CN211264200U - Embedded mainboard that radiating efficiency is high - Google Patents
Embedded mainboard that radiating efficiency is high Download PDFInfo
- Publication number
- CN211264200U CN211264200U CN201921591467.2U CN201921591467U CN211264200U CN 211264200 U CN211264200 U CN 211264200U CN 201921591467 U CN201921591467 U CN 201921591467U CN 211264200 U CN211264200 U CN 211264200U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- fixedly connected
- mainboard body
- mainboard
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of embedded motherboards, and discloses an embedded mainboard with high heat dissipation efficiency, which comprises a mainboard body, wherein the mainboard body is fixedly connected with a plurality of uniformly distributed supporting rods, one end of the supporting rods, which is far away from the mainboard body, is fixedly connected with a heat dissipation block, a cavity is formed in the heat dissipation block, a heat dissipation mechanism is fixedly connected in the cavity, and the left side and the right side of the mainboard body are movably connected with an installation mechanism; the heat dissipation mechanism comprises a heat dissipation fan fixedly connected with the side wall of the cavity, an air inlet pipeline and an air outlet pipeline corresponding to the heat dissipation fan are arranged in the heat dissipation block, and a plurality of air outlets are formed in one side of the air outlet pipeline far away from the discrete air heater. The utility model discloses can conveniently improve the radiating efficiency of mainboard body to improve the life of mainboard body, and can conveniently install the mainboard body, and be convenient for dismantle the maintenance to it.
Description
Technical Field
The utility model relates to an embedded mainboard technical field especially relates to an embedded mainboard that radiating efficiency is high.
Background
The embedded microcomputer industrial control technology is a very economical and practical automation technology which is generated and developed in the computer application practice since 20-century and integrates the technologies of electricity, machinery, computers, communication and the like. The method has the characteristics of high speed, flexible working mode, high reliability, strong information processing capability, low cost, wide application range and the like. Has been widely used in the industrial field.
When the existing embedded mainboard is used, the embedded mainboard is easy to dissipate a large amount of heat due to the fact that the working rate of the embedded mainboard is high, and the heat cannot be dissipated effectively, so that the embedded mainboard is easy to damage, and the service life of the embedded mainboard is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving among the prior art embedded mainboard when using, because of embedded mainboard work rate is great, lead to embedded mainboard to give off a large amount of heats easily, and can't effectually give off the heat to lead to embedded mainboard to damage easily, influence its life's problem, and the embedded mainboard that a radiating efficiency is high that provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an embedded mainboard with high heat dissipation efficiency comprises a mainboard body, wherein a plurality of uniformly distributed supporting rods are fixedly connected to the mainboard body, one ends of the supporting rods, far away from the mainboard body, are jointly and fixedly connected with a heat dissipation block, a cavity is formed in the heat dissipation block, a heat dissipation mechanism is fixedly connected to the cavity, and mounting mechanisms are movably connected to the left side and the right side of the mainboard body;
the heat dissipation mechanism comprises a heat dissipation fan fixedly connected with the side wall of the cavity, an air inlet pipeline and an air outlet pipeline corresponding to the heat dissipation fan are arranged in the heat dissipation block, and a plurality of air outlets are formed in one side of the air outlet pipeline far away from the discrete air heater.
Preferably, the left side and the right side of the air inlet pipeline are both fixedly connected with dust screens.
Preferably, the bottom of the main board body is fixedly connected with two uniformly distributed radiating fins.
Preferably, installation mechanism include with mainboard body lateral wall swing joint's installation piece, the lateral wall sliding connection of installation piece has the splint of two symmetric distributions, the lateral wall fixedly connected with pull rod of splint, set up the bar opening corresponding with the pull rod in the installation piece, two the common fixedly connected with spring in one side that the pull rod is relative, two the equal fixedly connected with connecting rod in one side that the pull rod carried on the back mutually, the one end that the pull rod was kept away from to the connecting rod passes the lateral wall and the fixedly connected with fixed plate of installation piece.
Preferably, one side of the fixing plate, which is far away from the connecting rod, is fixedly connected with a pull ring.
Preferably, one side of each of the two clamping plates opposite to each other is fixedly connected with a rubber pad.
