CN110739258A - wafer taking and separating device and method - Google Patents

wafer taking and separating device and method Download PDF

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Publication number
CN110739258A
CN110739258A CN201810806187.2A CN201810806187A CN110739258A CN 110739258 A CN110739258 A CN 110739258A CN 201810806187 A CN201810806187 A CN 201810806187A CN 110739258 A CN110739258 A CN 110739258A
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CN
China
Prior art keywords
adsorption
arm
plate
wafer
driving
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Pending
Application number
CN201810806187.2A
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Chinese (zh)
Inventor
邹金成
魏民
申兵兵
库石特·索拉布吉
埃里克·桑福德
史蒂文·尤时达
拉杰·维尔卡
何甘
美利莎·艾契尔
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Zishi Energy Co.,Ltd.
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Ota Installation Co
Dongtai Hi Tech Equipment Technology Co Ltd
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Priority to CN201810806187.2A priority Critical patent/CN110739258A/en
Priority to PCT/CN2019/096807 priority patent/WO2020015739A1/en
Publication of CN110739258A publication Critical patent/CN110739258A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of solar cell manufacturing equipment, in particular to an wafer taking and separating device and a method, wherein a driving assembly is connected with a separating assembly, an adsorption plate is fixed on the separating assembly, a turnable adsorption arm and an adsorption plate which are arranged on the side of the adsorption plate can be respectively adsorbed on the lower surface of a substrate and the upper surface of a film, so that a wafer is clamped between the adsorption plate and the adsorption arm and can synchronously move under the driving action of the driving assembly to take out the wafer from a carrier, the adsorption arm is connected with a motion controller, when the driving assembly drives the adsorption plate to contact and be adsorbed on the lower surface of the substrate in vacuum, the motion controller can drive the adsorption arm to vertically move, so that the adsorption arm contacts and vacuum adsorbs the film, and can also drive the adsorption arm to laterally turn over, so that the adsorption arm drives the film to be separated from the substrate, and the rapid taking of the wafer can be realized, and the rapid separation of the substrate and the film can be realized, and the productivity.

Description

wafer taking and separating device and method
Technical Field
The invention relates to the technical field of solar cell manufacturing equipment, in particular to a wafer taking and separating device and method.
Background
The thin film solar cell can be manufactured by using different materials such as low-price ceramics, graphite, metal sheets and the like as a substrate, so that the consumption of raw materials can be greatly reduced compared with a silicon substrate solar cell under the same light receiving area of , the thickness of a thin film capable of generating voltage is only several micrometers, and the thin film solar cell has good conversion efficiency.
In the prior art, substrates can be taken out each time, and after the substrates are taken out, the substrates need to be put into another separating assembly for separating the substrates from the films, so that the separation process of groups of substrates and films can be realized each time, the taking and the separation of the substrates are divided into two successive processes, different equipment is needed for completion, and the time of the separation process is long, so that the productivity is greatly influenced.
Disclosure of Invention
() problems to be solved
The invention provides an wafer taking and separating device and method, which can realize rapid taking of a substrate and rapid separation of the substrate and a film, thereby improving the productivity.
(II) technical scheme
In order to solve the technical problems, the invention provides an wafer taking and separating device, which comprises a separating component and a driving component, wherein a wafer comprises a substrate and a film arranged on the substrate, the driving component is connected with the separating component, an adsorption plate is fixed on the separating component and used for adsorbing and fixing the substrate, a reversible adsorption arm is arranged on the side of the adsorption plate, the adsorption plate and the adsorption arm can be adsorbed on the lower surface of the substrate and the upper surface of the film respectively so that the wafer is clamped between the adsorption plate and the adsorption arm, and the adsorption arm and the adsorption plate can synchronously move under the driving action of the driving component so as to take the wafer out of a carrier;
the adsorption arm is connected with a motion controller, when the driving assembly drives the adsorption plate to contact and vacuum-adsorb the adsorption plate on the lower surface of the substrate, the motion controller can drive the adsorption arm to vertically move so that the adsorption arm contacts and vacuum-adsorbs the film; the motion controller can also drive the adsorption arm to turn laterally, so that the adsorption arm drives the film to be separated from the substrate.
Preferably, the motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically under the driving action of the sliding control mechanism, and the rotating mechanism can drive the adsorption arm to overturn laterally.
Preferably, the rotating mechanism comprises a belt transmission mechanism, a driving wheel of the belt transmission mechanism is connected with a servo motor through a rotating coupling, any driven wheel of the belt transmission mechanism is connected with the adsorption arm through a rotating shaft, and the rotating coupling and the rotating shaft are respectively connected with the sliding control mechanism.
Preferably, the slide control mechanism includes:
the rotary sliding plate is connected with a guide rail through a sliding block, the sliding block is used for driving the rotary sliding plate to vertically slide along the guide rail, and the rotary coupling and the rotating shaft are respectively fixed on the rotary sliding plate;
the air cylinder is vertically connected to the rotary sliding plate and can drive the rotary sliding plate to slide when the air cylinder stretches and contracts;
and the limiting units are arranged on the rotary sliding plate and respectively limit the highest point and the lowest point of the sliding stroke of the rotary sliding plate.
Preferably, the limiting unit comprises limiting fixed blocks and limiting suites, the limiting fixed blocks are respectively arranged at the highest position and the lowest position of the sliding stroke of the rotary sliding plate, limiting tables are respectively arranged at two sides of the rotary sliding plate, limiting tables are arranged opposite to the limiting fixed blocks arranged at the highest position, limiting tables are arranged opposite to the limiting fixed blocks arranged at the lowest position, and the limiting suites are arranged on any pairs of the limiting tables and the limiting fixed blocks.
Preferably, the limiting sleeve comprises a limiting bolt and a limiting nut which are arranged in a matched mode.
Preferably, two ends of the rotating shaft are respectively connected with the rotating sliding plate through bearing fixing seats.
Preferably, the adsorption arm includes center pin and vacuum adsorption piece, rotary mechanism and vacuum adsorption piece are connected respectively the both ends of center pin, just non-coaxial setting between center pin and the vacuum adsorption piece under the drive of slip control mechanism, the center pin can drive the vertical slip of vacuum adsorption piece and drive the vacuum adsorption piece centers on the center pin is the side direction upset.
Preferably, the suction arm further comprises a step shaft, an end of the step shaft is connected with the central shaft, a connecting arm is arranged at the other end of the step shaft, the step shaft is connected with the vacuum suction sheet through the connecting arm, the connecting arm and the central shaft are arranged non-coaxially, when the central shaft rotates, the connecting arm can drive the vacuum suction sheet to turn from the side to the other side of the central shaft under the rotating action of the step shaft, so that the vacuum suction sheet turns laterally around the central shaft.
Preferably, the turning angle range of the vacuum adsorption sheet turning around the central shaft in the lateral direction is 0-360 degrees.
Preferably, the adsorption arm further comprises a vacuum generator, and the vacuum generator is connected with the vacuum adsorption sheet.
