CN105163482B - A kind of printed circuit board (PCB) - Google Patents
A kind of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN105163482B CN105163482B CN201510548067.3A CN201510548067A CN105163482B CN 105163482 B CN105163482 B CN 105163482B CN 201510548067 A CN201510548067 A CN 201510548067A CN 105163482 B CN105163482 B CN 105163482B
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pad
- pcb
- stiffening plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of printed circuit board (PCB).The printed circuit board (PCB) includes：First pad, positioned at printed circuit board surface narrow boards frame region and/or narrow boards frame and the turning join domain of main body printed circuit board surface, the first bond pad surface is coated with scolding tin tin cream, for welding the first stiffening plate；Second pad, on printed circuit board (PCB) side cross section corresponding with narrow boards frame region, and/or narrow boards frame and main body printed circuit board (PCB) connecting corner circuit board side cross section on, the second bond pad surface is coated with scolding tin tin cream, for welding the second stiffening plate；First stiffening plate, positioned at the top of first pad, with first pad solder；Second stiffening plate, positioned at the top of second pad, with second pad solder.Technical scheme provided in an embodiment of the present invention improves the resistance to fracture in printed circuit board (PCB) narrow boards frame region by laying pad, and the weld reinforcement plate above pad on printed circuit board (PCB) narrow boards frame surface and side cross section.
Description
Technical field
The present embodiments relate to printed circuit board (PCB) Strengthening Technology field, more particularly to a kind of printed circuit board (PCB).
Background technology
The fast development of electronic product make it that extra-thin electronic product is favored by masses.Generally, extra-thin electricity
Sub- product is to obtain more compact, narrower by thinner printed circuit board (PCB), and by electronic product internal circuit configuration spatial design
Realize.When printed circuit board space structure design is obtained it is compact narrow when, circuit board sheet frame locally becoming narrow, formed " L "
Shape, " C " shape or other shapes carry the printed circuit board (PCB) in narrow boards frame region.Figure 1A and Figure 1B is printed circuit board (PCB) in the prior art
Narrow boards mount structure schematic diagram, wherein, in Figure 1A printed circuit board (PCB) narrow boards frame 10 be regular rectangular shape；Printed circuit board (PCB) in Figure 1B
Narrow boards frame 11 is the banding circular arc that connects between two bodies of printed circuit board (PCB).
Due to there is the sheet frame narrowed suddenly in above-mentioned printed circuit board (PCB), printed circuit board (PCB) is than relatively thin in addition so that narrow boards frame
Locate stress to be deteriorated, narrow boards frame stress easily snaps off, adds the defect rate of printed circuit panel products in production process, reduce print
The production efficiency of printed circuit board.
The content of the invention
The embodiment of the present invention provides a kind of printed circuit board (PCB), to overcome lacking for printed circuit board (PCB) narrow boards frame stress frangibility
Fall into.
The embodiments of the invention provide a kind of printed circuit board (PCB), the printed circuit board (PCB) includes：
First pad, positioned at printed circuit board surface narrow boards frame region and/or narrow boards frame and main body printed circuit board surface
Turning join domain, the first bond pad surface is coated with scolding tin tin cream, for welding the first stiffening plate；
Second pad, on printed circuit board (PCB) side cross section corresponding with narrow boards frame region, and/or narrow boards frame and master
On the side cross section of the circuit board of body printed circuit board (PCB) connecting corner, the second bond pad surface is coated with scolding tin tin cream, for welding
Connect the second stiffening plate；
First stiffening plate, positioned at the top of first pad, with first pad solder；
Second stiffening plate, positioned at the top of second pad, with second pad solder.
Further, first stiffening plate and second stiffening plate are integrally formed by one piece of stiffening plate, and described second
Stiffening plate bends relative to first stiffening plate and set.
Further, the overlay area area ratio of first stiffening plate and first pad is 1:1；Described second
The overlay area area ratio of stiffening plate and second pad is 1:1.
Further, first pad and second pad are covered in banding, latticed or integral type shape
On printed circuit board (PCB).
Further, first pad is located at front and/or the reverse side of printed circuit board (PCB).
Further, second pad is located on the cross section of one side of printed circuit board (PCB) or two sides cross section
On.
Further, first stiffening plate and second stiffening plate can pass through scolding tin tin cream and pad solder
Metallic plate.
Further, the stiffening plate and the pad are welded by paster welding procedure.
Further, the electronic component in the printed circuit board surface is arranged on non-narrow boards frame region and the non-turning
Join domain.
