CN114889316A - Steel mesh open pore structure, metallization half hole module steel mesh device and lithography apparatus - Google Patents
Steel mesh open pore structure, metallization half hole module steel mesh device and lithography apparatus Download PDFInfo
- Publication number
- CN114889316A CN114889316A CN202210685410.9A CN202210685410A CN114889316A CN 114889316 A CN114889316 A CN 114889316A CN 202210685410 A CN202210685410 A CN 202210685410A CN 114889316 A CN114889316 A CN 114889316A
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- China
- Prior art keywords
- module
- integrated circuit
- pin
- hole
- circuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 37
- 239000010959 steel Substances 0.000 title claims abstract description 37
- 239000011148 porous material Substances 0.000 title claims description 5
- 238000001459 lithography Methods 0.000 title abstract description 3
- 238000001465 metallisation Methods 0.000 title abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000003466 welding Methods 0.000 claims abstract description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000006071 cream Substances 0.000 claims abstract description 7
- 238000010079 rubber tapping Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a steel mesh trompil structure, metallization half-hole module steel mesh device and lithography apparatus, includes the pin tin cream welded part that sets up with integrated circuit module contour line all around, pin tin cream welded part has at least one and corresponds slotted pin trompil module bottom part in integrated circuit module bottom and at least one pin trompil module epitaxial portion that corresponds integrated circuit module side half-hole, the width of pin trompil module bottom part is less than the slotted width in integrated circuit module bottom that corresponds the place, pin trompil module epitaxial portion's width is greater than the diameter that corresponds the integrated circuit side half-hole at place. The invention reduces the solder paste amount of the bottom part of the pin hole-opening module, increases the solder paste amount of the epitaxial part of the pin hole-opening module, effectively avoids the problems of insufficient welding strength or no welding and the like of the metalized semi-hole part at the side edge of the pin of the integrated circuit module, and avoids the problems of insufficient welding and poor desoldering of the pin of the integrated circuit module.
Description
Technical Field
The invention relates to the technical field of printing in the SMT industry, in particular to a steel mesh opening structure, a metallized semi-hole module steel mesh device and printing equipment.
Background
In the electronics industry, an integrated circuit module having a metallized half-hole design, as shown in fig. 3, has solder pins extending from a bottom surface 310 of the module to a side surface 320 of the module, bottom portions 330 of the module pins being coplanar with the bottom of the module, and module pin side metallized half-hole portions 340 recessed into the side of the module. In the SMT production soldering process, it is necessary to ensure that the bottom portions of the module pins and the side metalized half-hole portions are reliably soldered at the same time.
In the SMT industry, the steel mesh opening of the integrated circuit module generally uses a one-to-one hole pattern that completely corresponds to the size and position of the module pins, and extends a certain length to the outside of the module with the same width. As shown in fig. 4, the opening transfers solder paste printing to the PCB for soldering of the module. The solder paste of the lead bottom portion 420 is primarily used for module lead bottom portion soldering, and the lead extension portion 430 is primarily used for lead side metalized half hole portion soldering.
However, the steel mesh open-and-stand design method has many defects in the SMT welding process, as follows:
due to the action of a welding wetting force F of a metalized semi-hole part on the side edge of a module, the solder paste at the bottom of the module is extruded, and the solder paste at the bottom of the module is excessive, so that the molten solder paste overflows out of an area of a bonding pad, and a solder ball is formed at the bottom of the module or the solder paste of the module and the adjacent bonding pad form a short circuit welding defect;
and (II) because the tin quantity of the epitaxial part of the module pin opening is insufficient, the welding strength of the metallized semi-hole part at the side edge of the module pin is insufficient or no welding is formed.
