CN1109085C - 多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 - Google Patents
多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 Download PDFInfo
- Publication number
- CN1109085C CN1109085C CN00114627A CN00114627A CN1109085C CN 1109085 C CN1109085 C CN 1109085C CN 00114627 A CN00114627 A CN 00114627A CN 00114627 A CN00114627 A CN 00114627A CN 1109085 C CN1109085 C CN 1109085C
- Authority
- CN
- China
- Prior art keywords
- tackiness agent
- organic solvent
- polyimide
- peroxide
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004642 Polyimide Substances 0.000 title claims abstract description 28
- 229920001721 polyimide Polymers 0.000 title claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 25
- 239000000853 adhesive Substances 0.000 title claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 title claims abstract description 10
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 229920001577 copolymer Polymers 0.000 title claims description 7
- 239000004411 aluminium Substances 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 37
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 239000000178 monomer Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000004132 cross linking Methods 0.000 claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 13
- 239000005030 aluminium foil Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims description 17
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 8
- 238000010992 reflux Methods 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- -1 Hydroxy ester Chemical class 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 229940043232 butyl acetate Drugs 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 4
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 claims description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 claims description 3
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 claims description 3
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 3
- 150000002978 peroxides Chemical class 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- BONVROUPOZRCDU-UHFFFAOYSA-N 2-hydroxyprop-2-enamide Chemical compound NC(=O)C(O)=C BONVROUPOZRCDU-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 125000005907 alkyl ester group Chemical group 0.000 claims description 2
- 229960001701 chloroform Drugs 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims 2
- 238000012512 characterization method Methods 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000977 initiatory effect Effects 0.000 abstract description 3
- 238000007334 copolymerization reaction Methods 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 12
- 239000002131 composite material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical class CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
测试项目 | 测试条件 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例6 | 对比例1 | 测试方法 |
剥离强度(kg/cm) | 常态 | 1.78 | 1.72 | 1.70 | 1.83 | 1.76 | 1.63 | GB/T13557第3.1条 |
125℃处理30分钟后 | 1.73 | 1.70 | 1.67 | 1.74 | 1.71 | 1.58 | GB/T13557第3.2条 | |
200℃热冲击处理后 | 1.66 | 1.63 | 1.61 | 1.68 | 1.65 | 1.52 | GB/T13557第3.3条 | |
三氯乙烯浸3分钟后 | 1.65 | 1.61 | 1.58 | 1.64 | 1.60 | 1.48 | GB/T13557第3.4条 | |
