CN110678008B - Steel mesh of circuit board display connector and preparation method thereof - Google Patents
Steel mesh of circuit board display connector and preparation method thereof Download PDFInfo
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- CN110678008B CN110678008B CN201910904800.9A CN201910904800A CN110678008B CN 110678008 B CN110678008 B CN 110678008B CN 201910904800 A CN201910904800 A CN 201910904800A CN 110678008 B CN110678008 B CN 110678008B
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 119
- 239000010959 steel Substances 0.000 title claims abstract description 119
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 31
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000006071 cream Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a steel mesh of a circuit board display connector, which comprises a steel mesh body, a first section and a second section, wherein the steel mesh body comprises a first section and a second section; the first section is a section close to the inner side of the steel mesh; the second section is a section far away from the inner side of the steel mesh; and the length of the first section is less than the length of the second section; the distance between the first section and the second section is smaller than the width of the bonding pad; the width of the steel mesh is larger than that of the bonding pad; the distance from the edge of the pad to the steel mesh is smaller than the width of the pad; the length of the steel mesh exceeding the bonding pad is smaller than the width of the bonding pad. The method adopts sectional treatment on the steel mesh, firstly, the tin paste is printed, secondly, the display connector is pasted, and finally, the tin paste is melted at high temperature, welded and solidified, so that the tin on the adjacent bonding pads can not be connected when the tin paste is melted, and poor tin connection after solidification is avoided. The invention also provides a preparation method of the steel mesh, programming cutting is carried out according to the designed steel mesh scheme, and the precision requirement is 0.01 mm. Polishing is performed after cutting.
Description
Technical Field
The invention belongs to the technical field of circuit board processing and production, and particularly relates to a steel mesh of a circuit board display connector and a preparation method thereof.
Background
With the rapid development of the IT industry, almost all electronic devices need to be supported by PCBA (Printed Circuit Board + Assembly), and the development trend of server performance is fast in processing speed and large in storage capacity. The requirements on the display connector are more precise, the size of the display connector is smaller and smaller, the requirements on the display connector in a welding process are higher and higher, and a steel mesh (stents), namely an SMT Stencil (SMT Stencil), is a special SMT mould. Its primary function is to aid in the deposition of solder paste in order to transfer the correct amount of solder paste to the correct location on the empty PCB.
In the PCBA processing process, the display connector is often poor in continuous tin, difficult to maintain and prone to causing scrapping of the PCBA.
Disclosure of Invention
The invention provides a steel mesh of a circuit board display connector and a preparation method thereof.
In order to achieve the above object, the present invention provides a steel mesh for a circuit board display connector, comprising a steel mesh body, wherein the steel mesh body is provided in two sections, including a first section and a second section; the first section is a section close to the inner side of the steel mesh; the second section is a section far away from the inner side of the steel mesh; and the length of the first section is less than the length of the second section; the distance between the first section and the second section is smaller than the width of the bonding pad;
the width of the steel mesh is larger than that of the bonding pad; the distance from the edge of the pad to the steel mesh is smaller than the width of the pad; the length of the steel mesh exceeding the bonding pad is smaller than the width of the bonding pad.
Further, the distance between the first section and the second section is equal to 1.5 times of the distance from the edge of the welding disk to the steel mesh.
Further, the first section of the steel mesh is of a round angle structure; the second section of the steel mesh is of a round angle structure.
Further, the width of the steel net is equal to 1.1 to 1.3 times of the width of the pad.
Further, the distance from the edge of the pad to the steel mesh is equal to 0.5 to 0.8 times the width of the pad.
Further, the spacing between the first segment and the second segment is equal to 0.6 to 0.9 times the pad width.
Further, the length of the first segment is equal to 0.2 to 0.4 times the length of the bonding pad.
Further, the length of the second section is equal to the length of the pad, the distance from the edge of the pad to the steel mesh, the length of the first section, the distance between the first section and the second section and the length of the steel mesh exceeding the pad.
