CN217591209U - A bear circuit board and electrical components for fixing paster device - Google Patents
A bear circuit board and electrical components for fixing paster device Download PDFInfo
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- CN217591209U CN217591209U CN202220624661.1U CN202220624661U CN217591209U CN 217591209 U CN217591209 U CN 217591209U CN 202220624661 U CN202220624661 U CN 202220624661U CN 217591209 U CN217591209 U CN 217591209U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The embodiment of the application relates to the technical field of electronic devices, in particular to a bearing circuit board for fixing a patch device, comprising: the circuit board comprises a circuit board body and two welding pads which are positioned on the board surface of the circuit board body and are arranged at intervals in a first direction; the distance between the two bonding pads in the first direction is a first size, and the sum of the size of any one of the two bonding pads in the first direction and the first size is less than 0.35mm. The embodiment of the application further provides an electrical appliance assembly. The bearing circuit board and the electrical appliance assembly for fixing the surface mounted device provided by the embodiment of the application can reduce the probability of occurrence of the tombstone phenomenon of the 01005 element when the 01005 element is welded on the bearing circuit board.
Description
Technical Field
The embodiment of the application relates to the technical field of electronic devices, in particular to a bearing circuit board and an electrical appliance assembly for fixing a patch device.
Background
In the production stage of a Printed Circuit Board Assembly (PCBA) factory, in the reflow soldering process of a resistor, a capacitor and other chip components in a surface mounting process, when solder pastes on two bonding pads respectively used for fixing two ends of a component are reflowed and melted, the solder pastes on the two bonding pads can enable two ends of the component to generate different surface tension, when the difference of the surface tension received by the two ends of the component is larger, one end of the component with larger surface tension can pull the component to rotate so as to enable the other end of the component with smaller surface tension to be erected, and the phenomenon is the phenomenon of erecting.
Factors that cause a large difference in surface tension across the element are many, such as: the preheating temperature is set to be lower or higher, the shapes and the sizes of the patterns of the pads at the two ends are inconsistent, the thickness of the soldering paste is thinner or thicker, and the like. In contrast, at present, the tombstoning phenomenon of the device is usually avoided by changing the temperature value of the preheating temperature, making the shapes and the sizes of the patterns of the pads at the two ends consistent, changing the thickness of the soldering paste and the like.
However, the above method for avoiding the tombstoning of the device cannot further reduce the probability of the tombstoning of the 01005 device when the 01005 device is soldered on the carrier circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the present application is to provide a carrier circuit board and an electrical component for fixing a chip device, so as to reduce the probability of occurrence of a tombstone phenomenon in a 01005 element when the 01005 element is soldered on the carrier circuit board.
In order to solve the above problem, an embodiment of the present application provides a carrier circuit board for fixing a patch device, including: the circuit board comprises a circuit board body and two welding pads which are positioned on the board surface of the circuit board body and are arranged at intervals in a first direction; the distance between the two bonding pads in the first direction is a first size, and the sum of the size of any one of the two bonding pads in the first direction and the first size is less than 0.35mm.
In addition, this application embodiment still provides an electrical components, includes: paster component and foretell bearing circuit board, the both ends of paster component weld respectively on two pads.
The utility model provides a bearing circuit board and electrical components for fixing paster device, all include: the circuit board comprises a circuit board body and two welding pads which are positioned on the board surface of the circuit board body and are arranged at intervals in a first direction; the distance between the two bonding pads in the first direction is a first size, and the sum of the size of any one of the two bonding pads in the first direction and the first size is less than 0.35mm. In this way, since the dimension of the 01005 element in the length direction is 0.4mm, the distance between the two pads in the first direction is the first dimension, and the sum of the dimension of any one of the two pads in the first direction and the first dimension is less than 0.35mm, so that even if the position of the 01005 element is shifted due to solder paste reflow melting on the pad in the process of soldering the 01005 element on the two pads on the carrier circuit board, the minimum contact length between any end of the shifted 01005 element and one pad in the first direction is greater than 0.05mm, the difference of surface tension applied to the two ends of the 01005 element is small, and the probability of occurrence of a tombstone phenomenon in the 01005 element is reduced.
