CN204374875U - A kind of mainboard heat ink - Google Patents
A kind of mainboard heat ink Download PDFInfo
- Publication number
- CN204374875U CN204374875U CN201520039531.1U CN201520039531U CN204374875U CN 204374875 U CN204374875 U CN 204374875U CN 201520039531 U CN201520039531 U CN 201520039531U CN 204374875 U CN204374875 U CN 204374875U
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- Prior art keywords
- heat
- radiating fin
- radiating
- mainboard
- short
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Abstract
The utility model relates to a kind of mainboard heat ink, comprise heat-radiating substrate, this heat-radiating substrate is connected with mainboard and contacts with the CPU forming surface on mainboard, described heat-radiating substrate is arranged at intervals with long radiating fin and short radiating fin, and described long radiating fin is identical with the thickness of short radiating fin, all be welded on heat-radiating substrate, heat radiation riser is provided with vertically upward in the both sides of heat-radiating substrate, heat radiation riser is provided with radiator fan, described long radiating fin and short radiating fin offer louvre.The utility model structure is simple, reasonable in design, by heat-radiating substrate, heat radiation riser, long radiating fin, short radiating fin and radiator fan are used in combination, make it have good heat conduction and radiating effect, reduce system wind resistance, improve the draught capacity of system fan, therefore can reduce the requirement of the power to radiator fan.
Description
Technical field
The utility model relates to computer fittings technical field, particularly relates to a kind of mainboard heat ink.
Background technology
Along with the development of mankind's science and technology, computing machine has been not only a high-tech product, and the necessity of human lives especially, people are in work, study even leisure, and all be unable to do without computing machine, computing machine plays indispensable effect.It has penetrated into the every field of national economy and society, greatly changes the mode of production and life of people, and becomes the huge production power promoting social development.Its application has expanded to the every field of present society from initial military research field, formed huge computer industry, has driven the technical progress of global range, has caused deep social change thus.Computing machine enters common people house throughout school, enterprises and institutions, becomes the requisite instrument of information society.It is the important symbol that the mankind enter the information age.
Current computing machine first problems faced dispels the heat and noise exactly, considers complicacy and the equipment dependability of structure, still using air-cooled as main radiating mode.The various heater element heats of present stage are all by installing provided with fan in heating radiator or casing additional, but the heat produced due to various heater element still can conduct to the Copper Foil on computer main board by its pin, the temperature of mainboard is raised, in time heat can not be distributed, reduce its serviceable life.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of mainboard heat ink.
The utility model is achieved through the following technical solutions:
A kind of mainboard heat ink, comprise heat-radiating substrate, this heat-radiating substrate is connected with mainboard and contacts with the CPU forming surface on mainboard, described heat-radiating substrate is arranged at intervals with long radiating fin and short radiating fin, and described long radiating fin is identical with the thickness of short radiating fin, is all be welded on heat-radiating substrate, is provided with heat radiation riser vertically upward in the both sides of heat-radiating substrate, heat radiation riser is provided with radiator fan, described long radiating fin and short radiating fin offer louvre.
As optimal technical scheme of the present utility model, described radiator fan comprises turning axle, installation blade on the rotary shaft, and the periphery of described blade is provided with heat dissipation air hood, and heat dissipation air hood is provided with the flange for being connected on heat radiation riser.
As optimal technical scheme of the present utility model, described flange offers mounting hole downwards.
As optimal technical scheme of the present utility model, described heat-radiating substrate and heat radiation riser all adopt copper material to make, and described long radiating fin and short radiating fin adopt alumina based material to make.
Compared with prior art, the beneficial effects of the utility model are: the utility model structure is simple, reasonable in design, by heat-radiating substrate, heat radiation riser, long radiating fin, short radiating fin and radiator fan are used in combination, make it have good heat conduction and radiating effect, reduce system wind resistance, improve the draught capacity of system fan, therefore can reduce the requirement of the power to radiator fan.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model;
Fig. 2 is vertical view of the present utility model;
Fig. 3 is axonometric drawing of the present utility model.
In figure: 10-heat-radiating substrate; The long radiating fin of 20-; The short radiating fin of 30-; 40-dispels the heat riser; 50-radiator fan; 60-louvre; 70-turning axle; 80-blade; 90-heat dissipation air hood; 100-flange; 110-mounting hole.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is front view of the present utility model, and Fig. 2 is vertical view of the present utility model, and Fig. 3 is axonometric drawing of the present utility model.