A steel mesh preparation method of the connector of the circuit board display, cut out the steel mesh of the connector of a circuit board display, and polish and process;
furthermore, the cutting precision is required to be 0.01 mm.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
the embodiment of the invention provides a steel mesh of a circuit board display connector, which comprises a steel mesh body, wherein the steel mesh body is provided with two sections, including a first section and a second section; the first section is a section close to the inner side of the steel mesh; the second section is a section far away from the inner side of the steel mesh; and the length of the first section is less than the length of the second section; the distance between the first section and the second section is smaller than the width of the bonding pad; the width of the steel mesh is smaller than that of the bonding pad; the distance from the edge of the pad to the steel mesh is smaller than the width of the pad; the length of the steel mesh exceeding the bonding pad is smaller than the width of the bonding pad. The problem of poor short circuit and tin connection of adjacent bonding pads can be effectively solved by adopting a segmented design; the material pin can be shorter than the length of the bonding pad, and the length of the first subsection is smaller than that of the second subsection, so that the material pin is ensured not to have poor appearance with less tin. The distance between the first section and the second section is smaller than the width of the bonding pad, so that the first section and the second section can be connected after the solder paste is melted, and the distance between the two ends can be effectively welded. The width of the steel mesh is larger than that of the bonding pad so as to ensure that the boundary of the bonding pad does not generate little tin. The distance from the edge of the welding pad to the steel mesh is smaller than the width of the welding pad, so that the poor tin-lacking effect can be avoided. Because the area that the steel mesh surpassed the pad is for preventing welding the district, can't weld after the tin cream melts, the tin cream can flow to the pad, the regional tin cream of pad increases, and the length that the steel mesh surpassed the pad is less than the width of pad, avoids material pin anterior segment to appear few tin, rosin joint bad. In addition, the first section of the steel mesh and the second section of the steel mesh are both in a round angle structure, and the steel mesh is easy to realize. If the right angle, be unfavorable for the processing of equipment to the steel mesh, if realize the right angle processing, need high-accuracy equipment just can accomplish the processing, cause the steel mesh high price to be unfavorable for popularizing. And (4) processing a fillet, and finishing by using common equipment. From the perspective of using the steel mesh effect: if the right angle, tin cream printing accomplishes the back, is unfavorable for the tin cream drawing of patterns, can draw the point bad, derives other welding badly, and fillet effect drawing of patterns effect is very good, can not produce other badly.
According to the steel mesh of the circuit board display connector, the steel mesh is processed in a segmented mode, firstly, solder paste is printed, secondly, the display connector is mounted, and finally, the solder paste is melted at high temperature and welded and solidified, so that tin on adjacent bonding pads can not be connected when the solder paste is melted, and poor tin connection is avoided after solidification. The invention also provides a preparation method of the steel mesh of the circuit board display connector, and programming cutting is carried out according to the designed steel mesh scheme. The cutting precision is required to be 0.01 mm. Polishing treatment is carried out after cutting, and demolding is facilitated after the tin paste is printed on the steel mesh. Can effectively solve the bad tin connection. The yield of the circuit board is greatly improved, the production cost is reduced, and the competitiveness of the circuit board is improved.
Drawings
Fig. 1 is a schematic diagram showing a pad in a steel mesh of a connector for a circuit board display according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram showing a steel mesh design of a circuit board display connector according to embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Example 1
The embodiment 1 of the invention provides a steel mesh of a circuit board display connector, which selects stainless steel with proper thickness according to the minimum distance of Gerber file elements. Wherein the steel mesh thickness generally ranges: 0.10mm-0.15 mm.
Fig. 2 is a schematic diagram showing a steel mesh design of a circuit board display connector according to embodiment 1 of the present invention. The steel mesh comprises a steel mesh body, wherein the steel mesh body is provided with two sections, namely a first section L1 and a second section L2; the first segment L1 is a segment near the inside of the steel mesh; the second section L2 is a section away from the inner side of the steel mesh; and the length of the first section L1 is less than the length of the second section L2.
The width W2 of the steel mesh is larger than the width W of the bonding pad; the distance L0 from the edge of the pad to the steel mesh is smaller than the width W of the pad; the spacing D0 between the first segment and the second segment is less than the pad width W; the length D of the steel mesh beyond the bonding pad is smaller than the width W of the bonding pad.
The first section of the steel mesh is of a fillet structure; the second section of the steel mesh is of a round angle structure.
The spacing D0 between the first and second segments is equal to 1.5 times the distance L0 from the edge of the pad to the steel mesh.
As shown in fig. 1, a schematic diagram of a pad in a steel mesh of a circuit board display connector according to embodiment 1 of the present invention is shown; the length L of the bonding pad is 2-3 mm, and the width W of the bonding pad is 0.2-0.4 mm.
The width W2 of the steel net is equal to 1.1 to 1.3 times of the width W of the pad, namely W2 is (1.1-1.3) W.
The distance L0 from the edge of the pad to the steel net is equal to 0.5 to 0.8 times the width W of the pad, namely L0 is (0.5-0.8) W.
The distance D0 between the first segment and the second segment is equal to 0.6 to 0.9 times the pad width W, i.e. D0 is (0.6-0.9) W
The length L1 of the first segment is equal to 0.2 to 0.4 times the pad length L, i.e., L1 ═ 0.2 to 0.4L.
As can be seen from fig. 2, the lengths L2 of the second segment, i.e., the length L of the pad, the distance L0 from the edge of the pad to the steel mesh, the length L0 of the first segment, the distance D0 between the first segment and the second segment, and the length D of the steel mesh exceeding the pad are known. I.e., L2-L0-L1-D0 + D. According to the formula, the length of the first section or the second section which needs to be designed can be calculated according to the specific size of each section in the steel mesh, and whether the design of the first section and the second section meets the design requirement or not can be judged.
The problem of poor short circuit and tin connection of adjacent bonding pads can be effectively solved by adopting a segmented design; the material pin is shorter than the length of the bonding pad, and the length L1 of the first section is smaller than the length L2 of the second section, so that the material pin is ensured not to have poor appearance due to little tin.
The distance D0 between the first section and the second section is smaller than the width W of the bonding pad, so that the first section and the second section can be connected after the solder paste is melted, and the distance between the two ends can be effectively welded.
The width W2 of the steel mesh is larger than the width W of the pad to ensure that the boundary of the pad does not have less tin.
The distance L0 from the edge of the pad to the steel mesh is smaller than the width W of the pad, so that poor tin-lacking of the welding effect can be avoided.
Because the area that the steel mesh surpassed the pad is for preventing welding the district, can't weld after the tin cream melts, the tin cream can flow to the pad, the regional tin cream of pad increases, and the length D that the steel mesh surpassed the pad is less than the width W of pad, avoids material pin anterior segment to appear few tin, rosin joint bad.
In addition, the first section L1 of the steel net and the second section of the steel net both adopt a round angle structure, and the realization is easier. If the right angle, be unfavorable for the processing of equipment to the steel mesh, if realize the right angle processing, need high-accuracy equipment just can accomplish the processing, cause the steel mesh high price to be unfavorable for popularizing. And (4) processing a fillet, and finishing by using common equipment. From the perspective of using the steel mesh effect: if the right angle, tin cream printing accomplishes the back, is unfavorable for the tin cream drawing of patterns, can draw the point bad, derives other welding badly, and fillet effect drawing of patterns effect is very good, can not produce other badly.
The invention provides a steel mesh of a circuit board display connector and also provides a steel mesh preparation method of the circuit board display connector. The method is used for printing the solder paste on the steel mesh provided by the invention, then the display connector is mounted, and finally the solder paste is melted at high temperature, welded and solidified. When the solder paste is melted, the adjacent solder pads are not connected with each other, so that poor tin connection after solidification is avoided.
And programming cutting is carried out according to the designed steel mesh scheme, and the cutting precision is required to be 0.01 mm. Polishing treatment is carried out after cutting, and demolding is facilitated after the tin paste is printed on the steel mesh.
According to the invention, a proper steel mesh is designed according to the position of the Gerber file display connector bonding pad of the PCBA, so that the problem of tin connection is solved.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the present invention as defined in the accompanying claims.
