and acts together with the wickers containing growth hormone, so that the root nutrient components are supplemented while the rooting of the cutting branches is promoted, the growth of the roots can be effectively promoted, and the immunity of the cutting is improved; the proportion of the seedling culture medium is beneficial to the rooting and sprouting of the ivy, and the seedling rate and the seedling culture quality are improved. The method has the advantages of high cuttage survival rate of the ivy, developed root system and good growth vigor of the cultivated ivy seedlings, and the cultivation time can be shortened by about 6 days.
Detailed Description
The technical solution of the present invention will be described in detail below with reference to specific examples.
Example 1
The invention provides a cutting seedling method of ivy, which comprises the following steps:
s1, selection of cuttings: selecting 1-year-old, strong and semi-lignified branches, cutting the branches into 10cm cuttings, removing bottom leaves, wherein the internode distance from the bottom end of each cutting to the nearest part is 2.5 cm;
s2, cutting processing: immersing the bottom end of the cutting into the root treatment solution for soaking for 3 h; wherein, the root treating fluid is prepared as follows: pulping broussonetia papyrifera leaves, performing filter pressing, and controlling the water content in the filter-pressed broussonetia papyrifera leaf residues to be 45% to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaves residues, uniformly stirring, compacting, sealing and fermenting for 3d, and carrying out filter pressing to obtain a filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely crushed wicker, soaking for 18h, and filtering to obtain a root treatment solution, wherein the mass ratio of the broussonetia papyrifera leaves, the wicker and the brown sugar is 100: 10: 1.5;
s3, cuttage: washing the cut surfaces of the treated cuttings with clear water, airing, cutting the cuttings onto a seedling raising substrate, wherein the cutting depth is 1/2 of the total length of the cuttings, the cutting row spacing is 20cm, the plant spacing is 172cm, compacting soil around the cuttings, watering thoroughly, and placing the cuttings in a bright place without direct sunlight; wherein, the seedling culture substrate is prepared from vermiculite, perlite, garden soil, turfy soil and furnace slag according to the proportion of 1: 1: 7: 3: 1, mixing the components in a mass ratio;
s4, management: the temperature is controlled to be 15-17 ℃ and the relative humidity is controlled to be 87-90% during the seedling raising period.
Example 2
The invention provides a cutting seedling method of ivy, which comprises the following steps:
s1, selection of cuttings: selecting 2-year-old, strong and semi-lignified branches, cutting the branches into 15cm cuttings, removing bottom leaves, wherein the internode distance from the bottom end of each cutting to the nearest part is 3 cm;
s2, cutting processing: immersing the bottom end of the cutting into the root treatment solution for soaking for 5 h; wherein, the root treating fluid is prepared as follows: pulping broussonetia papyrifera leaves, performing filter pressing, and controlling the water content in the filter-pressed broussonetia papyrifera leaf residues to be 55% to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaves residues, uniformly stirring, compacting, sealing and fermenting for 6 days, and performing filter pressing to obtain filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely crushed wicker, soaking for 24h, and filtering to obtain a root treatment solution, wherein the mass ratio of the broussonetia papyrifera leaves, the wicker and the brown sugar is 100: 15: 1;
s3, cuttage: washing the cut surface of the treated cutting with clear water, drying, cutting the cut surface on a seedling culture substrate, wherein the cutting depth is 2/3 of the total length of the cutting, the cutting row spacing is 25cm, the plant spacing is 22cm, compacting the soil around the cutting, watering thoroughly, and placing the cutting in a bright place without direct sunlight; wherein, the seedling culture substrate is prepared from vermiculite, perlite, garden soil, turfy soil and furnace slag according to the proportion of 1: 1: 8: 2: 1, mixing the components in a mass ratio;
s4, management: the temperature is controlled to be 18-20 ℃ and the relative humidity is controlled to be 85-88% during the seedling raising period.
Example 3
The invention provides a cutting seedling method of ivy, which comprises the following steps:
s1, selection of cuttings: selecting 1-2 year-old, strong and semi-lignified branches, cutting into 12cm cuttings, removing bottom leaves, wherein the internode distance from the bottom end of each cutting to the nearest part is 2.5 cm;
s2, cutting processing: immersing the bottom end of the cutting into the root treatment solution for soaking for 4 h; wherein, the root treating fluid is prepared as follows: pulping broussonetia papyrifera leaves, performing filter pressing, and controlling the water content in the filter-pressed broussonetia papyrifera leaf residues to 47% to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaves residues, uniformly stirring, compacting, sealing and fermenting for 4 days, and performing filter pressing to obtain filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely crushed wicker, soaking for 20h, and filtering to obtain a root treatment solution, wherein the mass ratio of the broussonetia papyrifera leaves, the wicker and the brown sugar is 100: 12: 1.1;
s3, cuttage: washing the cut surface of the treated cutting with clear water, drying, cutting the cut surface on a seedling culture substrate, wherein the cutting depth is 1/2 of the total length of the cutting, the cutting row spacing is 20cm, the plant spacing is 20cm, compacting the soil around the cutting, watering thoroughly, and placing the cutting in a bright place without direct sunlight; wherein, the seedling culture substrate is prepared from vermiculite, perlite, garden soil, turfy soil and furnace slag according to the proportion of 1: 1: 7.5: 2.5: 1, mixing the components in a mass ratio;
s4, management: the temperature is controlled to be 16-18 ℃ and the relative humidity is controlled to be 86-88% during the seedling raising period.