耐锡焊性(秒) | 260℃锡浴中 | >60 | >60 | >60 | >60 | >60 | >60 | IPC-TM-650-2.4B(方法A) |
体积电阻(MΩ·m) | 恒定湿热处理恢复后 | 2.6×106 | 3.4×106 | 2.8×106 | 5.1×106 | 3.1×106 | 2.5×106 | GB4722第5章 |
表面电阻(MΩ) | 恒定湿熟处理恢复后 | 2.3×105 | 3.0×105 | 2.5×105 | 3.8×105 | 2.6×105 | 1.9×105 | G84722第6章 |
介电常数(最大值) | 恒定湿热处理恢复后 | 3.6 | 3.4 | 3.1 | 3.8 | 3.3 | 3.4 | GB4722第9章 |
介质损耗角正切(最大值) | 恒定湿热处理恢复后 | 0.032 | 0.038 | 0.035 | 0.031 | 0.037 | 0.036 | GB4722第9章 |
垂直层向电气强度(KV/mm最小值) | 108 | 112 | 103 | 102 | 110 | 107 | GB4722第11章 | |
耐化学药品性 | 2NNaOH/10分钟 | 无变化 | 无变化 | 无变化 | 无变化 | 无变化 | 无变化 | IPC-TM-650-2.3.2A |
2NHC1溶液/10分钟 | 无变化 | 无变化 | 无变化 | 无变化 | 无变化 | 无变化 | ||
耐折性 | 246 | 264 | 227 | 341 | 374 | 115 | GB4722第4章 |
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN00114627A CN1109085C (zh) | 2000-06-13 | 2000-06-13 | 多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN00114627A CN1109085C (zh) | 2000-06-13 | 2000-06-13 | 多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1281883A CN1281883A (zh) | 2001-01-31 |
CN1109085C true CN1109085C (zh) | 2003-05-21 |
Family
ID=4584278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00114627A Expired - Lifetime CN1109085C (zh) | 2000-06-13 | 2000-06-13 | 多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1109085C (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100535072C (zh) * | 2005-06-16 | 2009-09-02 | 湖北省化学研究院 | 一种多层柔性印制电路用低流动性的改性丙烯酸酯胶粘剂及制备方法 |
CN101210160B (zh) * | 2006-12-30 | 2010-05-19 | 比亚迪股份有限公司 | 一种粘合剂组合物 |
CN101125932B (zh) * | 2007-07-24 | 2010-05-19 | 陕西科技大学 | 聚丙烯酸及其共聚物膜的制备工艺 |
CN101104702B (zh) * | 2007-07-24 | 2010-12-08 | 陕西科技大学 | 不同结晶度脂肪族聚酯膜的制备工艺 |
CN100567439C (zh) * | 2007-11-15 | 2009-12-09 | 沈阳飞机工业(集团)有限公司 | 聚硫密封胶溶解剂 |
US20110318630A1 (en) * | 2008-12-26 | 2011-12-29 | Zeon Corporation | Separator for lithium ion secondary battery and lithium ion secondary battery |
CN101851430B (zh) * | 2009-04-03 | 2012-07-18 | 上海锦湖日丽塑料有限公司 | 一种聚合物合金的光泽改善方法 |
CN101875828B (zh) * | 2009-04-28 | 2012-04-25 | 中国科学院过程工程研究所 | 医用亲水性聚丙烯酸酯压敏胶粘剂及制备方法 |
CN101792641B (zh) * | 2010-02-08 | 2012-05-30 | 胡云睿 | 铝合金与pvc薄膜快速粘接用环保粘合剂与制备及应用 |
CN102031077B (zh) * | 2010-10-29 | 2012-05-09 | 明基材料有限公司 | 黏着剂组成物及黏着层 |
CN102485813A (zh) * | 2010-12-01 | 2012-06-06 | 成都市新津托展油墨有限公司 | 一种醇水性塑料凹版调金油的制备方法 |
CN102744934B (zh) * | 2012-06-28 | 2016-06-15 | 东莞市群跃电子材料科技有限公司 | Led软灯条用双面覆铜基材结构及制造方法 |
CN102838951B (zh) * | 2012-09-28 | 2014-05-28 | 广东多正化工科技有限公司 | 一种金属包覆胶粘剂及其制备方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1036393A (zh) * | 1987-10-14 | 1989-10-18 | 罗姆和哈斯公司 | 含低分子量聚合物添加剂的粘合剂组合物 |
EP0411551A2 (en) * | 1989-08-01 | 1991-02-06 | E.I. Du Pont De Nemours And Company | Multilayer interconnects |
CN1053079A (zh) * | 1989-12-27 | 1991-07-17 | 黄英经 | 一种制鞋用粘合剂 |
CN1054786A (zh) * | 1990-03-07 | 1991-09-25 | 中国科学院大连化学物理研究所 | 一种建筑密封胶 |
CN1071681A (zh) * | 1991-10-19 | 1993-05-05 | 薛志纯 | 皮革胶粘剂 |
CN1073467A (zh) * | 1989-05-02 | 1993-06-23 | 林特克株式会社 | 压敏胶组合物和使用该组合物的压敏胶粘合片等 |
JPH08104859A (ja) * | 1989-01-17 | 1996-04-23 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
CN1128782A (zh) * | 1995-08-03 | 1996-08-14 | 湖北省化学研究所 | 用于柔性印刷电路的耐高温胶粘剂及制备 |
CN1135512A (zh) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | 水乳液纸塑复合胶粘剂 |
WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
