CN209592016U - A kind of DIP pin device, encapsulating structure and plug-in and pull-off device - Google Patents
A kind of DIP pin device, encapsulating structure and plug-in and pull-off device Download PDFInfo
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- CN209592016U CN209592016U CN201822081204.9U CN201822081204U CN209592016U CN 209592016 U CN209592016 U CN 209592016U CN 201822081204 U CN201822081204 U CN 201822081204U CN 209592016 U CN209592016 U CN 209592016U
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- 238000003466 welding Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000009977 dual effect Effects 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The embodiment of the present application discloses a kind of DIP pin device, encapsulating structure and plug-in and pull-off device.The DIP pin device includes: DIP pin, limit convex closure and the first chamfering；Limit convex closure is located at the surface of DIP pin, and when DIP pin is inserted into PCB slot, limit convex closure is located in PCB slot；First chamfering is located at the surface of DIP pin, and is connected with the first side of limit convex closure, and when limit convex closure is located in the PCB slot, the side of limit convex closure towards the PCB slot is the first side for limiting convex closure.Reduce mobile range of the PCB pin in PCB slot, after DIP pin is inserted into PCB slot in local setting limit convex closure so as to improve the positioning accuracy of DIP pin.It also, is not in the problem of caused DIP pin does not enter the increase of hole probability, and the acceptance rate of production line declines in the prior art due to reducing H or increasing L.Moreover, the first chamfering has guiding correction effect, reduces DIP pin and limit the difficulty that convex closure enters PCB slot.
Description
Technical Field
The application relates to the technical field of electronic product manufacturing, in particular to a DIP pin device, a packaging structure and a plugging device.
Background
Currently, many electronic devices are provided with Dual Inline Package (DIP) pins, and the DIP pins can be mounted on a Printed Circuit Board (PCB) by Surface Mount Technology (SMT) or the like. Referring to the welding schematic diagram shown in fig. 1, a PCB slot is formed in a PCB, and when the DIP pin is mounted, the DIP pin is inserted into the PCB slot and is welded to the PCB by solder in the PCB slot. In fig. 1, the width of the PCB slot is H, and the width of the DIP pin is referred to as L.
However, when the gap (i.e., H-L) between the DIP pin and the PCB slot is too large, the DIP pin has a large range of motion in the PCB slot, which results in insufficient positioning accuracy of the DIP pin, and thus, the DIP pin may have problems of offset and torsion after soldering.
In order to solve the problem of insufficient positioning accuracy of the DIP pin, referring to the soldering diagrams shown in fig. 2(a) and fig. 2(b), a method of reducing the width H of the PCB slot or increasing the width L of the DIP pin is generally adopted in the prior art. When H is reduced or L is increased, the gap between the DIP pin and the PCB slotted hole is reduced, correspondingly, the moving range of the DIP pin in the PCB slotted hole is reduced, and therefore the positioning precision of the DIP pin is improved.
However, in the research process of the present application, the inventor finds that, in the two manners, since the width H of the PCB slot is reduced or the width L of the DIP pin is increased, the difficulty of the DIP pin entering the PCB slot is increased, the probability that the DIP pin does not enter the PCB slot (i.e., the hole missing probability) is increased, and further, the yield of the electronic product production line is even decreased. Through experiments, when the width L of the DIP pin is 0.15mm, and the width H of the PCB slotted hole is 0.45mm, the probability of no-access hole is increased by 139 parts per million (ppm) when H is reduced by 0.05mm, and the probability of no-access hole is increased by 441ppm when L is increased by 0.1 mm. That is, if the positioning accuracy of the DIP pin is improved by reducing the width H of the PCB slot or increasing the width L of the DIP pin, the hole missing probability of the DIP pin is increased, and even the yield of the electronic product production line is reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that DIP pin positioning accuracy is low among the prior art and in order to solve the problem that when improving the positioning accuracy of DIP pin through the mode that reduces H or increase L among the prior art, the hole probability that does not exist increases, the goodness rate of production line descends, this application embodiment discloses a dual in-line package DIP pin device, packaging structure and plug device.
In a first aspect, an embodiment of the present application provides a dual in-line package DIP pin device, including:
the dual in-line package (DIP) pin, the limiting convex hull and the first chamfer angle;
the limiting convex hull is positioned on the surface of the DIP pin, and when the DIP pin is inserted into a PCB slotted hole of a printed circuit board, the limiting convex hull is positioned in the PCB slotted hole;
the first chamfer is positioned on the surface of the DIP pin and connected with the first side of the limiting convex hull, and when the limiting convex hull is positioned in the PCB slotted hole, one side of the limiting convex hull, facing the PCB slotted hole, is the first side of the limiting convex hull.
The disclosed DIP pin device disclosed by the embodiment of the application is provided with the limiting convex hull locally, and after the DIP pin is inserted into the PCB slotted hole, the movable range of the PCB pin in the PCB slotted hole is reduced, so that the positioning precision of the DIP pin can be improved. In addition, the width H of the PCB slotted hole is not reduced, and the width L of the DIP pin is not increased, so that the problems that the probability of the DIP pin not entering the hole is increased and the excellent rate of a production line is reduced due to reduction of H or increase of L in the prior art can be solved. Furthermore, because the first chamfer is arranged on the surface of the DIP pin, and the DIP pin enters the PCB slotted hole in the process, the first chamfer enters the PCB slotted hole before the limiting convex packet, under the condition, the first chamfer is convenient for the DIP pin to enter the PCB slotted hole, has a certain guiding and deviation rectifying effect, and reduces the difficulty of the DIP pin and the limiting convex packet entering the PCB slotted hole.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the limiting convex hull is fixed on the surface of the DIP pin in a welded manner;
or the limiting convex hull and the DIP pin are of an integrated structure.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the material of the limiting convex hull and/or the first chamfer is the same as that of the DIP pin;
or,
the limiting convex hull and/or the first chamfer are/is made of metal.
With reference to the first aspect, in a third possible implementation manner of the first aspect, an angle range of an included angle between the first chamfer and the DIP pin is [120 °, 160 ° ];
an obtuse angle formed by a first target tangent line of the first chamfer and a plane of the DIP pin is an included angle between the first chamfer and the DIP pin, the first target tangent line is a tangent line passing through a first target point in all tangent lines of the first chamfer, and the first target point is a connection point of the first chamfer and the DIP pin.
With reference to the first aspect, in a fourth possible implementation manner of the first aspect, the method further includes:
a second chamfer;
the second chamfer is positioned on the surface of the DIP pin and connected with a second side of the limiting convex hull, and when the limiting convex hull is positioned in the PCB slotted hole, one side of the limiting convex hull, which is back to the PCB slotted hole, is the second side;
when the DIP pin is inserted into a PCB slotted hole of a printed circuit board, the second chamfer angle is positioned in the PCB slotted hole.
Through the second chamfer, can make the area of contact of DIP pin and the interior tin cream of PCB slotted hole further increase to can further increase the welding strength of DIP pin.
With reference to the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner of the first aspect,
the material of the second chamfer is the same as that of the DIP pin;
or,
the limiting convex hull and the second chamfer are made of metal.
With reference to the fourth possible implementation manner of the first aspect, in a sixth possible implementation manner of the first aspect,
the angle range of an included angle between the second chamfer and the DIP pin is [120 degrees ] and [ 160 degrees ];
an obtuse angle formed by a second target tangent line of the second chamfer and a plane of the DIP pin is an included angle between the second chamfer and the DIP pin, the second target tangent line is a tangent line passing through a second target point in all tangent lines of the second chamfer, and the second target point is a connection point of the second chamfer and the DIP pin.
In a second aspect, an embodiment of the present application provides a package structure, including:
the DIP pin device of the first aspect, and a PCB board having a PCB slot;
the DIP pin device is positioned in the PCB slotted hole and is fixed on the PCB through solder paste in the PCB slotted hole.
In a third aspect, an embodiment of the present application provides a plugging device, including:
the DIP pin device of the first aspect.
With reference to the third aspect, in a first possible implementation manner of the third aspect, the plug-in device is a SIM card socket, an earphone socket, or a universal serial bus USB connector.
The embodiment of the application discloses DIP pin device, packaging structure and plug device, wherein, this DIP pin device has set up spacing convex closure in part, after the DIP pin inserts the PCB slotted hole, has reduced the movable range of PCB pin in the PCB slotted hole to can improve the positioning accuracy of DIP pin. In addition, the width H of the PCB slotted hole is not reduced, and the width L of the DIP pin is not increased, so that the problems that the probability of the DIP pin not entering the hole is increased and the excellent rate of a production line is reduced due to reduction of H or increase of L in the prior art can be solved. Furthermore, because the first chamfer is arranged on the surface of the DIP pin, and the DIP pin enters the PCB slotted hole in the process, the first chamfer enters the PCB slotted hole before the limiting convex packet, under the condition, the first chamfer is convenient for the DIP pin to enter the PCB slotted hole, has a certain guiding and deviation rectifying effect, and reduces the difficulty of the DIP pin and the limiting convex packet entering the PCB slotted hole.
In addition, if the scheme of reducing the width H of the PCB slot in the prior art is adopted, the specification of the PCB needs to be adjusted, and the PCB with a smaller H is manufactured again. Moreover, the smaller the H, the higher the required processing precision of the PCB, and in this case, a milling cutter with a special size is often required to process the PCB to meet the requirement. In addition, the rejection rate of the PCB in the production process is increased, so that the manufacturing cost of the PCB is increased. Through a plurality of tests, the width of the PCB slotted hole is reduced from 0.45mm to 0.4mm, so that the manufacturing cost of the PCB board is increased by 0.1-0.3 RMB/PCS. Moreover, because the width of the PCB slot is reduced, the volume of the soldering tin contained in the PCB slot is reduced, namely, the soldering tin quantity is less, and the soldering strength of the DIP pin is reduced.
The DIP pin device disclosed by the embodiment of the application does not need to adjust the specification of the PCB, so that the PCB with smaller H does not need to be manufactured again, and the manufacturing cost of the PCB is not additionally increased. And, because the width of PCB slotted hole does not reduce, can not influence the soldering tin volume that the PCB slotted hole can hold, consequently, can not appear by the problem that the soldering tin reduces the welding strength reduction of DIP pin that leads to.
In addition, if the scheme of increasing the width L of the DIP pin in the prior art is adopted, the material consumption of the DIP pin is increased due to the increase of the width of the DIP pin, the weight of the DIP pin is increased, the weight of the electronic equipment using the DIP pin is increased, and the weight of the electronic equipment with more DIP pins is increased more obviously, so that the miniaturization and the light weight of the electronic equipment are not facilitated.
The DIP pin device disclosed in the embodiment of the application is provided with the limiting convex hull and the first chamfer angle on the DIP pin, but has smaller influence on the weight of the DIP pin compared with the scheme of increasing the width L of the DIP pin, so that the DIP pin device is more beneficial to the miniaturization and the light weight of electronic equipment.
And, in the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device passes through the PCB slotted hole and welds on the PCB board, because be provided with spacing convex closure and first chamfer on the surface of DIP pin, for the DIP pin, increased with the contact area of the tin cream in the PCB slotted hole, spacing convex closure and first chamfer play the nail wedge effect, consequently the DIP pin is when the atress, be difficult for following the stripping off on the PCB board, therefore can also increase the welding strength of DIP pin.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic diagram illustrating a soldering of a DIP pin according to the prior art;
fig. 2(a) is a schematic diagram of soldering of another DIP pin disclosed in the prior art;
fig. 2(b) is a schematic diagram of soldering of another DIP pin disclosed in the prior art;
fig. 3(a) is a front view of a DIP pin device as disclosed in an embodiment of the present application;
fig. 3(b) is a top view of a DIP pin device disclosed in an embodiment of the present application;
fig. 3(c) is a right side view of a DIP pin device disclosed in an embodiment of the present application;
fig. 4(a) is a front view of a soldering condition of a DIP pin device disclosed in an embodiment of the present application;
fig. 4(b) is a right side view of a soldering condition of a DIP pin device disclosed in an embodiment of the present application;
fig. 5 is a right side view of a soldering condition of a DIP pin device disclosed in an embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a package structure according to an embodiment of the disclosure;
fig. 7 is a schematic structural diagram of a plugging device disclosed in the embodiment of the present application.
Detailed Description
In order to solve the problem that DIP pin positioning accuracy is low among the prior art and in order to solve the problem that when improving the positioning accuracy of DIP pin through the mode that reduces H or increase L among the prior art, the hole probability that does not exist increases, the goodness rate of production line descends, this application embodiment discloses a dual in-line package DIP pin device, packaging structure and plug device.
A first embodiment of the present application discloses a dual in-line package DIP pin device, referring to front, top and right views of the DIP pin device shown in fig. 3(a), 3(b) and 3(c), respectively, the DIP pin device comprising: DIP pin 10, limit bump 20 and first chamfer 30.
Wherein, the limit convex hull 20 is located on the surface of the DIP pin 10.
Referring to the front view and the right view of the soldering condition shown in fig. 4(a) and 4(b), respectively, when the DIP pin 10 is inserted into a PCB slot of a printed circuit board, the position-limiting convex hull 20 is located in the PCB slot.
In addition, the first chamfer 30 is located on the surface of the DIP pin and connected to the first side 21 of the limiting convex hull 20, and when the limiting convex hull 20 is located in the PCB slot, the side of the limiting convex hull 20 facing the PCB slot is the first side of the limiting convex hull 20.
That is, the first chamfer 30 is disposed at a side of the limiting convex hull 20 extending into the PCB slot. The first chamfer 30 is connected with the first side 21 of the limiting convex hull 20, in this case, the first chamfer 30 and the limiting convex hull 20 may be of an integrated structure, that is, the first chamfer 30 and the limiting convex hull 20 are integrated, or the first chamfer 30 and the limiting convex hull 20 may also be two independent parts, and the two parts may be fixedly connected together by welding or gluing.
In the DIP pin device disclosed in the embodiment of the present application, when the DIP pin 10 is inserted into the PCB slot, the limiting convex hull 20 is located in the PCB slot, and the first chamfer 30 is connected to the first side 21 of the limiting convex hull 20, so that when the DIP pin 10 is inserted into the PCB slot, the first chamfer 30 and the limiting convex hull 20 are both located in the PCB slot. In addition, in the process of welding the DIP pin device disclosed in the embodiment of the present application to the PCB, the first chamfer 30 enters the PCB slot hole along with the DIP pin 10, and then the limiting convex hull 20 enters the PCB slot hole along with the DIP pin 10.
In addition, as shown in fig. 3(a), 3(b) and 3(c), the side of the limiting convex hull 20 may be arranged in an arc shape, thereby facilitating the DIP pin device to enter into the PCB slot.
The DIP pin device disclosed by the first embodiment of the application is locally provided with the limiting convex hull, and after the DIP pin is inserted into the PCB slotted hole, the movable range of the PCB pin in the PCB slotted hole is reduced, so that the positioning precision of the DIP pin can be improved. In addition, the width H of the PCB slotted hole is not reduced, and the width L of the DIP pin is not increased, so that the problems that the probability of the DIP pin not entering the hole is increased and the excellent rate of a production line is reduced due to reduction of H or increase of L in the prior art can be solved. Furthermore, because the first chamfer is arranged on the surface of the DIP pin, and the DIP pin enters the PCB slotted hole in the process, the first chamfer enters the PCB slotted hole before the limiting convex packet, under the condition, the first chamfer is convenient for the DIP pin to enter the PCB slotted hole, has a certain guiding and deviation rectifying effect, and reduces the difficulty of the DIP pin and the limiting convex packet entering the PCB slotted hole.
In addition, if the scheme of reducing the width H of the PCB slot in the prior art is adopted, the specification of the PCB needs to be adjusted, and the PCB with a smaller H is manufactured again. Moreover, the smaller the H, the higher the required processing precision of the PCB, and in this case, a milling cutter with a special size is often required to process the PCB to meet the requirement. In addition, the rejection rate of the PCB in the production process is increased, so that the manufacturing cost of the PCB is increased. Through a plurality of tests, the width of the PCB slotted hole is reduced from 0.45mm to 0.4mm, so that the manufacturing cost of the PCB board is increased by 0.1-0.3 RMB/PCS. Moreover, because the width of the PCB slot is reduced, the volume of the soldering tin contained in the PCB slot is reduced, namely, the soldering tin quantity is less, and the soldering strength of the DIP pin is reduced.
The DIP pin device disclosed by the embodiment of the application does not need to adjust the specification of the PCB, so that the PCB with smaller H does not need to be manufactured again, and the manufacturing cost of the PCB is not additionally increased. And, because the width of PCB slotted hole does not reduce, can not influence the soldering tin volume that the PCB slotted hole can hold, consequently, can not appear by the problem that the soldering tin reduces the welding strength reduction of DIP pin that leads to.
In addition, if the scheme of increasing the width L of the DIP pin in the prior art is adopted, the material consumption of the DIP pin is increased due to the increase of the width of the DIP pin, the weight of the DIP pin is increased, the weight of the electronic equipment using the DIP pin is increased, and the weight of the electronic equipment with more DIP pins is increased more obviously, so that the miniaturization and the light weight of the electronic equipment are not facilitated.