Example 4
The invention provides a cutting seedling method of ivy, which comprises the following steps:
s1, selection of cuttings: selecting 1-2 year-old, strong and semi-lignified branches, cutting into 13cm cuttings, removing bottom leaves, wherein the internode distance from the bottom end of each cutting to the nearest part is 3 cm;
s2, cutting processing: immersing the bottom end of the cutting into the root treatment solution for soaking for 4 h; wherein, the root treating fluid is prepared as follows: pulping broussonetia papyrifera leaves, performing filter pressing, and controlling the water content in the filter-pressed broussonetia papyrifera leaf residues to be 52% to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaves residues, uniformly stirring, compacting, sealing and fermenting for 5 days, and performing filter pressing to obtain filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely crushed wicker, soaking for 22h, and filtering to obtain a root treatment solution, wherein the mass ratio of the broussonetia papyrifera leaves, the wicker and the brown sugar is 100: 14: 1.3;
s3, cuttage: washing the cut surfaces of the treated cuttings with clear water, airing, cutting the cuttings onto a seedling raising substrate, wherein the cutting depth is 2/3 of the total length of the cuttings, the cutting row spacing is 25cm, the plant spacing is 20cm, compacting soil around the cuttings, watering thoroughly, and placing the cuttings in a bright place without direct sunlight; wherein, the seedling culture substrate is prepared from vermiculite, perlite, garden soil, turfy soil and furnace slag according to the proportion of 1: 1: 7: 2: 1, mixing the components in a mass ratio;
s4, management: the temperature is controlled to be 18-20 ℃ and the relative humidity is controlled to be 88-90% during the seedling raising period.
Comparative example 1
The difference from example 4 is only in the preparation of the root treatment solution in S2, which is prepared as follows: adding the coarsely crushed wickers into water, and soaking for 22h, wherein the mass ratio of the wickers to the water is 14: 75.
comparative example 2
Compared with embodiment 4, the difference is only that the step of processing the S2 cuttings is not included.
The method of examples 1-4 and comparative examples 1-2 are respectively adopted to carry out cuttage experiments, the cuttage survival rate of 200 seedlings of each group is respectively 99%, 98.5%, 99%, 99.5%, 98% and 86.5%, the rooting time of examples 1-4 is 13-14d, the rooting time of comparative example 1 is 16-17d, the rooting time of comparative example 2 is mostly 19-20d, and the root system of examples 1-4 is obviously developed compared with that of comparative examples 1-2.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A cutting seedling raising method of ivy is characterized by comprising the following steps:
s1, selection of cuttings: selecting 1-2 year-old, strong and semi-lignified branches, cutting into 10-15cm, and removing bottom leaves;
s2, cutting processing: immersing the bottom ends of the cutting strips into a root treatment solution for soaking treatment, wherein the root treatment solution is prepared from raw materials including wicker, broussonetia papyrifera leaves and brown sugar;
s3, cuttage: washing the cut surface of the treated cutting with clear water, drying, cutting the cut surface on a seedling substrate, wherein the cutting depth is 1/2-2/3 of the total length of the cutting, compacting the soil around the cutting, watering thoroughly, and placing the cutting in a bright place without direct sunlight;
s4, management: the temperature is controlled to be 15-20 ℃ and the relative humidity is controlled to be 85-90% during the seedling raising period.
2. The method for raising seedlings of ivy by cutting according to claim 1, wherein in S1, the distance between the bottom end of the cutting and the nearest internode is 2.5-3 cm.
3. The cutting seedling raising method of ivy according to claim 1, wherein in S2, the root treatment solution is prepared as follows: pulping broussonetia papyrifera leaves, and performing filter pressing to obtain filtrate a; adding brown sugar into the filter-pressed broussonetia papyrifera leaf residues, uniformly stirring, compacting, sealing and fermenting for 3-6 days, and performing filter pressing to obtain a filtrate b; mixing the filtrate a and the filtrate b, adding the coarsely ground wicker, soaking for 18-24h, and filtering to obtain the final product.
4. The cutting seedling method of ivy according to claim 3, wherein broussonetia papyrifera leaves are pulped and subjected to pressure filtration, and the water content in the paper mulberry leaf residue after pressure filtration is controlled to be 45-55%.
5. The ivy cutting seedling raising method according to claim 3 or 4, wherein the mass ratio of the broussonetia papyrifera leaves, the willow twigs and the brown sugar is 100: 10-15: 1-1.5.
6. The method for raising seedlings of ivy by cutting according to claim 1, wherein in S2, the bottom ends of the cuttings are immersed in the root treatment solution for 3-5 hours.
7. The cutting seedling method of ivy according to claim 1, wherein in S3, the seedling substrate is prepared from vermiculite, perlite, garden soil, turfy soil and furnace slag according to a ratio of 1: 1: 7-8: 2-3: 1 mass ratio.
8. The cutting seedling raising method of ivy according to claim 1, wherein in S3, the cutting row spacing is 20-25cm, and the plant spacing is 17-22 cm.
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| CN201911392801.6A CN110999648A (en) | 2019-12-30 | 2019-12-30 | Cutting seedling method of ivy |
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