-
2000
- 2000-06-13 CN CN00114627A patent/CN1109085C/zh not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1036393A (zh) * | 1987-10-14 | 1989-10-18 | 罗姆和哈斯公司 | 含低分子量聚合物添加剂的粘合剂组合物 |
JPH08104859A (ja) * | 1989-01-17 | 1996-04-23 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
CN1073467A (zh) * | 1989-05-02 | 1993-06-23 | 林特克株式会社 | 压敏胶组合物和使用该组合物的压敏胶粘合片等 |
EP0411551A2 (en) * | 1989-08-01 | 1991-02-06 | E.I. Du Pont De Nemours And Company | Multilayer interconnects |
CN1053079A (zh) * | 1989-12-27 | 1991-07-17 | 黄英经 | 一种制鞋用粘合剂 |
CN1054786A (zh) * | 1990-03-07 | 1991-09-25 | 中国科学院大连化学物理研究所 | 一种建筑密封胶 |
CN1071681A (zh) * | 1991-10-19 | 1993-05-05 | 薛志纯 | 皮革胶粘剂 |
CN1135512A (zh) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | 水乳液纸塑复合胶粘剂 |
WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
CN1128782A (zh) * | 1995-08-03 | 1996-08-14 | 湖北省化学研究所 | 用于柔性印刷电路的耐高温胶粘剂及制备 |
Also Published As
Publication number | Publication date |
---|---|
CN1281883A (zh) | 2001-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1109085C (zh) | 多元共聚丙烯酸酯胶粘剂及制备和在聚酰亚胺覆铝板上的应用 | |
US5621068A (en) | Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate | |
CN1913751A (zh) | 布线电路基板 | |
CN106867435B (zh) | 一种挠性印制电路聚酰亚胺补强板用改性丙烯酸酯胶粘剂及其应用 | |
JP4600640B2 (ja) | アクリル系接着剤シート | |
CN100535072C (zh) | 一种多层柔性印制电路用低流动性的改性丙烯酸酯胶粘剂及制备方法 | |
CN1075543C (zh) | 用于柔性印刷电路的耐高温阻燃胶粘剂及制备 | |
CN1837315A (zh) | 用于多层柔性印刷电路的一种低流动性丙烯酸酯胶 | |
CN110791219A (zh) | 一种ffc用聚酯热熔胶膜的制备方法及其聚酯热熔胶膜 | |
CN113308091B (zh) | 一种液晶聚酯树脂组合物及其应用 | |
CN1057318C (zh) | 用于柔性印刷电路的耐高温胶粘剂及制备 | |
CN113930212B (zh) | 一种低介电损耗挠性热固型粘结剂及其制备方法 | |
CN1109086C (zh) | 一种柔性印刷电路用的反应型阻燃胶粘剂及制备 | |
CN1438286A (zh) | 挠性印刷线路板固定用粘接剂片和挠性印刷线路板上安装电子件法 | |
CN1151921C (zh) | 聚酰亚胺覆镍箔及其制备 | |
US5162439A (en) | Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents | |
US4587162A (en) | Resin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivative | |
US5162438A (en) | Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents | |
JP4195590B2 (ja) | エポキシ樹脂層を有するボンディングシートおよびその製造方法 | |
CN116080157B (zh) | 一种印制电路用覆铜箔环氧玻纤布层压板 | |
JP2572835B2 (ja) | 配線板用樹脂組成物およびプリプレグ | |
JPH0311307B2 (zh) | ||
JPH08231933A (ja) | Tab用キャリアテープ | |
JP2715853B2 (ja) | 銅張り積層板の製造方法 | |
JPH10102025A (ja) | フレキシブルプリント配線板用銅張積層板およびフレキシブルプリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HUASHUO SCIENCE CO., LTD. Free format text: FORMER NAME: HUBEI PROV. CHEMICAL RESEARCH INST. |
|
CP01 | Change in the name or title of a patent holder |
Address after: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee after: Huashuo Technology Co., Ltd. Address before: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee before: Hubei Research Institute of Chemistry |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide Effective date of registration: 20100907 Granted publication date: 20030521 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20151106 Granted publication date: 20030521 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20151106 Registration number: 2010990000869 Pledgee after: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgee before: Bank of Hankou, Limited by Share Ltd, Optics Valley branch |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20030521 |