CN110832836A - 感光组件、成像模组、智能终端及制造感光组件的方法和模具 - Google Patents

感光组件、成像模组、智能终端及制造感光组件的方法和模具 Download PDF

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CN110832836A
CN110832836A CN201880044842.3A CN201880044842A CN110832836A CN 110832836 A CN110832836 A CN 110832836A CN 201880044842 A CN201880044842 A CN 201880044842A CN 110832836 A CN110832836 A CN 110832836A
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molding
photosensitive
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CN110832836B (zh
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田中武彦
陈振宇
梅哲文
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Priority claimed from PCT/CN2018/099271 external-priority patent/WO2019033961A1/zh
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3185Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

公开了感光组件、成像模组、智能终端及制造感光组件的方法和模具。感光组件包括:线路板,具有矩形形状的硬板区域且包括从硬板区域延伸的软板延伸部,其中,硬板区域具有压合侧和非压合侧,硬板区域在压合侧具有压合区域;感光元件,安装在线路板的硬板区域中;以及模塑部,形成在硬板区域上,围绕感光元件并向感光元件延伸且接触感光元件,模塑部具有内侧表面、外侧表面和顶表面,且模塑部不覆盖硬板区域的压合区域,顶表面具有平坦部;其中,模塑部在压合侧的部分的顶表面具有沉降部,沉降部位于平坦部与模塑部的外侧表面之间并低于平坦部,以及模塑部在非压合侧的部分的外侧表面与平坦部垂直。

Description

PCT国内申请,说明书已公开。

Claims (28)

  1. PCT国内申请,权利要求书已公开。
CN201880044842.3A 2017-08-18 2018-08-08 感光组件、成像模组、智能终端及制造感光组件的方法和模具 Active CN110832836B (zh)

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CN2017107125891 2017-08-18
CN201710712589.1A CN109413303B (zh) 2017-08-18 2017-08-18 感光组件、成像模组、智能终端及制造感光组件的方法和模具
PCT/CN2018/099271 WO2019033961A1 (zh) 2017-08-18 2018-08-08 感光组件、成像模组、智能终端及制造感光组件的方法和模具

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CN110421752B (zh) * 2019-08-06 2022-09-27 环维电子(上海)有限公司 待封装pcb板、防溢胶的塑封模具及塑封方法

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CN106488084A (zh) * 2015-08-28 2017-03-08 南昌欧菲光电技术有限公司 摄像头模组及其支架
CN206210795U (zh) * 2016-08-12 2017-05-31 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件以及电子设备
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US8878116B2 (en) * 2011-02-28 2014-11-04 Sony Corporation Method of manufacturing solid-state imaging element, solid-state imaging element and electronic apparatus
CN105262936A (zh) * 2014-07-17 2016-01-20 宁波舜宇光电信息有限公司 一种摄像模组的制造方法及其模组半成品
CN105100569A (zh) * 2015-07-28 2015-11-25 南昌欧菲光电技术有限公司 摄像头模组及其第一线路板与第二线路板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1507043A (zh) * 2002-12-06 2004-06-23 三菱电机株式会社 树脂封装型半导体装置
CN101221930B (zh) * 2007-01-10 2010-06-09 日月光半导体制造股份有限公司 芯片封装结构及其封装方法
CN103959466A (zh) * 2011-11-30 2014-07-30 京瓷株式会社 摄像元件收纳用封装及摄像装置
CN104425528A (zh) * 2013-08-19 2015-03-18 索尼公司 成像装置和电子装置
CN105474616A (zh) * 2013-08-22 2016-04-06 索尼公司 成像设备、制造设备、制造方法和电子器械
CN106488084A (zh) * 2015-08-28 2017-03-08 南昌欧菲光电技术有限公司 摄像头模组及其支架
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
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CN109413303B (zh) 2023-06-30
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