CN205283938U - Base plate, otter board, radio frequency payment module and wearable equipment - Google Patents
Base plate, otter board, radio frequency payment module and wearable equipment Download PDFInfo
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- CN205283938U CN205283938U CN201521076488.2U CN201521076488U CN205283938U CN 205283938 U CN205283938 U CN 205283938U CN 201521076488 U CN201521076488 U CN 201521076488U CN 205283938 U CN205283938 U CN 205283938U
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- pad
- radio frequency
- disking area
- welding disking
- size
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Abstract
The utility model discloses a base plate, otter board, radio frequency payment module and wearable equipment belongs to the printed circuit board field. Offered in pad regional (10) of this base plate first pad (20), first pad (20) are the inwardly opened window pad, and first pad (20) become " cross " shape, and the region in pad regional (10) outside first pad (20) is covered by the solder resist, the inwardly opened window pad is the size that the size of first pad (20) is lighter than pad region (20). Adopt the utility model provides a radio frequency payment module problem that the pad drops after the welding can effectively be solved to the radio frequency payment module of base plate, has improved the success rate of radio frequency payment module, adopts the utility model provides an inside empty problem of soldering tin can effectively be solved in pad welding on the pad that the otter board carries out radio frequency payment module and the PCB board of the carrier equipment of radio frequency payment module, is favorable to the popularization of the equipment of built -in radio frequency payment module.
Description
Technical field
This utility model relates to art of printed circuit boards, is specifically related to a kind of solve the substrate of Pad off on printed circuit board (PCB), web plate, radio frequency payment module and wearable device.
Background technology
Along with the wearable device of small amount payment is widelyd popularize, people to the performance of wearable device, outward appearance, cost needs can be more and more higher, the demand being placed in wearable device radio frequency payment module becomes increasingly conspicuous progressively strengthening the price competition each other of wearable device manufacturer.
At present, when radio frequency payment module is placed in wearable device, its structure and processing technology are as it is shown in figure 1, there is shown the printed circuit board (PCB) of plastic packaging layer 1, the substrate 2 of radio frequency payment module, tin cream 3 and wearable device and pcb board 4. The pad 5 of radio frequency payment module adopts swinging-out casement window mode, and the substrate of radio frequency payment module (LGA package) is in the same size with the pad of pcb board, and in welding, upper and lower pad overlaps. And there is following problem in this structure and processing technology:
One: pad 6 three's opening size all about 1.1mm*0.6mm of the pad 5 of radio frequency payment module, steel mesh 3 and wearable device, is easily generated bubble in welding; Its two: insert radio frequency payment module wearable device adopt negative and positive plate welding manner, in addition radio frequency payment module pad thickness is less than wearable device PCB pad thickness about 3 times, thus at the pad of welding process radio frequency payment module with wearable device PCB pad at stannum solidification process phase repulsive interaction, the repulsive force intensity produced is different, thus causing that radio frequency payment module pad departs from; Its three: radio frequency payment module pad adopts swinging-out casement window mode (on substrate reserved welding disking area identical with the actual occupied area of pad), pad is to adopt glue bonding way, making pad be in substrate surface, radio frequency payment module is crossed and is made squeegee be heated in stove to cause that pad departs from. Above 3 points, cause the pad of radio frequency payment module to be easily separated from, and can cause the bad finished product of 20%, limit wideling popularize of radio frequency payment module.
Utility model content
For the defect existed in prior art, the purpose of this utility model is in that providing a kind of can effectively prevent the substrate of Pad off, web plate, radio-frequency module and wearable device on the substrate of radio frequency payment module.
For achieving the above object, the technical solution adopted in the utility model is as follows:
A kind of substrate, offers the first pad in the welding disking area of described substrate, described first pad is inwardly opened window pad, and the first pad becomes " cross " shape, and in welding disking area, the region outside the first pad is covered by solder resist; Inwardly opened window pad refers to the size being smaller in size than welding disking area of the first pad.
Further, a kind of substrate as above, described welding disking area is square or circular; The described edge of the first pad flushes with the edge of welding disking area.
Further, substrate as above a kind of, the center of described first pad and the center superposition of welding disking area; Or,
When described welding disking area is square, if described welding disking area is at substrate edges, first pad be positioned at welding disking area substrate edges while overlapping, first pad is symmetrical arranged along the perpendicular bisector on this limit, if described welding disking area is not at the center superposition of substrate edges, described first pad center and welding disking area.