Drawings
FIG. 1 is a schematic diagram of a 01005 element;
fig. 2 is a schematic structural diagram of a carrier circuit board according to some embodiments of the present application;
fig. 3 is a schematic structural diagram of another view of a carrier circuit board according to some embodiments of the present disclosure.
Detailed Description
It can be known from the background art that, at present, in the reflow soldering process of the surface mount technology of the chip components such as resistors, capacitors and the like, tombstoning of the components is avoided by changing the temperature value of the preheating temperature, making the shapes and the sizes of the patterns of the bonding pads at the two ends consistent, changing the thickness of the soldering paste and the like. However, these methods for avoiding the tombstoning of the 010devices cannot further reduce the probability of the tombstoning of the 01005 devices when the 01005 devices are soldered on the circuit board.
With reference to fig. 1, a 01005 element refers to a class of elements having a length dimension L of 0.40mm (mm: millimeters), a width dimension W of 0.20mm, and a height dimension H of 0.20 mm.
The inventor of the present application finds that, in the reflow soldering process of the surface mount technology, when solder pastes respectively used on two pads at two ends of a 01005 element are reflowed and melted, the position of the 01005 element may shift, so that the contact length of one end of the shifted 01005 element and one pad in the length direction of the 01005 element is less than or equal to 0.05mm, the surface tension received by one end of the 01005 element is small, the difference between the surface tensions received by two ends of the 01005 element is large, and the stone phenomenon of the 01005 element occurs.
In order to reduce the probability of occurrence of a tombstoning phenomenon of the 01005 element when the 01005 element is soldered on the carrier circuit board, the inventor of the present application designs a carrier circuit board for fixing a chip device, comprising: the circuit board comprises a circuit board body and two welding pads which are positioned on the board surface of the circuit board body and are arranged at intervals in a first direction; the distance between the two bonding pads in the first direction is a first size, and the sum of the size of any one of the two bonding pads in the first direction and the first size is less than 0.35mm. In this way, since the dimension of the 01005 element in the length direction is 0.4mm, the distance between the two pads in the first direction is the first dimension, and the sum of the dimension of any one of the two pads in the first direction and the first dimension is less than 0.35mm, so that even if the position of the 01005 element is shifted due to solder paste reflow melting on the pad in the process of soldering the 01005 element on the two pads on the carrier circuit board, the minimum contact length between any end of the shifted 01005 element and one pad in the first direction is greater than 0.05mm, the difference of surface tension applied to the two ends of the 01005 element is small, and the probability of occurrence of a tombstone phenomenon in the 01005 element is reduced.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the various embodiments of the present application, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical means claimed in the present application can be realized by various changes and modifications of the following embodiments.
Referring to fig. 2 and 3, some embodiments of the present application provide a carrier circuit board for fixing a patch device, including: a circuit board body 110 and two pads 120 located on a board surface of the circuit board body 110 and spaced in a first direction (i.e., an X direction shown in fig. 3); the pitch of the two pads 120 in the first direction is a first dimension (i.e., a dimension shown in fig. 3), and the sum of the dimension of any one of the two pads 120 in the first direction and the first dimension is less than 0.35mm.
Specifically, the first direction is parallel to the surface of the circuit board body 110; the dimension of one of the two pads 120 in the first direction is the B dimension shown in fig. 3, and the dimension of the other of the two pads 120 in the first direction is the C dimension shown in fig. 3, that is, the dimension of any one of the two pads 120 in the first direction is the B dimension or the C dimension shown in fig. 3.
That is, in some embodiments of the present application, the sum of the B dimension shown in FIG. 3 and the A dimension shown in FIG. 3 is less than 0.35mm, and the sum of the C dimension shown in FIG. 3 and the A dimension shown in FIG. 3 is also less than 0.35mm.
