WO2020119488A1

WO2020119488A1 - Dip pin device, package structure, and pluggable device

Info

Publication number: WO2020119488A1
Application number: PCT/CN2019/122228
Authority: WO
Inventors: 杨俊杰; 王飞; 宋旭光; 潘华强; 刘鹏
Original assignee: 华为技术有限公司
Priority date: 2018-12-12
Filing date: 2019-11-30
Publication date: 2020-06-18
Also published as: CN209592016U; CN113678575A

Abstract

Disclosed are a DIP pin device, a package structure, and a pluggable device. The DIP pin device comprises: a DIP pin, a limiting bulge, and a first chamfer, wherein the limiting bulge is located on the surface of the DIP pin, when the DIP pin is plugged into a PCB slot hole, the limiting bulge is located in the PCB slot hole; the first chamfer is located on the surface of the DIP pin, and is connected with a first side of the limiting bulge, and when the limiting bulge is located in the PCB slot hole, the side, facing the PCB slot hole, of the limiting bulge is the first side of the limiting bulge. The limiting bulge is arranged in the local portion, and after the DIP pin is plugged into the PCB slot hole, the movable range of the DIP pin in the PCB slot hole is narrowed, and thereby improving the positioning precision of the DIP pin. Furthermore, the problems that in the prior art, due to the fact that H is reduced or L is increased, the probability that a DIP pin cannot be plugged into a hole is increased, and the qualification rate of a production line is reduced are solved. Moreover, the first chamfer has guide and deviation correction effects, so that the difficulty of entering the PCB slot hole for the DIP pin and the limiting bulge is reduced.

Description

DIP pin device, packaging structure and plug-in device

This application requires the priority of the Chinese patent application submitted to the State Intellectual Property Office of China on December 12, 2018, with the application number 201822081204.9 and the invention titled "a DIP pin device, packaging structure and plug-in device", all of which are The content is incorporated into this application by reference.

Technical field

This application relates to the technical field of electronic product manufacturing, in particular to a DIP pin device, a packaging structure, and a plug-in device.

Background technique

At present, many electronic devices are equipped with dual in-line package (DIP) pins. DIP pins can be mounted on the printed circuit board through surface mounting technology (SMT) and other methods (printed circuit board, PCB). Among them, referring to the soldering schematic diagram shown in FIG. 1, a PCB slot is provided on the PCB board, when installing the DIP pin, the DIP pin is inserted into the PCB slot, and the DIP pin is inserted through the solder in the PCB slot Solder together with PCB board. In Figure 1, the width of the PCB slot is H, and the width of the DIP pin is called L.

However, when the gap between the DIP pin and the PCB slot (ie, HL) is too large, the DIP pin has a large range of movement in the PCB slot, resulting in insufficient positioning accuracy of the DIP pin. Therefore, the DIP pin is After welding, problems such as offset and twisting may occur.

In order to solve the problem of insufficient positioning accuracy of DIP pins, please refer to the welding schematic diagrams shown in FIG. 2(a) and FIG. 2(b). In the prior art, the width H of the PCB slot is usually reduced, or the DIP lead is increased. The method of foot width L. When H decreases or L increases, the gap between the DIP pin and the PCB slot decreases. Correspondingly, the movement range of the DIP pin in the PCB slot becomes smaller, thereby improving the positioning accuracy of the DIP pin.

However, the inventor found in the research process of this application that the above two methods reduce the width H of the PCB slot or increase the width L of the DIP pin, which makes it more difficult for the DIP pin to enter the PCB slot, The probability that the DIP pin does not enter the PCB slot (that is, the probability of not entering the hole) increases, which further leads to a decline in the excellent rate of the electronic product production line. After testing, it was found that when the width L of the DIP pin is 0.15mm and the width H of the PCB slot is 0.45mm, the probability of not entering the hole increases by parts per million (ppm) when H decreases by 0.05mm 139, and every time L increases by 0.1mm, the probability of not entering the hole increases by 441ppm. That is to say, if the method of reducing the width H of the PCB slot or increasing the width L of the DIP pin improves the positioning accuracy of the DIP pin, it will increase the probability of the DIP pin not entering the hole, and even reduce the production line of the electronic product. Excellent rate.

Utility model content

In order to solve the problem of low positioning accuracy of the DIP pin in the prior art, and to solve the problem of improving the positioning accuracy of the DIP pin by reducing H or increasing L in the prior art, the probability of existing non-intrusive holes increases In order to reduce the excellent rate of the production line, the embodiments of the present application disclose a dual in-line package DIP pin device, a package structure, and a plug-in device.

In a first aspect, an embodiment of the present application provides a dual in-line package DIP pin device, including:

DIP pin, limit convex hull and first chamfer;

The limit convex hull is located on the surface of the DIP pin, and when the DIP pin is inserted into the PCB slot of the printed circuit board, the limit convex hull is located in the PCB slot;

The first chamfer is located on the surface of the DIP pin and is connected to the first side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing the PCB slot is the first side of the limiting convex hull.

The disclosed DIP pin device disclosed in the embodiment of the present application partially sets a limit convex hull. When the DIP pin is inserted into the PCB slot, the movable range of the PCB pin in the PCB slot is reduced, which can improve the DIP pin positioning accuracy. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.

With reference to the first aspect, in a first possible implementation manner of the first aspect, the limiting convex hull is fixed on the surface of the DIP pin in the form of welding;

Alternatively, the limit convex hull and the DIP pin are of an integrated structure.

With reference to the first aspect, in a second possible implementation manner of the first aspect, the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin;

or,

The material of the limiting convex hull and/or the first chamfer is a metal material.

With reference to the first aspect, in a third possible implementation manner of the first aspect, the angle range between the first chamfer and the DIP pin is [120°, 160°];

The obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.

With reference to the first aspect, in a fourth possible implementation manner of the first aspect, the method further includes:

Second chamfer

The second chamfer is located on the surface of the DIP pin and is connected to the second side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing away from the PCB slot is the second side;

When the DIP pin is inserted into the PCB slot of the printed circuit board, the second chamfer is located in the PCB slot.

Through the second chamfer, the contact area between the DIP pin and the solder paste in the PCB slot can be further increased, so that the soldering strength of the DIP pin can be further increased.

With reference to the fourth possible implementation manner of the first aspect, in the fifth possible implementation manner of the first aspect,

The material of the second chamfer is the same as the material of the DIP pin;

or,

The materials of the limiting convex hull and the second chamfer are metal materials.

With reference to the fourth possible implementation manner of the first aspect, in the sixth possible implementation manner of the first aspect,

The angle range between the second chamfer and the DIP pin is [120°, 160°];

Where, the obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin, and the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point, and the second target point is a connection point of the second chamfer and the DIP pin.

In a second aspect, an embodiment of the present application provides a packaging structure, including:

A DIP pin device as described in the first aspect, and a PCB board provided with PCB slots;

The DIP pin device is located in the PCB slot, and is fixed on the PCB board by the solder paste in the PCB slot.

In a third aspect, an embodiment of the present application provides a plug-in device, including:

The DIP pin device as described in the first aspect.

With reference to the third aspect, in a first possible implementation manner of the third aspect, the plug-in device is a user identity module SIM card holder, a headset holder, or a universal serial bus USB connector.

The embodiments of the present application disclose a DIP pin device, a packaging structure, and a plug-in device, wherein the DIP pin device is partially provided with a limiting convex hull, and when the DIP pin is inserted into the PCB slot, the PCB pin is reduced The movable range in the PCB slot hole can improve the positioning accuracy of the DIP pin. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.

In addition, if the solution of reducing the width H of the PCB slot in the prior art is adopted, it is necessary to adjust the specifications of the PCB board and re-make the PCB board with a smaller H. Moreover, the smaller H is, the higher the processing accuracy of the required PCB board. In this case, a special size milling cutter is often required to obtain a PCB board that meets the needs. In addition, the scrap rate in the production process of the PCB board will be increased, thereby increasing the production cost of the PCB board. After many tests, it was found that if the width of the PCB slot is reduced from 0.45mm to 0.4mm, the manufacturing cost of the PCB board will increase by 0.1-0.3RMB/PCS. Moreover, because the width of the PCB slot is reduced, the volume of solder that the PCB slot can accommodate is reduced, that is, the amount of solder is less, which will reduce the soldering strength of the DIP pin.

The DIP pin devices disclosed in the embodiments of the present application do not need to adjust the specifications of the PCB board, so there is no need to re-produce the PCB board with a smaller H, and the manufacturing cost of the PCB board will not be additionally increased. In addition, since the width of the PCB slot is not reduced, it will not affect the amount of solder that the PCB slot can accommodate. Therefore, the problem of reduced soldering strength of the DIP pin caused by the reduction in solder will not occur.

In addition, if the solution of increasing the width D of the DIP pin in the prior art is adopted, as the width of the DIP pin increases, the materials used for the DIP pin increase and the weight of the DIP pin increases, resulting in electronic equipment using the DIP pin The increase in the weight of electronic devices with more DIP pins makes the weight increase more obvious, which is not conducive to the miniaturization and lightweight of electronic devices.

In the DIP pin device disclosed in the embodiment of the present application, although the limit convex hull and the first chamfer are provided on the DIP pin, compared with the scheme of increasing the width L of the DIP pin, the weight of the DIP pin The impact is small, so it is more conducive to the miniaturization and light weight of electronic equipment.

In addition, in the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device is soldered to the PCB through the PCB slot, due to the limited convex hull and the first chamfer provided on the surface of the DIP pin, the relative For the DIP pin, the contact area with the solder paste in the PCB slot is increased. The limiting convex hull and the first chamfer function as a nail wedge. Therefore, when the DIP pin is stressed, it is not easy to remove it from the PCB board. Peeling, it can also increase the soldering strength of DIP pins.

BRIEF DESCRIPTION

In order to more clearly explain the technical solution of the present application, the following will briefly introduce the drawings that need to be used in the embodiments. Obviously, for those of ordinary skill in the art, without paying creative labor, Other drawings can also be obtained from these drawings.

1 is a schematic diagram of a DIP pin welding disclosed in the prior art;

2(a) is a schematic diagram of another DIP pin welding disclosed in the prior art;

2(b) is a schematic diagram of another DIP pin welding disclosed in the prior art;

3(a) is a front view of a DIP pin device disclosed in an embodiment of the present application;

3(b) is a top view of a DIP pin device disclosed in an embodiment of the present application;

3(c) is a right side view of a DIP pin device disclosed in an embodiment of the present application;

4(a) is a front view of a soldering situation of a DIP pin device disclosed in an embodiment of the present application;

FIG. 4(b) is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application;

5 is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application;

6 is a schematic cross-sectional view of a packaging structure disclosed in an embodiment of the present application;

7 is a schematic structural diagram of a plug-in device disclosed in an embodiment of the present application.

detailed description

The first embodiment of the present application discloses a dual in-line package DIP pin device, see the front view of the DIP pin device shown in FIGS. 3(a), 3(b) and 3(c), From a top view and a right view, the DIP pin device includes: a DIP pin 10, a limiting convex hull 20, and a first chamfer 30.

Wherein, the limiting convex hull 20 is located on the surface of the DIP pin 10.

Referring to the front view and the right view of the soldering situation shown in FIG. 4(a) and FIG. 4(b) respectively, when the DIP pin 10 is inserted into the PCB slot of the printed circuit board, the limit bump 20 is located on the PCB Inside the slot.

In addition, the first chamfer 30 is located on the surface of the DIP pin and is connected to the first side 21 of the limiting convex hull 20. When the limiting convex hull 20 is located in the PCB slot, The side of the limiting convex hull 20 facing the PCB slot is the first side of the limiting convex hull 20.

That is to say, the first chamfer 30 is disposed on the side where the limiting protrusion 20 extends into the PCB slot. The first chamfer 30 is connected to the first side 21 of the limiting convex hull 20. In this case, the first chamfer 30 and the limiting convex hull 20 may be an integrated structure, that is, the first chamfer 30 and The limiting convex hull 20 is integrated, or the first chamfer 30 and the limiting convex hull 20 may be two separate parts, and the two parts may be fixedly connected together by welding or gluing.

In the DIP pin device disclosed in the embodiment of the present application, when the DIP pin 10 is inserted into the PCB slot, the limiting convex hull 20 is located in the PCB slot, and the first chamfer 30 and the limiting convex hull The first side 21 of the 20 is connected. Therefore, when the DIP pin 10 is inserted into the PCB slot, the first chamfer 30 and the limiting convex package 20 are both located in the PCB slot. Moreover, in the process of soldering the DIP pin device disclosed in the embodiment of the present application to the PCB board, the first chamfer 30 first enters the PCB slot with the DIP pin 10, and then, the limiting convex hull 20 follows the DIP Pin 10 enters the PCB slot.

