CN110888506A - Multimedia dual-core industrial control mainboard - Google Patents
Multimedia dual-core industrial control mainboard Download PDFInfo
- Publication number
- CN110888506A CN110888506A CN201911195859.1A CN201911195859A CN110888506A CN 110888506 A CN110888506 A CN 110888506A CN 201911195859 A CN201911195859 A CN 201911195859A CN 110888506 A CN110888506 A CN 110888506A
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- China
- Prior art keywords
- groove
- mainboard
- heat dissipation
- motherboard
- expansion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a multimedia dual-core industrial control mainboard which comprises a mainboard body, a first expansion mainboard and a second expansion mainboard, wherein the mainboard body, the first expansion mainboard and the second expansion mainboard are connected through a plurality of connecting mechanisms, a heat dissipation plate is arranged above the mainboard body and is connected with the mainboard body through a plurality of positioning devices, a plurality of heat dissipation grooves are formed in the upper end of the heat dissipation plate, heat dissipation fans are arranged in the heat dissipation grooves, a through groove is formed in the upper end of the heat dissipation plate in a penetrating manner, a sealing device is arranged in the through groove, device grooves are formed in opposite side walls of the heat dissipation plate in a penetrating manner, and a plurality of groups of mounting grooves are formed in opposite inner walls of the two device grooves at equal intervals. The invention has reasonable structural design, can quickly radiate heat aiming at the mainboard and parts thereof, can customize the mainboard and can customize the number of radiating fins.
Description
Technical Field
The invention relates to the technical field of mainboards, in particular to a multimedia dual-core industrial control mainboard.
Background
The mainboard is also called a mainboard, a system board or a motherboard; the main board is generally a rectangular circuit board, on which the main circuit system for forming the computer is mounted, and generally includes elements of BIOS chip, I/O control chip, keyboard and panel control switch interface, indicator lamp plug-in unit, expansion slot, main board and direct current power supply plug-in unit of plug-in card, etc.
In the prior art, when the mainboard applied to a special field is used, the radiating effect of parts on the mainboard is very poor due to an excessively sealed environment, the parts are aged for a long time, the service life is shortened, the general mainboard does not have self-defining performance, and the special requirement that some people want to define the mainboard cannot be met, so that the multimedia dual-core industrial control mainboard is provided to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a multimedia dual-core industrial control mainboard.
In order to achieve the purpose, the invention adopts the following technical scheme:
the multimedia dual-core industrial control mainboard comprises a mainboard body, a first expansion mainboard and a second expansion mainboard, wherein the mainboard body, the first expansion mainboard and the second expansion mainboard are connected through a plurality of connecting mechanisms, a heat dissipation plate is arranged above the mainboard body and is connected with the mainboard body through a plurality of positioning devices, a plurality of heat dissipation grooves are formed in the upper end of the heat dissipation plate, heat dissipation fans are arranged in the heat dissipation grooves, through grooves are formed in the upper end of the heat dissipation plate in a penetrating manner, sealing devices are arranged in the through grooves, device grooves are formed in opposite side walls of the heat dissipation plate in a penetrating manner, a plurality of groups of mounting grooves are formed in opposite inner walls of the two device grooves at equal intervals, one group of mounting grooves consists of two mounting grooves which correspond up and down in position, a plurality of heat dissipation fins are arranged in the two device grooves, and mounting plates are fixedly connected to the upper ends and the lower ends of the, the mounting plates are respectively positioned in the mounting grooves, and the heating panel is provided with a limiting mechanism corresponding to the positions of the plurality of groups of mounting grooves in a penetrating manner.
Preferably, the connecting mechanism includes a connecting rod disposed on the first expansion motherboard or the second expansion motherboard, the connecting rod is fixedly connected to the first expansion motherboard or the second expansion motherboard through a fixing screw, two fixing plates are fixedly connected to the back side of the motherboard body, an elastic clamping band is fixedly connected between the two fixing plates, and the other end of the connecting rod penetrates through the elastic clamping band and abuts against the elastic clamping band.
Preferably, the positioning device comprises a positioning rod fixedly connected to the inner side wall of the heat dissipation plate, the main plate body is provided with a positioning hole in a penetrating mode, the positioning rod penetrates through the positioning hole, one end, penetrating through the positioning hole, of the positioning rod is provided with an external thread and a threaded cover in threaded connection, and a cushion pad is arranged on the side wall of the threaded cover.
Preferably, sealing device is including establishing the shrouding at logical inslot, it is equipped with the draw-in groove to run through on the inner wall that leads to the groove, fixedly connected with straight-bar on the inner wall of draw-in groove, the cover is equipped with the loop bar on the straight-bar, the other end of loop bar and the lateral wall fixed connection of shrouding, on the opposite side lateral wall of shrouding and between the inner wall that leads to the groove fixedly connected with plastic connecting piece.
Preferably, the limiting mechanism comprises a through groove penetrating through the heat dissipation plate, the through groove is communicated with one mounting groove, a limiting rod penetrates through the through groove, the limiting rod is located at one end outside the through groove and fixedly connected with a pressing plate, a fixing block is fixedly connected to the inner wall of the through groove, a connecting block is fixedly connected to the side wall of the limiting rod, a spring is sleeved on the limiting rod, two ends of the spring are respectively and elastically connected with the side wall of the fixing block and the side wall of the connecting block, a limiting hole penetrates through the upper end of the mounting plate located in the mounting groove corresponding to the through groove, and the tail end of the limiting rod penetrates through the through groove and extends into the limiting hole.
Preferably, a plurality of first mounting holes are formed in the side wall of the main board body in a penetrating manner, a plurality of second mounting holes are formed in the first expansion main board in a penetrating manner, and a plurality of third mounting holes are formed in the second expansion main board in a penetrating manner.
Preferably, the plurality of cooling fans are arranged on two sides of the through groove in a pairwise manner.
Preferably, a plurality of the heat dissipation fins are each designed in a polygonal trapezoidal shape.
The invention has the following beneficial effects;
1. the heat dissipation plate, the heat dissipation fan and the plurality of heat dissipation fins are arranged to be matched with each other, so that the heat dissipation can be carried out in all directions on the mainboard, and the active heat dissipation and the passive heat dissipation act together to drive airflow on the surface of the mainboard to flow, reduce heat, prevent hardware from aging and prolong the service life of the mainboard;
2. through setting up the mainboard body, first expand the mainboard, the second expands the mainboard, coupling mechanism, stop gear mutually supports with a plurality of heat radiation fins, the mainboard can be by-user-defined size, can be by-user-defined expand the mainboard, coupling mechanism makes when expanding the mainboard more convenient, conveniently align the circuit, conveniently etch circuit and welding, heat radiation fins's quantity also can be by-user-defined, consider heat radiation fins's price, the user can confirm the quantity of heat radiation fins who needs to use to the in-service use environment, be favorable to economic resources management, economic benefits is improved.
Drawings
Fig. 1 is a schematic structural diagram of a multimedia dual-core industrial control motherboard according to the present invention;
fig. 2 is a schematic side view of a multimedia dual-core industrial control motherboard according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
fig. 4 is a partial cross-sectional view of a heat dissipation plate of the multimedia dual-core industrial control motherboard according to the present invention;
fig. 5 is a schematic back view of the multimedia dual-core industrial control motherboard according to the present invention;
fig. 6 is a schematic view of a heat dissipation fin structure of the multimedia dual-core industrial control motherboard according to the present invention.