In this way, in the process of soldering the 01005 element on the two pads 120 on the carrier circuit board, since the length direction of the 01005 element is the same as the first direction, even if the solder paste on the two pads 120 is reflowed and melted to shift the position of the 01005 element, the minimum contact length of any one soldering terminal of the shifted 01005 element and one pad (i.e. one of the two pads 120) in the first direction is greater than 0.05mm, i.e. the surface tension applied to any soldering terminal of the 01005 element is not too small, so that the difference between the surface tensions applied to the two soldering terminals of the 01005 element is small, and the probability of occurrence of a tombstone phenomenon in the 01005 element is reduced. Wherein, two welding ends of the 01005 element are two ends of the 01005 element which are oppositely arranged in the length direction.
For convenience of illustration, one of the two pads 120 is the pad 121, and the other of the two pads 120 is the pad 122. More specifically, when the solder paste reflow melting on the two pads 120 shifts the position of the 01005 element, the contact area between one bonding end of the 01005 element and the pad 121 is larger than the contact area between the other bonding end of the 01005 element and the pad 122, so that the surface tension applied to one bonding end of the 01005 element (i.e., the end in contact with the pad 121) is larger than the surface tension applied to the other bonding end of the 01005 element (i.e., the end in contact with the pad 122).
However, in the present application, since the distance between the two pads 120 in the first direction is the first dimension, the sum of the dimension of any one of the two pads 120 in the first direction and the first dimension is less than 0.35mm, and the length direction of the 01005 element is the same as the first direction, the contact length between the other bonding end of the 01005 element and the pad 122 in the first direction is ensured to be greater than 0.05mm, so that the difference between the surface tension received by one bonding end of the 01005 element (i.e., the end in contact with the pad 121) and the surface tension received by the other bonding end of the 01005 element (i.e., the end in contact with the pad 122) is not too large, and the problem that the bonding end of the 01005 element having a large surface tension (i.e., the end in contact with the pad 121) pulls the 01005 element to rotate so that the other bonding end of the 01005 element having a small surface tension (i.e., the end in contact with the erected pad 122) is avoided, thereby reducing the probability of occurrence of the tombstoning phenomenon of the 01005 element.
In some embodiments, the sum of the first dimension and the dimension of any of the two pads 120 in the first direction is greater than or equal to 0.27mm.
Specifically, the sum of the first dimension and the dimension of any one of the two pads 120 in the first direction is greater than or equal to 0.27mm, that is, the sum of the dimension B shown in fig. 3 and the dimension a shown in fig. 3 is greater than or equal to 0.27mm, and the sum of the dimension C shown in fig. 3 and the dimension a shown in fig. 3 is also greater than or equal to 0.27mm. In this way, the distance between the edge of the pad 121 far from the pad 122 and the edge of the pad 122 far from the pad 121 can be made to be larger than 0.27mm, so that when a 01005 element with a length dimension of 0.4mm is welded, it can be ensured that both ends of the 01005 element can be welded on two pads.
In some embodiments, the sum of the first dimension and the dimension of any one of the two pads 120 in the first direction is less than or equal to 0.33mm and greater than or equal to 0.29mm.
Specifically, the sum of the first dimension and the dimension of any one of the two pads 120 in the first direction is less than or equal to 0.33mm and greater than or equal to 0.29mm, that is, the sum of the dimension B shown in fig. 3 and the dimension a shown in fig. 3 is less than or equal to 0.33mm and greater than or equal to 0.29mm, and the sum of the dimension C shown in fig. 3 and the dimension a shown in fig. 3 is less than or equal to 0.33mm and greater than or equal to 0.29mm. In this way, in the process of soldering the 01005 element on the two pads 120 on the carrier circuit board, and after the solder paste on the two pads 120 is reflowed and melted to shift the position of the 01005 element, the minimum contact length between any one soldering terminal of the shifted 01005 element and one pad (i.e. one of the two pads 120) in the first direction is greater than 0.07mm, thereby further reducing the occurrence probability of the tombstoning phenomenon of the 01005 element. In addition, the distance between the edge of the pad 121 far from the pad 122 and the edge of the pad 122 far from the pad 121 can be made to be larger than 0.29mm, so that when a 01005 element with a length dimension of 0.4mm is welded, it can be further ensured that both ends of the 01005 element can be welded on two pads.
