KR20010029108A - Surface mounting type pcb module - Google Patents

Surface mounting type pcb module Download PDF

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Publication number
KR20010029108A
KR20010029108A KR1019990041739A KR19990041739A KR20010029108A KR 20010029108 A KR20010029108 A KR 20010029108A KR 1019990041739 A KR1019990041739 A KR 1019990041739A KR 19990041739 A KR19990041739 A KR 19990041739A KR 20010029108 A KR20010029108 A KR 20010029108A
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KR
South Korea
Prior art keywords
pcb
solder cream
module
pcb module
solder
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KR1019990041739A
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Korean (ko)
Inventor
임대호
Original Assignee
김종수
엘지이노텍 주식회사
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Application filed by 김종수, 엘지이노텍 주식회사 filed Critical 김종수
Priority to KR1019990041739A priority Critical patent/KR20010029108A/en
Publication of KR20010029108A publication Critical patent/KR20010029108A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A printed circuit board(PCB) module is provided to prevent the position of the module from distortion by unstable soldering and maximize the soldering effect by fixing the flexure of the solder cream formed on the PCB module to the solder cream of the main PCB. CONSTITUTION: Of a printed circuit board(PCB) module, a second solder cream(40) maximizing the soldering effect by combining with the first solder cream of a main PCB is printed on the main PCB where corresponding to the side(32) of a PCB module(30) for SMD. Here, the width of the second solder cream(40) is the same as the width of the side(32) of the PCB module(30). The length(L) is below two thirds of the length of the side(32) of the module(30). The depth is between 190-210 μm. If the second solder cream(40) is longer than the PCB module(30), solder can penetrate into the flexure of the side(32) of the PCB module(30), affecting the copper laminates.

Description

표면 실장형 인쇄회로기판 모듈{SURFACE MOUNTING TYPE PCB MODULE}Surface Mount Printed Circuit Board Modules {SURFACE MOUNTING TYPE PCB MODULE}

본 발명은 표면 실장형 인쇄회로기판(Printed Circuit Board:이하 "PCB"라 함) 모듈에 관한 것으로서, 더욱 상세하게는 PCB 모듈의 일면에 솔더크림(solder cream)을 인쇄함으로서 메인 PCB의 솔더크림과 결합이 용이하도록 하여 PCB 모듈의 위치가 틀어지는 현상이 발생되는 것을 방지하도록 하는 솔더크림이 인쇄된 표면 실장형 PCB 모듈에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounted printed circuit board (hereinafter referred to as "PCB") module, and more particularly, to a solder cream of a main PCB by printing solder cream on one surface of a PCB module. The present invention relates to a surface-mount PCB module having a solder cream printed thereon to facilitate the coupling and to prevent the PCB module from being displaced.

통상적으로, 관통형(through-hole type)의 전자부품에 비하여 표면 실장형 모듈은 크기면에서 유리할 뿐만 아니라 PCB상에 장착할때 장착밀도를 높일 수 있고, PCB의 양면에 장착할 수 있어 소형의 전자제품 개발시 그 수요가 급증하고 있는 추세에 있다.In general, surface-mount modules are advantageous in size compared to through-hole type electronic components, and can increase the mounting density when mounted on the PCB, and can be mounted on both sides of the PCB. The demand for electronics is increasing rapidly.

일반적으로 표면 실장형 PCB 모듈을 메인 PCB에 실장하는 과정은 도 1에 도시된 바와 같이 먼저, 메인 PCB(10)의 실장면(12)에 150㎛의 두께(T1)를 가지는 제 1 솔더크림(20)을 인쇄한다.In general, the process of mounting the surface-mount PCB module on the main PCB is performed by first solder cream having a thickness T1 of 150 μm on the mounting surface 12 of the main PCB 10. Print 20).

이러한 상태에서 PCB 모듈(30)의 실장면(32)를 메인 PCB(10)에 인쇄된 제 1 솔더크림(20)에 접촉시킨 후 리플로우(reflow) 공정을 거쳐 PCB 모듈(30)을 메인 PCB(10)에 실장하였다.In this state, the mounting surface 32 of the PCB module 30 is brought into contact with the first solder cream 20 printed on the main PCB 10, and then the PCB module 30 is moved to the main PCB through a reflow process. It was mounted at (10).