In the figure: 1 heating panel, 2 mainboard bodies, 3 clamp plates, 4 first mounting holes, 5 first expansion mainboards, 6 connecting rods, 7 second mounting holes, 8 radiating grooves, 9 radiating fans, 10 through grooves, 11 plastic connecting pieces, 12 sealing plates, 13 loop bars, 14 second expansion mainboards, 15 third mounting holes, 16 threaded covers, 17 buffer pads, 18 positioning rods, 19 radiating fins, 20 device grooves, 21 limiting holes, 22 limiting rods, 23 fixing blocks, 24 springs, 25 connecting blocks, 26 mounting plates, 27 straight rods, 28 clamping grooves, 29 fixing screws, 30 fixing plates, 31 elastic clamping belts and 32 positioning holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-6, a multimedia dual-core industrial control motherboard includes a motherboard body 2, a first expansion motherboard 5 and a second expansion motherboard 14, the first expansion motherboard 5 and the second expansion motherboard 14 are made of the same material as the motherboard body 2 and have additional functional areas, a plurality of first mounting holes 4 are formed through the side wall of the motherboard body 2, a plurality of second mounting holes 7 are formed through the first expansion motherboard 5, a plurality of third mounting holes 15 are formed through the second expansion motherboard 14, each mounting hole is convenient for an operator to mount the device, the motherboard body 2 is connected with the first expansion motherboard 5 and the second expansion motherboard 14 through a plurality of connecting mechanisms, each connecting mechanism includes a connecting rod 6 disposed on the first expansion motherboard 5 or the second expansion motherboard 14, the connecting rod 6 is fixedly connected to the first expansion motherboard 5 or the second expansion motherboard 14 through a fixing screw 29, two fixed plates 30 of dorsal part fixedly connected with of mainboard body 2, fixedly connected with elasticity cassette tape 31 between two fixed plates 30, the elasticity of elasticity cassette tape 31 is tight enough, can be spacing to connecting rod 6, and the other end of connecting rod 6 runs through elasticity cassette tape 31 and offsets with elasticity cassette tape 31.
Wherein, mainboard body 2's top is equipped with heating panel 1, heating panel 1 is connected with mainboard body 2 through a plurality of positioner, positioner includes locating lever 18 of fixed connection on 1 inside wall of heating panel, it is equipped with locating hole 32 to run through on mainboard body 2, locating lever 18 runs through locating hole 32, locating lever 18 runs through the one end that locating hole 32 is equipped with external screw thread and threaded connection has screw cap 16, be equipped with blotter 17 on screw cap 16's the lateral wall, when needs expand mainboard body 2, need keep flat mainboard body 2 on the workstation, and each blotter 17 has just played the benefit that prevents the spare part damage on mainboard body 2 this moment, the effect of support has been played, make things convenient for mainboard body 2 to weld and expand, a smooth operation environment is provided.
Specifically, the upper end of heating panel 1 is equipped with a plurality of radiating grooves 8, all be equipped with radiator fan 9 in a plurality of radiating grooves 8, the upper end of heating panel 1 is run through and is equipped with logical groove 10, two liang of branch of a plurality of radiator fan 9 are listed as in the both sides that lead to groove 10, radiator fan 9 can be discharged a large amount of heats that mainboard body 2 sent, reduce the part rate of ageing, extension mainboard body 2 life, it is equipped with sealing device to lead to inslot 10, sealing device is including establishing shrouding 12 in leading to groove 10, it is equipped with draw-in groove 28 to run through on the inner wall that leads to groove 10, fixedly connected with straight-bar 27 on the inner wall of draw-in groove 28, the cover is equipped with loop bar 13 on the straight-bar 27, the other end of loop bar 13 and the lateral wall fixed connection of.
In the invention, device grooves 20 are respectively penetrated through opposite side walls of a heat dissipation plate 1, a plurality of groups of mounting grooves are uniformly arranged on opposite inner walls in two device grooves 20 at equal intervals, one group of mounting grooves consists of two mounting grooves which are vertically corresponding, a plurality of heat dissipation fins 19 are respectively arranged in the two device grooves 20, the plurality of heat dissipation fins 19 are respectively designed into a polygonal trapezoid shape, the upper end and the lower end of each heat dissipation fin 19 are respectively fixedly connected with a mounting plate 26, the plurality of mounting plates 26 are respectively positioned in the mounting grooves, the heat dissipation plate 1 is penetrated and provided with a limiting mechanism corresponding to the plurality of groups of mounting grooves, the limiting mechanism comprises a penetrating groove penetrating through the heat dissipation plate 1, the penetrating groove is communicated with one mounting groove, a limiting rod 22 penetrates through the penetrating groove, one end of the limiting rod 22 positioned outside the penetrating groove is fixedly connected with a pressing plate 3, and a fixing block 23 is, fixedly connected with connecting block 25 on the lateral wall of gag lever post 22, the cover is equipped with spring 24 on the gag lever post 22, spring 24's both ends respectively with the lateral wall of fixed block 23 and the lateral wall elastic connection of connecting block 25, the upper end that is located the mounting panel 26 that this runs through the mounting groove and corresponds runs through and is equipped with spacing hole 21, the tail end of gag lever post 22 runs through and runs through the groove and extend to in the spacing hole 21.