In some embodiments, the sum of the first dimension and the dimension of any one of the two pads 120 in the first direction is 0.31mm. That is, the sum of the B dimension shown in FIG. 3 and the A dimension shown in FIG. 3 is 0.31mm, and the sum of the C dimension shown in FIG. 3 and the A dimension shown in FIG. 3 is 0.31mm.
In this way, in the process of soldering the 01005 element on the two pads 120 on the carrier circuit board, and after the solder paste on the two pads 120 is reflowed and melted to shift the position of the 01005 element, the minimum contact length between any one soldering terminal of the shifted 01005 element and one pad (i.e. one of the two pads 120) in the first direction is greater than 0.09mm, thereby further reducing the occurrence probability of the tombstoning phenomenon of the 01005 element.
In some embodiments, the dimension of either of the two pads 120 in the first direction is greater than or equal to 0.14mm and less than or equal to 0.18mm. That is, the B dimension shown in fig. 3 is greater than or equal to 0.14mm and less than or equal to 0.18mm, while the C dimension shown in fig. 3 is greater than or equal to 0.14mm and less than or equal to 0.18mm.
Thus, when the two bonding ends of the 01005 device are respectively bonded to the two bonding pads 120, the solder paste on any one of the two bonding pads 120 can ensure that the surface tension provided by the solder paste on the bonding end of the 01005 device is not too large, thereby reducing the probability of occurrence of a tombstoning phenomenon in the 01005 device.
In some embodiments, the first dimension is greater than or equal to 0.13mm and less than or equal to 0.17mm. That is, the a dimension shown in fig. 3 is 0.13mm or more and 0.17mm or less.
Therefore, the phenomenon of short circuit of the 01005 device caused by the solder paste on the two bonding pads 120 converging in a molten state can be avoided. In addition, excessive moment on the 01005 element can be avoided when the solder paste on the two pads 120 provides surface tension to the two bonding ends of the 01005 element respectively.
In some embodiments, the size of each of the two pads 120 in a second direction (i.e., the Y direction shown in fig. 3) is greater than or equal to 0.17mm and less than or equal to 0.21mm, wherein the second direction is perpendicular to the first direction and parallel to the board surface.
Specifically, the dimension of any one of the two pads 120 in the second direction is the dimension D shown in fig. 3; the dimension of each of the two pads 120 in the second direction is greater than or equal to 0.17mm and less than or equal to 0.21mm, that is, the dimension D shown in fig. 3 is greater than or equal to 0.17mm and less than or equal to 0.21mm.
Thus, when the two bonding ends of the 01005 device are respectively bonded to the two bonding pads 120, it is further ensured that the surface tension provided by the solder paste on any one of the two bonding pads 120 to the bonding end of the 01005 device is not too large, thereby reducing the probability of occurrence of a tombstone in the 01005 device.
In an embodiment, the size of each of the two pads 120 in the first direction is 0.16mm, the size of each of the two pads 120 in the second direction is 0.19mm, and the first size is 0.15mm. Therefore, the probability of occurrence of the tombstoning phenomenon of the 01005 element can be reduced to within one-zero percent.
In some implementations, both pads 120 are square pads or square-like pads. Thus, the shapes of the two pads 120 can be made to fit the shapes of the two welding ends of the 01005 element, so that the two welding ends of the 01005 element can be welded on the two pads 120 respectively. The shape of the square-like pad is not square, but is similar to square, such as: the corner of the bonding pad is a round corner and is different from the right angle of the square bonding pad, and a bulge or a groove is arranged on the edge of the bonding pad.