Preferably, the separating assembly still includes the plummer, the adsorption plate is fixed on the plummer, it installs to adsorb the arm through motion control ware on the plummer, the plummer is connected drive assembly is last drive assembly's drive is down, the plummer can drive the adsorption plate with adsorb arm synchronous motion.
Preferably, the plummer includes PMKD and fixed curb plate, the fixed curb plate stands on the PMKD, install the side of fixed curb plate motion controller, the tip of PMKD outwards stretches out there is the fixed arm, the fixed arm corresponds the setting in motion controller's side, the end that stretches out of fixed arm is connected with the adsorption plate.
Preferably, reversible adsorption arms and adsorption plates form a separation unit, the separation unit comprises a forward separation unit and a reverse separation unit, the adsorption arms of the forward separation unit are arranged on the outer side of the adsorption plates, the adsorption arms of the reverse separation unit are arranged on the inner side of the adsorption plates, the forward separation unit and the reverse separation unit are arranged at intervals, and the overturning directions of two adsorption arms in the adjacent forward separation unit and the reverse separation unit are opposite.
Preferably, the driving assembly includes:
the X-axis driver is connected with the separation assembly to drive the adsorption plate and the adsorption arm to synchronously move horizontally;
and the Y-axis driver is connected with the X-axis driver and is used for driving the X-axis driver to vertically move.
Preferably, the driving assembly further comprises a connecting mechanism, the X-axis driver is fixed on the connecting mechanism, the Y-axis driver is connected with the connecting mechanism, and the connecting mechanism can drive the X-axis driver to move vertically under the driving action of the Y-axis driver.
Preferably, the connecting mechanism comprises a connecting bottom plate and a connecting side plate, the X-axis driver is fixed on the connecting bottom plate, the connecting bottom plate is fixed on the connecting side plate, the connecting side plate is connected with the Y-axis driver, and the connecting side plate can drive the connecting bottom plate to vertically move under the driving of the Y-axis driver.
Preferably, the X-axis driver includes X-axis driving motor, synchronous pulley and horizontal slide rail, horizontal slide rail is laid connect the bottom plate on be equipped with slidable horizontal slider on the horizontal slide rail, separator element fixed connection be in on the horizontal slider, X-axis driving motor passes through synchronous pulley drive horizontal slider follows horizontal slide rail makes horizontal migration, so that horizontal slider drives separator element makes horizontal migration.
Preferably, the Y-axis driver comprises a Y-axis driving motor and a vertical slide rail, a movable vertical slide block is arranged on the vertical slide rail, and the vertical slide block is connected with the Y-axis driving motor and can vertically move along the vertical slide rail under the driving of the Y-axis driving motor; the connecting side plate is fixedly connected to the vertical sliding block, and under the driving of the vertical sliding block, the connecting side plate drives the connecting bottom plate to vertically move so as to drive the X-axis driver to vertically move.
Preferably, the vertical slide rail is a lead screw, the lead screw is connected with the Y-axis driving motor through a driving coupler, the vertical sliding block is sleeved on the lead screw, and the Y-axis driving motor drives the lead screw to rotate through the driving coupler so as to drive the vertical sliding block to move vertically along the lead screw.
The invention also provides wafer taking and separating methods, which are based on the wafer taking and separating device and comprise the following steps:
the driving assembly drives the adsorption plate to contact and be adsorbed on the lower surface of the substrate in a vacuum mode, and drives the adsorption arm to turn over laterally through the motion controller, so that the adsorption arm turns over to the upper side of the substrate, and a gap is reserved between the adsorption arm and the adsorption plate;
the motion controller drives the adsorption arm to vertically slide so that the adsorption arm is in contact with and adsorbs the film on the substrate in vacuum;
the driving assembly drives the adsorption plate and the adsorption arm to synchronously move so as to synchronously take out the substrate and the film from the carrier;
keeping the adsorption plate fixed, and driving the adsorption arm to turn over laterally through the motion controller so that the adsorption arm drives the film to be separated from the substrate.
Preferably, the motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically under the driving action of the sliding control mechanism, and the rotating mechanism can drive the adsorption arm to overturn laterally.
Preferably, reversible adsorption arms and adsorption plates form a separation unit, the separation unit comprises a forward separation unit and a reverse separation unit, the adsorption arms of the forward separation unit are arranged on the outer side of the adsorption plates, the adsorption arms of the reverse separation unit are arranged on the inner side of the adsorption plates, the forward separation unit and the reverse separation unit are arranged at intervals, and the overturning directions of two adsorption arms in the adjacent forward separation unit and the reverse separation unit are opposite.
(III) advantageous effects
The technical scheme of the invention has the following beneficial effects:
1. the device drives the adsorption arm to turn over laterally by the motion controller, so that the film on the substrate is lifted laterally by the turning over of the adsorption arm to safely separate the substrate from the film, and the device and the method can realize the quick taking of the wafer on the same device, realize the quick separation of the substrate and the film of the wafer, effectively save the process conversion time and greatly improve the productivity;
2. after the adsorption plate finishes the adsorption on the lower surface of the substrate, the adsorption arm is driven to vertically move to tightly attach the film, so that the film is adsorbed by vacuum, the adsorption arm and the film as well as the film and the substrate are prevented from deviating, the safe clamping of the adsorption plate and the adsorption arm on the wafer is further ensured, the film is prevented from being damaged, and the relative displacement between the substrate and the film can be ensured in the processes of taking and separating, so that the process of taking and separating has high accuracy;
3. in the device and the method, a plurality of separating units are respectively arranged on the separating components, so that operations can be realized, and the picking, placing and separating of a plurality of wafers can be simultaneously completed.
4. In the device and the method, the forward separating units and the reverse separating units are arranged at intervals, and the overturning directions of the two adsorption arms in the adjacent forward separating units and the reverse separating units are opposite, so that the adsorption arms of the adjacent two groups of separating units are prevented from interfering with each other when being overturned, the safety of equipment is improved, and the space of the equipment can be effectively saved;
5. according to the device and the method, the limiting unit is arranged, so that the rotary sliding plate has a controllable vertical sliding stroke, and the accuracy of taking and separating the film is improved.
Drawings
FIG. 1 is a schematic structural diagram of a wafer picking and separating device according to an embodiment of the present invention;
FIG. 2 is a top view of a separation module of an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a rotating mechanism according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating the operation of a motion controller according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a motion controller according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of a carrier according to embodiments to three of the present invention;
FIG. 7 is a schematic view of the wafer loading status of -III according to the present invention;
FIG. 8 is a schematic drawing of a separation module according to embodiments -III of the present invention;
fig. 9 is a schematic structural view of an initial separation state of the separation modules according to embodiments to iii of the present invention;
fig. 10 is a schematic structural diagram of a separated state of the separation assemblies -three according to the embodiments of the present invention.
Wherein, 1, Y-axis driver; 2. an X-axis driver; 3. connecting the bottom plate; 4. a separation assembly; 5. connecting the side plates; 6. a water jet;
10. fixing the bottom plate; 20. fixing the side plate; 30. a rotation mechanism; 40. rotating the sliding plate; 50. a cylinder; 60. a guide rail; 70. an adsorption arm; 80. a fixed arm; 90. an adsorption plate;
31. a servo motor; 32. a rotating coupling; 33. rotating the connecting plate; 34. a driving wheel; 35. a belt; 36. a driven wheel; 37. a rotating shaft; 38. a bearing fixing seat;
401. 406, limiting fixing blocks; 402. 404, a limit bolt; 403. 405, a limit nut; 407. a fixed mount;
100. a carrier; 200. a substrate; 300. a film.