In addition, as shown in FIGS. 3(a), 3(b) and 3(c), the sides of the limiting convex hull 20 can be arranged in an arc shape, so that the DIP pin device can enter the PCB slot.

The DIP pin device disclosed in the first embodiment of the present application partially sets a limit convex hull. When the DIP pin is inserted into the PCB slot, the movable range of the PCB pin in the PCB slot is reduced, thereby improving the DIP Pin positioning accuracy. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.

Further, in the DIP pin device disclosed in the embodiments of the present application, the limiting convex hull may be fixed on the surface of the DIP pin in various ways. In one of the modes, the limiting convex hull is fixed on the surface of the DIP pin by welding. Alternatively, the limit convex hull and the DIP pin have an integrated structure. In this case, the limit convex hull may be punched out from the DIP pin.

In addition, the limiting convex hull can also be fixed on the surface of the DIP pin by means of adhesive bonding, which is not limited in the embodiment of the present application.

Correspondingly, the first chamfer can also be fixed on the surface of the DIP pin in various ways. For example, the first chamfer may be fixed on the surface of the DIP pin by welding, or the first chamfer may be an integrated structure with the DIP pin. In addition, the first chamfer can also be fixed on the surface of the DIP pin by adhesive bonding or the like, which is not limited in the embodiment of the present application.

In addition, the materials of the limiting convex hull and/or the first chamfer can also be of various types. For example, the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin. Or, in another feasible manner, the material of the limiting convex hull and/or the first chamfer is a metal material. For example, the metal material is nickel white copper or stainless steel.

Further, in the DIP pin device disclosed in the embodiment of the present application, the angle range between the angle between the first chamfer and the DIP pin is [120°, 160°].

Referring to the right view of the welding situation shown in FIG. 5, in this figure, the connection point between the first chamfer and the DIP pin is point A, that is, point A is the first target point. The first chamfer often corresponds to multiple tangents. Among them, the tangent passing through point A in each tangent is the first target tangent, and the obtuse angle θ formed by the first target tangent and the plane where the DIP pin lies is the first chamfer and Angle between DIP pins.

If the angle θ between the first chamfer and the DIP pin is too large, the closer the limiting convex hull is to the DIP pin, and the smaller the thickness of the limiting convex hull, the more the DIP pin device disclosed in the embodiment of the present application The DIP pin in the prior art is preferred, in this case, the limiting effect of the first chamfer is poor. In addition, if the angle θ between the first chamfer and the DIP pin is too small, the limiting convex hull is more prominent than the DIP pin, and it is easily interfered by the hole wall of the PCB slot, in this case , The guiding effect of the first chamfer is less. Therefore, in the embodiment of the present application, generally setting 120°≦θ≦160°, the angle θ between the first chamfer and the DIP pin can be set to any value between 120° and 160°. For example, the angle θ between the first chamfer and the DIP pin can be set to 120°, or the angle θ between the first chamfer and the DIP pin can be set to 160°, or the first The angle θ between the chamfer and the DIP pin is set to the middle value of 120° and 160° (that is, 140°).

Further, the DIP pin device disclosed in the embodiment of the present application further includes: a second chamfer 40.

The second chamfer 40 is located on the surface of the DIP pin 10 and is connected to the second side of the limiting convex hull 20. When the limiting convex hull 20 is located in the PCB slot, The side of the limiting convex hull 20 facing away from the PCB slot is the second side;

When the DIP pin 10 is inserted into the PCB slot of the printed circuit board, the second chamfer 40 is located in the PCB slot.

That is, referring to FIGS. 4(a) and 4(b), when the DIP pin is inserted into the PCB slot, the second chamfer is located above the first chamfer and the DIP pin. In this case, due to the existence of the second chamfer, the contact area with the solder paste in the PCB slot is further increased, so that the soldering strength of the DIP pin can be further increased.

Wherein, the second chamfer and the limiting convex hull may be an integrated structure, or the second angle and the limiting convex hull may also be two independent structures.