Compared with the prior art, the utility model provides an embedded mainboard that radiating efficiency is high possesses following beneficial effect:
1. this embedded mainboard that radiating efficiency is high through being provided with heat dissipation mechanism, can conveniently improve the radiating efficiency of mainboard body to the life of mainboard body has been improved.
2. This embedded mainboard that radiating efficiency is high through being provided with installation mechanism, can conveniently install the mainboard body, and is convenient for dismantle the maintenance to it.
The part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses can conveniently improve the radiating efficiency of mainboard body to improve the life of mainboard body, and can conveniently install the mainboard body, and be convenient for dismantle the maintenance to it.
Drawings
Fig. 1 is a schematic structural view of an embedded motherboard with high heat dissipation efficiency according to the present invention;
fig. 2 is the utility model provides a structural schematic diagram of embedded mainboard a part that radiating efficiency is high.
In the figure: the heat dissipation device comprises a main board body 1, a support rod 2, a heat dissipation block 3, a heat dissipation mechanism 4, a heat dissipation fan 41, an air inlet pipeline 42, an air outlet pipeline 43, a mounting mechanism 5, a mounting block 51, a clamping plate 52, a pull rod 53, a spring 54, a connecting rod 55, a fixing plate 56, a dust screen 6, a heat dissipation fin 7 and a pull ring 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-2, an embedded motherboard with high heat dissipation efficiency comprises a motherboard body 1, wherein a plurality of uniformly distributed support rods 2 are fixedly connected to the motherboard body 1, one ends of the support rods 2, which are far away from the motherboard body 1, are jointly and fixedly connected with a heat dissipation block 3, a cavity is formed in the heat dissipation block 3, a heat dissipation mechanism 4 is fixedly connected in the cavity, and mounting mechanisms 5 are movably connected to the left side and the right side of the motherboard body 1;
The dust screen 6 is fixedly connected to the left side and the right side of the air inlet pipeline 42, so that external dust can be prevented from entering the air inlet pipeline 42.
The bottom fixedly connected with of mainboard body 1 has two evenly distributed's fin 7, can conveniently improve the radiating efficiency to mainboard body 1.
One side fixedly connected with pull ring 8 that connecting rod 55 was kept away from to dead plate 56 can conveniently stimulate dead plate 56.
The rubber pads are fixedly connected to the opposite sides of the two clamping plates 52, so that the friction force of the clamping plates 52 can be increased conveniently, and the clamping is more stable.
In the utility model, when the heat dissipation of the main board body 1 is needed, the heat dissipation fan 41 is started, the heat dissipation fan 41 sucks air from the outside through the air inlet pipeline 42, when the air passes through the dust screen 6, the dust screen 6 filters the dust in the air and enters the air inlet pipeline 42, then enters the air outlet pipeline 43 through the air inlet pipeline 42, and discharges the air through the air outlets on the side wall of the air outlet pipeline 43, the air outlet efficiency of the heat dissipation fan 41 is enlarged, the redundant heat of the main board body 1 is guided away by using the radiating fins 7, the heat dissipation efficiency of the main board body 1 can be conveniently improved, thereby the service life of the main board body 1 is prolonged, when the main board body 1 is needed to be installed, the pull ring 8 is pulled, the pull ring 8 pulls the fixing plate 56, the fixing plate 56 pulls the connecting rod 55, the connecting rod 55 pulls the pull rod 53, the pull rod 53 slides in the strip-shaped opening, and pulling spring 54 and splint 52, placing mainboard body 1 between two splint 52, loosening pull ring 8, spring 54 pulling pull rod 53, pull rod 53 pulls splint 52, uses two splint 52 to carry out the centre gripping to mainboard body 1, can conveniently install mainboard body 1, and is convenient for dismantle the maintenance to it.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. An embedded mainboard with high heat dissipation efficiency comprises a mainboard body (1), and is characterized in that a plurality of uniformly distributed support rods (2) are fixedly connected to the mainboard body (1), one ends of the support rods (2) far away from the mainboard body (1) are jointly and fixedly connected with a heat dissipation block (3), a cavity is formed in the heat dissipation block (3), a heat dissipation mechanism (4) is fixedly connected to the cavity, and mounting mechanisms (5) are movably connected to the left side and the right side of the mainboard body (1);
the heat dissipation mechanism (4) comprises a heat dissipation fan (41) fixedly connected with the side wall of the cavity, an air inlet pipeline (42) and an air outlet pipeline (43) corresponding to the heat dissipation fan (41) are arranged in the heat dissipation block (3), and a plurality of air outlets are formed in one side, away from the heat dissipation fan (41), of the air outlet pipeline (43).