Detailed Description
The following provides a detailed description of an embodiment of the present invention, taken in conjunction with the accompanying drawings and examples, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified. The terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention.
Example
As shown in fig. 1, the present embodiment provides a wafer picking and separating apparatus for rapidly picking and placing and separating a wafer, wherein the wafer includes a substrate 200 and a film 300 disposed on the substrate 200. the apparatus includes a separating assembly 4 and a driving assembly connected to the separating assembly 4, the driving assembly can drive the separating assembly to move as a whole, wherein a suction plate 90 is fixed on the separating assembly 4, the suction plate 90 is used for vacuum-sucking the substrate 200, a reversible suction arm 70 is disposed on a side of the suction plate 90, the suction arm 70 can be turned over to above the substrate 200 or turned axially outward to be away from the substrate 200 position, the suction arm 70 is connected to a motion controller, the driving assembly drives the separating assembly 4 to move as a whole, the suction plate 90 can contact and vacuum-suck the lower surface of the substrate 200, at this time, the motion controller can drive the suction arm 70 to move vertically, so that the suction arm 70 contacts and vacuum-sucks the upper surface of the film 300, so that the wafer is held between the suction plate 90 and the suction arm 70, when the wafer is held between the suction plate 90 and the suction arm 70, the wafer is driven to move laterally, the substrate 70 is moved, the wafer picking and the substrate can be taken out, the wafer can be taken out, and the substrate can be taken out, thereby the wafer can be taken out quickly.
Therefore, the device can realize quick taking of the wafer and quick separation of the substrate 200 and the film 300 of the wafer on the same device, effectively save process conversion time and greatly improve productivity, meanwhile, the motion controller can drive the adsorption arm 70 to vertically slide automatically, so that the process of clamping and taking the wafer is further divided into two steps in step, aspect, when the adsorption plate 90 adsorbs the substrate 200, a vertical safety gap exists between the film 300 and the adsorption arm 70, and the film 300 can be prevented from being damaged or falling off, in aspect, after the adsorption plate 90 finishes adsorption on the substrate 200, the adsorption arm 70 is driven to vertically move, so that absolute displacement of the adsorption arm 70 is decomposed from at least two degrees of freedom, precision fine adjustment of adsorption positions of the adsorption arm 70 and the film 300 is realized, and deviation between the adsorption arm 70 and the film 300 and the substrate 200 is prevented, and further, safe clamping of the adsorption plate 90 and the adsorption arm 70 on the wafer is ensured, the film 300 is prevented from being damaged, and fine adjustment of adsorption positions of the adsorption arm 70 and the film 300 and the substrate can be ensured in both the process of taking and separation, and the substrate 300 have high precision and no displacement, so that the process has high precision in the process of taking and the substrate taking process.
The separating component 4 of the device can respectively realize the sheet taking and the separation.
When the substrate is taken, the separation assembly 4 is driven to move by the driving assembly so as to drive the adsorption plate 90 to contact and be adsorbed on the lower surface of the substrate 200 in a vacuum manner; because the adsorption arm 70 has a preset vertical sliding stroke, when the adsorption arm 70 is turned over the substrate 200, because a safety gap exists between the adsorption arm 70 and the film 200, the wafer is not damaged by the turning of the adsorption arm 70, and the adsorption arm 70 is driven by the motion controller to vertically slide down, so that the wafer is contacted and vacuum-adsorbed on the film 300, and the wafer is accurately clamped between the adsorption plate 90 and the adsorption arm 70, thereby preventing the substrate 200 and the film 300 from relative displacement during the wafer taking. After the wafer is held, the driving assembly drives the separating assembly 4 to move integrally, so as to drive the adsorption plate 90 and the adsorption arm 70 to move synchronously, so as to rapidly take out the wafer from the carrier 100.
When the separation module 4 is in the initial separation state, the adsorption arm 70 and the adsorption plate 90 are clamped and adsorbed on the upper and lower sides of the wafer respectively, when the separation module 4 is in the initial separation state, as shown in fig. 9 and 10, when the separation module 4 is in the end separation state, the adsorption arm 70 is turned over to the side surface of the adsorption plate 90 from the upper direction of the adsorption plate 90, and in the process that the separation module 4 is from the initial separation state to the end separation state, the separation module 4 drives the adsorption arm 70 to turn over laterally by using the motion controller, so that the film 300 on the substrate 200 is lifted up laterally by turning over the adsorption arm 70, and the substrate 200 is separated from the film 300 safely.
Specifically, in fig. 1, the horizontal direction is taken as an X axis, the vertical direction is taken as a Y axis, the driving mechanism includes an X axis driver 2 and a Y axis driver 1, the X axis driver 2 is connected with the separation assembly 4 and is used for driving the whole separation assembly 4 to move horizontally, that is, the adsorption plate 90 and the adsorption arm 70 are driven to move horizontally synchronously; the Y-axis driver 1 is connected with the X-axis driver 2 and is used for driving the X-axis driver 2 to move vertically.
In this embodiment , drive assembly still includes coupling mechanism, X axle driver 2 is fixed on coupling mechanism, coupling mechanism is connected with Y axle driver 1, under the drive effect of Y axle driver 1, coupling mechanism can drive X axle driver 2 and make vertical migration coupling mechanism is including connecting bottom plate 3 and connecting curb plate 5, X axle driver 2 is fixed on connecting bottom plate 3, connecting bottom plate 3 is fixed on connecting curb plate 5, connecting curb plate 5 is connected with Y axle driver 1, under the drive of Y axle driver 1, connecting curb plate 5 can drive connecting bottom plate 3 and make vertical migration, thereby drive X axle driver 2 and make vertical migration.
It should be noted that, the connection mechanism may include other structures besides the above structure, as long as it is ensured that the X-axis driver 2 can be fixed on the connection mechanism, and the connection mechanism is connected to the Y-axis driver 1, so that when the Y-axis driver drives the connection mechanism to move, the X-axis driver 2 can be driven to vertically move.
Preferably, X axle driver 2 includes X axle driving motor, synchronous pulley and horizontal slide rail, horizontal slide rail is laid on connecting bottom plate 3, be equipped with slidable horizontal slider on horizontal slide rail, 4 fixed connection on horizontal slider of separator assembly, X axle driving motor passes through synchronous pulley drive horizontal slider and makes horizontal migration along horizontal slide rail, thereby make horizontal slider drive separator assembly 4's whole along the removal of horizontally X axle, the same principle, Y axle driver 1 includes Y axle driving motor and vertical slide rail, vertical slide rail erects the setting, be equipped with vertical slider on it, vertical slider can slide along vertical slide rail, Y axle driving motor is preferred to be installed at arbitrary ends of vertical slide rail, and can drive vertical slider and slide, connect 5 fixed connection of curb plate on vertical slider, thereby make vertical slider can drive and connect 5 vertical motions of curb plate, and then drive 2 vertical motions of X axle driver.