The DIP pin device disclosed in the embodiment of the application is provided with the limiting convex hull and the first chamfer angle on the DIP pin, but has smaller influence on the weight of the DIP pin compared with the scheme of increasing the width L of the DIP pin, so that the DIP pin device is more beneficial to the miniaturization and the light weight of electronic equipment.
And, in the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device passes through the PCB slotted hole and welds on the PCB board, because be provided with spacing convex closure and first chamfer on the surface of DIP pin, for the DIP pin, increased with the contact area of the tin cream in the PCB slotted hole, spacing convex closure and first chamfer play the nail wedge effect, consequently the DIP pin is when the atress, be difficult for following the stripping off on the PCB board, therefore can also increase the welding strength of DIP pin.
Further, in the DIP pin device disclosed in the embodiment of the present application, the limiting convex hull may be fixed on the surface of the DIP pin in various ways. In one mode, the limiting convex hull is fixed on the surface of the DIP pin in a welding mode. Or, the limiting convex hull and the DIP pin are of an integrated structure, and in this case, the limiting convex hull may be punched out of the DIP pin.
In addition, the limiting convex hulls can be fixed on the surfaces of the DIP pins in a gluing mode and the like, and the limiting convex hulls are not limited in the embodiment of the application.
Accordingly, the first chamfer may be fixed on the surface of the DIP pin in various ways. For example, the first chamfer may be fixed on the surface of the DIP pin by welding, or the first chamfer may be integrated with the DIP pin. In addition, the first chamfer can also be fixed on the surface of the DIP pin by gluing or the like, which is not limited in the embodiment of the application.
In addition, the material of the limiting convex hull and/or the first chamfer angle can be of various types. For example, the material of the limiting convex hull and/or the first chamfer is the same as that of the DIP pin. Or, in another feasible manner, the limiting convex hull and/or the first chamfer are made of a metal material. For example, the metal material is cupronickel or stainless steel.
Further, in the DIP pin device disclosed in the embodiment of the present application, an angle range of an angle between the first chamfer and the DIP pin is [120 °, 160 ° ].
An obtuse angle formed by a first target tangent line of the first chamfer and a plane of the DIP pin is an included angle between the first chamfer and the DIP pin, the first target tangent line is a tangent line passing through a first target point in all tangent lines of the first chamfer, and the first target point is a connection point of the first chamfer and the DIP pin.
Referring to the right side view of the soldering condition shown in fig. 5, in the figure, the connection point of the first chamfer and the DIP pin is point a, that is, point a is the first target point. The first chamfer often corresponds to a plurality of tangent lines, wherein a tangent line passing through the point a in each tangent line is a first target tangent line, and an obtuse angle theta formed by the first target tangent line and a plane where the DIP pin is located is an included angle between the first chamfer and the DIP pin.
If the included angle theta between first chamfer and the DIP pin is too big, then the DIP pin is pressed close to spacing convex closure more, and the thickness of spacing convex closure is less, then the disclosed DIP pin device of this application embodiment is inclined to the DIP pin among the prior art more, and under this condition, the spacing effect of first chamfer is relatively poor. In addition, if the included angle theta between the first chamfer and the DIP pin is too small, the limiting convex hull is more prominent relative to the DIP pin and is easily interfered by the hole wall of the PCB slotted hole, and under the condition, the guiding effect of the first chamfer is smaller. Therefore, in the embodiment of the present application, 120 ° ≦ θ ≦ 160 ° is generally set, i.e., the angle θ between the first chamfer and the DIP pin may be set to any value between 120 ° and 160 °. For example, the angle θ between the first chamfer and the DIP pin may be set to 120 °, or the angle θ between the first chamfer and the DIP pin may be set to 160 °, or the angle θ between the first chamfer and the DIP pin may be set to an intermediate value (i.e., 140 °) between 120 ° and 160 °.
Further, in the DIP pin device disclosed in the embodiment of the present application, the DIP pin device further includes: a second chamfer 40.
The second chamfer 40 is located on the surface of the DIP pin 10 and connected to a second side of the limiting convex hull 20, and when the limiting convex hull 20 is located in the PCB slot, a side of the limiting convex hull 20 facing away from the PCB slot is a second side;
when the DIP pin 10 is inserted into a PCB slot of a printed circuit board, the second chamfer 40 is located within the PCB slot.