Further, a kind of substrate as above, when described welding disking area and the first pad are rectangle, welding disking area is of a size of 1.2mm*0.6mm, and the first pad is of a size of 1.1mm*0.6mm.
Further, a kind of substrate as above, the length that the middle part of described first pad longer sides leans out is not less than 0.5mm, and the length that the middle part of shorter edge leans out is 0.4mm.
This utility model embodiment additionally provides the position one_to_one corresponding of a kind of web plate corresponding with aforesaid substrate, the position of the network interface of web plate and described first pad, the size of the maximum rectangle that the size of network interface is not more than in " cross " region of the first pad.
Further, a kind of web plate as above, described network interface includes along symmetrically arranged four rims of the mouth of network interface central cross line, and the outward flange in four rims of the mouth and the edge of the first pad flush.
Further, a kind of web plate as above, when described first pad is rectangle, first pad is of a size of 1.1mm*0.6mm, the length that the middle part of longer sides leans out is not less than 0.5mm, and the length that the middle part of shorter edge leans out is 0.4mm, and the network interface of web plate is of a size of 0.9mm*0.4mm.
This utility model embodiment additionally provides a kind of radio frequency payment module, and described radio frequency payment module includes substrate as above.
This utility model embodiment additionally provides a kind of wearable device, described wearable device includes above-mentioned radio frequency payment module and equipment pcb board, the size of the maximum rectangle that the size of the second pad docked with the first pad on described equipment pcb board is not more than in " cross " region of the first pad.
The beneficial effects of the utility model are in that: adopt the radio frequency payment module of substrate provided by the utility model, the problem that can effectively solve the problem that radio frequency payment module Pad off after welding, improve the success rate of radio frequency payment module, web plate provided by the utility model is adopted to carry out the pad of radio frequency payment module and the pad solder on the pcb board of the vehicle equipment (wearable device such as built-in radio frequency payment module) of radio frequency payment module, can effectively solve the problem that the empty problem within scolding tin, be conducive to the popularization of the equipment of built-in radio frequency payment module.
Accompanying drawing explanation
Fig. 1 be the pad of pad and the pcb board of wearable device of existing radio frequency payment module weld schematic diagram;
The structural representation of the Fig. 2 a kind of substrate for providing in this utility model detailed description of the invention;
Fig. 3 is the schematic diagram of the welding disking area of substrate shown in Fig. 2;
Fig. 4 is the schematic diagram of the first pad in the welding disking area of substrate shown in Fig. 2;
The structural representation of the Fig. 5 a kind of web plate for providing in this utility model detailed description of the invention;
Fig. 6 is the schematic diagram of the pad structure on the pcb board of a kind of wearable device provided in this utility model detailed description of the invention;
Fig. 7 is the schematic diagram that the pad solder of the pad of substrate in this utility model detailed description of the invention and equipment pcb board assembles.
Detailed description of the invention
Below in conjunction with Figure of description and detailed description of the invention, this utility model is described in further detail.
Fig. 2 illustrates the structural representation of a kind of substrate provided in this utility model detailed description of the invention, the first pad 20 is offered in the welding disking area 10 of described substrate, described first pad 20 is inwardly opened window pad, first pad 20 one-tenth " cross " shape, in welding disking area 1, the region outside the first pad 20 is covered by solder resist; Inwardly opened window pad refers to the size being smaller in size than welding disking area 10 of the first pad 20.
In present embodiment, described welding disking area 10 refers to the design welding disking area reserved on substrate for pad, region shared by first pad 20 is the region applied in the welding disking area 10 reserved, that is, first pad 20 be after completing it can be seen that the pad exposed, the difference section of welding disking area 10 and the first pad 20 is covered by solder resist. Namely solder resist covers that layer film being furnished with on circuit boards above copper cash, includes but not limited to the solder resist of existing green or other color.
In actual design, it is variously-shaped that the shape of described welding disking area 10 can be designed to square (rectangle or square) or circle etc. as required. First pad 20 can also be designed to different shapes, it is preferred that the shape of described first pad 20 is identical with the shape of welding disking area 10, and the described edge of the first pad 20 flushes with the edge of welding disking area 10.
First pad 20 position in welding disking area 10, can be arranged according to practical situation, the center of described first pad 20 can be directly and the center superposition of welding disking area 20, or, when welding disking area is square, if welding disking area 10 is at substrate edges, the first pad 20 is positioned at overlapping of substrate edges with welding disking area 10, first pad 20 is symmetrical arranged along the perpendicular bisector on this limit, as shown in Figure 2; When described welding disking area 10 is not when substrate edges, the center of described first pad 20 and the center superposition of welding disking area 10. Certainly, in actual design, welding disking area 10 when substrate edges, the first pad 20 center can also with the center superposition of welding disking area 10, but adopt the mode shown in Fig. 2 more save space.
Fig. 3 and Fig. 4 respectively illustrates the schematic diagram of the welding disking area 10 on the substrate shown in Fig. 2 and the first pad 20, welding disking area 10 and the first pad 20 are rectangle structure, in present embodiment, welding disking area 10 is of a size of 1.2mm*0.6mm, and described first pad 20 is of a size of 1.1mm*0.6mm.
The length and width leaning out part of " cross " shape of the first pad 20 can be configured according to actual needs, in present embodiment, for the welding disking area 10 shown in Fig. 3 and Fig. 4 and the first pad 20, the length that the middle part of the first pad 20 longer sides leans out is not less than 0.5mm (shown in figure is 0.5mm), and the length that the middle part of shorter edge leans out is 0.4mm.
The aforesaid substrate provided in present embodiment and printed circuit board (PCB), pad thereon adopts inwardly opened window mode, and in welding disking area, the region outside pad is covered by solder resist, adopts which can effectively prevent pad from coming off from substrate; Additionally, on the basis of inwardly opened window, by four limit design " cross " shape pads of pad, which is conducive to the aerofluxus when being welded by substrate with other PC plate.
Present embodiment additionally provides a kind of web plate corresponding with the substrate shown in Fig. 2, as shown in Figure 5, the position one_to_one corresponding of the position of the network interface 30 of web plate and described first pad 20, network interface 30 size is not more than the maximum rectangular dimension in " cross " region of the first pad 20.
The shape of the network interface 30 of web plate can be adopt existing network interface form.
In order to the air within tin cream when being conducive to welding is discharged, improve welding quality, in present embodiment, the network interface 30 of described web plate includes along symmetrically arranged four rims of the mouth 31 of network interface central cross line, when being tin cream on the first pad 20 adopting this web plate, the outward flange in four rims of the mouth 31 and the edge of the first pad 20 flush, as shown in Figure 5, on the first pad 20, during tin cream, tin cream can be divided into four parts by this network interface automatically, and tin cream passes through to fall from four rims of the mouth 31 of network interface 30. In present embodiment, the gap between four rims of the mouth 31 is 0.1mm.
The size of network interface 30 can be processed according to the size of the first pad 20, if the size of the maximum rectangle that guarantee network interface area (size) is not more than in " cross " region of the first pad, for the first pad 20 shown in Fig. 4, first pad 20 is rectangle, first pad is of a size of 1.1mm*0.6mm, the length that the middle part of longer sides leans out is not less than 0.5mm, the length that the middle part of shorter edge leans out is 0.4mm, maximum rectangular dimension in " cross " region of pad is 1.1mm*0.4mm, therefore, network interface 30 size of the web plate shown in Fig. 5 can be designed as 0.9mm*0.4mm.
Present embodiment additionally provides a kind of radio frequency payment module, the substrate of this radio frequency payment module substrate for providing in present embodiment.
Present embodiment additionally provides a kind of wearable device, this wearable device includes the printed circuit board (PCB) of equipment and equipment pcb board and above-mentioned radio frequency payment module, wherein, the area of the second pad 40 docked with the first pad 20 on described equipment pcb board is not more than the maximum rectangular area in " cross " structural region of the first pad 20, as shown in Figure 6.
In actual applications, the size of described second pad 40 further accounts for the size of web plate, the network interface size being sized larger than or being equal to web plate of the second pad 40. In present embodiment, the first pad 20 is rectangle, and it is of a size of 1.1mm*0.6mm, and the network interface 30 of web plate is of a size of 0.9mm*0.4mm, and the second pad 30 is of a size of 1mm*0.4mm, as shown in Figure 6. Fig. 7 illustrates that the second pad 40 by the first pad 20 on the substrate of radio frequency payment module with the pcb board of wearable device carries out the structural representation of welding assembly, and when assembling, what position, four rims of the mouth 31 was corresponding is tin cream, also show plastic packaging layer 50 in figure.
The radio frequency payment module provided in present embodiment is provided, when radio frequency payment module is placed in wearable device, pad on the substrate of radio frequency payment module, tin cream, Wearable pcb board on pad solder together time, can effectively solve the pad on the substrate of radio frequency payment module to depart from and tin cream air bubble problem, improve yield rate.
Need to illustrate, the substrate provided in present embodiment, except the radio frequency payment module being applied in present embodiment, equally applicable with other electronic device module in need two substrates to carry out pad solder situation.
Obviously, this utility model can be carried out various change and modification without deviating from spirit and scope of the present utility model by those skilled in the art. So, if these amendments of the present utility model and modification belong within the scope of this utility model claim and equivalent technology thereof, then this utility model is also intended to comprise these change and modification.
Claims (10)
1. a substrate, it is characterized in that: in the welding disking area (10) of described substrate, offer the first pad (20), described first pad (20) is inwardly opened window pad, first pad (20) becomes " cross " shape, and in welding disking area (10), the region outside the first pad is covered by solder resist; Inwardly opened window pad refers to the size being smaller in size than welding disking area (10) of the first pad (20).
2. a kind of substrate according to claim 1, it is characterised in that: described welding disking area (10) is for square or circular; The edge of described first pad (20) flushes with the edge of welding disking area (10).
3. a kind of substrate according to claim 2, it is characterised in that: the center superposition of described first pad (20) center and welding disking area (10); Or,
When described welding disking area (10) is for time square, if described welding disking area (10) is at substrate edges, first pad (20) be positioned at welding disking area (10) substrate edges while overlapping, first pad (20) is symmetrical arranged along the perpendicular bisector on this limit, if described welding disking area (10) is not at the center superposition of substrate edges, described first pad (20) center and welding disking area (10).
4. a kind of substrate according to claim 1 and 2, it is characterized in that: when described welding disking area (10) and the first pad (20) are for rectangle, welding disking area (10) is of a size of 1.2mm*0.6mm, and the first pad (20) is of a size of 1.1mm*0.6mm.
5. a kind of substrate according to claim 4, it is characterised in that: the length that the middle part of described first pad (20) longer sides leans out is not less than 0.5mm, and the length that the middle part of shorter edge leans out is 0.4mm.
6. based on a kind of web plate of substrate described in claim 1, it is characterized in that: the position one_to_one corresponding of the position of the network interface (30) of web plate and described first pad (20), the size of the maximum rectangle that the size of network interface (30) is not more than in " cross " region of the first pad (20).
7. a kind of web plate according to claim 6, it is characterized in that: described network interface (30) includes along symmetrically arranged four rims of the mouth (31) of network interface central cross line, and the outward flange of four rims of the mouth (31) and the edge of the first pad (20) flush.
8. a kind of web plate according to claim 6 or 7, it is characterized in that: when described first pad (20) is for rectangle, first pad (20) is of a size of 1.1mm*0.6mm, the length that the middle part of longer sides leans out is not less than 0.5mm, the length that the middle part of shorter edge leans out is 0.4mm, and the network interface (30) of web plate is of a size of 0.9mm*0.4mm.
9. a radio frequency payment module, it is characterised in that: described radio frequency payment module includes the substrate that one of claim 1 to 5 is described.
10. a wearable device, it is characterized in that: described wearable device includes the radio frequency payment module described in claim 9 and equipment pcb board, the size of the maximum rectangle that the size of the second pad (40) docked with the first pad (20) on described equipment pcb board is not more than in " cross " region of the first pad (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521076488.2U CN205283938U (en) | 2015-12-22 | 2015-12-22 | Base plate, otter board, radio frequency payment module and wearable equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521076488.2U CN205283938U (en) | 2015-12-22 | 2015-12-22 | Base plate, otter board, radio frequency payment module and wearable equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205283938U true CN205283938U (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521076488.2U Expired - Fee Related CN205283938U (en) | 2015-12-22 | 2015-12-22 | Base plate, otter board, radio frequency payment module and wearable equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205283938U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430894A (en) * | 2015-12-22 | 2016-03-23 | 北京握奇智能科技有限公司 | Substrate, mesh plate, radio frequency payment module and wearable equipment |
| CN110191580A (en) * | 2019-05-31 | 2019-08-30 | Oppo（重庆）智能科技有限公司 | Circuit board and its tin cream method for arranging, electronic device |
-
2015
- 2015-12-22 CN CN201521076488.2U patent/CN205283938U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430894A (en) * | 2015-12-22 | 2016-03-23 | 北京握奇智能科技有限公司 | Substrate, mesh plate, radio frequency payment module and wearable equipment |
| CN110191580A (en) * | 2019-05-31 | 2019-08-30 | Oppo（重庆）智能科技有限公司 | Circuit board and its tin cream method for arranging, electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160601 Termination date: 20211222 |