In order to enhance the structural reliability of the driving mechanism, the vertical slide rail of the Y-axis driver can adopt a structure in which a lead screw and a nut are movably assembled, in addition to the structure in which the slide block is movably assembled in the rail. Wherein, preferred vertical slide rail is the lead screw, then vertical slider is the nut, and the lead screw passes through drive coupling and Y axle driving motor's output shaft to make Y axle driving motor pass through drive coupling drive lead screw and rotate, thereby drive the vertical slider of spiro union on the lead screw and move along the lead screw, and then realize the vertical removal of vertical slider.
It should be noted that in the X-axis driver 2 and the Y-axis driver 1 of this embodiment , the driving motor may be the servo motor 31 or the stepping motor, the horizontal slide rail of the X-axis driver 2 and the vertical slide rail of the Y-axis driver 1 may be replaced by the lead screw and the support seat assembly, the synchronous pulley of the X-axis driver 2 may be replaced by the gear assembly, that is, the X-axis driving motor is connected to the separation assembly 4 through the gear assembly to drive the separation assembly 4 to move horizontally along the horizontal slide rail, and the driving coupling of the Y-axis driver 1 may be replaced by the synchronous pulley or the gear assembly, as long as the Y-axis driving motor drives the X-axis driver 2 to move along the vertical slide rail through the connecting side plate 5.
In the apparatus of the present embodiment, reversible adsorption arms 70 and adsorption plates 90 are used as separation units, the separation units include a forward separation unit and a reverse separation unit, the adsorption arms 70 of the forward separation unit are disposed on the outer side of the adsorption plates 90, and the adsorption arms 70 of the reverse separation unit are disposed on the inner side of the adsorption plates 90. in the present embodiment, sets or multi-set separation units are disposed on the separation module, when sets of separation units are disposed, the separation units can be either forward separation units or reverse separation units, when multiple sets of separation units are disposed, the forward separation units and reverse separation units are arranged at intervals, because the adsorption arms 70 in each set of separation units can be individually controlled, and the inversion directions of two adsorption arms 70 in the adjacent forward separation units and reverse separation units are opposite, preferably, the range of angles of each adsorption arm 70 when laterally inverted is 0-360 degrees, thereby achieving effective separation of two adjacent substrate sets in the apparatus while avoiding interference between the two adsorption arms .
The structure of the separation module 4 will be specifically described below by taking separation modules 4 as an example, in which of the two separation modules are forward separation modules, are reverse separation modules, and two adsorption plates 90 of the two separation modules are adjacent to each other in order to facilitate the safe turning of the adsorption arms 70 of each group.
As shown in fig. 2, the separating assembly 4 includes a rotating mechanism 30 and a sliding control mechanism, the motion controller includes a rotating mechanism 30 and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm 70 through the rotating mechanism 30, under the driving action of the sliding control mechanism, the rotating mechanism 30 and the adsorption arm 70 can synchronously slide vertically, and the rotating mechanism 30 can also independently drive the adsorption arm 70 to turn laterally. Since the driving assembly can drive the separating assembly 4 to move integrally, when the separating assembly 4 moves integrally, the rotating mechanism 30, the sliding control mechanism, and the adsorption plate 90 fixed on the separating assembly 4 move synchronously, so that after the position of the adsorption plate 90 is determined, the adsorption arm 70 can be driven to move and turn over by the cooperation of the rotating mechanism 30 and the sliding control mechanism on the basis of the determined position.
In order to further the reliable connection between the separation assembly 4 and the driving assembly, and to improve the operation precision of the device, the separation assembly 4 preferably further comprises a bearing table, the adsorption plate 90 is fixed on the bearing table, the adsorption arm 70 is mounted on the bearing table through a motion controller, the bearing table is connected to the driving assembly, and the driving assembly can drive the bearing table to move, so that the bearing table drives the adsorption plate 90 and the adsorption arm 70 to move synchronously, and the driving assembly is driven to realize the driving effect on the overall movement of the separation assembly 4.
The plummer includes but is not limited to a fixed bottom plate 10 and a fixed side plate 20, the fixed side plate 20 stands on the fixed bottom plate 10, the rotating mechanism 30 and the sliding control mechanism of the motion controller are both installed on the same side of the fixed side plate 20, a fixed arm 80 extends outwards from the end of the fixed bottom plate 10, the fixed arm 80 is correspondingly arranged on the side of the motion controller, and the extending end of the fixed arm 80 is connected with an adsorption plate 90.
When two sets of separation units are arranged on the separation module 4, fixed side plates 20 are preferably respectively erected on two ends of the fixed base plate 10, two rotating mechanisms 30 are respectively connected to two adsorption arms 70 in the two sets of separation units, the two rotating mechanisms 30 are respectively installed on the inner sides of the two fixed side plates 20 through sliding control mechanisms, two fixed arms 80 are extended outwards from the same end of the fixed base plate 10 side by side, a adsorption plate 90 is fixed at the extending end of each fixed arm 80, wherein the adsorption plate 90 comprises an adsorption end part which is inserted into the carrier 100 through the adsorption end part and is adsorbed on the lower surface of the substrate 200 in vacuum, a preset distance is reserved between the two fixed arms 80 to avoid mutual collision between the substrates 200 of the two wafers and the thin films 300 during picking or separation, because if the overturning directions of the two rotating mechanisms 30 are the same, the preset distance between the two fixed arms 80 is enough to leave a space between the two thin films 300 to ensure that no interference occurs during separation, but if the overturning directions of the two thin films 300 are the two rotating mechanisms are the same, the preset distance between the two fixed arms 80 is enough to ensure that the two wafers can be separated by adopting a large enough space between the two adsorption arms 300, the two movable mechanisms 300, the movable adsorption arms 300, the two adsorption mechanisms can not only the automatic multi-wafer-separation-wafer-separation-wafer-separation-wafer.
In order to realize the lateral overturning of the adsorption arm 70, the preferred adsorption arm 70 comprises a central shaft and a vacuum adsorption piece, the rotary mechanism and the vacuum adsorption piece are respectively connected to two ends of the central shaft, and the central shaft and the vacuum adsorption piece are arranged in a non-coaxial manner, so that the rotary mechanism can vertically move under the driving of the sliding control mechanism, the central shaft can drive the vacuum adsorption piece to vertically slide, and the vacuum adsorption piece is driven to laterally overturn around the central shaft through the self-rotation of the central shaft.