Disclosure of Invention
Aiming at the problem of poor welding of an integrated circuit module designed by a metallized half-hole, the invention provides a steel mesh opening structure, a metallized half-hole module steel mesh device and printing equipment, which can avoid the phenomena of tin balls and poor short circuit caused by excessive tin paste at the bottom part of a pin opening module, ensure that the epitaxial part of the pin opening module has enough tin quantity for welding, eliminate the problem of poor welding of the integrated circuit module and meet higher production requirements.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a steel mesh trompil structure, includes the pin tin cream welded part that sets up with integrated circuit module contour line all around, pin tin cream welded part has at least one and corresponds slotted pin trompil module bottom part in integrated circuit module bottom and at least one pin trompil module epitaxial part that corresponds integrated circuit module side half-hole, the width of pin trompil module bottom part is less than the slotted width in integrated circuit module bottom that corresponds the place, the width of pin trompil module epitaxial part is greater than the diameter that corresponds the integrated circuit side half-hole at place.
Preferably, the bottom part of the pin hole-opening module is retracted toward the inside of the slot by a dimension D relative to the profiles of two sides of the slot at the bottom of the integrated circuit module 1 So that the width of the bottom part of the pin hole-opening module is reduced and is smaller than the width of the bottom groove of the integrated circuit module.
Preferably, said dimension D 1 For the bottom of the integrated circuit module is notched by a width W 1 5% -20%.
Preferably, the bottom portion of the pin hole-opening module is inwardly retracted corresponding to the two side profiles of the bottom slot of the integrated circuit module, so that the two sides of the width of the bottom portion of the pin hole-opening module are synchronously reduced and kept at the middle of the bottom slot of the integrated circuit module.
Preferably, the pin-tapping module extension part is retracted towards the inside of the hole by a dimension D relative to the boundaries of the two side holes of the half-hole of the side edge of the integrated circuit module 2 So that the width of the epitaxial part of the pin hole-opening module is reduced and is smaller than the diameter of the half hole at the side of the integrated circuit module.
Preferably, said dimension D 2 Is the diameter W of the half hole at the side of the integrated circuit module 2 5% -20%.
Preferably, the pin-tapping module extension portion is inwardly retracted relative to the hole boundaries at the two sides of the integrated circuit module side half-hole so that the width of the pin-tapping module extension portion is synchronously reduced at the two sides and is kept at the middle of the integrated circuit module side half-hole.
Preferably, the integrated circuit module bottom slot width W 1 And the diameter W of the half hole of the side plate of the integrated circuit module 2 And the width of the bottom part of the pin hole opening module is smaller than that of the extension part of the pin hole opening module so as to reduce the bottom solder paste of the integrated circuit module during welding and avoid overflow.
On the other hand, the invention adopts the following technical scheme: a metallized half-hole module steel mesh device comprises the steel mesh open-pore structure.
On the other hand, the invention adopts the following technical scheme: a printing device comprises the steel mesh open pore structure.
Compared with the prior art, the invention has the following beneficial effects:
the invention reduces the amount of the solder paste at the bottom of the pin hole-opening module, and avoids the problem that the solder paste at the bottom of the integrated circuit module overflows out of the area of the bonding pad due to the extrusion force of the solder paste at the bottom of the integrated circuit module under the action of the welding wetting force F at the epitaxial part of the pin hole-opening module, so that solder balls are formed at the bottom of the integrated circuit module or poor short circuit welding is formed between the solder paste and the adjacent bonding pad. Meanwhile, the amount of tin paste of the epitaxial part of the pin hole opening module is increased, the fact that the side metalized half hole part of the integrated circuit module has enough tin amount for welding is guaranteed, and meanwhile when the amount of tin of the bottom part of the pin hole opening module is insufficient, the tin amount of the epitaxial part of the pin hole opening module can be supplemented to the bottom part of the pin hole opening module, and the problem of poor welding of the integrated circuit module is solved. The problems that the welding strength of the metallized semi-hole part at the side edge of the pin of the integrated circuit module is insufficient or welding is not formed and the like are effectively avoided, and the problems of insufficient welding and poor desoldering of the pin of the integrated circuit module are avoided.
Drawings
In order to more clearly illustrate the technical solution, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a partially enlarged schematic view of fig. 1.
Fig. 3 is a schematic structural diagram of an integrated circuit module.
Fig. 4 is a schematic view of a conventional steel mesh structure.
