CN110832836A - 感光组件、成像模组、智能终端及制造感光组件的方法和模具 - Google Patents
感光组件、成像模组、智能终端及制造感光组件的方法和模具 Download PDFInfo
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- CN110832836A CN110832836A CN201880044842.3A CN201880044842A CN110832836A CN 110832836 A CN110832836 A CN 110832836A CN 201880044842 A CN201880044842 A CN 201880044842A CN 110832836 A CN110832836 A CN 110832836A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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Abstract
公开了感光组件、成像模组、智能终端及制造感光组件的方法和模具。感光组件包括:线路板,具有矩形形状的硬板区域且包括从硬板区域延伸的软板延伸部,其中,硬板区域具有压合侧和非压合侧,硬板区域在压合侧具有压合区域;感光元件,安装在线路板的硬板区域中;以及模塑部,形成在硬板区域上,围绕感光元件并向感光元件延伸且接触感光元件,模塑部具有内侧表面、外侧表面和顶表面,且模塑部不覆盖硬板区域的压合区域,顶表面具有平坦部;其中,模塑部在压合侧的部分的顶表面具有沉降部,沉降部位于平坦部与模塑部的外侧表面之间并低于平坦部,以及模塑部在非压合侧的部分的外侧表面与平坦部垂直。
Description
PCT国内申请,说明书已公开。
Claims (28)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (3)
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CN2017107125891 | 2017-08-18 | ||
CN201710712589.1A CN109413303B (zh) | 2017-08-18 | 2017-08-18 | 感光组件、成像模组、智能终端及制造感光组件的方法和模具 |
PCT/CN2018/099271 WO2019033961A1 (zh) | 2017-08-18 | 2018-08-08 | 感光组件、成像模组、智能终端及制造感光组件的方法和模具 |
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CN110832836A true CN110832836A (zh) | 2020-02-21 |
CN110832836B CN110832836B (zh) | 2022-02-22 |
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CN201880044842.3A Active CN110832836B (zh) | 2017-08-18 | 2018-08-08 | 感光组件、成像模组、智能终端及制造感光组件的方法和模具 |
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CN110421752B (zh) * | 2019-08-06 | 2022-09-27 | 环维电子(上海)有限公司 | 待封装pcb板、防溢胶的塑封模具及塑封方法 |
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US8878116B2 (en) * | 2011-02-28 | 2014-11-04 | Sony Corporation | Method of manufacturing solid-state imaging element, solid-state imaging element and electronic apparatus |
CN105262936A (zh) * | 2014-07-17 | 2016-01-20 | 宁波舜宇光电信息有限公司 | 一种摄像模组的制造方法及其模组半成品 |
CN105100569A (zh) * | 2015-07-28 | 2015-11-25 | 南昌欧菲光电技术有限公司 | 摄像头模组及其第一线路板与第二线路板 |
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2017
- 2017-08-18 CN CN201710712589.1A patent/CN109413303B/zh active Active
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- 2018-08-08 CN CN201880044842.3A patent/CN110832836B/zh active Active
Patent Citations (10)
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CN1507043A (zh) * | 2002-12-06 | 2004-06-23 | 三菱电机株式会社 | 树脂封装型半导体装置 |
CN101221930B (zh) * | 2007-01-10 | 2010-06-09 | 日月光半导体制造股份有限公司 | 芯片封装结构及其封装方法 |
CN103959466A (zh) * | 2011-11-30 | 2014-07-30 | 京瓷株式会社 | 摄像元件收纳用封装及摄像装置 |
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CN208093560U (zh) * | 2017-08-18 | 2018-11-13 | 宁波舜宇光电信息有限公司 | 制造感光组件的模塑模具 |
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CN109413303A (zh) | 2019-03-01 |
CN109413303B (zh) | 2023-06-30 |
CN110832836B (zh) | 2022-02-22 |
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