Technical scheme provided in an embodiment of the present invention, by the front narrow boards frame region of printed circuit board (PCB) and/or narrow boards
Frame and the turning join domain of main body printed circuit board surface, and printed circuit board (PCB) side corresponding with narrow boards frame region are transversal
On face and/or narrow boards frame and main body printed circuit board (PCB) connecting corner circuit board side cross section on lay pad, in pad
Upper weld reinforcement plate, improves the intensity at printed circuit board (PCB) narrow boards frame so that bigger stress can be born at narrow boards frame, prevents
Only printed circuit board (PCB) improves product quality in stress and situation about fractureing at narrow boards frame during assembling and product use.
Brief description of the drawings
Figure 1A is the first narrow boards mount structure schematic diagram of printed circuit board (PCB) in the prior art；
Figure 1B is second of narrow boards mount structure schematic diagram of printed circuit board (PCB) in the prior art；
Fig. 2A is a kind of structural representation for printed circuit board (PCB) that the embodiment of the present invention one is provided；
Fig. 2 B are a kind of structural representations for printed circuit board (PCB) that the embodiment of the present invention one is provided；
Fig. 2 C are a kind of cross-sectional views for printed circuit board (PCB) that the embodiment of the present invention one is provided；
Fig. 3 is a kind of structural representation for printed circuit board (PCB) that the embodiment of the present invention two is provided；
Fig. 4 A are the first structural representations for the pad that the embodiment of the present invention two is provided；
Fig. 4 B are second of structural representations of the pad that the embodiment of the present invention two is provided；
Fig. 4 C are the third structural representations for the pad that the embodiment of the present invention two is provided；.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention rather than entire infrastructure are illustrate only in description, accompanying drawing.
Embodiment one
Fig. 2A is a kind of structural representation for printed circuit board (PCB) that the embodiment of the present invention one is provided；Fig. 2 B are to weld stiffening plate
The structural representation for the printed circuit board (PCB) being connected on pad；Fig. 2 C are that the hatching AA ' of the printed circuit board (PCB) along along Fig. 2 B is cut
Cross-sectional view.Referring to Fig. 2A, Fig. 2 B and Fig. 2 C, the printed circuit board (PCB) includes：First pad 20, the second pad 21,
First stiffening plate 22 and the second stiffening plate 23.First pad 20 is located at the region of printed circuit board surface narrow boards frame 24 and/or narrow boards
Frame 24 and the turning join domain 26 on the surface of main body printed circuit board (PCB) 25, the surface of the first pad 20 are coated with scolding tin tin cream 27, use
In the first stiffening plate 22 of welding；Second pad 21, positioned at printed circuit board (PCB) side cross section 28 corresponding with the region of narrow boards frame 24
On, and/or narrow boards frame 24 and the connecting corner of main body printed circuit board (PCB) 25 circuit board side cross section 29 on, the second pad 21
Surface is coated with scolding tin tin cream 27, for welding the second stiffening plate 23；First stiffening plate 22, positioned at the upper of first pad 20
Side, is welded with first pad 20；Second stiffening plate 23, positioned at the top of second pad 21, with second pad
21 welding.
Wherein, narrow boards frame 24 refers to that sheet frame adjacent thereto on printed circuit board (PCB) is compared, and width is less than the area of adjacent sheet frame
Domain.
It is preferred that, the first stiffening plate 22 and the second stiffening plate 23 are integrally formed by one piece of stiffening plate, the phase of the second stiffening plate 23
Bend and set for the first stiffening plate 22.
As shown in Figure 2 B, the first stiffening plate 22 and the second stiffening plate 23 are respectively welded at the first pad by scolding tin tin cream 27
20 and second on pad 21, and the first pad 20 is located at the region of printed circuit board surface narrow boards frame 24 and narrow boards frame 24 and printed with main body
The turning join domain 26 on the surface of circuit board 25, the second pad 21 is located at printed circuit board (PCB) side corresponding with the region of narrow boards frame 24
On cross section 28 and narrow boards frame 24 and the connecting corner of main body printed circuit board (PCB) 25 circuit board side cross section 29 on.Along Fig. 2 B
The hatching AA ' of middle printed circuit board (PCB) cuts and obtained in Fig. 2 C, Fig. 2 C, and the surface of printed circuit board base board 210 is followed successively by the upwards
One pad 20, the stiffening plate 22 of scolding tin tin cream 27 and first, the side of printed circuit board base board 210 is transversal to be followed successively by upwardly the second weldering
Disk 21, the stiffening plate 23 of scolding tin tin cream 27 and second.
It is preferred that, the overlay area area ratio of the first stiffening plate 22 and the first pad 20 is 1:1；The He of second stiffening plate 23
The overlay area area ratio of second pad 21 is 1:1.
The technical scheme that the present embodiment is provided, by the front narrow boards frame region of printed circuit board (PCB) and narrow boards frame and main body
It is on the turning join domain of printed circuit board surface, and printed circuit board (PCB) side cross section corresponding with narrow boards frame region and narrow
Sheet frame is welded on the pad and mended with laying pad on the side cross section of the circuit board of main body printed circuit board (PCB) connecting corner
Strong plate, improves the intensity at printed circuit board (PCB) narrow boards frame so that printed circuit board (PCB) narrow boards during assembling and product use
Stress is difficult at frame to fracture.
Embodiment two
On the basis of embodiment one, in the embodiment of the present embodiment, as shown in figure 3, the first pad 20 is located at printing
The region of circuit board surface narrow boards frame 24, the second pad 20 is located at printed circuit board (PCB) side cross section corresponding with the region of narrow boards frame 24
On 28.First pad 20 and the second pad 21 are welded with the first stiffening plate 22 and the second stiffening plate 23 respectively by scolding tin tin cream 27
Connect.First stiffening plate 22 and the second stiffening plate 23 are integrally formed by one piece of stiffening plate, and the second stiffening plate 23 is relative to the first reinforcement
The bending of plate 22 is set.The overlay area area ratio of first stiffening plate 22 and the first pad 20 is 1:1；Second stiffening plate 23 and
The overlay area area ratio of two pads 21 is 1:1.
It is preferred that, first pad and second pad are covered in print with banding, latticed or integral type shape
On printed circuit board.As shown in Figure 4 A, bond pad shapes are banding；As shown in Figure 4 B, bond pad shapes are latticed, above two pad
Shape reduces scolding tin tin cream usage amount, improves intensity at printed circuit board (PCB) narrow boards frame of knowing clearly, has saved production cost.Described one
Body formula shape, is that pad integrally coats the printed circuit board (PCB) region for being produced on its covering, as shown in Figure 4 C.The integral type shape
Pad and the stiffening plate welded by scolding tin tin cream after, the stiffening plate is connected more firm with the pad, more favorably
Intensity at raising printed circuit board (PCB) narrow boards frame.
It is preferred that, first pad is located at front and/or the reverse side of printed circuit board (PCB).First pad is produced on print
The surface of printed circuit board, surface region does not have any electronic component.First pad can only be laid in printed circuit board (PCB)
Front or the reverse side of printed circuit board (PCB).Meanwhile, first pad can also be laid in simultaneously printed circuit board (PCB) front and
Reverse side, first pad further increases printed circuit board (PCB) narrow boards by scolding tin tin cream and first welding with reinforcement plate
Intensity at frame.
It is preferred that, second pad is located on the cross section of one side of printed circuit board (PCB) or two sides cross section
On.Second pad is laid on the side cross section of printed circuit board (PCB), and the side transverse cross-sectional area does not have electronic component.
Second pad can only be produced on the side cross section of printed circuit board (PCB).Meanwhile, the second pad can also be while cloth
Two sides cross section of printed circuit board (PCB) is located at, the second pad is further carried by scolding tin tin cream and the second welding with reinforcement plate
Intensity at high printed circuit board (PCB) narrow boards frame.
Further, the first stiffening plate 22 and the second stiffening plate 23 be can be by the gold of scolding tin tin cream 27 and pad solder
Belong to plate.The metallic sheet material can be the alloy of copper, iron or both.For the ease of metallic plate and pad solder, in metal
Plate surface can be with tin plating, silver-plated, gold-plated or addition rare metal.Exemplary, stiffening plate and pad pass through paster Welder
Skill is welded, and paster welding procedure is not only with tin amount is few but also scolding tin tin cream coats uniform, energy while saving production cost
Enough make stiffening plate and the stronger welding of pad.The stiffening plate can be steel plate, and the steel stiffening plate Thickness scope can
To be 0.1-1mm.
During stiffening plate and pad solder, further, the stiffening plate and the pad pass through paster Welder
Skill is welded.
In above-described embodiment, the electronic component in the printed circuit board surface is arranged on non-narrow boards frame region and/or non-
The turning join domain.Exemplary, the first pad is located at printed circuit board surface narrow boards frame region and narrow boards frame and main body
The turning join domain of printed circuit board surface, it is transversal that the second pad is located at printed circuit board (PCB) side corresponding with narrow boards frame region
Face and narrow boards frame with the side cross section of the circuit board of main body printed circuit board (PCB) connecting corner, the above-mentioned pad of laying first and the
The printed circuit board surface of two pads and side cross section are without any electronic component, and electronic component is distributed in except described in above-mentioned laying
The region of first pad and second pad.