Fig. 5 is a schematic view illustrating a conventional steel net when it is welded.
The labels in the figures indicate: the integrated circuit module perimeter contour 100, the pin-opening module bottom portion 110, the pin-opening module extension 120, the integrated circuit module 300, the module bottom surface 310, the module side surface 320, the module pin bottom portion 330, the module pin side metalized half-hole portion 340, the steel mesh 400, the module perimeter contour 410, the pin bottom 420, the pin extension 430, the PCB 440, and the solder paste 450.
Detailed Description
For a clear and complete understanding of the technical solutions, the present invention will now be further described with reference to the embodiments and the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
To facilitate understanding of the embodiments of the present application, the following description explains the related art to which the present application relates.
As shown in fig. 3, the solder pins of integrated circuit module 300 extend from the bottom surface 310 of the module to the side surface 320 of the module, with the bottom portions 330 of the module pins being coplanar with the bottom of the module and with the side metallized half-hole portions 340 of the module pins being recessed into the side of the module. As shown in fig. 4, in the SMT industry, the steel net 400 of the ic module is opened in a one-to-one manner corresponding to the size and position of the module pins, that is, the steel net is set according to the peripheral contour 410 of the ic module and has the same width and extends a certain length to the outside of the module. The opening transfers solder paste printing to the PCB board for soldering of the module. The solder paste of the lead bottom 420 is mainly used for module lead bottom partial soldering, and the lead extension 430 is mainly used for lead side metalized semi-hole partial soldering. However, in the above-mentioned steel mesh open-and-stand design, due to the action of the soldering wetting force F of the module side metalized half-hole portion 340 during the SMT soldering process, the solder paste at the bottom of the integrated circuit module 300 is pressed, and the solder paste 450 between the bottom of the module and the PCB 440 is excessive, which causes the molten solder paste to overflow out of the pad area, thereby forming solder balls at the bottom of the module, or forming poor short-circuit soldering with the solder paste of the adjacent pad. Meanwhile, the solder strength of the metallized semi-hole part at the side edge of the module pin is not enough or no solder is formed due to insufficient tin amount of the module pin extension part.
In order to solve the above problems, the present embodiment provides a steel mesh opening structure, as shown in fig. 1 and 2, including a pin solder paste soldering portion disposed by a peripheral contour line 100 of an integrated circuit module, the pin solder paste soldering portion has at least one pin opening module bottom portion 110 corresponding to a bottom slot of the integrated circuit module and at least one pin opening module extension portion 120 corresponding to a side half-hole of the integrated circuit module, a width of the pin opening module bottom portion 110 is smaller than a width of a bottom slot of the integrated circuit module corresponding to the pin opening module, and a width of the pin opening module extension portion 120 is greater than a diameter of the side half-hole of the integrated circuit corresponding to the pin opening module.
In this embodiment, the width of the slot at the bottom of the ic module is the same as the diameter of the half-hole of the side plate of the ic module, and is the width W, and the width of the bottom portion 110 of the pin-opening module is smaller than the width of the epitaxial portion 120 of the pin-opening module, so as to reduce the solder paste at the bottom of the ic module during soldering and prevent the solder paste from overflowing. This embodiment adopts the trompil design of differentiation, reduces the width to pin trompil module bottom part and to the widening of pin trompil module epitaxial portion, has both guaranteed that pin trompil module bottom part can not lead to phenomenon such as tin pearl, short circuit harmfulness because of the tin cream is too much, has guaranteed again that pin trompil module epitaxial portion has sufficient tin volume to weld.
As shown in fig. 2, the bottom portion 110 of the pin-hole module is recessed toward the inside of the slot by a dimension D relative to the profile of the two sides of the slot at the bottom of the ic module 1 So that the width of the bottom part of the pin hole-opening module is reduced and is smaller than the width of the groove at the bottom of the integrated circuit module. And simultaneously, the profiles on two sides are synchronously and unilaterally retracted, so that the two sides of the width of the bottom part of the pin hole-opening module are synchronously reduced and are kept in the middle of the groove in the bottom of the integrated circuit module. As a preferred embodiment of this embodiment, the dimension D 1 Is 5-20% of the width W of the bottom slot of the integrated circuit module.
The pin tapping module epitaxial part is opposite to the retraction dimension D in the boundary of the two side holes of the half hole of the side edge of the integrated circuit module towards the hole 2 So that the width of the epitaxial part of the pin hole-opening module is reduced and is smaller than the diameter of the half hole at the side of the integrated circuit module. Simultaneously, the two side profiles of the epitaxial part of the pin opening module are synchronously and unilaterally retracted, so that the two sides of the width of the epitaxial part of the pin opening module are synchronously retractedSmall and remains in the middle of the integrated circuit module side half-hole. As a preferred embodiment of this embodiment, the dimension D 2 Is the diameter W of the half hole at the side of the integrated circuit module 2 5% -20%.
This embodiment has reduced the solder paste volume of pin trompil module bottom part, avoids because the effect of pin trompil module epitaxial part welding wetting force F for integrated circuit module bottom solder paste receives the extrusion force and leads to the area that fused solder paste overflows the pad, and then forms the tin pearl in integrated circuit module bottom, perhaps forms short circuit welding bad problem with adjacent pad solder paste. Meanwhile, the amount of tin paste of the epitaxial part of the pin hole opening module is increased, the fact that the side metalized half hole part of the integrated circuit module has enough tin amount for welding is guaranteed, and meanwhile when the amount of tin of the bottom part of the pin hole opening module is insufficient, the tin amount of the epitaxial part of the pin hole opening module can be supplemented to the bottom part of the pin hole opening module, and the problem of poor welding of the integrated circuit module is solved. The problems that the welding strength of the metallized semi-hole part at the side edge of the pin of the integrated circuit module is insufficient or welding is not formed and the like are effectively avoided, and the problems of insufficient welding and poor desoldering of the pin of the integrated circuit module are avoided.
In another aspect, the present invention provides another embodiment: a metallized half-hole module steel mesh device comprises the steel mesh opening structure of the embodiment.
In another aspect, the present invention provides another embodiment: a printing apparatus comprising a steel mesh opening structure of the above embodiment.
The above disclosure is intended to be illustrative of one or more of the preferred embodiments of the present invention and is not intended to limit the invention in any way, which is equivalent or conventional to one skilled in the art and which is intended to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims.
Claims (10)
1. A steel mesh open pore structure, its characterized in that: including the pin tin cream solder part that sets up with integrated circuit module contour line all around, pin tin cream solder part has at least one pin trompil module bottom part that corresponds the integrated circuit module bottom fluting and at least one pin trompil module epitaxial part that corresponds integrated circuit module side half-hole, the width of pin trompil module bottom part is less than the integrated circuit module bottom fluting width that corresponds the place, the width of pin trompil module epitaxial part is greater than the diameter that corresponds the integrated circuit side half-hole at place.
2. A steel mesh open-cell structure according to claim 1, wherein: the bottom part of the pin hole-opening module is retracted towards the inside of the groove relative to the profiles of two sides of the groove at the bottom of the integrated circuit module 1 So that the width of the bottom part of the pin hole-opening module is reduced and is smaller than the width of the groove at the bottom of the integrated circuit module.
3. A steel mesh open-cell structure according to claim 2, wherein: the dimension D 1 For said integrated circuit module bottom slotting width W 1 5% -20%.
4. A steel mesh open-cell structure according to claim 2, wherein: the bottom part of the pin hole-opening module is inwards retracted corresponding to the profiles of two sides of the bottom groove of the integrated circuit module so that two sides of the width of the bottom part of the pin hole-opening module are synchronously reduced and are kept in the middle of the bottom groove of the integrated circuit module.
5. A steel mesh open-cell structure according to claim 1, wherein: the pin tapping module epitaxial part is opposite to the retraction dimension D in the boundary of the two side holes of the half hole of the side edge of the integrated circuit module towards the hole 2 So that the width of the epitaxial part of the pin hole-opening module is reduced and is smaller than the diameter of the half hole at the side of the integrated circuit module.
6. A steel mesh open-cell structure, according to claim 5, wherein: the dimension D 2 Is the side half-hole of the integrated circuit moduleDiameter W 2 5% -20%.
7. A steel mesh open-cell structure, according to claim 5, wherein: the pin hole-opening module epitaxial part is inwards retracted corresponding to the hole boundaries on the two sides of the half hole on the side edge of the integrated circuit module, so that the width of the pin hole-opening module epitaxial part is synchronously reduced on two sides, and the pin hole-opening module epitaxial part is kept in the middle of the half hole on the side edge of the integrated circuit module.
8. A steel mesh open-cell structure according to claim 1, wherein: the integrated circuit module has a bottom slot width W 1 And the diameter W of the half hole of the side plate of the integrated circuit module 2 And the width of the bottom part of the pin hole opening module is smaller than that of the extension part of the pin hole opening module so as to reduce the bottom solder paste of the integrated circuit module during welding and avoid overflow.
9. A metallised half-hole module steel mesh arrangement comprising a steel mesh open structure as claimed in any one of claims 1 to 7.
10. A printing apparatus, characterized by: comprising a steel mesh open structure as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210685410.9A CN114889316B (en) | 2022-06-17 | 2022-06-17 | Steel mesh open pore structure, metallization half-hole module steel mesh device and lithography apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210685410.9A CN114889316B (en) | 2022-06-17 | 2022-06-17 | Steel mesh open pore structure, metallization half-hole module steel mesh device and lithography apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114889316A true CN114889316A (en) | 2022-08-12 |
| CN114889316B CN114889316B (en) | 2023-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210685410.9A Active CN114889316B (en) | 2022-06-17 | 2022-06-17 | Steel mesh open pore structure, metallization half-hole module steel mesh device and lithography apparatus |
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Citations (7)
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|---|---|---|---|---|
| JP2001293972A (en) * | 2000-04-17 | 2001-10-23 | Matsushita Electric Ind Co Ltd | Screen mask and screen process printing method |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN107454758A (en) * | 2017-09-28 | 2017-12-08 | 信利半导体有限公司 | One kind print tin steel-screen and pad structure |
| CN108966528A (en) * | 2018-09-18 | 2018-12-07 | 郑州云海信息技术有限公司 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
| CN208424964U (en) * | 2018-05-23 | 2019-01-22 | 常州市泽宸电子有限公司 | SMT steel mesh |
| CN214481552U (en) * | 2020-10-26 | 2021-10-22 | 厦门强力巨彩光电科技有限公司 | Steel mesh opening structure for preventing tin beads |
| US20220013484A1 (en) * | 2020-07-08 | 2022-01-13 | Beijing Xiaomi Mobile Software Co., Ltd. | Chip, circuit board and electronic device |
-
2022
- 2022-06-17 CN CN202210685410.9A patent/CN114889316B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293972A (en) * | 2000-04-17 | 2001-10-23 | Matsushita Electric Ind Co Ltd | Screen mask and screen process printing method |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN107454758A (en) * | 2017-09-28 | 2017-12-08 | 信利半导体有限公司 | One kind print tin steel-screen and pad structure |
| CN208424964U (en) * | 2018-05-23 | 2019-01-22 | 常州市泽宸电子有限公司 | SMT steel mesh |
| CN108966528A (en) * | 2018-09-18 | 2018-12-07 | 郑州云海信息技术有限公司 | A kind of steel mesh and preparation method thereof of circuit board internal memory connector |
| US20220013484A1 (en) * | 2020-07-08 | 2022-01-13 | Beijing Xiaomi Mobile Software Co., Ltd. | Chip, circuit board and electronic device |
| CN214481552U (en) * | 2020-10-26 | 2021-10-22 | 厦门强力巨彩光电科技有限公司 | Steel mesh opening structure for preventing tin beads |
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| CN114889316B (en) | 2023-04-14 |
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