That is, referring to fig. 4(a) and 4(b), when the DIP pin is inserted into the PCB slot, the second chamfer is located above the first chamfer and the DIP pin. In this case, the second chamfer further increases the contact area with the solder paste in the PCB slot, thereby further increasing the soldering strength of the DIP pin.
The second chamfer and the limiting convex hull can be of an integrated structure, or the second angle and the limiting convex hull can also be of two independent structures.
In addition, the second chamfer can be fixed on the surface of the DIP pin in various ways. For example, the second chamfer may be fixed on the surface of the DIP pin by welding, or the limiting convex hull and the DIP pin are of an integral structure, in which case, the limiting convex hull may be punched out of the DIP pin.
In addition, the second chamfer angle can be fixed on the surface of the DIP pin by means of gluing and the like. The embodiments of the present application do not limit this.
The second chamfer can be made of various materials. For example, the second chamfer is made of the same material as the DIP pin. Or the second chamfer is made of metal. For example, the metal material is cupronickel or stainless steel.
Further, in the DIP pin device disclosed in the embodiment of the present application, an angle range of an angle between the second chamfer and the DIP pin is [120 °, 160 ° ].
An obtuse angle formed by a second target tangent line of the second chamfer and a plane of the DIP pin is an included angle between the second chamfer and the DIP pin, the second target tangent line is a tangent line passing through a second target point in all tangent lines of the second chamfer, and the second target point is a connection point of the second chamfer and the DIP pin.
A package structure according to a second embodiment of the present application, referring to a schematic cross-sectional view of the package structure shown in fig. 6, includes the DIP pin device 100 disclosed in the first embodiment of the present application, and further includes a PCB board 200 provided with a PCB slot 210.
In this package structure, the DIP pin device 100 is located in the PCB slot 210 and is fixed on the PCB 200 by the solder paste in the PCB slot 210.
In a third embodiment of the present application, a plugging device is further disclosed, which includes the DIP pin device disclosed in the first embodiment of the present application.
The plug-in device is a subscriber identity module SIM card seat, an earphone seat or a universal serial bus USB connector. Of course, the plugging device may also be another device having a DIP pin, which is not limited in the embodiment of the present application.
If the plugging device is a SIM card socket, the schematic structural diagram is shown in fig. 6, where fig. 6 is a schematic diagram of the SIM card socket, and a circled portion in the diagram includes the DIP pin device disclosed in the embodiment of the present application.
In the SIM card holder in the prior art, according to the conventional design in the industry, the DIP pin width L is usually 0.15mm, and the PCB slot width H is usually 0.45 mm. Multiple tests show that after the DIP pins in the SIM card holder are welded, the movable range of the DIP pins in a PCB slot hole is too large, the problem that 8.9% of card supports are inserted and pulled to be high is caused approximately, and the inserting and pulling height of the SIM card holder in normal volume production needs to be lower than 3%, namely, the problem that the SIM card holder in the prior art is insufficient in positioning accuracy.
The SIM card seat disclosed by the embodiment of the application is provided with the DIP pin device, namely, the surface of the DIP pin is provided with the limiting convex hull and the first chamfer, and in addition, the second chamfer can be further arranged, so that the movable range of the DIP pin in the PCB slot hole is reduced, and the positioning precision of the SIM card seat is improved.
Wherein, in the SIM card holder, the width of the limiting convex hull is usually 0.05 mm. Under the condition, through a plurality of tests, the card support plugging and unplugging floating high defective rate of the SIM card seat disclosed by the embodiment of the application is reduced to 1.2% from 8.9%, so that the normal quality standard of production can be met.
Furthermore, in the SIM cassette disclosed in the embodiment of the application, the first chamfer can play a guiding role, the probability of no-access hole is lower than 100mm, and is equivalent to the conventional design, and compared with the scheme of reducing the width of PCB slot hole and increasing the width of DIP pin in the prior art, the probability of no-access hole is reduced. In addition, the limiting convex hull and the first chamfer angle not only play a role of 'nail wedge', but also increase the contact area with solder paste in a PCB slot hole, and the second chamfer angle also can increase the contact area with the solder paste, so that the welding strength of the SIM card seat is increased.
In order to clarify the advantages of the present application, the SIM card holder was tested several times, and the following scheme comparison table was obtained. In the table, in the SIM card holder in the original scheme, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.15mm, the card-insertion floating probability is 8.9%, the hole-missing probability is 5ppm, and the cost of the PCB board is set to a. In addition, in the scheme 2, a method for reducing the width of the PCB slot is adopted, in this case, the width of the PCB slot is 0.40mm, the width of the DIP pin is 0.15mm, the card-insertion floating probability is 7.1%, the hole-not-entering probability is 139ppm, and the cost of the PCB is a + 0.1-0.3 yuan/PCS, that is, although the SIM card holder of the scheme improves the positioning accuracy, the cost of the PCB is increased, the welding difficulty is increased, and because the width of the PCB slot is reduced, the solder paste in the PCB slot is correspondingly reduced, thereby reducing the welding strength. In addition, in the scheme 3, a method of increasing the width of the DIP pin is adopted, in this case, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.25mm, the card-insertion floating probability is 1.2%, the hole-missing probability is 441ppm, and the cost of the PCB board is a, that is, although the SIM card holder of the scheme improves the positioning accuracy, the welding difficulty is increased, and the weight of the DIP pin is increased, thereby increasing the weight of the SIM card holder. Scheme 4 adopts the scheme disclosed by the embodiment of the application, namely, the scheme of limiting through a convex hull is adopted, in this case, the width of a PCB slotted hole is 0.45mm, the width of a DIP pin is 0.15mm, the surface of the DIP pin is provided with the limiting convex hull with the width of 0.05mm, the probability of floating of a plug-in card is 1.2%, the probability of not entering the hole is less than 100ppm, and the cost of the PCB is A, therefore, the SIM card seat of the scheme not only improves the positioning precision, but also does not increase the cost of the PCB, compared with the scheme 2 and the scheme 3, the welding difficulty is reduced, the width of the whole DIP pin is increased by the scheme 3, and the scheme 4 only increases the limiting convex hull and at least one chamfer angle at the local part of the DIP pin, therefore, the scheme has little influence on the weight of the SIM card seat. Further, because spacing convex closure and first chamfer not only play "nail wedge effect", still increased with the area of contact of the solder paste in the PCB slotted hole to and the second chamfer also can increase with the area of contact of solder paste, consequently scheme 4 can also increase the welding strength of SIM cassette.
TABLE 1 comparison of DIP pin design schemes for various card seats
According to the above table, the scheme disclosed in the embodiment of the present application significantly improves the positioning accuracy and reduces the floating probability of the card from 8.9% to 1.2% to meet the requirement of mass production, compared with the original scheme (i.e., scheme 1). Moreover, compared with the scheme (namely scheme 2) for reducing the width of the PCB slotted hole, the scheme disclosed by the embodiment of the application has the advantages that the cost of the PCB is low by 0.1-0.3RMB/PCS, the positioning and positioning accuracy is higher, the welding processing difficulty is small, and the welding strength is high. For the scheme that increases DIP pin width, this scheme welding degree of difficulty is lower, and the weight of device is littleer, does benefit to the development of light-dutyization.
It should be understood that, in the various embodiments of the present application, the size of the serial number of each process does not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
All parts of the specification are described in a progressive mode, the same and similar parts of all embodiments can be referred to each other, and each embodiment is mainly introduced to be different from other embodiments. In particular, as to the apparatus and system embodiments, since they are substantially similar to the method embodiments, the description is relatively simple and reference may be made to the description of the method embodiments in relevant places.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
Claims (10)
1. A DIP pin device, comprising:
the dual in-line package (DIP) pin, the limiting convex hull and the first chamfer angle;
the limiting convex hull is positioned on the surface of the DIP pin, and when the DIP pin is inserted into a PCB slotted hole of a printed circuit board, the limiting convex hull is positioned in the PCB slotted hole;
the first chamfer is positioned on the surface of the DIP pin and connected with the first side of the limiting convex hull, and when the limiting convex hull is positioned in the PCB slotted hole, one side of the limiting convex hull, facing the PCB slotted hole, is the first side of the limiting convex hull.
2. The DIP pin device of claim 1,
the limiting convex hull is fixed on the surface of the DIP pin in a welding mode;
or,
the limiting convex hull and the DIP pin are of an integrated structure.
3. The DIP pin device of claim 1,
the material of the limiting convex hull and/or the first chamfer is the same as that of the DIP pin;
or,
the limiting convex hull and/or the first chamfer are/is made of metal.