In order to ensure that the turning precision of the vacuum suction sheet is sufficiently high during turning, it is preferable that the suction arm 70 further includes a step shaft, an end of the step shaft is connected to the central shaft, a connecting arm is disposed at a end of the step shaft, the step shaft is connected to the vacuum suction sheet through the connecting arm, the connecting arm can drive the vacuum suction sheet to turn from side to side of the central shaft under the rotation of the step shaft so that the vacuum suction sheet turns laterally around the central shaft, and the connecting arm is disposed non-coaxially with the central shaft and can reasonably control the turning radius of the lateral turning of the connecting arm, so that the vacuum suction sheet is turned over above the film 300 under the driving of the rotation mechanism, and then the vacuum suction sheet 300 is vertically moved downward under the driving of the motion controller so as to clamp the wafer from the upper surface of the film 300 while the film 300 is lifted from the substrate 200 by turning of the vacuum suction sheet, wherein the number of step levels of the step shaft can be determined according to the turning radius of the vacuum suction sheet, the rotation angle and the structural strength coefficient of the vacuum suction sheet, and the vacuum suction sheet 200 can be controlled by the vacuum suction unit 30, so that the vacuum suction sheet and the vacuum suction sheet can be turned over environment can be conveniently created, and the vacuum suction sheet 200.
Specifically, as shown in fig. 3, the rotating mechanism 30 of this embodiment includes a belt transmission mechanism, a driving wheel 34 of the belt transmission mechanism is connected to a servo motor 31 through a rotating coupling 32, a belt transmission mechanism may be provided with or a plurality of driven wheels 36, and any driven wheel 36 of the belt transmission mechanism is connected to the adsorption arm 70 through a rotating shaft 37, that is, the rotating shaft 37 is driven to rotate through the rotation of a driving shaft of the servo motor 31, so as to drive the adsorption arm 70 to turn laterally, wherein the rotating coupling 32 and the rotating shaft 37 are respectively connected to a sliding control mechanism, and the sliding control mechanism can simultaneously drive the rotating coupling 32 and the rotating shaft 37 to synchronously move, so as to realize the vertical reciprocating self-sliding of the rotating mechanism 30.
It should be noted that the belt transmission mechanism of the rotating mechanism 30 may also be a gear transmission mechanism, correspondingly, a driving gear in the gear transmission mechanism is connected with the rotating coupler 32, and any driven gear is connected with the rotating shaft 37, so as to realize reliable transmission of power and torque of the servo motor 31, and the power unit of the rotating mechanism 30 may be the servo motor 31 or a stepping motor.
As shown in fig. 4, in order to reliably control the vertical reciprocating self-sliding of the rotating mechanism 30, the sliding control mechanism of the present embodiment includes a rotating slide plate 40, a cylinder 50, and a stopper unit.
Specifically, the guide rail 60 is preferably laid on the fixed side plate 20 of the bearing platform, so that when the driving mechanism drives the bearing platform to move, the guide rail 60 can move along with the bearing platform, thereby pushing the rotating mechanism 30 to move along with the whole separation assembly 4; the rotary sliding plate 40 is connected with the guide rail 60 through a sliding block, the sliding block drives the rotary sliding plate 40 to vertically slide along the guide rail 60, and the moving direction of the rotary sliding plate 40 is limited by the guide rail 60; the rotating shaft coupling 32 and the rotating shaft 37 are respectively fixed on the rotating slide plate 40 and can move along with the sliding of the rotating slide plate 40, wherein preferably, two ends of the rotating shaft 37 are respectively connected with the rotating slide plate 40 through the bearing fixing seats 38, and preferably, the rotating shaft coupling 32 is fixed on the rotating slide plate 40 through the rotating connecting plate 33, so that the rotating precision of the rotating shaft 37 and the rotating shaft coupling 32 is respectively ensured to be high.
Besides the limitation of the moving direction of the rotating sliding plate 40 by the guide rail 60, the moving direction of the rotating sliding plate 40 can be limited by the screw assembly, that is, the screw nut is arranged on the rotating sliding plate 40, and the screw is fixed on the fixed side plate 20, so that the vertical sliding of the rotating sliding plate 40 is realized by the vertical sliding of the screw nut on the screw.
The cylinder 50 is vertically connected to the rotary sliding plate 40, and can drive the rotary sliding plate 40 to slide when the cylinder 50 extends and contracts, in this embodiment , preferably, the cylinder barrel of the cylinder 50 is fixed on the fixed side plate 20 through the fixing frame 407, the piston rod of the cylinder 50 is fixed on the fixed bottom plate 10, and the other end reciprocates along the axial direction of the cylinder barrel, because the fixed bottom plate 10 is fixed relative to the whole separating assembly 4, when the cylinder 50 is in an extended state, the end of the piston rod abuts against the fixed bottom plate 10, the other end pushes the slider to move upwards along the guide rail 60, the rotary sliding plate 40 is fixed on the slider, the rotary sliding plate 30 is fixed on the rotary sliding plate 40, and the adsorption arm 70 is fixed on the rotary mechanism 30, when the piston rod of the cylinder 50 extends, the slider 60 moves upwards, so that the rotary sliding plate 40, the rotary mechanism 30 and the adsorption arm 70 also move upwards, and when the piston rod of the cylinder 50 contracts, the piston rod pulls the slider to move downwards along the guide rail 60, so that the rotary sliding plate 40, the rotary.
It should be noted that, besides the telescopic cylinder 50 is used to drive the rotating slide plate 40 to slide, a screw nut assembly structure can be used to drive the rotating slide plate 40 to slide, that is, the screw rod is vertically arranged on the fixing bottom plate 10, the screw nut is sleeved outside the screw rod and moves along the axial direction of the screw rod, and the screw nut is fixed on the rotating slide plate 40, so that the relative movement between the screw nut and the screw rod is used to drive the rotating slide plate 40 to slide vertically.
Preferably, the limiting unit is installed on the rotary sliding plate 40 and limits the highest point and the lowest point of the sliding stroke of the rotary sliding plate 40, so that the combination of the guide rail 60 and the limiting unit is used to realize the double limiting of the sliding direction and the sliding stroke of the rotary sliding plate 40, further realize the fine adjustment of the displacement of the adsorption arm 70, and ensure the safe adsorption of the adsorption arm 70 on the film 300.
Specifically, the limiting unit comprises limiting fixed blocks 401 and 406 and limiting kits, the limiting fixed blocks 401 and 406 are respectively arranged at the highest position and the lowest position of the sliding stroke of the rotary sliding plate 40, limiting tables are respectively arranged on two sides of the rotary sliding plate 40, limiting tables are arranged opposite to the limiting fixed block 401 arranged at the highest position, limiting tables are arranged opposite to the limiting fixed block 406 arranged at the lowest position, the limiting kits are arranged on any pairs of limiting tables and the limiting fixed blocks 401 and 406, and preferably the limiting kits comprise limiting bolts 402 and 404 and limiting nuts 403 and 405 which are arranged in a matched mode.
of lower limit stop is arranged on the left side of the top of the rotary sliding plate 40 of the embodiment , of higher limit stop extending outwards is arranged on the right side of the top of the rotary sliding plate 40, so that a step structure is formed on the top of the rotary sliding plate 40. , a highest limit fixed block 401 is arranged above the left limit stop, a limit bolt 402 is arranged on the limit fixed block 401, a limit nut 403 is arranged at a position corresponding to the limit stop, so that sets of limit bolts 402 and limit nuts 403 are oppositely arranged, so that sets of limit kit arranged at the highest point are formed, similarly, a lowest limit fixed block 406 is arranged below the right limit stop, a limit bolt 404 is arranged on the outwards extending limit stop, a limit nut 405 is correspondingly arranged on the limit fixed block 406, so that sets of limit bolts 404 and limit nuts 405 are oppositely arranged, so that sets of limit kit arranged at the lowest point are formed, when the piston rod of the air cylinder 50 extends, the limit bolt 402 at the highest point is in contact with the limit nut 403, so that the position is a sliding stroke of the air cylinder 50, when the piston rod retracts, the piston rod 404 and the piston rod contacts with the lowest limit nut 405, so that the limit bolt 404 and the piston rod slides up and down, the limit nut 405, and the limit nut 405, so that the limit stroke of the piston rod is not only stops.
