CN215642554U - Computer motherboard heat radiation structure - Google Patents
Computer motherboard heat radiation structure Download PDFInfo
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- CN215642554U CN215642554U CN202122088113.XU CN202122088113U CN215642554U CN 215642554 U CN215642554 U CN 215642554U CN 202122088113 U CN202122088113 U CN 202122088113U CN 215642554 U CN215642554 U CN 215642554U
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- side wall
- mounting
- heat dissipation
- fixedly connected
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Abstract
The utility model discloses a heat dissipation structure of a computer mainboard, which comprises an installation frame, wherein a groove is formed between the central positions of the upper side wall and the lower side wall of the installation frame, the middle position of the two side walls of the groove is fixedly connected with a first connecting block, the side walls of the two opposite sides of the first connecting blocks are fixedly connected with installation rings, a second connecting block is fixedly connected between the side walls of the two opposite sides of the installation rings, a heat dissipation mechanism is arranged in the installation rings, and a structure body installation mechanism is arranged on the periphery of the installation frame. The utility model has the advantages that the good structure body mounting mechanism is arranged, the mounting convenience and mounting firmness of the actual structure body are good, the good computer mainboard mounting mechanism is arranged, the mounting hole positions of the actual computer mainboard are more, the mounting flexibility of the actual computer mainboard is good, in addition, the efficient computer mainboard wind guide heat dissipation mechanism is arranged, and the heat dissipation effect after the actual computer mainboard is mounted is good.
Description
Technical Field
The utility model relates to the field of mainboard heat dissipation structures, in particular to a computer mainboard heat dissipation structure.
Background
A motherboard, also called a main board (main board), a system board (system board) or a motherboard (mother board); it is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
At present, when current computer motherboard heat radiation structure lies in the in-service use, lack good structure body installation mechanism, the installation convenience and the installation fastness of actual structure body are general, and lack good computer motherboard installation mechanism, and actual computer motherboard installation hole site is less, and actual installation computer motherboard installation flexibility is general, lacks efficient computer motherboard wind-guiding heat radiation mechanism in addition, and the radiating effect after the installation of actual computer motherboard is not good.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that the existing computer mainboard heat dissipation structure lacks of a good structure body installation mechanism, a computer mainboard installation mechanism and an air guide heat dissipation mechanism.
In order to solve the technical problems, the utility model adopts a technical scheme that: the heat dissipation structure of the computer mainboard comprises a mounting frame, wherein a groove is formed between the central positions of the upper side wall and the lower side wall of the mounting frame, the middle position of the two side walls of the groove is fixedly connected with a first connecting block, the opposite side walls of the two first connecting blocks are fixedly connected with mounting rings, a second connecting block is fixedly connected between the opposite side walls of the two mounting rings, a heat dissipation mechanism is arranged in the mounting rings, and a structure body mounting mechanism is arranged around the mounting frame;
the heat dissipation mechanism comprises a heat dissipation fan, a fan seat is fixedly mounted on the rear side of the inner side wall of the mounting ring, the heat dissipation fan is fixedly mounted above the fan seat, and the heat dissipation fan can work to guide air to play a role in heat dissipation of a computer mainboard;
the structure body mounting mechanism comprises a mounting seat, four corners of the outer side wall of the mounting seat are fixedly connected with the mounting seat, a fourth mounting hole is formed between the upper side wall and the lower side wall of the mounting seat, and the mounting seat can be matched with a fixing piece to fixedly mount the structure body.
Preferably, a first reinforcing rod is fixedly connected between the side walls of the two opposite mounting seats on the front side or the rear side, and a second reinforcing rod is fixedly connected between the side walls of the two opposite mounting seats on one side, so that the structural reinforcing effect of the structural body mounting mechanism is achieved.
Preferably, four corners of the inner side wall of the groove are fixedly connected with second reinforcing blocks, the middle positions of the front side and the rear side of the inner side wall of the groove are fixedly connected with first reinforcing blocks, and the first reinforcing blocks are fixedly connected with second connecting blocks.
Preferably, a third mounting hole is formed between the central positions of the upper side wall and the lower side wall of the first reinforcing block, a first mounting hole is formed between the central positions of the upper side wall and the lower side wall of the first connecting block, second mounting holes are symmetrically formed between the upper side wall and the lower side wall of the second connecting block, fifth mounting holes are formed between the upper side wall and the lower side wall of four corners of the mounting frame, and a plurality of mounting holes can be matched with the fixing pieces to flexibly mount the computer mainboard.
The utility model has the following beneficial effects:
1. by arranging the good structure body mounting mechanism, the mounting convenience and mounting firmness of the actual structure body are good;
2. according to the utility model, by arranging the good computer mainboard mounting mechanism, the actual mounting hole positions of the computer mainboard are more, and the mounting flexibility for actually mounting the computer mainboard is good;
3. the utility model has the advantages that the efficient air guide and heat dissipation mechanism of the computer mainboard is arranged, and the heat dissipation effect after the actual installation of the computer mainboard is good.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a perspective view of the mounting frame of the present invention;
fig. 3 is an enlarged view of the utility model at a in fig. 1.
In the figure: 1. installing a frame; 2. a groove; 3. a first connection block; 4. a mounting ring; 5. a second connecting block; 6. a first reinforcing block; 7. a mounting seat; 8. a first reinforcing bar; 9. a second reinforcing bar; 10. a first mounting hole; 11. a second mounting hole; 12. a third mounting hole; 13. a fourth mounting hole; 14. a fifth mounting hole; 15. a second reinforcing block; 16. a fan base; 17. a heat dissipation fan.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.