4. The DIP pin device of claim 1,
the angle range of an included angle between the first chamfer and the DIP pin is [120 degrees ] and [ 160 degrees ];
an obtuse angle formed by a first target tangent line of the first chamfer and a plane of the DIP pin is an included angle between the first chamfer and the DIP pin, the first target tangent line is a tangent line passing through a first target point in all tangent lines of the first chamfer, and the first target point is a connection point of the first chamfer and the DIP pin.
5. The DIP pin device of claim 1, further comprising:
a second chamfer;
the second chamfer is positioned on the surface of the DIP pin and connected with a second side of the limiting convex hull, and when the limiting convex hull is positioned in the PCB slotted hole, one side of the limiting convex hull, which is back to the PCB slotted hole, is the second side;
when the DIP pin is inserted into a PCB slotted hole of a printed circuit board, the second chamfer angle is positioned in the PCB slotted hole.
6. The DIP pin device of claim 5,
the material of the second chamfer is the same as that of the DIP pin;
or,
the limiting convex hull and the second chamfer are made of metal.
7. The DIP pin device of claim 5,
the angle range of an included angle between the second chamfer and the DIP pin is [120 degrees ] and [ 160 degrees ];
an obtuse angle formed by a second target tangent line of the second chamfer and a plane of the DIP pin is an included angle between the second chamfer and the DIP pin, the second target tangent line is a tangent line passing through a second target point in all tangent lines of the second chamfer, and the second target point is a connection point of the second chamfer and the DIP pin.
8. A package structure, comprising:
the DIP pin device of any of claims 1 to 7, and a PCB board provided with PCB slots;
the DIP pin device is positioned in the PCB slotted hole and is fixed on the PCB through solder paste in the PCB slotted hole.
9. A plugging device, comprising:
the DIP pin device of any of claims 1 to 7.
10. The plugging device according to claim 9,
the plug-in device is a subscriber identity module SIM card seat, an earphone seat or a universal serial bus USB connector.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822081204.9U CN209592016U (en) | 2018-12-12 | 2018-12-12 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
| CN201980080401.3A CN113678575A (en) | 2018-12-12 | 2019-11-30 | DIP pin device, packaging structure and plugging device |
| PCT/CN2019/122228 WO2020119488A1 (en) | 2018-12-12 | 2019-11-30 | Dip pin device, package structure, and pluggable device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822081204.9U CN209592016U (en) | 2018-12-12 | 2018-12-12 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209592016U true CN209592016U (en) | 2019-11-05 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822081204.9U Expired - Fee Related CN209592016U (en) | 2018-12-12 | 2018-12-12 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
| CN201980080401.3A Pending CN113678575A (en) | 2018-12-12 | 2019-11-30 | DIP pin device, packaging structure and plugging device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980080401.3A Pending CN113678575A (en) | 2018-12-12 | 2019-11-30 | DIP pin device, packaging structure and plugging device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN209592016U (en) |
| WO (1) | WO2020119488A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020119488A1 (en) * | 2018-12-12 | 2020-06-18 | 华为技术有限公司 | Dip pin device, package structure, and pluggable device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
| CN102883549A (en) * | 2011-07-15 | 2013-01-16 | 台达电子企业管理（上海）有限公司 | Circuit board with heat collection structure and manufacturing method for circuit board |
| CN103166026A (en) * | 2011-12-08 | 2013-06-19 | 贵州航天电器股份有限公司 | Elastic contact-pin contact part |
| CN106332449B (en) * | 2016-08-31 | 2019-03-05 | 安徽赛福电子有限公司 | A kind of electronic component pin |
| JP6793342B2 (en) * | 2017-03-24 | 2020-12-02 | パナソニックＩｐマネジメント株式会社 | Electronic circuit unit and electrical equipment |
| CN209592016U (en) * | 2018-12-12 | 2019-11-05 | 华为技术有限公司 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
-
2018
- 2018-12-12 CN CN201822081204.9U patent/CN209592016U/en not_active Expired - Fee Related
-
2019
- 2019-11-30 WO PCT/CN2019/122228 patent/WO2020119488A1/en active Application Filing
- 2019-11-30 CN CN201980080401.3A patent/CN113678575A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020119488A1 (en) * | 2018-12-12 | 2020-06-18 | 华为技术有限公司 | Dip pin device, package structure, and pluggable device |
| CN113678575A (en) * | 2018-12-12 | 2021-11-19 | 华为技术有限公司 | DIP pin device, packaging structure and plugging device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113678575A (en) | 2021-11-19 |
| WO2020119488A1 (en) | 2020-06-18 |
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