Example two
The structure of the wafer taking and separating device in the second embodiment is substantially the same as that of the device in the second embodiment , and the same parts are not repeated, except that as shown in fig. 5, in the device in the second embodiment, the rotating mechanism 30 is connected to the rotating shaft 37 through the swing cylinder 50, and the swing cylinder 50 drives the rotating shaft 37 to rotate, so as to drive the adsorption handle to turn laterally, wherein the swing cylinder 50 and the rotating shaft 37 are respectively connected to the rotating slide plate 40 and connected to the sliding control mechanism, and the sliding control mechanism can simultaneously drive the swing cylinder 50 and the rotating shaft 37 to synchronously move, so as to realize the vertical reciprocating self-sliding of the rotating mechanism 30.
EXAMPLE III
Based on embodiment or embodiment two, this embodiment three provides methods for separating a wafer from a wafer, including the steps of:
and S1, the driving assembly drives the adsorption plate to contact and vacuum-adsorb on the lower surface of the substrate, and drives the adsorption arm to laterally overturn through the motion controller, so that the adsorption arm overturns to the upper side of the substrate, and a gap is reserved between the adsorption arm and the adsorption plate.
And S2, the motion controller drives the adsorption arm to slide vertically, so that the adsorption arm contacts and vacuum adsorbs the film on the substrate.
And S3, the driving component drives the adsorption plate and the adsorption arm to synchronously move so as to synchronously take out the substrate and the film from the carrier.
And S4, keeping the adsorption plate fixed, and driving the adsorption arm to turn over laterally through the motion controller so that the adsorption arm drives the film to separate from the substrate.
The steps S1 to S4 are slice picking steps, and the step S5 is a separation step.
Step , the step of picking up slices can be specifically divided into the following steps:
s201: driving the X-axis driver 2 to move horizontally and driving the Y-axis driver 1 to move upwards so that the adsorption plate 90 contacts the lower surface of the substrate 200 and is adsorbed on the substrate 200 by vacuum; the adsorption arm 70 is driven to laterally turn by the rotation mechanism 30 of the motion controller, so that the adsorption arm 70 is turned over above the substrate 200, and a gap is left between the adsorption arm 70 and the adsorption plate 90.
As shown in fig. 6 and 7, a plurality of square carriers 100 are arranged in parallel, each carrier 100 is provided with a groove for loading a square substrate 200 of a wafer, when the substrate 200 is loaded in the groove, the edge of the film 300 on the substrate 200 is loaded on the upper surface of the carrier 100, the end of the carrier 100 is provided with channels matched with the adsorption plates 90, the number of the channels is the same as the number of the adsorption end parts on the adsorption plates 90, in the third embodiment, the adsorption end parts of the adsorption plates 90 are two, and then the channels of the carrier 100 are correspondingly provided with two channels.
As shown in fig. 8, when the separation assembly 4 is used for taking a wafer, the adsorption plate 90 may be first vacuum-adsorbed on the lower surface of the substrate 100, and then the adsorption arm 70 is turned over the adsorption plate 90, so that the wafer is located between the adsorption plate 90 and the adsorption arm 70; the adsorption arm 70 may be turned over the adsorption plate 90, and then the driving assembly drives the adsorption plate 90 to move and adsorb onto the lower surface of the substrate 100, i.e. the wafer is inserted between the adsorption plate 90 and the adsorption arm 70.
Since the cylinder 50 is kept in the extended state, a safety gap is left between the suction arm 70 and the suction plate 90, so that when the suction plate 90 is located in the channel of the carrier 100 and is sucked under the substrate 200, the suction arm 70 is located above the film 300 and does not contact the film 300.
S201: the driving cylinder 50 is retracted to drive the rotating mechanism 30 and the adsorption arm 70 to synchronously move downward along the Y-axis direction, so that the adsorption arm 70 contacts with the upper surface of the film 300, and the adsorption arm 70 is adsorbed on the film 300 by vacuum.
And S301, ensuring that the wafer is clamped between the adsorption arm 70 and the adsorption plate 90, driving the Y-axis driver 1 to move upwards for a certain distance, so that the adsorption plate 90 and the adsorption arm 70 of the separation assembly 4 synchronously drive the substrate 200 and the film 300 of the wafer to leave the carrier 100, and ensuring that the separation assembly 4 is not in contact with the carrier 100.
S302: the X-axis driver 2 drives the whole separation assembly 4 to move to a predetermined separation position, so that the adsorption plate 90 and the adsorption arm 70 can respectively take out the film 300 and the substrate 200 from the carrier 100 at the same time, and the step of taking out the film is completed.
In the above-mentioned taking step, since the two sets of separators are disposed on the separating assembly 4 of the apparatus, two substrates 200 can be taken out simultaneously each time, thereby effectively improving the productivity.
In the step , the separation step can be specifically divided into the following steps:
s401: the X-axis driver 2 and the Y-axis driver 1 are respectively driven to move to a preset separation position, and the separation position is provided with a water spray opening 6.
And S402, synchronously adjusting the positions of the film 300 and the substrate 200 through the movement of the X-axis driver 2 and the Y-axis driver 1 so that water spray nozzles 6 are respectively arranged between the film 300 and the substrate 200 of each wafer.
And S403, driving the rotating mechanism 30 to rotate so as to drive the adsorption arm 70 to laterally overturn, so that the film 300 is lifted from the substrate 200, wherein the rotating mechanism 30 rotates to lift the film 300 from the substrate 200 at a certain angle, so that the film 300 is separated from the substrate 200.
The separation assembly 4 between steps 402 and 403 undergoes a process from an initial state of separation to an end state of separation, in which the water jet 6 continuously sprays water to the bonding surface of the substrate 200 and the film 300 to improve the lubrication between the film 300 and the substrate 200 and ensure the safety of separation and the integrity of the workpiece.
Since the apparatus is provided with two sets of separating units, the two rotating mechanisms 30 respectively provided in the two sets of separating units can rotate for a certain angle slowly in opposite directions at the same time, that is, the left side suction arm 70 in fig. 8 rotates left and the right side suction arm 70 rotates right, when the two rotating mechanisms 30 rotate for a certain angle, the two substrates 200 and the thin film 300 are respectively separated.
S504: after the substrate 200 is separated from the film 300, the rotation mechanism 30 is driven to rotate rapidly to drive the suction arm 70 to turn to the outside position, so that the substrate 200 is completely separated from the film 300, thereby completing the separation of the substrate 200 and the film 300.
