CN110856391A - 一种复合材料机壳增加金属层的结构 - Google Patents
一种复合材料机壳增加金属层的结构 Download PDFInfo
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- CN110856391A CN110856391A CN201911159978.1A CN201911159978A CN110856391A CN 110856391 A CN110856391 A CN 110856391A CN 201911159978 A CN201911159978 A CN 201911159978A CN 110856391 A CN110856391 A CN 110856391A
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- casing
- metal plate
- gear
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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Citations (15)
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KR20060071159A (ko) * | 2004-12-21 | 2006-06-26 | 주식회사 대우일렉트로닉스 | 텔레비전의 냉각장치 |
US20100053885A1 (en) * | 2008-08-29 | 2010-03-04 | Apple Inc. | Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies |
DE202011100009U1 (de) * | 2011-04-21 | 2011-06-24 | Asia Vital Components Co., Ltd. | Kühlmodul |
CN202656536U (zh) * | 2012-04-09 | 2013-01-09 | 昆山同寅兴业机电制造有限公司 | 复合材料机壳增加金属层的结构 |
CN203398565U (zh) * | 2013-08-27 | 2014-01-15 | 汇网电气有限公司 | Smc加强型电箱 |
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CN208317107U (zh) * | 2018-06-29 | 2019-01-01 | 深圳市吉瑞达电路科技有限公司 | 一种具有加强筋的电路板 |
CN109445543A (zh) * | 2019-01-11 | 2019-03-08 | 宋晨歌 | 一种便于拆卸的计算机主机外壳 |
CN208656839U (zh) * | 2018-09-29 | 2019-03-26 | 东莞市盈发五金制品有限公司 | 一种高强度手机主板上盖 |
CN208675666U (zh) * | 2018-07-23 | 2019-03-29 | 乌木马科技(天津)有限公司 | 一种具有散热型防护箱体的电动汽车驱动控制器 |
CN109793365A (zh) * | 2019-03-29 | 2019-05-24 | 陈曦 | 方便取放书本的防潮课桌 |
CN208919691U (zh) * | 2018-10-13 | 2019-05-31 | 河南奥利德科技有限公司 | 一种净化手工彩钢板十字连接型材 |
CN208986982U (zh) * | 2018-11-06 | 2019-06-14 | 惠州德恳电子科技有限公司 | 一种手机主板密封结构 |
-
2019
- 2019-11-25 CN CN201911159978.1A patent/CN110856391B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20060071159A (ko) * | 2004-12-21 | 2006-06-26 | 주식회사 대우일렉트로닉스 | 텔레비전의 냉각장치 |
US20100053885A1 (en) * | 2008-08-29 | 2010-03-04 | Apple Inc. | Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies |
DE202011100009U1 (de) * | 2011-04-21 | 2011-06-24 | Asia Vital Components Co., Ltd. | Kühlmodul |
CN202656536U (zh) * | 2012-04-09 | 2013-01-09 | 昆山同寅兴业机电制造有限公司 | 复合材料机壳增加金属层的结构 |
CN203398565U (zh) * | 2013-08-27 | 2014-01-15 | 汇网电气有限公司 | Smc加强型电箱 |
CN104902706A (zh) * | 2015-06-08 | 2015-09-09 | 廖婕 | 一种高精度装配壳体 |
CN107132889A (zh) * | 2017-06-27 | 2017-09-05 | 深圳市诚骋科技有限公司 | 一种轻质加厚型计算机主机箱承载板 |
CN207184967U (zh) * | 2017-07-31 | 2018-04-03 | 广东欧珀移动通信有限公司 | 电子装置外壳和电子装置 |
CN208317107U (zh) * | 2018-06-29 | 2019-01-01 | 深圳市吉瑞达电路科技有限公司 | 一种具有加强筋的电路板 |
CN208675666U (zh) * | 2018-07-23 | 2019-03-29 | 乌木马科技(天津)有限公司 | 一种具有散热型防护箱体的电动汽车驱动控制器 |
CN208656839U (zh) * | 2018-09-29 | 2019-03-26 | 东莞市盈发五金制品有限公司 | 一种高强度手机主板上盖 |
CN208919691U (zh) * | 2018-10-13 | 2019-05-31 | 河南奥利德科技有限公司 | 一种净化手工彩钢板十字连接型材 |
CN208986982U (zh) * | 2018-11-06 | 2019-06-14 | 惠州德恳电子科技有限公司 | 一种手机主板密封结构 |
CN109445543A (zh) * | 2019-01-11 | 2019-03-08 | 宋晨歌 | 一种便于拆卸的计算机主机外壳 |
CN109793365A (zh) * | 2019-03-29 | 2019-05-24 | 陈曦 | 方便取放书本的防潮课桌 |
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Effective date of registration: 20210519 Address after: 350000 room 511-5612, 5 / F, building 6, jinjingwan business operation center, Pingtan Comprehensive Experimental Zone, Fuzhou City, Fujian Province (cluster registration) Patentee after: Zhongwei united innovation (Pingtan) Engineering Research Co.,Ltd. Address before: 516000 No. 1510-1, 15th floor, Kerong venture building, 666 Huihuan section, Zhongkai Avenue, Huizhou Zhongkai hi tech Zone, Huicheng District, Huizhou City, Guangdong Province Patentee before: Huizhou Zhongwei flexible optoelectronic Intelligent Manufacturing Research Institute Co.,Ltd. |
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Effective date of registration: 20220104 Address after: 215000 building 3, No.8 CHENGWAN Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Suzhou Huoao New Material Technology Co.,Ltd. Address before: 350000 room 511-5612, 5 / F, building 6, jinjingwan business operation center, Pingtan Comprehensive Experimental Zone, Fuzhou City, Fujian Province (cluster registration) Patentee before: Zhongwei united innovation (Pingtan) Engineering Research Co.,Ltd. |