In addition, the second chamfer can be fixed on the surface of the DIP pin in various ways. For example, the second chamfer can be fixed on the surface of the DIP pin by soldering, or the limit convex hull and the DIP pin have an integrated structure. In this case, the limit convex The package may be punched out from the DIP pin.

In addition, the second chamfer can also be fixed on the surface of the DIP pin by glue bonding or the like. This embodiment of the present application does not limit this.

The material of the second chamfer can also be of various types. For example, the material of the second chamfer is the same as the material of the DIP pin. Alternatively, the material of the second chamfer is a metal material. For example, the metal material is nickel white copper or stainless steel.

Further, in the DIP pin device disclosed in the embodiment of the present application, the angle range between the second chamfer and the DIP pin is [120°, 160°].

The second embodiment of the present application discloses a packaging structure. Refer to the schematic cross-sectional view of the packaging structure shown in FIG. 6. The packaging structure includes the DIP pin device 100 disclosed in the first embodiment of the present application, and further includes a PCB. The PCB 200 of the slot 210.

In this packaging structure, the DIP pin device 100 is located in the PCB slot 210 and is fixed on the PCB board 200 by solder paste in the PCB slot 210.

In a third embodiment of the present application, a plug-in device is also disclosed. The plug-in device includes the DIP pin device disclosed in the first embodiment of the present application.

Wherein, the plug-in device is a SIM card holder of a user identity module, an earphone holder or a USB connector of a universal serial bus. Of course, the plug-in device can also be other devices with DIP pins, which are not limited in the embodiments of the present application.

If the plug-in device is a SIM card holder, the schematic structural diagram is shown in FIG. 6, wherein FIG. 6 is a schematic diagram of the SIM card holder, and the circled part in the figure includes the DIP pin device disclosed in the embodiment of the present application.

In the SIM card holder in the prior art, according to the conventional design in the industry, the width L of the DIP pin is usually 0.15 mm, and the width H of the PCB slot is usually 0.45 mm. Multiple tests have shown that after soldering the DIP pin in the SIM card holder, the movable range of the DIP pin in the PCB slot is too large, which will cause about 8.9% card tray floating height problem, and normal mass production The floating height of the SIM card holder needs to be less than 3%, that is to say, the SIM card holder in the prior art has the problem of insufficient positioning accuracy.

The SIM card holder disclosed in the embodiment of the present application is provided with a DIP pin device, that is, a limit convex hull and a first chamfer are provided on the surface of the DIP pin, and a second chamfer can also be provided, thereby reducing the DIP pin The movable range in the PCB slot improves the positioning accuracy of the SIM card holder.

Among them, in the SIM card holder, the width of the limiting convex hull is usually 0.05 mm. In this case, after multiple tests, the SIM card holder disclosed in the examples of the present application has a low card tray insertion and removal high defect rate from 8.9% to 1.2%, which can meet normal mass production quality standards.

Further, in the SIM card holder disclosed in the embodiment of the present application, the first chamfer can play a guiding role, and the probability of not entering the hole is less than 100mm, which is equivalent to the conventional design, and reduces the PCB slot width and increase Compared with the scheme of large DIP pin width, the probability of not entering the hole is reduced. In addition, the limit convex hull and the first chamfer not only play a role of "nail wedge", but also increase the contact area with the solder paste in the PCB slot, and the second chamfer can also increase the contact area with the solder paste, Thereby increasing the welding strength of the SIM card holder.