Similarly, in the two-component separation unit of the apparatus, the two rotating mechanisms 30 are rapidly rotated to the outer positions shown in fig. 10, respectively, to completely separate the film 300 and the substrate 200, and the separation member 4 is in the separated state.
As can be seen from the above, when two sets of separating units are mounted on the separating assembly 4, of the two sets of separating units are forward separating units, are reverse separating units, and in order to facilitate the safe turning of the adsorbing arms 70 of each set, the two adsorbing plates 90 of the two sets of separating units are adjacent, and the turning directions of the two adsorbing arms 70 of the two sets of separating units are opposite, so that the substrate 200 and the film 300 are separated by the method, operations can be performed while picking and placing and separating the multiple substrates 200, and the two adjacent sets of separators can be effectively prevented from interfering with each other when the adsorbing arms 70 are turned over, thereby improving the safety of the apparatus, and effectively saving the space of the apparatus.
In summary, in the wafer picking and separating device and method according to the above embodiments, the substrate 200 is vacuum-adsorbed by the adsorption plate 90, the vertical self-sliding of the adsorption arm 70 is driven by the motion controller, so that the adsorption arm 70 adsorbs the film 300 on the substrate 200, and the wafer is clamped between the adsorption arm 70 and the adsorption plate 90, and the adsorption arm 70 and the adsorption plate 90 are driven by the driving assembly to synchronously move, so as to achieve fast picking of the wafer, and effectively ensure the integrity of the substrate 200 and the film 300 of the wafer when the wafer is picked up, and prevent the quality of the wafer from being affected, the device drives the adsorption arm 70 to laterally turn over by the motion controller, so as to laterally lift the film 300 on the substrate 200 by turning over the adsorption arm 70, so that the substrate 200 and the film 300 are safely separated, therefore, the device and method can not only achieve fast picking of the wafer on the same device, but also achieve fast separation of the substrate 200 and the film 300 of the wafer, effectively save process conversion time, and greatly improve productivity.
In the device and the method, the motion controller drives the adsorption arm 70 to vertically slide, the clamping and taking process of the wafer is further decomposed into steps, and when the adsorption plate 90 adsorbs the substrate 200, a vertical safety gap exists between the film 300 and the adsorption arm 70, so that the film 300 can be prevented from being damaged or falling off;
in the device and the method, a plurality of separating units are respectively arranged on the same separating component so as to realize operations and complete the picking, placing and separating of a plurality of wafers at the same time.
In the device and the method, the forward separating units and the reverse separating units are arranged at intervals, and the overturning directions of the two adsorption arms 70 in the adjacent forward separating units and the reverse separating units are opposite, so that the mutual interference of the adsorption arms 70 of the adjacent two groups of separating units during overturning is prevented, the safety of equipment is improved, and the space of the equipment can be effectively saved;
in the device and the method, the limiting unit is arranged, so that the rotary sliding plate 40 has controllable vertical sliding stroke, and the accuracy of taking and separating the film is improved.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (23)

  1. The wafer taking and separating device is characterized by comprising a separating assembly and a driving assembly, wherein a wafer comprises a substrate and a film arranged on the substrate, the driving assembly is connected with the separating assembly, an adsorption plate is fixed on the separating assembly and used for adsorbing and fixing the substrate, a reversible adsorption arm is arranged on the side of the adsorption plate, the adsorption plate and the adsorption arm can be adsorbed on the lower surface of the substrate and the upper surface of the film respectively so that the wafer is clamped between the adsorption plate and the adsorption arm, and under the driving action of the driving assembly, the adsorption arm and the adsorption plate can synchronously move so as to take the wafer out of a carrier;
    the adsorption arm is connected with a motion controller, when the driving assembly drives the adsorption plate to contact and vacuum-adsorb the adsorption plate on the lower surface of the substrate, the motion controller can drive the adsorption arm to vertically move so that the adsorption arm contacts and vacuum-adsorbs the film; the motion controller can also drive the adsorption arm to turn laterally, so that the adsorption arm drives the film to be separated from the substrate.
  2. 2. The wafer taking and separating device as claimed in claim 1, wherein the motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, under the driving action of the sliding control mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically, and the rotating mechanism can drive the adsorption arm to turn laterally.
  3. 3. The wafer taking and separating device as claimed in claim 2, wherein the rotating mechanism comprises a belt transmission mechanism, a driving wheel of the belt transmission mechanism is connected with a servo motor through a rotating coupling, any driven wheel of the belt transmission mechanism is connected with the adsorption arm through a rotating shaft, and the rotating coupling and the rotating shaft are respectively connected with the sliding control mechanism.
  4. 4. The wafer picking and separating device of claim 3, wherein the slide control mechanism comprises:
    the rotary sliding plate is connected with a guide rail through a sliding block, the sliding block is used for driving the rotary sliding plate to vertically slide along the guide rail, and the rotary coupling and the rotating shaft are respectively fixed on the rotary sliding plate;
    the air cylinder is vertically connected to the rotary sliding plate and can drive the rotary sliding plate to slide when the air cylinder stretches and contracts;
    and the limiting units are arranged on the rotary sliding plate and respectively limit the highest point and the lowest point of the sliding stroke of the rotary sliding plate.
  5. 5. The wafer taking and separating device as claimed in claim 4, wherein the spacing unit comprises spacing fixed blocks and spacing suites, the spacing fixed blocks are respectively arranged at the highest position and the lowest position of the sliding stroke of the rotating sliding plate, spacing platforms are respectively arranged at two sides of the rotating sliding plate, wherein spacing platforms are arranged opposite to the spacing fixed block arranged at the highest position, spacing platforms are arranged opposite to the spacing fixed block arranged at the lowest position, and the spacing suites are arranged on any pairs of the spacing platforms and the spacing fixed blocks.
  6. 6. The wafer taking and separating device as claimed in claim 5, wherein the limiting sleeve comprises a limiting bolt and a limiting nut which are matched with each other.
  7. 7. The wafer taking and separating device as claimed in claim 4, wherein both ends of the rotating shaft are respectively connected with the rotating slide plate through bearing fixing seats.
  8. 8. The wafer taking and separating device as claimed in claim 2, wherein the suction arm comprises a central shaft and a vacuum suction piece, the rotating mechanism and the vacuum suction piece are respectively connected to two ends of the central shaft, and the central shaft and the vacuum suction piece are arranged non-coaxially, and the central shaft can drive the vacuum suction piece to vertically slide and drive the vacuum suction piece to laterally turn around the central shaft under the driving of the sliding control mechanism.
  9. 9. The wafer picking and separating device as claimed in claim 8, wherein the suction arm further comprises a step shaft, the end of the step shaft is connected to the central shaft, the other end of the step shaft is provided with a connecting arm, the step shaft is connected to the vacuum suction sheet through the connecting arm, the connecting arm is non-coaxially arranged with the central shaft, when the central shaft rotates, the connecting arm can drive the vacuum suction sheet to turn from the side to the other side of the central shaft under the rotation action of the step shaft, so that the vacuum suction sheet turns laterally around the central shaft.