Some embodiments of the present application further provide an electrical component comprising: a chip component and a carrier circuit board, wherein two ends of the chip component are respectively welded on two bonding pads 120 of the carrier circuit board. Wherein, the paster element is 01005 element. In fact, the carrier boards provided by these embodiments are the same as the carrier boards provided by the above embodiments, and therefore, the carrier boards provided by these embodiments can also reduce the probability of occurrence of a tombstone phenomenon of the 01005 element when the 01005 element is soldered.
In some embodiments, solder paste is printed on a carrier circuit board using a printing screen having a mesh with a length dimension and a width dimension of 0.19 mm. Therefore, after the solder paste is printed on the bearing circuit board by using the printing screen plate, the demoulding performance of the printing screen plate is better. Preferably, the printing screen has at least two meshes, and when the printing screen is used to print solder paste on the carrier circuit board, the two meshes are respectively disposed opposite to the two pads 120, so as to print solder paste on the two pads 120.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the present application, and that various changes in form and details may be made therein without departing from the spirit and scope of the present application in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the application, and it is intended that the scope of the application be limited only by the claims appended hereto.
Claims (10)
1. A carrier circuit board for securing a patch device, comprising:
the circuit board comprises a circuit board body and two welding pads which are positioned on the board surface of the circuit board body and are arranged at intervals in a first direction;
the distance between the two bonding pads in the first direction is a first size, and the sum of the size of any one of the two bonding pads in the first direction and the first size is less than 0.35mm.
2. The carrier circuit board of claim 1, wherein the sum of the first dimension and the dimension of either of the two pads in the first direction is greater than or equal to 0.27mm.
3. The carrier circuit board of claim 2, wherein the sum of the first dimension and the dimension of either of the two pads in the first direction is less than or equal to 0.33mm and greater than or equal to 0.29mm.
4. The carrier circuit board of claim 3, wherein the sum of the first dimension and the dimension of either of the two pads in the first direction is 0.31mm.
5. The carrier circuit board of any of claims 1-4, wherein the size of each of the two pads in the first direction is greater than or equal to 0.14mm and less than or equal to 0.18mm.
6. The carrier circuit board of any of claims 1-4, wherein the first dimension is greater than or equal to 0.13mm and less than or equal to 0.17mm.
7. The carrier circuit board of any one of claims 1-4, wherein a dimension of each of the two pads in a second direction is greater than or equal to 0.17mm and less than or equal to 0.21mm, wherein the second direction is perpendicular to the first direction and the second direction is parallel to the board surface.
8. The carrier circuit board of any one of claims 1-4, wherein each of the two pads has a dimension in the first direction of 0.16mm, each of the two pads has a dimension in the second direction of 0.19mm, and the first dimension is 0.15mm, wherein the second direction is perpendicular to the first direction and the second direction is parallel to the board surface.
9. Load carrying circuit board according to any one of claims 1-4, characterized in that both of said pads are square pads or quasi square pads.
10. An electrical component, comprising: a chip element and a carrier circuit board according to any one of claims 1-9, both ends of the chip element being soldered to both of the pads, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624661.1U CN217591209U (en) | 2022-03-21 | 2022-03-21 | A bear circuit board and electrical components for fixing paster device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624661.1U CN217591209U (en) | 2022-03-21 | 2022-03-21 | A bear circuit board and electrical components for fixing paster device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217591209U true CN217591209U (en) | 2022-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220624661.1U Active CN217591209U (en) | 2022-03-21 | 2022-03-21 | A bear circuit board and electrical components for fixing paster device |
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| Country | Link |
|---|---|
| CN (1) | CN217591209U (en) |
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- 2022-03-21 CN CN202220624661.1U patent/CN217591209U/en active Active
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