그러나, 이러한 종래의 기술에 따라 메인 PCB에 표면 실장형 PCB 모듈을 부착시키는 과정에서 메인 PCB에 인쇄된 제 1 솔더크림의 면적이 넓었기 때문에 리플로우 공정에서 PCB 모듈의 위치가 틀어지는 현상이 발생되고 불완전한 솔더링으로 냉땜(PCB 모듈의 실장면와 메인 PCB의 실장면가 솔더에 의해 완전히 접합되지 않은 상태) 등의 공정 불량이 발생하는 문제점이 있었다.However, according to the conventional technology, since the area of the first solder cream printed on the main PCB is large in the process of attaching the surface-mount PCB module to the main PCB, the position of the PCB module is changed in the reflow process. Due to incomplete soldering, there is a problem in that process defects such as cold soldering (the mounting surface of the PCB module and the mounting surface of the main PCB are not completely joined by the solder) occur.

본 발명은, 상기와 같은 문제점을 해결하기 위한 것으로 그 목적은 표면 실장형 PCB 모듈의 실장면에 솔더크림을 인쇄하고 리플로우 솔더링 공정에서, PCB 모듈의 솔더크림이 메인 PCB의 실장면에 고정되도록 하고, 메인 PCB의 솔더크림과 PCB 모듈의 솔더크림을 동일 순간에 녹임으로써 PCB 모듈의 위치가 틀어지는 현상이 발생되어 불완전한 솔더링으로 냉땜 등의 공정 불량이 발생하는 것을 차단시키도록 하는 데 있다.The present invention is to solve the above problems and its purpose is to print the solder cream on the mounting surface of the surface-mount PCB module and in the reflow soldering process, so that the solder cream of the PCB module is fixed to the mounting surface of the main PCB In addition, the solder cream of the main PCB and the solder cream of the PCB module are melted at the same instant, thereby causing the position of the PCB module to be distorted, thereby preventing process defects such as cold soldering from incomplete soldering.

도 1은 종래의 메인 PCB에 표면 실장형 타입의 PCB 모듈이 실장된 상태를 나타낸 사시도1 is a perspective view showing a state in which a surface-mount type PCB module is mounted on a conventional main PCB

도 2는 본 발명에 따라 표면 실장형 PCB 모듈에 솔더크림이 인쇄된 상태를 나타낸 사시도Figure 2 is a perspective view showing a state where the solder cream is printed on the surface-mount PCB module according to the present invention

도 3은 본 발명에 따라 표면 실장형 PCB 모듈의 솔더크림을 리플로우 솔더링시킨 후의 형상을 나타낸 사시도Figure 3 is a perspective view showing the shape after reflow soldering the solder cream of the surface-mount PCB module according to the present invention

도 4는 본 발명에 따라 솔더크림이 인쇄된 표면 실장형 PCB 모듈을 메인 PCB에 실장하는 모습을 나타낸 측단면도Figure 4 is a side cross-sectional view showing a surface mounted PCB module solder cream printed on the main PCB according to the present invention.

＜도면의 주요부분에 대한 부호의 설명＞<Description of the code | symbol about the principal part of drawing>

10: 메인 PCB 12, 32 : 실장면10: main PCB 12, 32: mounting surface

20 : 제 1 솔더크림 30 : 표면 실장형 PCB 모듈20: first solder cream 30: surface-mount PCB module

40 : 제 2 솔더크림40: second solder cream

상기와 같은 목적을 달성하기 위한 본 발명의 특징은, 메인 PCB에 인쇄된 제 1 솔더크림에 실장되는 표면 실장형 PCB 모듈에 있어서, 상기 PCB 모듈이, 상기 제 1 솔더크림에 대응하는 위치에 형성되는 실장면과, 상기 실장면의 하면에 위치하여 상기 실장면의 크기보다 작게 형성되는 제 2 솔더크림을 구비하며, 상기 제 2 솔더크림이 리플로우 솔더링시 상기 제 1 솔더크림과 결합하도록 구성된다.A feature of the present invention for achieving the above object is, in the surface-mount PCB module mounted on the first solder cream printed on the main PCB, the PCB module is formed at a position corresponding to the first solder cream And a second solder cream disposed on a lower surface of the mounting surface and formed to be smaller than the size of the mounting surface, wherein the second solder cream is coupled to the first solder cream during reflow soldering. .