In the invention, when the mainboard is connected and installed, firstly, the heat dissipation plate 1 is installed on the mainboard body 2, each positioning hole 32 on the mainboard body 2 and a plurality of positioning rods 18 fixed on the heat dissipation plate 1 are aligned, each positioning rod 18 is inserted into each positioning hole 32, then a screw cap 16 is screwed on each positioning rod 18 at the back of the mainboard body 2, each screw cap 16 is screwed to fix the heat dissipation plate 1 on the mainboard body 2, then the number of heat dissipation fins 19 required to be used is determined according to the actual use environment, the heat dissipation fins 19 required to be used are inserted into each group of mounting grooves, the mounting plates 26 at the upper end and the lower end of the heat dissipation fins 19 respectively enter two corresponding mounting grooves at the upper end and the lower end, when the mounting plate 26 positioned at the upper end enters the mounting groove, the pressure plate 3 at the corresponding position is pulled out from the surface of the heat dissipation plate 1, the pressure plate 3 drives the limiting rod 22 at, the springs 24 at the corresponding positions are driven to contract, the mounting plate 26 is smoothly inserted into the mounting grooves, and then the pressing plate 3 is loosened, if the remaining heat dissipation fins 19 are mounted in the device grooves 20, the plastic connecting piece 11 is buckled and broken when the mainboard chip is mounted, and the sealing plate 12 is pushed into the clamping groove 28 to be hidden.
When the mainboard body 2 needs to be expanded, the elastic clamping bands 31 at the corresponding positions are pulled away, the connecting rods 6 on the first expansion mainboard 5 and the second expansion mainboard 14 are respectively inserted between the elastic clamping bands 31 for positioning, and then etching and welding are carried out according to actual circuits.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The multimedia dual-core industrial control mainboard comprises a mainboard body (2), a first expansion mainboard (5) and a second expansion mainboard (14), and is characterized in that the mainboard body (2), the first expansion mainboard (5) and the second expansion mainboard (14) are connected through a plurality of connecting mechanisms, a heat dissipation plate (1) is arranged above the mainboard body (2), the heat dissipation plate (1) is connected with the mainboard body (2) through a plurality of positioning devices, a plurality of heat dissipation grooves (8) are arranged at the upper end of the heat dissipation plate (1), heat dissipation fans (9) are arranged in the plurality of heat dissipation grooves (8), a through groove (10) is arranged at the upper end of the heat dissipation plate (1) in a penetrating manner, a sealing device is arranged in the through groove (10), device grooves (20) are arranged on opposite side walls of the heat dissipation plate (1) in a penetrating manner, and a plurality of groups of mounting grooves are arranged on opposite inner walls in the two device grooves (20) at equal intervals, a set of mounting groove comprises two mounting grooves that correspond from top to bottom by the position, two all be equipped with a plurality of heat radiation fins (19), it is a plurality of in device groove (20) the equal fixedly connected with mounting panel (26) in upper and lower both ends of heat radiation fins (19), it is a plurality of mounting panel (26) are located each mounting groove respectively, heating panel (1) runs through and is equipped with the stop gear corresponding with multiunit mounting groove position.
2. The multimedia dual-core industrial control motherboard according to claim 1, wherein the connecting mechanism comprises a connecting rod (6) disposed on the first expansion motherboard (5) or the second expansion motherboard (14), the connecting rod (6) is fixedly connected to the first expansion motherboard (5) or the second expansion motherboard (14) by a fixing screw (29), two fixing plates (30) are fixedly connected to the back side of the motherboard body (2), an elastic clamping band (31) is fixedly connected between the two fixing plates (30), and the other end of the connecting rod (6) penetrates through the elastic clamping band (31) and abuts against the elastic clamping band (31).
3. The multimedia dual-core industrial control mainboard of claim 1, wherein the positioning device comprises a positioning rod (18) fixedly connected to the inner side wall of the heat dissipation plate (1), a positioning hole (32) is formed in the mainboard body (2) in a penetrating manner, the positioning rod (18) penetrates through the positioning hole (32), one end of the positioning rod (18) penetrating through the positioning hole (32) is provided with an external thread and is in threaded connection with a threaded cap (16), and a buffer pad (17) is arranged on the side wall of the threaded cap (16).