In order to clarify the advantages of this application, the SIM card holder was tested many times, and the following scheme comparison table was obtained. In this table, in the original SIM card holder, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.15mm, the probability of the card floating height is 8.9%, the probability of not entering the hole is 5ppm, and set the PCB The cost of the board is A. The SIM card holder of this solution has the disadvantage of low positioning accuracy, which makes it difficult to insert and remove the SIM card holder. In addition, in Scheme 2, the method of reducing the width of the PCB slot is used. In this case, the width of the PCB slot is 0.40mm, the width of the DIP pin is 0.15mm, and the probability of the card floating height is 7.1%. The hole probability is 139ppm, and the cost of the PCB board is A+0.1~0.3 yuan/PCS, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the cost of the PCB board and the difficulty of soldering, and As the width of the PCB slot is reduced, the solder paste in the PCB slot is correspondingly reduced, which leads to a reduction in soldering strength. In addition, in scheme 3, the method of increasing the width of the DIP pin is adopted. In this case, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.25mm, and the floating height probability of the card is 1.2%, not in The hole probability is 441ppm, and the cost of the PCB board is A, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the difficulty of soldering, and because of the increase in the weight of the DIP pin, it leads to the SIM card The weight of the seat increases. The solution 4 adopts the solution disclosed in the embodiments of the present application, that is, the solution through the convex hull limit. In this case, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.15mm, and the DIP The surface of the pin is provided with a limit convex hull with a width of 0.05mm. The probability of floating height of the card is 1.2%, the probability of not entering the hole is <100ppm, and the cost of the PCB board is A. According to this, the SIM of the program The card holder not only improves the positioning accuracy, and does not increase the cost of the PCB board, but also, compared with the solutions 2 and 3, the soldering difficulty is reduced, and, the solution 3 increases the width of the entire DIP pin, while the solution 4 It's just that the limit convex hull and at least one chamfer are added locally to the DIP pin. Therefore, this solution has little effect on the weight of the SIM card holder. Further, since the limiting convex hull and the first chamfer not only play a role of "nail wedge", but also increase the contact area with the solder paste in the PCB slot, and the second chamfer can also increase the contact with the solder paste Area, so option 4 can also increase the welding strength of the SIM card holder.

Table 1 Comparison of DIP foot design schemes of various decks

According to the above table, compared with the original solution (ie, solution 1), the positioning accuracy of the solution disclosed in the embodiments of the present application is significantly improved, and the floating probability of the card is reduced from 8.9% to 1.2%, which meets the needs of mass production. In addition, compared with the solution for reducing the width of the PCB slot (ie, solution 2), the solution disclosed in the embodiments of the present application has a lower cost of the PCB board of 0.1-0.3RMB/PCS, and has higher positioning accuracy, less welding processing difficulty, and welding high strength. Compared with the scheme of increasing the width of the DIP pin, this scheme has a lower soldering difficulty and a smaller device weight, which is conducive to the development of lightweight.

It should be understood that in various embodiments of the present application, the size of the sequence number of each process does not mean that the execution order is sequential, and the execution order of each process should be determined by its function and inherent logic, and should not correspond to the embodiments of this application. The implementation process constitutes no limitation.

Each part of this specification is described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the device and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

Claims

A dual in-line package DIP pin device, characterized in that it includes:

DIP pin, limit convex hull and first chamfer;

The limit convex hull is located on the surface of the DIP pin, and when the DIP pin is inserted into the PCB slot of the printed circuit board, the limit convex hull is located in the PCB slot;

The first chamfer is located on the surface of the DIP pin and is connected to the first side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing the PCB slot is the first side of the limiting convex hull.
The DIP pin device according to claim 1, wherein:

The limiting convex hull is fixed on the surface of the DIP pin in the form of welding;

or,

The limit convex hull and the DIP pin have an integrated structure.
The DIP pin device according to claim 1, wherein:

The material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin;

or,

The material of the limiting convex hull and/or the first chamfer is a metal material.
The DIP pin device according to claim 1, wherein:

The angle range between the first chamfer and the DIP pin is [120°, 160°];

The obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
The DIP pin device according to claim 1, further comprising:

Second chamfer

The second chamfer is located on the surface of the DIP pin and is connected to the second side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing away from the PCB slot is the second side;

When the DIP pin is inserted into the PCB slot of the printed circuit board, the second chamfer is located in the PCB slot.
The DIP pin device according to claim 5, wherein:

The material of the second chamfer is the same as the material of the DIP pin;

or,

The materials of the limiting convex hull and the second chamfer are metal materials.
The DIP pin device according to claim 5, wherein:

The angle range between the second chamfer and the DIP pin is [120°, 160°];

The obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin, and the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point, and the second target point is a connection point of the second chamfer and the DIP pin.
A packaging structure, which is characterized by comprising:

The DIP pin device according to any one of claims 1 to 7, and a PCB board provided with a PCB slot;

The DIP pin device is located in the PCB slot, and is fixed on the PCB board by the solder paste in the PCB slot.
A plug-in device is characterized by comprising:

The DIP pin device according to any one of claims 1 to 7.
The plug-in device according to claim 9, wherein:

The plug-in device is a SIM card holder of a user identity module, an earphone holder or a USB connector of a universal serial bus.