CN110739258A - 一种晶片取片分离装置及方法 - Google Patents

一种晶片取片分离装置及方法 Download PDF

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Publication number
CN110739258A
CN110739258A CN201810806187.2A CN201810806187A CN110739258A CN 110739258 A CN110739258 A CN 110739258A CN 201810806187 A CN201810806187 A CN 201810806187A CN 110739258 A CN110739258 A CN 110739258A
Authority
CN
China
Prior art keywords
adsorption
arm
plate
wafer
driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810806187.2A
Other languages
English (en)
Chinese (zh)
Inventor
邹金成
魏民
申兵兵
库石特·索拉布吉
埃里克·桑福德
史蒂文·尤时达
拉杰·维尔卡
何甘
美利莎·艾契尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zishi Energy Co.,Ltd.
Original Assignee
Ota Installation Co
Dongtai Hi Tech Equipment Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ota Installation Co, Dongtai Hi Tech Equipment Technology Co Ltd filed Critical Ota Installation Co
Priority to CN201810806187.2A priority Critical patent/CN110739258A/zh
Priority to PCT/CN2019/096807 priority patent/WO2020015739A1/fr
Publication of CN110739258A publication Critical patent/CN110739258A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201810806187.2A 2018-07-20 2018-07-20 一种晶片取片分离装置及方法 Pending CN110739258A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810806187.2A CN110739258A (zh) 2018-07-20 2018-07-20 一种晶片取片分离装置及方法
PCT/CN2019/096807 WO2020015739A1 (fr) 2018-07-20 2019-07-19 Dispositif et procédé d'extraction et de séparation de tranche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810806187.2A CN110739258A (zh) 2018-07-20 2018-07-20 一种晶片取片分离装置及方法

Publications (1)

Publication Number Publication Date
CN110739258A true CN110739258A (zh) 2020-01-31

Family

ID=69165004

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810806187.2A Pending CN110739258A (zh) 2018-07-20 2018-07-20 一种晶片取片分离装置及方法

Country Status (2)

Country Link
CN (1) CN110739258A (fr)
WO (1) WO2020015739A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038794A (zh) * 2023-08-30 2023-11-10 安徽美达伦光伏科技有限公司 一种太阳能电池片链式酸洗机及生产线

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2876773B2 (ja) * 1990-10-22 1999-03-31 セイコーエプソン株式会社 プログラム命令語長可変型計算装置及びデータ処理装置
CN203218245U (zh) * 2013-03-06 2013-09-25 昆山富利瑞电子科技有限公司 晶圆自动取放机械手
CN207217572U (zh) * 2017-09-27 2018-04-10 无锡奥特维科技股份有限公司 一种电池片掰片装置及掰片系统
CN207587752U (zh) * 2017-11-29 2018-07-06 北京创昱科技有限公司 一种新型独立驱动的薄膜分离机构
CN107946218A (zh) * 2017-11-29 2018-04-20 北京创昱科技有限公司 一种可实现大产能的薄膜分离设备
CN108155270B (zh) * 2017-12-13 2019-09-20 北京创昱科技有限公司 一种薄膜与晶片的分离装置和分离方法
CN208444824U (zh) * 2018-07-20 2019-01-29 东泰高科装备科技（北京）有限公司 一种晶片取片分离装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038794A (zh) * 2023-08-30 2023-11-10 安徽美达伦光伏科技有限公司 一种太阳能电池片链式酸洗机及生产线
CN117038794B (zh) * 2023-08-30 2024-02-13 安徽美达伦光伏科技有限公司 一种太阳能电池片链式酸洗机及生产线

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Publication number Publication date
WO2020015739A1 (fr) 2020-01-23

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PB01 Publication
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20210223

Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102200

Applicant after: Zishi Energy Co.,Ltd.

Address before: Room A129-1, No. 10 Zhongxing Road, Changping District Science and Technology Park, Beijing 102200

Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd.

Applicant before: ALTA DEVICES, Inc.

SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination