CN108966528A - A kind of steel mesh and preparation method thereof of circuit board internal memory connector - Google Patents
A kind of steel mesh and preparation method thereof of circuit board internal memory connector Download PDFInfo
- Publication number
- CN108966528A CN108966528A CN201811092916.9A CN201811092916A CN108966528A CN 108966528 A CN108966528 A CN 108966528A CN 201811092916 A CN201811092916 A CN 201811092916A CN 108966528 A CN108966528 A CN 108966528A
- Authority
- CN
- China
- Prior art keywords
- pad
- steel mesh
- circuit board
- internal memory
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of steel meshes of circuit board internal memory connector, including steel mesh ontology, the position of pad offers pad hole respectively on corresponding circuits plate on the steel mesh ontology, and the inboard width of the pad hole is less than the width of the pad, the outside width of the pad hole is greater than the width of the pad, and the length of the pad hole is greater than the length of the pad.The invention also discloses a kind of steel mesh preparation methods of circuit board internal memory connector, comprising: is cut into any of the above-described kind of steel mesh ontology；Polishing treatment.The steel mesh and preparation method thereof of the circuit board internal memory connector, on the one hand it can effectively ensure that effective connection of internal memory connector and pad, tin when tin cream melts simultaneously on adjacent pad will not connect, to avoid the company's of being formed tin after solidification bad, increase substantially the yield of production circuit board, production cost is reduced, circuit board competitiveness is improved.
Description
Technical field
The present invention relates to circuit board processing technique fields, more specifically to a kind of steel of circuit board internal memory connector
Net further relates to a kind of steel mesh preparation method of circuit board internal memory connector.
Background technique
In the high speed development of current electronics industry, almost all of electronic equipment requires PCBA (Printed
Circuit Board+Assembly, print populated circuit board) support.And server performance development trend processing speed is fast,
Memory capacity is big.(size is smaller and smaller) more accurate to internal memory connector requirement is caused, internal memory connector is wanted in welding procedure
Ask higher and higher.
However, in PCBA process, internal memory connector often occur, to connect tin bad, causes PCBA yield lower, and interior
It deposits connector and connects the bad maintenance difficult of tin, PCBA is be easy to cause to scrap, so that PCBA scrappage is higher.
It is current art technology in conclusion how to efficiently solve the problems such as PCBA yield is lower, scrappage is higher
Personnel's problem to be solved.
Summary of the invention
In view of this, the first purpose of this invention is to provide a kind of steel mesh of circuit board internal memory connector, the steel mesh
Structure design can efficiently solve that PCBA yield is lower, the higher problem of scrappage, second object of the present invention is to mention
For a kind of steel mesh preparation method of circuit board internal memory connector.
In order to reach above-mentioned first purpose, the invention provides the following technical scheme:
A kind of steel mesh of circuit board internal memory connector, including steel mesh ontology are welded on corresponding circuits plate on the steel mesh ontology
The position of disk offers pad hole respectively, and the inboard width of the pad hole is less than the width of the pad, the pad hole
Outside width be greater than the pad width, and the length of the pad hole be greater than the pad length.
Preferably, in the steel mesh of foregoing circuit board memory connector, the inboard width of the pad hole is the pad
0.6~0.9 times of width.
Preferably, in the steel mesh of foregoing circuit board memory connector, the outside width of the pad hole is the pad
1.1~1.3 times of width.
Preferably, in the steel mesh of foregoing circuit board memory connector, the inner side edge of the pad hole is located at the pad
The inside of inner side edge and at a distance of the first pre-determined distance, the outer side edges of the pad hole be located at the outside of the outer side edges of the pad and
At a distance of the second pre-determined distance, second pre-determined distance is greater than first pre-determined distance.
Preferably, in the steel mesh of foregoing circuit board memory connector, first pre-determined distance is not more than 1mm.
Preferably, in the steel mesh of foregoing circuit board memory connector, the range of first pre-determined distance be 0.1mm~
0.5mm。
Preferably, in the steel mesh of foregoing circuit board memory connector, the range of second pre-determined distance be 0.2mm~
0.4mm。
The steel mesh of circuit board internal memory connector provided by the invention includes steel mesh ontology, on steel mesh ontology on corresponding circuits plate
The position of pad offers pad hole respectively, and the inboard width of pad hole is less than the width of pad, the outside width of pad hole
Greater than the width of pad, and the length of pad hole is greater than the length of pad.
Using steel mesh provided by the invention, print solder paste is first passed around, secondly internal memory connector attachment, last tin cream passes through
High temperature melt welding solidification, internal memory connector is welded on pad.Since the inboard width of pad hole is less than the width of pad
Degree, the outside width of pad hole is greater than the width of pad, and the length of pad hole is greater than the length of pad, thus on the one hand can
Effective connection of internal memory connector and pad is effectively ensured, while the tin on pad adjacent when tin cream thawing will not connect, from
And avoid the company's of being formed tin after solidification bad, the yield of production circuit board is increased substantially, production cost is reduced, it is competing to improve circuit board
Strive power.
In order to reach above-mentioned second purpose, the present invention also provides a kind of steel mesh preparation sides of circuit board internal memory connector
Method, comprising:
It is cut into any of the above-described kind of steel mesh ontology；
Polishing treatment.
Since the steel mesh of steel mesh preparation method preparation has the pad hole of above structure, foregoing circuit board memory connector
Steel mesh have above-mentioned technique effect, thus the steel mesh preparation method of the circuit board internal memory connector should also have corresponding technology
Effect.
Preferably, described to be cut into any of the above-described kind of steel mesh in the steel mesh preparation method of foregoing circuit board memory connector
Ontology specifically includes:
It is cut into any of the above-described kind of steel mesh ontology, and cutting accuracy is required in 0.01mm.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the steel mesh of a specific embodiment of the invention.
It is marked in attached drawing as follows:
Pad 1, steel mesh 2, the width W of pad, the inboard width W1 of pad hole, the outside width W2 of pad hole, first is pre-
If distance L0, the length L1, the second pre-determined distance L2 of pad hole.
Specific embodiment
The embodiment of the invention discloses a kind of steel meshes of circuit board internal memory connector, to improve the yield of production circuit board.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of the steel mesh of a specific embodiment of the invention.
In a specific embodiment, the steel mesh of circuit board internal memory connector provided by the invention includes steel mesh ontology, steel
The thickness of net ontology can be arranged according to Gerber file (circuit board electronic map file) element minimum spacing, and it is suitable specifically to choose
The stainless (steel) wire of thickness, refer to the prior art for the principle of selection, and details are not described herein again.Under normal conditions, the thickness of steel mesh ontology
Degree range is 0.1mm~0.15mm.
The position of pad offers pad hole respectively on corresponding circuits plate on steel mesh ontology, that is, pad hole position with
The position of pad is corresponding, in order to upper tin.The inboard width of pad hole is less than the width of pad, and the outside width of pad hole is greater than
The width of pad, and the length of pad hole is greater than the length of pad.It should be noted that after referring to welding pin on the outside of pad hole
The side that pin stretches out, then the opposite other side is the inside of pad hole.By setting trapezoidal for pad hole, corresponding pad
Inboard pad hole size it is smaller, and then the spacing of the corresponding pad hole of adjacent two pad is larger, thus after print solder paste,
Tin on tin cream pad adjacent when melting is not easy to connect.By the way that the length of pad hole to be set greater than to the length of pad, energy
While soldering reliability is enough effectively ensured, convenient for detection welding quality.
Using steel mesh provided by the invention, print solder paste is first passed around, secondly internal memory connector attachment, last tin cream passes through
High temperature melt welding solidification, internal memory connector is welded on pad.Since the inboard width of pad hole is less than the width of pad
Degree, the outside width of pad hole is greater than the width of pad, and the length of pad hole is greater than the length of pad, thus on the one hand can
Effective connection of internal memory connector and pad is effectively ensured, while the tin on pad adjacent when tin cream thawing will not connect, from
And avoid the company's of being formed tin after solidification bad, the yield of production circuit board is increased substantially, production cost is reduced, it is competing to improve circuit board
Strive power.
Specifically, the inboard width of pad hole is 0.6~0.9 times of the width of pad.As shown in Figure 1, pad hole is interior
Side width is denoted as W1, and the width of pad is denoted as W, and the outside width of pad hole is denoted as W2, then W1=(0.6~0.9) W, by pad
The inboard width setting in hole within the above range, on the one hand can guarantee the welding of valid memory connector and pad, have simultaneously
Effect prevents tin cream from connecting.
Further, the outside width of pad hole is 1.1~1.3 times of pad width.Namely W2=(01.1~1.3)
W.The outside width of pad hole is larger, to guarantee the soldering reliability of internal memory connector and pad.
In the above embodiments, the inner side edge of pad hole be located at the inner side edge of pad inside and at a distance of first it is default away from
It is located at the outside of the outer side edges of pad from, outer side edges of pad hole and at a distance of the second pre-determined distance, the second pre-determined distance is greater than the
One pre-determined distance.As shown in Figure 1, the distance of inner side edge of the inner side edge of pad hole apart from pad, i.e. the first pre-determined distance are denoted as
L0, the distance of outer side edges of the outer side edges of pad hole apart from pad, i.e. the second pre-determined distance are denoted as L2, and the length of pad hole is denoted as
L1, then L1=L-L0+L2, wherein L2 is greater than L0, to guarantee that the length of pad hole is greater than the length of pad.
Specifically, the first pre-determined distance is not more than 1mm.Namely L0 is not more than 1mm, and the range of preferred L0 is 0.1mm
~0.5mm.Certainly, for the pad hole determined for one, corresponding first pre-determined distance should be a value determined, and the value
In above-mentioned numberical range.Further, the range of the second pre-determined distance is 0.2mm~0.4mm.
The parameter of the corresponding pad of steel mesh shown in FIG. 1 are as follows: the range of the width L of pad is in 1.2mm~1.8mm, pad
Width W range in 0.3mm~0.6mm, the range of the center spacing P of adjacent two pad is in 0.5mm~0.8mm.Then steel mesh
Corresponding parameter are as follows: inboard width W1=(0.6~0.9) W of pad hole, the outside width W2=(0.8~0.95) of pad hole
W, distance L2=0.2mm~0.4mm of outer side edges of the outer side edges of pad hole apart from pad, the hole inner side edge of pad is apart from pad
Inner side edge distance L0=0.1mm~0.5mm, the length L1=L-L0+L2 of pad hole.
The present invention also provides a kind of steel mesh preparation methods of circuit board internal memory connector, in a specific embodiment,
The following steps are included:
S1: it is cut into such as any one steel mesh ontology in above-described embodiment；
The structure of specific steel mesh ontology please refers to above-described embodiment, and details are not described herein again.
S2: polishing treatment.
It is processed by shot blasting after cutting, so that being conducive to demoulding after steel mesh print solder paste.
Since the steel mesh of steel mesh preparation method preparation has the pad hole of above structure, foregoing circuit board memory connector
Steel mesh have above-mentioned technique effect, thus the beneficial effect of the steel mesh preparation method of the circuit board internal memory connector please refers to
State embodiment.
Specifically, step S1 is specifically included:
It is cut into such as any one steel mesh ontology in above-described embodiment, and cutting accuracy is required in 0.01mm.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (9)
1. a kind of steel mesh of circuit board internal memory connector, which is characterized in that including steel mesh ontology, corresponding electricity on the steel mesh ontology
The position of pad offers pad hole respectively on the plate of road, and the inboard width of the pad hole is less than the width of the pad, institute
The outside width for stating pad hole is greater than the width of the pad, and the length of the pad hole is greater than the length of the pad.
2. the steel mesh of circuit board internal memory connector according to claim 1, which is characterized in that the inside of the pad hole is wide
Degree is 0.6~0.9 times of the width of the pad.
3. the steel mesh of circuit board internal memory connector according to claim 3, which is characterized in that the outside of the pad hole is wide
Degree is 1.1~1.3 times of the width of the pad.
4. the steel mesh of described in any item circuit board internal memory connectors according to claim 1~3, which is characterized in that the pad
The inner side edge in hole is located at the inside of the inner side edge of the pad and at a distance of the first pre-determined distance, and the outer side edges of the pad hole are located at
The outside of the outer side edges of the pad and at a distance of the second pre-determined distance, second pre-determined distance be greater than described first it is default away from
From.
5. the steel mesh of circuit board internal memory connector according to claim 3, which is characterized in that first pre-determined distance is not
Greater than 1mm.
6. the steel mesh of circuit board internal memory connector according to claim 3, which is characterized in that first pre-determined distance
Range is 0.1mm~0.5mm.
7. the steel mesh of circuit board internal memory connector according to claim 6, which is characterized in that second pre-determined distance
Range is 0.2mm~0.4mm.
8. a kind of steel mesh preparation method of circuit board internal memory connector characterized by comprising
It is cut into such as the described in any item steel mesh ontologies of claim 1-7；
Polishing treatment.
9. steel mesh preparation method according to claim 8, which is characterized in that described to be cut into as claim 1-7 is any
Steel mesh ontology described in, specifically includes:
It is cut into such as the described in any item steel mesh ontologies of claim 1-7, and cutting accuracy is required in 0.01mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092916.9A CN108966528A (en) | 2018-09-18 | 2018-09-18 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092916.9A CN108966528A (en) | 2018-09-18 | 2018-09-18 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108966528A true CN108966528A (en) | 2018-12-07 |
Family
ID=64471230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811092916.9A Pending CN108966528A (en) | 2018-09-18 | 2018-09-18 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966528A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678008A (en) * | 2019-09-24 | 2020-01-10 | 苏州浪潮智能科技有限公司 | Steel mesh of circuit board display connector and preparation method thereof |
| CN114889316A (en) * | 2022-06-17 | 2022-08-12 | 珠海格力电器股份有限公司 | Steel mesh open pore structure, metallization half hole module steel mesh device and lithography apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09323189A (en) * | 1996-06-04 | 1997-12-16 | Nec Toyama Ltd | Solder paste composition, production of printed circuit board having solder pad, and production of electronic part package circuit board |
| CN2899389Y (en) * | 2006-05-23 | 2007-05-09 | 比亚迪股份有限公司 | SMT printing template structure |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN103249262A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Face mounting interconnected seat opening structure for soldering paste printing steel screen |
| CN107454758A (en) * | 2017-09-28 | 2017-12-08 | 信利半导体有限公司 | One kind print tin steel-screen and pad structure |
-
2018
- 2018-09-18 CN CN201811092916.9A patent/CN108966528A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09323189A (en) * | 1996-06-04 | 1997-12-16 | Nec Toyama Ltd | Solder paste composition, production of printed circuit board having solder pad, and production of electronic part package circuit board |
| CN2899389Y (en) * | 2006-05-23 | 2007-05-09 | 比亚迪股份有限公司 | SMT printing template structure |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN103249262A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Face mounting interconnected seat opening structure for soldering paste printing steel screen |
| CN107454758A (en) * | 2017-09-28 | 2017-12-08 | 信利半导体有限公司 | One kind print tin steel-screen and pad structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678008A (en) * | 2019-09-24 | 2020-01-10 | 苏州浪潮智能科技有限公司 | Steel mesh of circuit board display connector and preparation method thereof |
| CN114889316A (en) * | 2022-06-17 | 2022-08-12 | 珠海格力电器股份有限公司 | Steel mesh open pore structure, metallization half hole module steel mesh device and lithography apparatus |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20181207 |