따라서, 상기와 같이 구성된 본 발명에 따르면 PCB 모듈에 형성된 제 2 솔더크림과 메인 PCB에 형성된 제 1 솔더크림이 결합되어, 메인 PCB에 PCB 모듈을 실장시 솔더링 효과를 최대화시킬 수 있다.Therefore, according to the present invention configured as described above, the second solder cream formed on the PCB module and the first solder cream formed on the main PCB are combined to maximize the soldering effect when the PCB module is mounted on the main PCB.

이하, 본 발명에 따른 솔더크림이 인쇄된 표면 실장형 PCB 모듈의 구성 및 작용을 도 2 내지 도 4를 참조하여 상세하게 설명하기로 한다. 도 2 내지 도 4에 있어서 도 1과 동일한 구성요소에 대해서는 동일 부분에 대해서는 동일부호를 부여하여 그에 대한 설명을 생략한다.Hereinafter, the configuration and operation of the surface-mount PCB module printed with the solder cream according to the present invention will be described in detail with reference to FIGS. 2 to 4, the same components as in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

도 2는 본 발명에 따라 표면 실장형 PCB 모듈에 솔더크림이 인쇄된 상태를 나타낸 사시도이고, 도 3은 본 발명에 따라 표면 실장형 PCB 모듈의 솔더크림을 솔더링시킨 후의 형상을 나타낸 사시도이며, 도 4는 본 발명에 따라 솔더크림이 인쇄된 표면 실장형 PCB 모듈을 메인 PCB에 실장하는 모습을 나타낸 측단면도이다.Figure 2 is a perspective view showing a state where the solder cream is printed on the surface-mount PCB module according to the invention, Figure 3 is a perspective view showing the shape after soldering the solder cream of the surface-mount PCB module according to the invention, 4 is a side cross-sectional view showing a surface of a solder cream printed surface mounted PCB module mounted on the main PCB according to the present invention.

도 2 및 도 3을 보면, 먼저 제 2 솔더크림(40)은 솔더링 과정에서 메인 PCB(10)의 제 1 솔더크림(20)과 합쳐져 솔더링 효과를 최대화시키도록 소정 크기와 소정 두께를 가지고 표면 실장형 타입의 PCB 모듈(30)의 실장면(32)와 대응하는 메인 PCB(10)의 면에 인쇄된다. 여기서, 제 2 솔더크림(40)의 크기는 폭이 PCB 모듈(30)의 실장면(32)의 폭과 동일하고, 길이(L)가 실장면(32)의 2/3 이하이며, 소정 두께는 190~210㎛ 사이인 것이 바람직하다. 여기에서, 제 2 솔더크림(40)의 길이(L)가 PCB 모듈(30)의 실장면(32)의 길이의 2/3 이하인 이유는 제 2 솔더크림(40)의 길이가 실장면(32)의 길이의 2/3을 초과하는 경우 리플로우 솔더링 과정에서 솔더가 PCB 모듈(30)의 실장면(32) 끝단의 곡선부에 침투하여 동박이 손실되기 때문이다.2 and 3, first, the second solder cream 40 is surface-mounted to have a predetermined size and a predetermined thickness so as to be combined with the first solder cream 20 of the main PCB 10 in the soldering process to maximize the soldering effect. It is printed on the surface of the main PCB 10 corresponding to the mounting surface 32 of the PCB module 30 of the type. Here, the size of the second solder cream 40 is equal to the width of the mounting surface 32 of the PCB module 30, the length (L) is 2/3 or less of the mounting surface 32, the predetermined thickness It is preferable that it is between 190-210 micrometers. Here, the reason that the length L of the second solder cream 40 is 2/3 or less of the length of the mounting surface 32 of the PCB module 30 is because the length of the second solder cream 40 is the mounting surface 32. This is because, in the case of exceeding 2/3 of the length of), the solder penetrates the curved portion of the end of the mounting surface 32 of the PCB module 30 and loses the copper foil during the reflow soldering process.