Described a kind of mainboard heat ink, comprise heat-radiating substrate 10, this heat-radiating substrate 10 is connected with mainboard and contacts with the CPU forming surface on mainboard, described heat-radiating substrate 10 is arranged at intervals with long radiating fin 20 and short radiating fin 30, and described long radiating fin 20 is identical with the thickness of short radiating fin 30, all be welded on heat-radiating substrate 10, heat radiation riser 40 is provided with vertically upward in the both sides of heat-radiating substrate 10, heat radiation riser 40 is provided with radiator fan 50, described long radiating fin 20 and short radiating fin 30 offer louvre 60.By heat-radiating substrate 10, heat radiation riser 40, long radiating fin 20, short radiating fin 30 and radiator fan 50 are used in combination, make it have good heat conduction and radiating effect, reduce system wind resistance, improve the draught capacity of system fan, therefore can reduce the requirement of the power to radiator fan.
Described radiator fan 50 comprises turning axle 70, the blade 80 be arranged on turning axle 70, the periphery of described blade 80 is provided with heat dissipation air hood 90, heat dissipation air hood 90 is provided with the flange 100 for being connected on heat radiation riser 40, described flange 100 offers mounting hole 110 downwards.
In the present embodiment: described heat-radiating substrate 10 and heat radiation riser 40 all adopt copper material to make, and described long radiating fin 20 and short radiating fin 30 adopt alumina based material to make.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (4)
1. a mainboard heat ink, it is characterized in that: comprise heat-radiating substrate (10), this heat-radiating substrate (10) is connected with mainboard and contacts with the CPU forming surface on mainboard, described heat-radiating substrate (10) is arranged at intervals with long radiating fin (20) and short radiating fin (30), and described long radiating fin (20) is identical with the thickness of short radiating fin (30), all be welded on heat-radiating substrate (10), heat radiation riser (40) is provided with vertically upward in the both sides of heat-radiating substrate (10), heat radiation riser (40) is provided with radiator fan (50), described long radiating fin (20) and short radiating fin (30) offer louvre (60).
2. a kind of mainboard heat ink according to claim 1, it is characterized in that: described radiator fan (50) comprises turning axle (70), the blade (80) be arranged on turning axle (70), the periphery of described blade (80) is provided with heat dissipation air hood (90), and heat dissipation air hood (90) is provided with the flange (100) for being connected in heat radiation riser (40).
3. a kind of mainboard heat ink according to claim 2, is characterized in that: described flange (100) offers mounting hole (110) downwards.
4. a kind of mainboard heat ink according to claim 1, it is characterized in that: described heat-radiating substrate (10) and heat radiation riser (40) all adopt copper material to make, described long radiating fin (20) and short radiating fin (30) adopt alumina based material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039531.1U CN204374875U (en) | 2015-01-21 | 2015-01-21 | A kind of mainboard heat ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039531.1U CN204374875U (en) | 2015-01-21 | 2015-01-21 | A kind of mainboard heat ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204374875U true CN204374875U (en) | 2015-06-03 |
Family
ID=53331077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520039531.1U Expired - Fee Related CN204374875U (en) | 2015-01-21 | 2015-01-21 | A kind of mainboard heat ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204374875U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109375753A (en) * | 2018-12-14 | 2019-02-22 | 河南飙风信息科技有限公司 | A kind of radiator for big data server |
| CN109413965A (en) * | 2018-12-14 | 2019-03-01 | 河南飙风信息科技有限公司 | It is a kind of for automating the cooling system of the O&M network equipment |
| CN110888506A (en) * | 2019-11-29 | 2020-03-17 | 深圳市核芯智联科技开发有限公司 | Multimedia dual-core industrial control mainboard |
| WO2022161548A3 (en) * | 2022-05-16 | 2023-02-02 | 苏州云首软件科技有限公司 | High-efficiency heat dissipation device for computer processor |
-
2015
- 2015-01-21 CN CN201520039531.1U patent/CN204374875U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109375753A (en) * | 2018-12-14 | 2019-02-22 | 河南飙风信息科技有限公司 | A kind of radiator for big data server |
| CN109413965A (en) * | 2018-12-14 | 2019-03-01 | 河南飙风信息科技有限公司 | It is a kind of for automating the cooling system of the O&M network equipment |
| CN110888506A (en) * | 2019-11-29 | 2020-03-17 | 深圳市核芯智联科技开发有限公司 | Multimedia dual-core industrial control mainboard |
| WO2022161548A3 (en) * | 2022-05-16 | 2023-02-02 | 苏州云首软件科技有限公司 | High-efficiency heat dissipation device for computer processor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170822 Address after: 102206 Room 403, Tong Yuan Tong Development Center, No. four, 6 hi tech street, Ding Lu Road, Beijing, Changping District Patentee after: DISPLAY PLUS (BEIJING) INFORMATION TECHNOLOGY CO.,LTD. Address before: 101111, A, room 13, block 28, information road, No. 1, Beijing, Haidian District, China. 13A-1 Patentee before: Beijing Lishi Hi-Tech Information Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150603 |