The technical scheme that the present embodiment is provided, by being laid in printed circuit board surface narrow boards frame region and side cross section
Pad, is welded the stiffening plate of pad and same homalographic by scolding tin tin cream, is enhanced at printed circuit board (PCB) narrow boards frame
Intensity so that the narrow boards frame of printed circuit board (PCB) is not easily broken assembling and can bear bigger stress in.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art it is various it is obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention is carried out by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other more equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (9)
1. a kind of printed circuit board (PCB), it is characterised in that including：
First pad, positioned at turning for printed circuit board surface narrow boards frame region and/or narrow boards frame and main body printed circuit board surface
Angle join domain, the first bond pad surface is coated with scolding tin tin cream, for welding the first stiffening plate；
Second pad, on printed circuit board (PCB) side cross section corresponding with narrow boards frame region, and/or narrow boards frame prints with main body
On the side cross section of the circuit board of printed circuit board connecting corner, the second bond pad surface is coated with scolding tin tin cream, for welding the
Two stiffening plates；
First stiffening plate, positioned at the top of first pad, with first pad solder；
Second stiffening plate, positioned at the top of second pad, with second pad solder；
Narrow boards frame refers to that sheet frame adjacent thereto on printed circuit board (PCB) is compared, and width is less than the region of adjacent sheet frame.
2. printed circuit board (PCB) according to claim 1, it is characterised in that：
First stiffening plate and second stiffening plate are integrally formed by one piece of stiffening plate, and second stiffening plate is relative to institute
State the bending setting of the first stiffening plate.
3. printed circuit board (PCB) according to claim 1, it is characterised in that
The overlay area area ratio of first stiffening plate and first pad is 1:1；
The overlay area area ratio of second stiffening plate and second pad is 1:1.
4. printed circuit board (PCB) according to claim 1, it is characterised in that first pad and second pad are with band
Shape, the covering of latticed or integral type shape are on a printed circuit；
The integral type shape, is that pad integrally coats the printed circuit board (PCB) region for being produced on its covering.
5. printed circuit board (PCB) according to claim 1, it is characterised in that first pad is being located at printed circuit board (PCB) just
Face and/or reverse side.
6. printed circuit board (PCB) according to claim 1, it is characterised in that second pad is located at printed circuit board (PCB) one
On the cross section of side or on the cross section of two sides.
7. printed circuit board (PCB) according to claim 1, it is characterised in that first stiffening plate and second stiffening plate
Being can be by scolding tin tin cream and the metallic plate of pad solder.
8. printed circuit board (PCB) according to claim 1, it is characterised in that the stiffening plate and the pad are welded by paster
Technique is connect to be welded.
9. printed circuit board (PCB) according to claim 1, it is characterised in that the electronic component in the printed circuit board surface
It is arranged on non-narrow boards frame region and/or the non-turning join domain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548067.3A CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548067.3A CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105163482A CN105163482A (en) | 2015-12-16 |
| CN105163482B true CN105163482B (en) | 2017-11-07 |
Family
ID=54804207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510548067.3A Active CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163482B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714467A (en) * | 2016-11-25 | 2017-05-24 | 维沃移动通信有限公司 | Printed circuit board manufacturing method, printed circuit board and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202009534U (en) * | 2011-01-20 | 2011-10-12 | 瀚斯宝丽显示科技（南京）有限公司 | Reinforced structure for preventing break of flexible circuit board |
| CN202617505U (en) * | 2012-05-17 | 2012-12-19 | 厦门伊普斯电子有限公司 | A firmer flexible printed circuit |
| CN102869189A (en) * | 2012-09-18 | 2013-01-09 | 上海华勤通讯技术有限公司 | Printed circuit board (PCB) provided with reinforced bonding pad |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298346A (en) * | 1996-05-08 | 1997-11-18 | Toshiba Corp | Flexible printed wiring board |
-
2015
- 2015-08-31 CN CN201510548067.3A patent/CN105163482B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202009534U (en) * | 2011-01-20 | 2011-10-12 | 瀚斯宝丽显示科技（南京）有限公司 | Reinforced structure for preventing break of flexible circuit board |
| CN202617505U (en) * | 2012-05-17 | 2012-12-19 | 厦门伊普斯电子有限公司 | A firmer flexible printed circuit |
| CN102869189A (en) * | 2012-09-18 | 2013-01-09 | 上海华勤通讯技术有限公司 | Printed circuit board (PCB) provided with reinforced bonding pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105163482A (en) | 2015-12-16 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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