4. The multimedia dual-core industrial control mainboard of claim 1, wherein the sealing device comprises a sealing plate (12) disposed in the through groove (10), a clamping groove (28) is disposed through an inner wall of the through groove (10), a straight rod (27) is fixedly connected to an inner wall of the clamping groove (28), a sleeve rod (13) is sleeved on the straight rod (27), the other end of the sleeve rod (13) is fixedly connected to a side wall of the sealing plate (12), and a plastic connector (11) is fixedly connected between the other side wall of the sealing plate (12) and the inner wall of the through groove (10).
5. The multimedia dual-core industrial control mainboard of claim 1, wherein the limiting mechanism comprises a through groove penetrating through the heat dissipation plate (1), the through groove is communicated with one mounting groove, a limiting rod (22) is arranged in the through groove in a penetrating way, one end of the limiting rod (22) which is positioned outside the through groove is fixedly connected with a pressing plate (3), a fixed block (23) is fixedly connected on the inner wall of the through groove, a connecting block (25) is fixedly connected on the side wall of the limiting rod (22), a spring (24) is sleeved on the limiting rod (22), two ends of the spring (24) are respectively and elastically connected with the side wall of the fixing block (23) and the side wall of the connecting block (25), a limiting hole (21) is arranged at the upper end of the mounting plate (26) in the mounting groove corresponding to the through groove in a penetrating way, the tail end of the limiting rod (22) penetrates through the through groove and extends into the limiting hole (21).
6. The multimedia dual-core industrial control motherboard according to claim 1, wherein a plurality of first mounting holes (4) are formed through the sidewall of the motherboard body (2), a plurality of second mounting holes (7) are formed through the first extended motherboard (5), and a plurality of third mounting holes (15) are formed through the second extended motherboard (14).
7. The multimedia dual-core industrial control motherboard according to claim 1, wherein a plurality of said heat dissipation fans (9) are arranged on both sides of the through slot (10) in pairs.
8. The multimedia dual-core industrial control motherboard according to claim 1, wherein a plurality of the heat dissipation fins (19) are each designed in a polygonal trapezoidal shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911195859.1A CN110888506B (en) | 2019-11-29 | 2019-11-29 | Multimedia dual-core industrial control mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911195859.1A CN110888506B (en) | 2019-11-29 | 2019-11-29 | Multimedia dual-core industrial control mainboard |
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| CN110888506A true CN110888506A (en) | 2020-03-17 |
| CN110888506B CN110888506B (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911195859.1A Active CN110888506B (en) | 2019-11-29 | 2019-11-29 | Multimedia dual-core industrial control mainboard |
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| CN2807480Y (en) * | 2005-04-27 | 2006-08-16 | 凌华科技股份有限公司 | Radiating module |
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| CN102403418A (en) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | Manufacturing method of high-power LED radiating structure |
| CN103747608B (en) * | 2013-12-13 | 2017-03-15 | 深圳市同为数码科技股份有限公司 | A kind of Anti-off movable heat conduction structure |
| CN205987553U (en) * | 2016-08-25 | 2017-02-22 | 睿芯信息科技（上海）有限公司 | Embedded but expander circuit board |
| CN209563078U (en) * | 2018-11-15 | 2019-10-29 | 贵州浪潮英信科技有限公司 | The server cooling fin of interchangeable radiating fin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040156171A1 (en) * | 2003-02-07 | 2004-08-12 | Dong Shun Chi | Heat sink clip |
| CN101605427A (en) * | 2009-06-29 | 2009-12-16 | 中国电子科技集团公司第十研究所 | One-way separation type extensible interconnection mother board |
| CN204374875U (en) * | 2015-01-21 | 2015-06-03 | 北京砺石高科信息技术有限公司 | A kind of mainboard heat ink |
| CN206251499U (en) * | 2016-12-23 | 2017-06-13 | 河北科技大学 | A kind of mechanical and electric equipment installation support base with heat sinking function |
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| CN110888506B (en) | 2021-06-25 |
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