이하, 본 발명에 의한 솔더크림이 인쇄된 표면 실장형 타입의 PCB 모듈의 작용을 도 2 내지 도 4를 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, the operation of the surface mount type PCB module printed with the solder cream according to the present invention will be described in detail with reference to FIGS. 2 to 4.

먼저, PCB 모듈(30)의 실장면(32)의 하면에 두께(T2) 210㎛를 가지는 제 2 솔더크림(40)을 도 2에 도시된 바와 같이 인쇄한다.First, a second solder cream 40 having a thickness T2 of 210 μm is printed on the bottom surface of the mounting surface 32 of the PCB module 30 as shown in FIG. 2.

이러한 상태에서 PCB 모듈(30)을 리플로우 솔더링 과정을 거치면, PCB 모듈(30)에 인쇄되어 있던 제 2 솔더크림(40)에 도 3에 도시된 바와 같이 굴곡부가 형성된다. 여기에서, 솔더의 굴곡부 두께(T3)는 150㎛ 정도로 된다.In this state, when the PCB module 30 undergoes a reflow soldering process, a bent portion is formed in the second solder cream 40 printed on the PCB module 30 as shown in FIG. 3. Here, the bend thickness T3 of the solder is about 150 µm.

이와같이, 메인 PCB(10)에 PCB 모듈(30)을 실장시키기 위하여 리플로우 솔더링 과정을 수행하여 제 1 솔더크림(20)과 제 2 솔더크림(40)이 용융된 상태에서 PCB 모듈(30)에 형성된 제 2 솔더크림(40)의 굴곡부가 메인 PCB(10)에 형성된 제 1 솔더크림(20)과 접촉하면 제 1 솔더크림(20)의 굴곡부가 약 50~100㎛ 눌려진 상태로 접합되어 안정된 결합 상태를 유지한다.As such, a reflow soldering process is performed to mount the PCB module 30 on the main PCB 10 to the PCB module 30 in a state in which the first solder cream 20 and the second solder cream 40 are melted. When the bent portion of the formed second solder cream 40 comes into contact with the first solder cream 20 formed on the main PCB 10, the bent portion of the first solder cream 20 is joined in a pressed state of about 50 to 100 μm, thereby ensuring stable bonding. Maintain state.

이상에서 설명한 바와 같이 본 발명에 의한 솔더크림이 인쇄된 표면 실장형 PCB 모듈에 의하면,As described above, according to the surface-mount PCB module printed with the solder cream according to the present invention,

PCB 모듈에 형성된 솔더크림의 굴곡부가 메인 PCB에 형성된 솔더크림에 고정되는 상태이기 때문에 PCB 모듈의 위치가 틀어지는 현상이 발생되어 불완전한 솔더링으로 냉땜 등의 공정 불량이 발생하는 것을 방지하여 솔더링 효과를 극대화시킬수 있게된다.Since the bent portion of the solder cream formed on the PCB module is fixed to the solder cream formed on the main PCB, the position of the PCB module may be distorted, thereby preventing the process defects such as cold soldering from incomplete soldering, thereby maximizing the soldering effect. Will be.

Claims (1)

메인 PCB에 인쇄된 제 1 솔더크림에 실장되는 표면 실장형 PCB 모듈에 있어서,In the surface-mount PCB module mounted on the first solder cream printed on the main PCB, 상기 PCB 모듈은,The PCB module, 상기 제 1 솔더크림에 대응하는 위치에 형성되는 실장면과,A mounting surface formed at a position corresponding to the first solder cream; 상기 실장면의 하면에 위치하여 상기 실장면의 크기보다 작게 형성되는 제 2 솔더크림을 구비하며,A second solder cream disposed on a lower surface of the mounting surface and smaller than the size of the mounting surface; 상기 제 2 솔더크림은 리플로우 솔더링시 상기 제 1 솔더크림과 결합하는 것을 특징으로 하는 표면 실장형 PCB 모듈.And the second solder cream is coupled to the first solder cream during reflow soldering.
KR1019990041739A 1999-09-29 1999-09-29 Surface mounting type pcb module KR20010029108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019990041739A KR20010029108A (en) 1999-09-29 1999-09-29 Surface mounting type pcb module

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Application Number Priority Date Filing Date Title
KR1019990041739A KR20010029108A (en) 1999-09-29 1999-09-29 Surface mounting type pcb module

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