  10. 10. The wafer picking and separating device as claimed in claim 8, wherein the vacuum suction sheet is laterally turned around the central axis by a turning angle in a range of 0 to 360 °.
  11. 11. The wafer pick-up and separation device of claim 8, wherein the suction arm further comprises a vacuum generator, and the vacuum generator is connected to the vacuum suction plate.
  12. 12. The wafer taking and separating device as claimed in claim 2, wherein the separating assembly further comprises a carrier, the adsorption plate is fixed on the carrier, the adsorption arm is mounted on the carrier through a motion controller, the carrier is connected to the driving assembly, and the carrier can drive the adsorption plate and the adsorption arm to move synchronously under the driving of the driving assembly.
  13. 13. The wafer taking and separating device as claimed in claim 12, wherein the carrier comprises a fixed bottom plate and a fixed side plate, the fixed side plate stands on the fixed bottom plate, the motion controller is installed at the side of the fixed side plate, a fixed arm extends outwards from the end of the fixed bottom plate, the fixed arm is correspondingly arranged at the side of the motion controller, and the extending end of the fixed arm is connected with the adsorption plate.
  14. 14. The wafer taking and separating device of any of claims 1-13, wherein invertible adsorption arms and adsorption plates form a separation unit, the separation unit comprises a forward separation unit and a reverse separation unit, the adsorption arms of the forward separation unit are arranged on the outer side of the adsorption plates, the adsorption arms of the reverse separation unit are arranged on the inner side of the adsorption plates, the forward separation unit and the reverse separation unit are arranged at intervals, and the inversion directions of two adsorption arms in the adjacent forward separation unit and reverse separation unit are opposite.
  15. 15. The wafer picking and separating device of any of claims 1-13 and , wherein the drive assembly comprises:
    the X-axis driver is connected with the separation assembly to drive the adsorption plate and the adsorption arm to synchronously move horizontally;
    and the Y-axis driver is connected with the X-axis driver and is used for driving the X-axis driver to vertically move.
  16. 16. The wafer taking and separating device as recited in claim 15, wherein the driving assembly further comprises a connecting mechanism, the X-axis driver is fixed to the connecting mechanism, the Y-axis driver is connected to the connecting mechanism, and the connecting mechanism drives the X-axis driver to move vertically under the driving action of the Y-axis driver.
  17. 17. The wafer taking and separating device as claimed in claim 16, wherein the connecting mechanism comprises a connecting bottom plate and a connecting side plate, the X-axis driver is fixed on the connecting bottom plate, the connecting bottom plate is fixed on the connecting side plate, the connecting side plate is connected with the Y-axis driver, and the connecting side plate can drive the connecting bottom plate to move vertically under the driving of the Y-axis driver.
  18. 18. The wafer picking and separating device as claimed in claim 17, wherein the X-axis driver comprises an X-axis driving motor, a synchronous pulley and a horizontal slide rail, the horizontal slide rail is laid on the connecting bottom plate, a slidable horizontal slide block is provided on the horizontal slide rail, the separating assembly is fixedly connected to the horizontal slide block, and the X-axis driving motor drives the horizontal slide block to move horizontally along the horizontal slide rail through the synchronous pulley, so that the horizontal slide block drives the separating assembly to move horizontally.
  19. 19. The wafer picking and separating device of claim 17, wherein the Y-axis drive includes a Y-axis drive motor and a vertical slide rail, the vertical slide rail having a movable vertical slide block thereon, the vertical slide block being connected to the Y-axis drive motor and being capable of moving vertically along the vertical slide rail under the drive of the Y-axis drive motor; the connecting side plate is fixedly connected to the vertical sliding block, and under the driving of the vertical sliding block, the connecting side plate drives the connecting bottom plate to vertically move so as to drive the X-axis driver to vertically move.
  20. 20. The wafer taking and separating device of claim 19, wherein the vertical slide rail is a lead screw, the lead screw is connected with the Y-axis driving motor through a driving coupling, the vertical slider is sleeved on the lead screw, and the Y-axis driving motor drives the lead screw to rotate through the driving coupling so as to drive the vertical slider to vertically move along the lead screw.
  21. 21, wafer taking and separating method, which is based on the wafer taking and separating device as claimed in any of claims 1-20, and comprises the following steps:
    the driving assembly drives the adsorption plate to contact and be adsorbed on the lower surface of the substrate in a vacuum mode, and drives the adsorption arm to turn over laterally through the motion controller, so that the adsorption arm turns over to the upper side of the substrate, and a gap is reserved between the adsorption arm and the adsorption plate;
    the motion controller drives the adsorption arm to vertically slide so that the adsorption arm is in contact with and adsorbs the film on the substrate in vacuum;
    the driving assembly drives the adsorption plate and the adsorption arm to synchronously move so as to synchronously take out the substrate and the film from the carrier;
    keeping the adsorption plate fixed, and driving the adsorption arm to turn over laterally through the motion controller so that the adsorption arm drives the film to be separated from the substrate.
  22. 22. The method for separating and taking out slices as claimed in claim 21, wherein the motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, under the driving action of the sliding control mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically, and the rotating mechanism can drive the adsorption arm to turn laterally.
  23. 23. The wafer picking and separating method of claim 21 or 22, wherein reversible adsorption arms and adsorption plates form a separation unit, the separation unit comprises a forward separation unit and a reverse separation unit, the adsorption arms of the forward separation unit are arranged at the outer side of the adsorption plates, the adsorption arms of the reverse separation unit are arranged at the inner side of the adsorption plates, the forward separation unit and the reverse separation unit are arranged at intervals, and the two adsorption arms of the adjacent forward separation unit and the reverse separation unit are reversed.
CN201810806187.2A 2018-07-20 2018-07-20 wafer taking and separating device and method Pending CN110739258A (en)

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PCT/CN2019/096807 WO2020015739A1 (en) 2018-07-20 2019-07-19 Wafer extracting and separating device and method

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CN117038794A (en) * 2023-08-30 2023-11-10 安徽美达伦光伏科技有限公司 Solar cell chain pickling machine and production line

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CN203218245U (en) * 2013-03-06 2013-09-25 昆山富利瑞电子科技有限公司 Mechanical hand capable of automatically taking and placing wafer
CN207217572U (en) * 2017-09-27 2018-04-10 无锡奥特维科技股份有限公司 A kind of cell piece breaks sheet devices and breaks piece system
CN107946218A (en) * 2017-11-29 2018-04-20 北京创昱科技有限公司 A kind of thin film separation equipment that big production capacity can be achieved
CN207587752U (en) * 2017-11-29 2018-07-06 北京创昱科技有限公司 A kind of novel thin film separation mechanism independently driven
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CN208444824U (en) * 2018-07-20 2019-01-29 东泰高科装备科技（北京）有限公司 A kind of crystal plate taking separator

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Publication number Priority date Publication date Assignee Title
CN117038794A (en) * 2023-08-30 2023-11-10 安徽美达伦光伏科技有限公司 Solar cell chain pickling machine and production line
CN117038794B (en) * 2023-08-30 2024-02-13 安徽美达伦光伏科技有限公司 Solar cell chain pickling machine and production line

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