Referring to fig. 1 and 3, a heat dissipation structure for a computer motherboard comprises a mounting frame 1, a groove 2 is formed between the center positions of the upper and lower side walls of the mounting frame 1, a first connecting block 3 is fixedly connected to the middle position of the two side walls of the groove 2, a mounting ring 4 is fixedly connected to the opposite side wall of the two first connecting blocks 3, a second connecting block 5 is fixedly connected between the opposite side walls of the two mounting rings 4, a heat dissipation mechanism is arranged in the mounting ring 4, a structure body mounting mechanism is arranged around the mounting frame 1, the heat dissipation mechanism comprises a heat dissipation fan 17, a fan base 16 is fixedly mounted on the rear side of the inner side wall of the mounting ring 4, the heat dissipation fan 17 is fixedly mounted above the fan base 16, and can guide wind to dissipate heat of the computer motherboard, the structure body mounting mechanism comprises a mounting base 7, four mounting bases 7 are fixedly connected to the outer side walls of the corners of the mounting base 7, a fourth mounting hole 13 is formed between the upper and lower side walls of the mounting base 7, can cooperate the mounting to carry out the fixed mounting of structure body, set up third mounting hole 12 between the wall central point puts about first reinforcing block 6 and seted up first mounting hole 10 between the wall central point puts about 3 first connecting blocks of wall, be the symmetry between the wall about 5 second connecting blocks and seted up second mounting hole 11, seted up fifth mounting hole 14 between the wall about 1 four corners of installing frame, the nimble installation that carries out computer motherboard of a plurality of installation hole site cooperation mountings of accessible.
As shown in fig. 1 and 2, a first reinforcing block 6 is fixedly connected to the middle position of the front side and the rear side of the inner side wall of the groove 2, and a second connecting block 5 is fixedly connected to the two first reinforcing blocks 6.
As shown in fig. 3, a first reinforcing rod 8 is fixedly connected between two opposite side walls of the front or rear mounting seat 7, a second reinforcing rod 9 is fixedly connected between two opposite side walls of the mounting seat 7, and the two opposite side walls of the mounting seat play a role in reinforcing the structure of the structure body mounting mechanism, and second reinforcing blocks 15 are fixedly connected at four corners of the inner side wall of the groove 2.
When the structure body is used, the structure body can be fixedly installed through the fourth installation holes 13 on the installation seats 7 at four corners, the first reinforcing rods 8 and the second reinforcing rods 9 are arranged among the four installation seats 7 for reinforcing, the actual installation reliability of the structure body is good, the computer mainboard can be flexibly and fixedly installed through the first installation holes 10, the second installation holes 11, the third installation holes 12 and the fifth installation holes 14 in a matched mode, after the computer mainboard is installed, the two cooling fans 17 can be opened for guiding air, and the cooling effect of the computer mainboard is achieved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A computer motherboard heat radiation structure, includes installing frame (1), its characterized in that: a groove (2) is formed between the central positions of the upper side wall and the lower side wall of the mounting frame (1), the middle position of the two side walls of the groove (2) is fixedly connected with a first connecting block (3), the side wall of one opposite side of the two first connecting blocks (3) is fixedly connected with a mounting ring (4), a second connecting block (5) is fixedly connected between the side walls of one opposite side of the two mounting rings (4), a heat dissipation mechanism is arranged in the mounting ring (4), and a structural body mounting mechanism is arranged on the periphery of the mounting frame (1);
the heat dissipation mechanism comprises a heat dissipation fan (17), a fan seat (16) is fixedly installed on the rear side of the inner side wall of the installation ring (4), and the heat dissipation fan (17) is fixedly installed above the fan seat (16);
the structure body installation mechanism comprises an installation seat (7), wherein the installation seat (7) is fixedly connected with four corners of the outer side wall of the installation seat (7), and a fourth installation hole (13) is formed between the upper side wall and the lower side wall of the installation seat (7).
2. A computer motherboard heat dissipation structure as recited in claim 1, wherein: and a first reinforcing rod (8) is fixedly connected between the side walls of the two opposite sides of the mounting seats (7) on the front side or the rear side.
3. A computer motherboard heat dissipation structure as recited in claim 1, wherein: and a second reinforcing rod (9) is fixedly connected between the side walls of the two opposite sides of the mounting seats (7) on one side.
4. A computer motherboard heat dissipation structure as recited in claim 1, wherein: four corners of recess (2) inside wall fixedly connected with second reinforcement piece (15).
5. A computer motherboard heat dissipation structure as recited in claim 1, wherein: the groove is characterized in that a first reinforcing block (6) is fixedly connected to the middle positions of the front side wall and the rear side wall of the groove (2), a second reinforcing block (6) is fixedly connected to the second connecting block (5), and a third mounting hole (12) is formed between the center positions of the upper side wall and the lower side wall of the first reinforcing block (6).
6. A computer motherboard heat dissipation structure as recited in claim 1, wherein: a first mounting hole (10) is formed between the center positions of the upper side wall and the lower side wall of the first connecting block (3), and second mounting holes (11) are symmetrically formed between the upper side wall and the lower side wall of the second connecting block (5).
7. A computer motherboard heat dissipation structure as recited in claim 1, wherein: fifth mounting holes (14) are formed between the upper side wall and the lower side wall of the four corners of the mounting frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122088113.XU CN215642554U (en) | 2021-09-01 | 2021-09-01 | Computer motherboard heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122088113.XU CN215642554U (en) | 2021-09-01 | 2021-09-01 | Computer motherboard heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215642554U true CN215642554U (en) | 2022-01-25 |
Family
ID=79905138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122088113.XU Active CN215642554U (en) | 2021-09-01 | 2021-09-01 | Computer motherboard heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215642554U (en) |
-
2021
- 2021-09-01 CN CN202122088113.XU patent/CN215642554U/en active Active
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