Claims (9)
1. The steel mesh of the circuit board display connector is characterized by comprising a steel mesh body, wherein the steel mesh body is provided into two sections and comprises a first section and a second section; the first section is a section close to the inner side of the steel mesh; the second section is a section far away from the inner side of the steel mesh; and the length of the first section is less than the length of the second section; the distance between the first section and the second section is smaller than the width of the bonding pad; the distance between the first section and the second section is equal to 1.5 times of the distance from the edge of the welding disc to the steel mesh;
the width of the steel mesh is larger than that of the bonding pad; the distance from the edge of the pad to the steel mesh is smaller than the width of the pad; the length of the steel mesh exceeding the bonding pad is smaller than the width of the bonding pad.
2. A steel mesh for a circuit panel display connector as claimed in claim 1, wherein the first section of the steel mesh has a rounded configuration; the second section of the steel mesh is of a round angle structure.
3. A steel mesh for a circuit panel display connector as claimed in claim 1, wherein the width of the steel mesh is equal to 1.1 to 1.3 times the width of the bonding pad.
4. A steel mesh for a circuit board display connector as claimed in claim 1, wherein the distance from the pad edge to the steel mesh is equal to 0.5 to 0.8 times the width of the pad.
5. A steel net for a circuit board display connector according to claim 1, wherein the distance between the first section and the second section is equal to 0.6 to 0.9 times the width of the bonding pad.
6. A steel net for a circuit board display connector according to claim 1, wherein the length of the first section is equal to 0.2 to 0.4 times the length of the pad.
7. A steel mesh for a circuit board display connector as claimed in claim 1, wherein the second section has a length equal to the length of the pad-the distance from the edge of the pad to the steel mesh-the length of the first section-the distance between the first and second sections + the length of the steel mesh beyond the pad.
8. A method for preparing a steel mesh of a circuit board display connector is characterized by comprising the following steps:
cutting a steel mesh body according to any one of claims 1 to 7;
and (6) polishing.
9. The method for preparing a steel mesh for a circuit board display connector according to claim 8, wherein the cutting the steel mesh body according to any one of claims 1 to 8 comprises:
cutting the steel mesh body according to any one of the claims 1-8 with a cutting accuracy of 0.01 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904800.9A CN110678008B (en) | 2019-09-24 | 2019-09-24 | Steel mesh of circuit board display connector and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904800.9A CN110678008B (en) | 2019-09-24 | 2019-09-24 | Steel mesh of circuit board display connector and preparation method thereof |
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| CN110678008A CN110678008A (en) | 2020-01-10 |
| CN110678008B true CN110678008B (en) | 2021-02-02 |
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| CN112788859B (en) * | 2021-01-21 | 2022-04-01 | 上海望友信息科技有限公司 | Shielding frame steel mesh opening method and device, electronic equipment and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090042382A1 (en) * | 2007-08-06 | 2009-02-12 | Barry Thomas Hawkey | Device packages |
| JP2009220349A (en) * | 2008-03-14 | 2009-10-01 | Riso Kagaku Corp | Stencil printing device |
| JP2011025453A (en) * | 2009-07-22 | 2011-02-10 | Process Lab Micron:Kk | Arcuate printing plate |
| US9283641B2 (en) * | 2012-09-25 | 2016-03-15 | Intel Corporation | Flux materials for heated solder placement and associated techniques and configurations |
| CN205311036U (en) * | 2015-12-30 | 2016-06-15 | 福建联迪商用设备有限公司 | SMT steel mesh |
| US20170285249A1 (en) * | 2016-03-30 | 2017-10-05 | Le Holdings(Beijing)Co., Ltd. | Screen printing stencil, light guide plate, display device , and method for manufacturing light guide plate |
| CN205961599U (en) * | 2016-07-19 | 2017-02-15 | 深圳市创荣发电子有限公司 | Prevent open cell structure of tin sweat(ing) printing steel mesh |
| CN206759825U (en) * | 2017-06-09 | 2017-12-15 | 江西合力泰科技有限公司 | Surface mount steel mesh |
| CN207720518U (en) * | 2017-12-26 | 2018-08-10 | 武汉奥泽电子有限公司 | A kind of PCB pads component |
| CN208480079U (en) * | 2018-07-17 | 2019-02-05 | 深圳市汇晨电子股份有限公司 | A kind of print tin steel-screen |
| CN108966528A (en) * | 2018-09-18 | 2018-12-07 | 郑州云海信息技术有限公司 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
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