2. The embedded motherboard with high heat dissipation efficiency as recited in claim 1, wherein the dust screen (6) is fixedly connected to both left and right sides of the air inlet pipeline (42).
3. The embedded motherboard with high heat dissipation efficiency as recited in claim 1, wherein the bottom of the motherboard body (1) is fixedly connected with two evenly distributed heat dissipation fins (7).
4. The embedded main board with high heat dissipation efficiency according to claim 1, wherein the mounting mechanism (5) includes a mounting block (51) movably connected to a side wall of the main board body (1), the side wall of the mounting block (51) is slidably connected to two symmetrically distributed clamping plates (52), a pull rod (53) is fixedly connected to the side wall of the clamping plate (52), a strip-shaped opening corresponding to the pull rod (53) is formed in the mounting block (51), a spring (54) is fixedly connected to one side of the two opposite pull rods (53) together, a connecting rod (55) is fixedly connected to one side of the two opposite pull rods (53), and one end of the connecting rod (55) far away from the pull rod (53) penetrates through the side wall of the mounting block (51) and is fixedly connected to a fixing plate (56).
5. The embedded motherboard with high heat dissipation efficiency as recited in claim 4, wherein a pull ring (8) is fixedly connected to one side of the fixing plate (56) far away from the connecting rod (55).
6. The embedded motherboard with high heat dissipation efficiency as recited in claim 4, wherein a rubber pad is fixedly connected to the opposite side of each of the two clamping plates (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921591467.2U CN211264200U (en) | 2019-09-24 | 2019-09-24 | Embedded mainboard that radiating efficiency is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921591467.2U CN211264200U (en) | 2019-09-24 | 2019-09-24 | Embedded mainboard that radiating efficiency is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211264200U true CN211264200U (en) | 2020-08-14 |
Family
ID=71954510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921591467.2U Active CN211264200U (en) | 2019-09-24 | 2019-09-24 | Embedded mainboard that radiating efficiency is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211264200U (en) |
-
2019
- 2019-09-24 CN CN201921591467.2U patent/CN211264200U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210742314U (en) | Electric power detection device convenient to installation | |
| CN210142942U (en) | Vertical cabinet type generator set | |
| CN211264200U (en) | Embedded mainboard that radiating efficiency is high | |
| CN217880219U (en) | Integrated monitoring host | |
| CN212011625U (en) | Low-power consumption power module | |
| CN210402183U (en) | Control mainboard with protective structure for internet of things | |
| CN211349271U (en) | CPU radiator conversion platform | |
| CN220044022U (en) | Automatic detection device based on computer application technology | |
| CN110888506B (en) | Multimedia dual-core industrial control mainboard | |
| CN220087724U (en) | Mainboard structure with TYPEC interface | |
| CN218471243U (en) | Computer mainboard with pre-buried cooling water pipe | |
| CN211656772U (en) | Control cabinet for information technology with heat radiation structure | |
| CN214100764U (en) | Air insulation type bus duct pipeline | |
| CN212322211U (en) | Air guide cover for computer heat dissipation | |
| CN214409887U (en) | Big data is server cooling system for cloud storage based on 5G | |
| CN221548503U (en) | LED power supply module | |
| CN214506278U (en) | Heat radiation fin structure for power distribution control equipment | |
| CN215435556U (en) | Heat dissipation device of antithetical couplet printing machine | |
| CN216873731U (en) | Low-power consumption industrial control mainboard | |
| CN218296160U (en) | Energy efficiency monitoring devices of heating panel quick detach | |
| CN216249107U (en) | Computer communication mainboard support frame | |
| CN219453407U (en) | Clamp for EDFA optical amplifier | |
| CN211720423U (en) | Electromechanical integrated motor heat dissipation device | |
| CN212226506U (en) | Embedded terminal based on Internet of things | |
| CN216017595U (en) | Heat dissipation device for driving isolation circuit of direct-current power supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |