CN110818394A - 一种陶瓷加热圈的生产工艺及其制造方法 - Google Patents

一种陶瓷加热圈的生产工艺及其制造方法 Download PDF

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CN110818394A
CN110818394A CN201911104522.5A CN201911104522A CN110818394A CN 110818394 A CN110818394 A CN 110818394A CN 201911104522 A CN201911104522 A CN 201911104522A CN 110818394 A CN110818394 A CN 110818394A
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海默梅塞尔
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Jiaxing Aerge Electric Heating Technology Co Ltd
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Abstract

本发明提供一种陶瓷加热圈的生产工艺及其制造方法，包括陶瓷基体和发热电阻材料，其具体地制备方法如下：步骤(1)、陶瓷基体制备，步骤(2)、发热电阻材料制备，步骤(3)、陶瓷基体与发热电阻材料的结合：将制得的氧化铝生瓷片基片电阻膜包覆于所述陶瓷基体的外部并且印刷导电浆料，然后进行一次1000℃温度烧结，控制时间10～20分钟，接着再印刷贵金属浆料，然后进行一次1500℃温度烧结，控制时间5～10分钟，实现陶瓷基体与发热电阻材料之间充分地结合在一体。本发明结构简单紧凑，体积小，传热效率高；本发明产品制作容易，基片材料极易得到；釉面平整、光亮。而且安全、环保、节能、市场前景大。

Description

一种陶瓷加热圈的生产工艺及其制造方法
技术领域
本发明涉及一种电加热器，尤其涉及一种陶瓷加热圈的生产工艺及其制造方法。
背景技术
陶瓷加热元件是一种高效率、热分布均匀、具有绝缘性能的加热器，是直接在陶瓷生坯上印刷导电电阻浆料，经叠片、排胶后，在高温下共烧成为一体的产品，产品本身及生产过程符合环保要求。与传统合金电热丝，PTC加热元件相比较具有结构简单、升温迅速、功率密度大、使用安全、耐腐蚀、使用寿命长等诸多优点，所广泛应用于日常生活，工业技术，军事，科学，通讯，医疗，环保，宇航等多种领域。
发明内容
本发明的目的就在于为了解决上述问题而提供一种陶瓷加热圈的生产工艺，所述陶瓷电加热圈能够整体提升了传热效率。
本发明通过以下技术方案来实现上述目的：一种陶瓷加热圈的生产工艺，包括陶瓷基体和发热电阻材料，其具体地制备方法如下：
步骤(1)、陶瓷基体制备
所述陶瓷基体包括以下重量份的原料：α-氧化铝93.5％；苏州土1.55％；碳酸钙和SiO2混合物2.65％；氧化钇0.3％；氧化锆2％；
以上原料混合球磨后添加15重量份的蜡在80℃的温度下热压成型、1500℃下素烧为所述陶瓷基体；
步骤(2)、发热电阻材料制备
所述发热电阻材料是由Ni、Si、Mn、Al、Fe组成，各组分的质量百分比含量为：Si：1.0～4.0％；Mn：1.5～4.0％；Al：1.5～3.5％；Fe：0.4～0.8％；Ni：余量；
先在上述原料粉料中加入20重量份的去离子水、15重量份的二氧化锆及10重量份的瓷料进行第一次混磨，浆料混磨8h后过300目筛，再在零下10-20℃冷藏的浆料中加入20重量份的二甲苯/正丁醇混合剂进行第二次球磨18小时，并加入除泡剂进行真空搅拌50分钟，除泡，流延成型制成氧化铝生瓷片；以氧化铝生瓷片为基片，在其上印刷钨金属发热电路膜；
步骤(3)、陶瓷基体与发热电阻材料的结合
将制得的氧化铝生瓷片基片电阻膜包覆于所述陶瓷基体的外部并且印刷导电浆料，然后进行一次1000℃温度烧结，控制时间10～20分钟，接着再印刷贵金属浆料，然后进行一次1500℃温度烧结，控制时间5～10分钟，实现陶瓷基体与发热电阻材料之间充分地结合在一体。
作为优选的，所述除泡剂是采用磷酸三丁酯。
与现有技术相比，本发明的有益效果是：
本发明结构简单紧凑，体积小，传热效率高；本发明产品制作容易，基片材料极易得到；釉面平整、光亮。而且安全、环保、节能、市场前景大。
具体实施方式
以下实施例针对本发明作进一步说明：
本发明通过以下技术方案来实现上述目的：一种陶瓷加热圈的生产工艺，包括陶瓷基体和发热电阻材料，具体步骤制备步骤如下：
步骤(1)、陶瓷基体制备
所述陶瓷基体包括以下重量份的原料：α-氧化铝93.5％；苏州土1.55％；碳酸钙和SiO2混合物2.65％；氧化钇0.3％；氧化锆2％；
以上原料混合球磨后添加15重量份的蜡在80℃的温度下热压成型、1500℃下素烧为所述陶瓷基体；
步骤(2)、发热电阻材料制备
所述发热电阻材料是由Ni、Si、Mn、Al、Fe组成，各组分的质量百分比含量为：Si：1.0～4.0％；Mn：1.5～4.0％；Al：1.5～3.5％；Fe：0.4～0.8％；Ni：余量；
先在上述原料粉料中加入20重量份的去离子水、15重量份的二氧化锆及10重量份的瓷料进行第一次混磨，浆料混磨8h后过300目筛，再在零下10-20℃冷藏的浆料中加入20重量份的二甲苯/正丁醇混合剂进行第二次球磨18小时，并加入除泡剂进行真空搅拌50分钟，除泡，流延成型制成氧化铝生瓷片；以氧化铝生瓷片为基片，在其上印刷钨金属发热电路膜；
步骤(3)、陶瓷基体与发热电阻材料的结合
将制得的氧化铝生瓷片基片电阻膜包覆于所述陶瓷基体的外部并且印刷导电浆料，然后进行一次1000℃温度烧结，控制时间10～20分钟，接着再印刷贵金属浆料，然后进行一次1500℃温度烧结，控制时间5～10分钟，实现陶瓷基体与发热电阻材料之间充分地结合在一体。
其中，所述除泡剂是采用磷酸三丁酯。
本发明结构简单紧凑，体积小，传热效率高；本发明产品制作容易，基片材料极易得到；釉面平整、光亮。而且安全、环保、节能、市场前景大。
以上所述的实施实例对本发明的技术方案进行了详细的说明，应理解的是以上所述仅为本发明的较佳实施例，并不用于限制本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许改动或修饰为等同变化的等效实施例，但是，凡在本发明的原则范围内所做的任何修改或改进等，均应包含在本发明范围之内。

Claims (2)

1.一种陶瓷加热圈的生产工艺，其特征在于，包括陶瓷基体和发热电阻材料，具体步骤制备步骤如下：
步骤(1)、陶瓷基体制备
所述陶瓷基体包括以下重量份的原料：α-氧化铝93.5％；苏州土1.55％；碳酸钙和SiO2混合物2.65％；氧化钇0.3％；氧化锆2％；
以上原料混合球磨后添加15重量份的蜡在80℃的温度下热压成型、1500℃下素烧为所述陶瓷基体；
步骤(2)、发热电阻材料制备
所述发热电阻材料是由Ni、Si、Mn、Al、Fe组成，各组分的质量百分比含量为：Si：1.0～4.0％；Mn：1.5～4.0％；Al：1.5～3.5％；Fe：0.4～0.8％；Ni：余量；
先在上述原料粉料中加入20重量份的去离子水、15重量份的二氧化锆及10重量份的瓷料进行第一次混磨，浆料混磨8h后过300目筛，再在零下10-20℃冷藏的浆料中加入20重量份的二甲苯/正丁醇混合剂进行第二次球磨18小时，并加入除泡剂进行真空搅拌50分钟，除泡，流延成型制成氧化铝生瓷片；以氧化铝生瓷片为基片，在其上印刷钨金属发热电路膜；
步骤(3)、陶瓷基体与发热电阻材料的结合
将制得的氧化铝生瓷片基片电阻膜包覆于所述陶瓷基体的外部并且印刷导电浆料，然后进行一次1000℃温度烧结，控制时间10～20分钟，接着再印刷贵金属浆料，然后进行一次1500℃温度烧结，控制时间5～10分钟，实现陶瓷基体与发热电阻材料之间充分地结合在一体。
2.根据权利要求1中所述的一种陶瓷加热圈的生产工艺，其特征在于，所述除泡剂是采用磷酸三丁酯。
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